JPH039942A - Vinyl chloride resin composition - Google Patents
Vinyl chloride resin compositionInfo
- Publication number
- JPH039942A JPH039942A JP14351789A JP14351789A JPH039942A JP H039942 A JPH039942 A JP H039942A JP 14351789 A JP14351789 A JP 14351789A JP 14351789 A JP14351789 A JP 14351789A JP H039942 A JPH039942 A JP H039942A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- parts
- thermoplastic resin
- epoxy group
- polymerization
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 title claims abstract description 28
- 239000011342 resin composition Substances 0.000 title claims description 13
- 239000000178 monomer Substances 0.000 claims abstract description 61
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 38
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 31
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims abstract description 26
- 229920005989 resin Polymers 0.000 claims abstract description 23
- 239000011347 resin Substances 0.000 claims abstract description 23
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 18
- 229920001577 copolymer Polymers 0.000 claims abstract description 14
- 150000008064 anhydrides Chemical class 0.000 claims abstract description 6
- 125000003700 epoxy group Chemical group 0.000 claims description 24
- -1 maleimide compound Chemical class 0.000 claims description 16
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 abstract description 23
- 238000002156 mixing Methods 0.000 abstract description 8
- 239000004593 Epoxy Substances 0.000 abstract description 4
- 125000000217 alkyl group Chemical group 0.000 abstract description 3
- 239000004566 building material Substances 0.000 abstract description 3
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 abstract 1
- 238000006116 polymerization reaction Methods 0.000 description 37
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 24
- 239000000203 mixture Substances 0.000 description 20
- 238000000034 method Methods 0.000 description 14
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 12
- 239000004342 Benzoyl peroxide Substances 0.000 description 10
- 235000019400 benzoyl peroxide Nutrition 0.000 description 10
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 8
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 7
- 230000007423 decrease Effects 0.000 description 7
- 239000007787 solid Substances 0.000 description 7
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 6
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 5
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 238000012662 bulk polymerization Methods 0.000 description 4
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 4
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 4
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 229920002451 polyvinyl alcohol Polymers 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 239000005062 Polybutadiene Substances 0.000 description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 description 3
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- SEEYREPSKCQBBF-UHFFFAOYSA-N n-methylmaleimide Chemical compound CN1C(=O)C=CC1=O SEEYREPSKCQBBF-UHFFFAOYSA-N 0.000 description 3
- 229920002857 polybutadiene Polymers 0.000 description 3
- 230000000379 polymerizing effect Effects 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- JNPCNDJVEUEFBO-UHFFFAOYSA-N 1-butylpyrrole-2,5-dione Chemical compound CCCCN1C(=O)C=CC1=O JNPCNDJVEUEFBO-UHFFFAOYSA-N 0.000 description 2
- HHVCCCZZVQMAMT-UHFFFAOYSA-N 1-hydroxy-3-phenylpyrrole-2,5-dione Chemical compound O=C1N(O)C(=O)C=C1C1=CC=CC=C1 HHVCCCZZVQMAMT-UHFFFAOYSA-N 0.000 description 2
- NQDOCLXQTQYUDH-UHFFFAOYSA-N 1-propan-2-ylpyrrole-2,5-dione Chemical compound CC(C)N1C(=O)C=CC1=O NQDOCLXQTQYUDH-UHFFFAOYSA-N 0.000 description 2
- YEKDUBMGZZTUDY-UHFFFAOYSA-N 1-tert-butylpyrrole-2,5-dione Chemical compound CC(C)(C)N1C(=O)C=CC1=O YEKDUBMGZZTUDY-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- OYUNTGBISCIYPW-UHFFFAOYSA-N 2-chloroprop-2-enenitrile Chemical compound ClC(=C)C#N OYUNTGBISCIYPW-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical class CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- QARVLSVVCXYDNA-UHFFFAOYSA-N bromobenzene Chemical compound BrC1=CC=CC=C1 QARVLSVVCXYDNA-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 239000003505 polymerization initiator Substances 0.000 description 2
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 2
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000010558 suspension polymerization method Methods 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- KTZVZZJJVJQZHV-UHFFFAOYSA-N 1-chloro-4-ethenylbenzene Chemical compound ClC1=CC=C(C=C)C=C1 KTZVZZJJVJQZHV-UHFFFAOYSA-N 0.000 description 1
- XYAWIGUQSAEIKJ-UHFFFAOYSA-N 1-dodecanoylpyrrole-2,5-dione Chemical compound C(CCCCCCCCCCC)(=O)N1C(C=CC1=O)=O XYAWIGUQSAEIKJ-UHFFFAOYSA-N 0.000 description 1
- DABFKTHTXOELJF-UHFFFAOYSA-N 1-propylpyrrole-2,5-dione Chemical compound CCCN1C(=O)C=CC1=O DABFKTHTXOELJF-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- GVJRTUUUJYMTNQ-UHFFFAOYSA-N 2-(2,5-dioxofuran-3-yl)acetic acid Chemical compound OC(=O)CC1=CC(=O)OC1=O GVJRTUUUJYMTNQ-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- DXIJHCSGLOHNES-UHFFFAOYSA-N 3,3-dimethylbut-1-enylbenzene Chemical compound CC(C)(C)C=CC1=CC=CC=C1 DXIJHCSGLOHNES-UHFFFAOYSA-N 0.000 description 1
- AGULWIQIYWWFBJ-UHFFFAOYSA-N 3,4-dichlorofuran-2,5-dione Chemical compound ClC1=C(Cl)C(=O)OC1=O AGULWIQIYWWFBJ-UHFFFAOYSA-N 0.000 description 1
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical group N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 1
- CXJAFLQWMOMYOW-UHFFFAOYSA-N 3-chlorofuran-2,5-dione Chemical compound ClC1=CC(=O)OC1=O CXJAFLQWMOMYOW-UHFFFAOYSA-N 0.000 description 1
- ODIRZFWMNJUHIM-UHFFFAOYSA-N 3-dodecanoylpyrrole-2,5-dione Chemical compound CCCCCCCCCCCC(=O)C1=CC(=O)NC1=O ODIRZFWMNJUHIM-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- QZYCWJVSPFQUQC-UHFFFAOYSA-N 3-phenylfuran-2,5-dione Chemical compound O=C1OC(=O)C(C=2C=CC=CC=2)=C1 QZYCWJVSPFQUQC-UHFFFAOYSA-N 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- 101100355616 Mus musculus Chml gene Proteins 0.000 description 1
- GHAZCVNUKKZTLG-UHFFFAOYSA-N N-ethyl-succinimide Natural products CCN1C(=O)CCC1=O GHAZCVNUKKZTLG-UHFFFAOYSA-N 0.000 description 1
- HDFGOPSGAURCEO-UHFFFAOYSA-N N-ethylmaleimide Chemical compound CCN1C(=O)C=CC1=O HDFGOPSGAURCEO-UHFFFAOYSA-N 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000007900 aqueous suspension Substances 0.000 description 1
- AGXUVMPSUKZYDT-UHFFFAOYSA-L barium(2+);octadecanoate Chemical compound [Ba+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O AGXUVMPSUKZYDT-UHFFFAOYSA-L 0.000 description 1
- AYJRCSIUFZENHW-DEQYMQKBSA-L barium(2+);oxomethanediolate Chemical compound [Ba+2].[O-][14C]([O-])=O AYJRCSIUFZENHW-DEQYMQKBSA-L 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000011437 continuous method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- FWLDHHJLVGRRHD-UHFFFAOYSA-N decyl prop-2-enoate Chemical compound CCCCCCCCCCOC(=O)C=C FWLDHHJLVGRRHD-UHFFFAOYSA-N 0.000 description 1
- UQLDLKMNUJERMK-UHFFFAOYSA-L di(octadecanoyloxy)lead Chemical compound [Pb+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O UQLDLKMNUJERMK-UHFFFAOYSA-L 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- KHAYCTOSKLIHEP-UHFFFAOYSA-N docosyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCCCCCOC(=O)C=C KHAYCTOSKLIHEP-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010556 emulsion polymerization method Methods 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 238000004817 gas chromatography Methods 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- OCWMFVJKFWXKNZ-UHFFFAOYSA-L lead(2+);oxygen(2-);sulfate Chemical compound [O-2].[O-2].[O-2].[Pb+2].[Pb+2].[Pb+2].[Pb+2].[O-]S([O-])(=O)=O OCWMFVJKFWXKNZ-UHFFFAOYSA-L 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 229920012128 methyl methacrylate acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229940065472 octyl acrylate Drugs 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920005670 poly(ethylene-vinyl chloride) Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 230000035936 sexual power Effects 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はパイプ、屋根材、窓枠などの建材や電気部品、
自動車部品、雑貨などの各種成形品の用途に有用な塩化
ビニル系樹脂組成物に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention is applicable to building materials such as pipes, roofing materials, window frames, electrical parts,
This invention relates to vinyl chloride resin compositions useful for various molded products such as automobile parts and miscellaneous goods.
塩化ビニル系樹脂は、安価でかつすぐれた物理的性質、
化学的性質を持っていることことから、種々の分野で幅
広く使用されている。しかしながら、耐熱性に劣るため
、耐熱特性が要求される分野にはその使用範囲に制限が
ある。Vinyl chloride resin is inexpensive and has excellent physical properties.
Due to its chemical properties, it is widely used in various fields. However, since it has poor heat resistance, its use is limited in fields where heat resistance is required.
このため、従来より、塩化ビニル系樹脂の耐熱性を改善
するために、種々の方法が試みられている。たとえば、
特開昭６１−１６２５４３号、同６１−２４３８４６号
、同６１−２６４０３７号などの公報には、芳香族ビニ
ル単量体、メタクリル酸、無水マレイン酸、マレイミド
化合物、アクリロニトリル、アクリル酸アルキルエステ
ル、メタクリル酸アルキルエステルなどからなる少なく
とも二種以上の単量体を共重合させた熱可塑性樹脂を塩
化ビニル系樹脂にブレンドする方法などが開示されてい
る。For this reason, various methods have been tried in the past in order to improve the heat resistance of vinyl chloride resins. for example,
Publications such as JP-A-61-162543, JP-A No. 61-243846, and JP-A No. 61-264037 include aromatic vinyl monomers, methacrylic acid, maleic anhydride, maleimide compounds, acrylonitrile, acrylic acid alkyl esters, methacrylic A method has been disclosed in which a thermoplastic resin obtained by copolymerizing at least two or more monomers such as acid alkyl esters is blended with a vinyl chloride resin.
しかるに、これら公知の方法は、塩化ビニル系樹脂とこ
れにブレンドする熱可塑性樹脂との相溶性が悪いことに
起因するためか、耐熱性がなお不充分であったり、加工
性を犠牲にして耐熱性の向上を図るものがほとんどで、
耐熱性、加工性のいずれにも充分に満足できるものはな
かった。However, in these known methods, the heat resistance is still insufficient, perhaps due to the poor compatibility between the vinyl chloride resin and the thermoplastic resin blended with it, or the heat resistance is improved at the expense of processability. Most of them aim to improve sexual performance,
There was no material that was fully satisfactory in both heat resistance and workability.
本発明は、このような現状に鑑み、耐熱性、加工性のい
ずれの特性にもすぐれ、また良好な耐衝撃性や色相をも
備えた塩化ビニル系樹脂組成物を提供することを目的と
している。In view of the current situation, it is an object of the present invention to provide a vinyl chloride resin composition that is excellent in both heat resistance and processability, and also has good impact resistance and color. .
本発明者らは、上記の目的を達成するために鋭意検討を
加えた結果、塩化ビニル系樹脂に対し、特定の熱可塑性
樹脂を二種組み合わせてブレンドすることにより、耐熱
性に非常にすぐれるとともに、良好な加工性を具備し、
そのうえ耐衝撃性や色相をも満足する塩化ビニル系樹脂
組成物が得られるものであることを見い出し、本発明を
完成するに至った。As a result of intensive studies to achieve the above object, the present inventors have found that by blending a combination of two specific thermoplastic resins with a vinyl chloride resin, it is possible to achieve extremely high heat resistance. At the same time, it has good workability,
The inventors have also discovered that it is possible to obtain a vinyl chloride resin composition that satisfies impact resistance and hue, and has completed the present invention.
すなわち、本発明は、
Ａ）塩化ビニル系樹脂１００重量部に、Ｂ）エポキシ基
含有ビニル単量体０．３〜５重量％とこれと共重合可能
なビニル単量体９５〜９９．７重量％との共重合体から
なるエポキシ基含有熱可塑性樹脂０．３〜１０重量部と
、Ｃ）不飽和ジカルボン酸無水物０．３〜５重量％とマ
レイミド化合物５〜４０ｔ１％とアクリル酸アルキルエ
ステルおよび／またはメタクリル酸アルキルエステル〔
以下、（メタ）アクリル酸アルキルエステルという〕０
〜２５重量％とシアン化ビニル単量体５〜２５重量％と
芳香族ビニル単量体４５〜８９．７重量％との共重合体
からなる熱可塑性樹脂５〜５０重量部とを、ブレンドし
たことを特徴とする塩化ビニル系樹脂組成物に係るもの
である。That is, the present invention includes: A) 100 parts by weight of vinyl chloride resin, B) 0.3 to 5% by weight of an epoxy group-containing vinyl monomer and 95 to 99.7 parts by weight of a vinyl monomer copolymerizable therewith. 0.3 to 10 parts by weight of an epoxy group-containing thermoplastic resin consisting of a copolymer with C) 0.3 to 5 parts by weight of an unsaturated dicarboxylic anhydride, 5 to 40% of a maleimide compound, and 1% of an acrylic acid alkyl ester. and/or methacrylic acid alkyl ester [
Hereinafter, referred to as (meth)acrylic acid alkyl ester]0
~25% by weight and 5 to 50 parts by weight of a thermoplastic resin consisting of a copolymer of 5 to 25% by weight of vinyl cyanide monomer and 45 to 89.7% by weight of vinyl aromatic monomer were blended. The present invention relates to a vinyl chloride resin composition characterized by the following.
本発明に用いられるＡ成分の塩化ビニル系樹脂は、塩化
ビニルの単独重合体、塩化ビニルとエチレン、プロピレ
ン、酢酸ビニルなどとの共重合体、あるいは塩化ビニル
とビニルエーテル類、アクリル酸やメタクリル酸のエス
テル類、アクリルアミド、アクリロニトリル、マレイミ
ド化合物などとの共重合体を含むものであり、塊状重合
、懸濁重合、乳化重合、溶液重合などいずれの製造方法
によるものでもよい。重合度は特に制限されないが、６
００〜２，５００程度の重合度を有するものが好ましい
。The vinyl chloride resin used as component A in the present invention is a homopolymer of vinyl chloride, a copolymer of vinyl chloride and ethylene, propylene, vinyl acetate, etc., or a copolymer of vinyl chloride and vinyl ethers, acrylic acid or methacrylic acid. It includes copolymers with esters, acrylamide, acrylonitrile, maleimide compounds, etc., and may be produced by any method such as bulk polymerization, suspension polymerization, emulsion polymerization, or solution polymerization. The degree of polymerization is not particularly limited, but is 6
A polymer having a degree of polymerization of about 0.00 to 2,500 is preferable.
本発明に用いられるＢ成分のエポキシ基含有熱可塑性樹
脂は、エポキシ基含有ビニル単量体とこれと共重合可能
なビニル単量体との共重合体からなるものである。The epoxy group-containing thermoplastic resin as component B used in the present invention is composed of a copolymer of an epoxy group-containing vinyl monomer and a vinyl monomer copolymerizable therewith.
エポキシ基含有ビニル単量体としては、グリシジルアク
リレート、グリシジルメタクリレート、アリルグリシジ
ルエーテル、２−メチルアリルグリシジルエーテル、ス
チレン−ｐ−グリシジルエーテルなどが挙げられ、これ
ら単量体の中からその一種を単独でまたは二種以上を混
合して使用することができる。Examples of the epoxy group-containing vinyl monomer include glycidyl acrylate, glycidyl methacrylate, allyl glycidyl ether, 2-methylallyl glycidyl ether, and styrene-p-glycidyl ether. Alternatively, two or more types can be used in combination.
これと共重合可能なビニル単量体には、芳香族ビニル単
量体、シアン化ビニル単量体、マレイミド化合物、（メ
タ）アクリル酸アルキルエステルのほか、エチレン、プ
ロピレン、イソブチレンなどのオレフィン、塩化ビニル
、塩化ビニリデンなどの脂肪族ビニル化合物、アクリル
アミド、メタクリルアミド、アクリル酸、メタクリル酸
、酢酸ビニルなどがあり、これら単量体のうちの一種ま
たは二種以上が用いられる。Vinyl monomers that can be copolymerized with this include aromatic vinyl monomers, vinyl cyanide monomers, maleimide compounds, (meth)acrylic acid alkyl esters, as well as olefins such as ethylene, propylene, and isobutylene, and chlorinated vinyl monomers. Examples include vinyl, aliphatic vinyl compounds such as vinylidene chloride, acrylamide, methacrylamide, acrylic acid, methacrylic acid, vinyl acetate, and one or more of these monomers are used.
上記の芳香族ビニル単量体としては、スチレン、α−メ
チルスチレン、ビニルトルエン、ｔ−ブチルスチレン、
ハロゲン置換スチレンなどを、シアン化ビニル単量体と
しては、アクリロニトリル、メタクリロニトリル、α−
クロロアクリロニトリルなどを、マレイミド化合物とし
ては、Ｎ−メチルマレイミド、Ｎ−エチルマレイミド、
Ｎ−７”ロピルマレイミド、Ｎ−イソプロピルマレイミ
ド、Ｎ−ブチルマレイミド、Ｎ−ターシャリブチルマレ
イミド、Ｎ−シクロヘキシルマレイミド、Ｎ−フェニル
マレイミド、Ｎ−ヒドロキシフェニルマレイミド、Ｎ−
ラウロイルマレイミドなどを、それぞれ挙げることがで
きる。Examples of the aromatic vinyl monomers include styrene, α-methylstyrene, vinyltoluene, t-butylstyrene,
Examples of vinyl cyanide monomers include halogen-substituted styrene, acrylonitrile, methacrylonitrile, α-
Examples of maleimide compounds include chloroacrylonitrile, N-methylmaleimide, N-ethylmaleimide,
N-7” Lopylmaleimide, N-isopropylmaleimide, N-butylmaleimide, N-tert-butylmaleimide, N-cyclohexylmaleimide, N-phenylmaleimide, N-hydroxyphenylmaleimide, N-
Examples include lauroylmaleimide and the like.
また、上記の（メタ）アクリル酸アルキルエステルとし
ては、（メタ）アクリル酸メチル、（メタ）アクリル酸
エチル、（メタ）アクリル酸ブチル、（メタ）アクリル
酸ターシャリブチル、（メタ）アクリル酸ターシャリブ
チルシクロヘキシル、（メタ）アクリル酸アミル、（メ
タ）アクリル酸オクチル、（メタ）アクリル酸２−エチ
ルヘキシル、（メタ）アクリル酸デシル、（メタ）アク
リル酸ラウリル、（メタ）アクリル酸ステアリル、（メ
タ）アクリル酸ベヘニル、（メタ）アクリル酸シクロヘ
キシル、（メタ）アクリル酸ベンジルなどのアルキル基
の炭素数が通常１〜２２のアルコールのアクリル酸また
はメタクリル酸アルキルエステルが用いられる。In addition, the above-mentioned (meth)acrylic acid alkyl esters include methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, tert-butyl (meth)acrylate, and tertiary (meth)acrylate. Butylcyclohexyl, amyl (meth)acrylate, octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, decyl (meth)acrylate, lauryl (meth)acrylate, stearyl (meth)acrylate, (meth)acrylate ) Acrylic acid or methacrylic acid alkyl esters of alcohols in which the alkyl group usually has 1 to 22 carbon atoms, such as behenyl acrylate, cyclohexyl (meth)acrylate, and benzyl (meth)acrylate, are used.
これら単量体成分の組成としては、全単量体中、つまり
エポキシ基含有ビニル単量体とこれと共重合可能なビニ
ル単量体との合計量中、前者のエポキシ基含有ビニル単
量体が０．３〜５重量％、好適には０．４〜４重量％で
、後者の他のビニル単量体が９５〜９９．７重量％、好
適には９６〜９９．６重量％となるようにするのがよい
。エポキシ基含有ビニル単量体が０．３重量％未満とな
ると、耐熱性が充分に向上せず、また５重量％を超えて
しまうと加工性やさらに耐衝撃性も低下するため、いず
れも好ましくない。As for the composition of these monomer components, in the total monomers, that is, in the total amount of the epoxy group-containing vinyl monomer and the vinyl monomer copolymerizable with it, the former epoxy group-containing vinyl monomer is 0.3 to 5% by weight, preferably 0.4 to 4% by weight, and the latter other vinyl monomer is 95 to 99.7% by weight, preferably 96 to 99.6% by weight. It is better to do so. If the epoxy group-containing vinyl monomer is less than 0.3% by weight, heat resistance will not be sufficiently improved, and if it exceeds 5% by weight, processability and even impact resistance will decrease, so both are preferred. do not have.
このような単量体組成の共重合体からなるＢ成分のエポ
キシ基含有熱可塑性樹脂は、従来公知の溶液重合法、懸
濁重合法、乳化重合法あるいは塊状重合法によって、製
造することができる。たとえば懸濁重合法では、重合釜
に脱イオン水とポリビニルアルコール、ゼラチン、炭酸
カルシウム、炭酸バリウム、メタクリル酸−メタクリル
酸アルキルエステル共重合体のアルカリ金属塩などの通
常用いられている分散剤とを入れて溶解する。これに単
量体混合物とターシャリブチルパーオキサイド、ベンゾ
イルパーオキサイド、アゾビスイソブチロニトリルなど
の通常用いられている重合開始剤とを混合した溶液を加
え、窒素ガス雰囲気下、よく撹拌して懸濁状態にし、昇
温しで６０〜１０Ｏ℃で所定時間重合し、重合終了後、
反応液を冷却し、ろ過、水洗、乾燥することにより、エ
ポキシ基含有熱可塑性樹脂が得られる。The epoxy group-containing thermoplastic resin of component B consisting of a copolymer having such a monomer composition can be produced by a conventionally known solution polymerization method, suspension polymerization method, emulsion polymerization method, or bulk polymerization method. . For example, in the suspension polymerization method, deionized water and commonly used dispersants such as polyvinyl alcohol, gelatin, calcium carbonate, barium carbonate, and alkali metal salts of methacrylic acid-methacrylic acid alkyl ester copolymers are added to a polymerization pot. Add and dissolve. A solution containing a monomer mixture and commonly used polymerization initiators such as tert-butyl peroxide, benzoyl peroxide, and azobisisobutyronitrile was added to this, and the mixture was thoroughly stirred under a nitrogen gas atmosphere. The suspension was made into a suspended state, and the temperature was raised to polymerize at 60 to 100°C for a predetermined period of time. After the polymerization was completed,
An epoxy group-containing thermoplastic resin is obtained by cooling the reaction solution, filtering, washing with water, and drying.
溶液重合法で得る場合の溶剤としては、たとえばトルエ
ン、キシレン、メチルエチルケトン、メチルイソブチル
ケトン、ブチルセロソルブ、クロロベンゼンなどの一種
または二種以上を使用することができる。As the solvent in the case of obtaining by solution polymerization method, for example, one or more of toluene, xylene, methyl ethyl ketone, methyl isobutyl ketone, butyl cellosolve, chlorobenzene, etc. can be used.
このように製造されるＢ成分のエポキシ基含有熱可塑性
樹脂の分子量としては、特に制限されるものではないが
、耐熱性や取り扱い性などの観点から、一般に重量平均
分子量で１，０００〜２００゜０００の範囲にあるのが
望ま°しい。The molecular weight of the epoxy group-containing thermoplastic resin of component B produced in this way is not particularly limited, but from the viewpoint of heat resistance and handleability, the weight average molecular weight is generally 1,000 to 200°. It is desirable that it be in the range of 000.
本発明に用いられるＣ成分の熱可塑性樹脂は、不飽和ジ
カルボン酸無水物、マレイミド化合物、シアン化ビニル
単量体および芳香族ビニル単量体よりなる単量体混合物
、あるいはこれにさらに（メタ）アクリル酸アルキルエ
ステルを加えてなる単量体混合物の共重合体である。The thermoplastic resin of component C used in the present invention is a monomer mixture consisting of an unsaturated dicarboxylic acid anhydride, a maleimide compound, a vinyl cyanide monomer, and an aromatic vinyl monomer, or a monomer mixture consisting of an unsaturated dicarboxylic anhydride, a maleimide compound, a vinyl cyanide monomer, and an aromatic vinyl monomer, or It is a copolymer of a monomer mixture containing an acrylic acid alkyl ester.
不飽和ジカルボン酸無水物としては、無水マレイン酸、
クロロマレイン酸無水物、ジクロロマレイン酸無水物、
シトラコン酸無水物、イタコン酸無水物、フェニルマレ
イン酸無水物、アコニット酸無水物などがあり、これら
のうちの一種または二種以上が用いられる。Examples of unsaturated dicarboxylic anhydrides include maleic anhydride,
Chloromaleic anhydride, dichloromaleic anhydride,
Examples include citraconic anhydride, itaconic anhydride, phenylmaleic anhydride, and aconitic anhydride, and one or more of these may be used.
マレイミド化合物としては、Ｎ−メチルマレイミド、Ｎ
−エチルマレイミド、Ｎ−プロピルマレイミド、Ｎ−イ
ソプロピルマレイミド、Ｎ−ブチルマレイミド、Ｎ−タ
ーシャリブチルマレイミド、Ｎ−シクロヘキシルマレイ
ミド、Ｎ−フェニルマレイミド、Ｎ−ヒドロキシフェニ
ルマレイミド、Ｎ−ラウロイルマレイミドなどがあり、
これらのうちの一種または二種以上が用いられる。Examples of maleimide compounds include N-methylmaleimide, N-methylmaleimide,
- Ethylmaleimide, N-propylmaleimide, N-isopropylmaleimide, N-butylmaleimide, N-tertiarybutylmaleimide, N-cyclohexylmaleimide, N-phenylmaleimide, N-hydroxyphenylmaleimide, N-lauroylmaleimide, etc.
One or more of these may be used.
シアン化ビニル単量体としては、アクリロニトリル、メ
タクリロニトリル、α−クロロアクリロニトリルなどが
あり、特にアクリロニトリルが好ましく用いられる。Examples of vinyl cyanide monomers include acrylonitrile, methacrylonitrile, and α-chloroacrylonitrile, with acrylonitrile being particularly preferably used.
芳香族ビニル単量体としては、スチレン、α−メチルス
チレン、０−クロルスチレン、ｐ−クロルスチレン、ビ
ニルトルエンなどがあり、これらのうちの一種または二
種以上が用いられる。Examples of the aromatic vinyl monomer include styrene, α-methylstyrene, 0-chlorostyrene, p-chlorostyrene, and vinyltoluene, and one or more of these may be used.
（メタ）アクリル酸アルキルエステルとしては、アルキ
ル基の炭素数が通常１〜２２であるものが好ましく、具
体的には、（メタ）アクリル酸メチル、（メタ）アクリ
ル酸エチル、（メタ）アクリル酸ブチル、（メタ）アク
リル酸ターシャリブチル、（メタ）アクリル酸アミル、
（メタ）アクリル酸オクチル、（メタ）アクリル酸２−
エチルヘキシル、（メタ）アクリル酸デシル、（メタ）
アクリル酸ラウリル、（メタ）アクリル酸ステアリル、
（メタ）アクリル酸シクロヘキシル、（メタ）アクリル
酸ターシャリブチルシクロヘキシル、（メタ）アクリル
酸ベンジルなどがあり、これらのうちの一種または二種
以上が用いられる。As the (meth)acrylic acid alkyl ester, those whose alkyl group usually has 1 to 22 carbon atoms are preferred, and specifically, methyl (meth)acrylate, ethyl (meth)acrylate, (meth)acrylic acid Butyl, tert-butyl (meth)acrylate, amyl (meth)acrylate,
(meth)octyl acrylate, (meth)acrylic acid 2-
Ethylhexyl, (meth)decyl acrylate, (meth)
lauryl acrylate, stearyl (meth)acrylate,
Examples include cyclohexyl (meth)acrylate, tert-butylcyclohexyl (meth)acrylate, and benzyl (meth)acrylate, and one or more of these may be used.
これら単量体成分の組成としては、不飽和ジカルボン酸
無水物では０．３〜５重量％、好適には０゜４〜４重量
％であり、０．３重量％未満では耐熱性が向上せず、５
重量％を超えると加工性や耐衝撃性が低下し、また色相
が悪くなる。マレイミド化合物では５〜４０重量％、好
適には８〜３５重量％であり、５重量％未満では耐熱性
が向上せず、４０重量％を超えると加工性や耐衝撃性が
低下する。シアン化ビニル単量体では５〜２５重景％重
量適には７〜２５重量％であり、５重量％未満では耐衝
撃性の低下がみられ、２５重量％を超えると耐熱性が向
上しない。芳香族ビニル単量体では４５〜８９．７重量
％、好適には５０〜８０重量％であり、４５重量％未満
では脆くなり、８９．７重量％を超えると耐熱性の向上
が不充分となる。また、（メタ）アクリル酸アルキルエ
ステルでは０〜２５重量％、好適には０〜２０重量％で
あり、この単量体は耐熱性や加工性の向上のため必要に
応じて用いられるものであるが、２５重世％を超えると
耐衝撃性が低下する。The composition of these monomer components is 0.3 to 5% by weight, preferably 0.4 to 4% by weight for unsaturated dicarboxylic anhydrides, and if it is less than 0.3% by weight, heat resistance will be improved. zu, 5
If it exceeds % by weight, processability and impact resistance will decrease, and the hue will deteriorate. For maleimide compounds, the content is 5 to 40% by weight, preferably 8 to 35% by weight; if it is less than 5% by weight, heat resistance will not improve, and if it exceeds 40% by weight, processability and impact resistance will decrease. For vinyl cyanide monomers, the content is 5 to 25% by weight, preferably 7 to 25% by weight, and if it is less than 5% by weight, the impact resistance will decrease, and if it exceeds 25% by weight, the heat resistance will not improve. . For aromatic vinyl monomers, the content is 45 to 89.7% by weight, preferably 50 to 80% by weight; if it is less than 45% by weight, it will become brittle, and if it exceeds 89.7% by weight, the improvement in heat resistance will be insufficient. Become. In the case of (meth)acrylic acid alkyl ester, it is 0 to 25% by weight, preferably 0 to 20% by weight, and this monomer is used as necessary to improve heat resistance and processability. However, if it exceeds 25%, impact resistance decreases.
このような単量体組成の共重合体からなるＣ成分の熱可
塑性樹脂は、従来公知の溶液重合法や塊状重合法によっ
て、製造することができる。たとえば塊状重合法では、
重合釜にシアン化ビニル単量体および芳香族ビニル単量
体を仕込み、窒素置換して撹拌下温度８０〜１３０℃で
不飽和ジカルボン酸無水物、マレイミド化合物、（メタ
）アクリル酸アルキルエステルなどの単量体とターシャ
リブチルパーオキサイド、ベンゾイルパーオキサイド、
アゾイソブチロニトリルなどの通常用し）られている重
合開始剤を溶解した芳香族ビニル単量体溶液を滴下しな
がら重合し、目標となる転化率に達するまで重合を続け
ればよい。The thermoplastic resin of component C consisting of a copolymer having such a monomer composition can be produced by a conventionally known solution polymerization method or bulk polymerization method. For example, in the bulk polymerization method,
A vinyl cyanide monomer and an aromatic vinyl monomer were charged into a polymerization reactor, and the atmosphere was replaced with nitrogen, and unsaturated dicarboxylic acid anhydride, maleimide compound, (meth)acrylic acid alkyl ester, etc. Monomer and tert-butyl peroxide, benzoyl peroxide,
Polymerization may be carried out while dropping an aromatic vinyl monomer solution in which a commonly used polymerization initiator such as azoisobutyronitrile is dissolved, and the polymerization may be continued until a target conversion rate is reached.
このようにして得られる重合液を、薄膜蒸留機、フラッ
シャ−１押出機などを用いて減圧乾燥することにより、
ペレット状や粒状などの熱可塑性樹脂が得られる。By drying the polymerization solution obtained in this way under reduced pressure using a thin film distillation machine, a Flasher-1 extruder, etc.,
Thermoplastic resins such as pellets and granules can be obtained.
溶液重合法で得る場合の溶剤としては、たとえばベンゼ
ン、トルエン、キシレン、クロロベンゼン、ブロモベン
ゼン、メチルエチルケトン、メチルイソブチルケトンな
どの一種または二種以上の溶剤を使用することができる
。As the solvent for obtaining by the solution polymerization method, one or more solvents such as benzene, toluene, xylene, chlorobenzene, bromobenzene, methyl ethyl ketone, and methyl isobutyl ketone can be used.
なお、これらいずれの重合法を採用するときでも、その
重合操作は回分式であっても連続式であってもよく、特
に制限はない。In addition, when employing any of these polymerization methods, the polymerization operation may be a batch method or a continuous method, and there is no particular restriction.
このように製造されるＣ成分の熱可塑性樹脂の分子量と
しては、特に制限されるものではないが、耐熱性や取り
扱い性などの観点から、一般に重量平均分子量で５０．
０００〜３００．０００の範囲にあるのが望ましい。The molecular weight of the C component thermoplastic resin produced in this way is not particularly limited, but from the viewpoint of heat resistance and handleability, the weight average molecular weight is generally 50.
It is desirable that it be in the range of 000 to 300.000.
本発明の塩化ビニル系樹脂組成物は、Ａ成分である塩化
ビニル系樹脂に上記したＢ成分であるエポキシ基含有熱
可塑性樹脂およびＣ成分である熱可塑性樹脂を配合し、
均一に溶融混合することにより調製される。The vinyl chloride resin composition of the present invention blends the above-mentioned epoxy group-containing thermoplastic resin as the B component and the thermoplastic resin as the C component into the vinyl chloride resin as the A component,
Prepared by uniformly melt-mixing.
ここで、各成分の配合割合は、Ａ成分１００重量部に対
し、Ｂ成分が０．３〜１０重量部、好適には０．４〜７
重量部、Ｃ成分が５〜５０重量部、好適には７〜４０重
量部である。Ｂ成分が０．３重量部未満であると耐熱性
が向上せず、１０重量部を超えると加工性や耐衝撃性が
低下する。また、Ｃ成分が５重量部未満であると耐熱性
が向上せず、５０重量部を超えると脆くなるとともに加
工性や耐衝撃性が低下する。Here, the blending ratio of each component is 0.3 to 10 parts by weight, preferably 0.4 to 7 parts by weight of component B to 100 parts by weight of component A.
The C component is 5 to 50 parts by weight, preferably 7 to 40 parts by weight. If component B is less than 0.3 parts by weight, heat resistance will not improve, and if it exceeds 10 parts by weight, processability and impact resistance will decrease. Moreover, if the C component is less than 5 parts by weight, the heat resistance will not be improved, and if it exceeds 50 parts by weight, it will become brittle and the workability and impact resistance will decrease.
Ａ、Ｂ、Ｃ各成分を均一に混合する方法は特に限定され
ず、ヘンシェルミキサー、リボンブレンダーなどであら
かじめよく混合しておき、これをバンバリーミキサ−１
押出機、ロールなどで溶融混合してもよいし、連続混練
機に各成分を定量的に供給しながら溶融混合してもよい
。There are no particular restrictions on the method for uniformly mixing the A, B, and C components, but they must be thoroughly mixed in advance using a Henschel mixer, ribbon blender, etc., and then mixed using a Banbury mixer 1.
Melt mixing may be performed using an extruder, rolls, etc., or melt mixing may be performed while quantitatively supplying each component to a continuous kneader.
本発明の塩化ビニル系樹脂組成物には、少量の熱安定剤
、可塑剤、酸化防止剤、紫外線吸収剤、充填剤、滑剤、
発泡剤、難燃剤、加工助剤、顔料などを必要に応じて配
合してもよい。The vinyl chloride resin composition of the present invention contains small amounts of heat stabilizers, plasticizers, antioxidants, ultraviolet absorbers, fillers, lubricants,
Foaming agents, flame retardants, processing aids, pigments, etc. may be added as necessary.
また、耐衝撃性が特に望まれる用途に使用する場合、必
要に応じて従来公知の耐衝撃性改良剤、たとえば、ポリ
ブタジェンに芳香族ビニル単量体およびメチルメタクリ
レートをグラフト重合したＭＢＳ樹脂、ポリブタジェン
に芳香族ビニル単量体およびアクリロニトリルをグラフ
ト重合したＡＢＳ樹脂、ポリブタジェンに芳香族ビニル
単量体、メチルメタクリレートおよびアクリロニトリル
をグラフト重合したＭＡＢＳ樹脂などを配合してもよい
。In addition, when used in applications where impact resistance is particularly desired, if necessary, conventionally known impact resistance modifiers may be added, such as MBS resin, which is obtained by graft polymerizing aromatic vinyl monomers and methyl methacrylate to polybutadiene, and polybutadiene. ABS resin obtained by graft polymerizing an aromatic vinyl monomer and acrylonitrile, MABS resin obtained by graft polymerizing an aromatic vinyl monomer, methyl methacrylate, and acrylonitrile to polybutadiene, etc. may be blended.
以上のように、本発明の塩化ビニル系樹脂組成物は、耐
熱性にすぐれるとともに、良好な加工性を備え、しかも
耐衝撃性や色相をも満足するものであるため、自動車部
品、家電製品、建材などの各種の分野で幅広く使用する
ことができる。As described above, the vinyl chloride resin composition of the present invention has excellent heat resistance, good processability, and satisfies impact resistance and color, so it can be used in automobile parts and home appliances. , can be widely used in various fields such as building materials.
つぎに、本発明を参考例、実施例および比較例によって
具体的に説明する。なお、以下に部および％とあるのは
、それぞれ重量部および重量％を意味するものとする。Next, the present invention will be specifically explained using reference examples, working examples, and comparative examples. Note that parts and % below mean parts by weight and % by weight, respectively.
〈Ｂ成分のエポキシ基含有熱可塑性樹脂の製造〉参考例
１
重合釜にスチレン６００部を仕込み、撹拌しながら窒素
置換して１１０℃まで昇温し、この温度に達すると、グ
リシジルメタクリレート５部およびベンゾイルパーオキ
サイド０．３１部をスチレン３００部に溶解した溶液を
３５２分ががって定量的に滴下し、重合を続けた。<Manufacture of epoxy group-containing thermoplastic resin as component B> Reference Example 1 600 parts of styrene was charged into a polymerization kettle, the atmosphere was replaced with nitrogen while stirring, and the temperature was raised to 110°C. When this temperature was reached, 5 parts of glycidyl methacrylate and A solution of 0.31 parts of benzoyl peroxide dissolved in 300 parts of styrene was quantitatively added dropwise over a period of 352 minutes to continue polymerization.
滴下終了後、温度を５０℃まで急冷し、少量のサンプル
を取り出して固形分を調べたところ４１゜２％であった
。また、重合液中のグリシジルメタクリレートをガスク
ロマトグラフィーで調べたところ、グリシジルメタクリ
レートは検出されなかった。この重合液を減圧乾燥して
、エポキシ基含有熱可塑性樹脂を得た。この樹脂をテト
ラヒドロフランに溶解し、ゲルパーミェーションクロマ
トグラフィー（Ｇ Ｐ Ｃ）によって、その重量平均分
子量を調べたところ、１５８，０００であった。After the dropwise addition was completed, the temperature was rapidly cooled to 50°C, a small sample was taken out, and the solid content was examined and found to be 41°2%. Furthermore, when glycidyl methacrylate in the polymerization solution was examined by gas chromatography, no glycidyl methacrylate was detected. This polymerization solution was dried under reduced pressure to obtain an epoxy group-containing thermoplastic resin. When this resin was dissolved in tetrahydrofuran and its weight average molecular weight was examined by gel permeation chromatography (GPC), it was found to be 158,000.
参考例２
重合釜にスチレン６００部とアクリロニトリル５０部と
を仕込み、撹拌してよく混合したのち、窒素置換して１
０５℃まで昇温し、この温度に達すると、グリシジルメ
タクリレート１０部、Ｎ−フェニルマレイミド６０部お
よびベンゾイルパーオキサイド０．２８部をスチレン４
００部に溶解した溶液を３６５分かかつて定量的に滴下
し、重合を続けた。Reference Example 2 600 parts of styrene and 50 parts of acrylonitrile were placed in a polymerization pot, stirred to mix well, and then replaced with nitrogen.
When the temperature is increased to 0.05°C, 10 parts of glycidyl methacrylate, 60 parts of N-phenylmaleimide and 0.28 parts of benzoyl peroxide are added to 4 parts of styrene.
00 parts of the solution was quantitatively added dropwise over 365 minutes to continue polymerization.
滴下終了後、温度を５０℃まで急冷し、少量のサンプル
を取り出して固形分を調べたところ４２゜７％であった
。また、重合液中のスチレン以外の未反応単量体を前記
同様に調べたところ、グリシジルメタクリレートとＮ−
フェニルマレイミドは検出されず、アクリロニトリルが
０．７４％（対重合液）含まれていた。この重合液を減
圧乾燥して、エポキシ基含有熱可塑性樹脂を得た。この
樹脂の重量平均分子量を前記同様にして調べたところ、
２０７．０００であった。After the dropwise addition was completed, the temperature was rapidly cooled to 50°C, a small sample was taken out, and the solid content was examined and found to be 42.7%. In addition, when unreacted monomers other than styrene in the polymerization solution were investigated in the same manner as above, glycidyl methacrylate and N-
Phenylmaleimide was not detected, and acrylonitrile was contained at 0.74% (based on the polymerization solution). This polymerization solution was dried under reduced pressure to obtain an epoxy group-containing thermoplastic resin. When the weight average molecular weight of this resin was investigated in the same manner as above, it was found that
It was 207.000.
参考例３〜９
重合釜仕込量とその組成、滴下液の組成とその量、重合
温度および滴下時間を、第１表に示すようにした以外は
、参考例１と同様に重合し、さらに減圧乾燥して７種の
エポキシ基含有熱可塑性樹脂を得た０重合後の未反応単
量体および固形分を参考例１と同様にして調べた。未反
応単量体については、グリシジルメタクリレート、メチ
ルメタクリレートおよびマレイミド化合物はいずれも検
出されなかった。未反応のアクリロニトリル量および固
形分の測定結果を、前記同様にして調べた樹脂の重量平
均分子量とともに、参考例１．２の結果と併せて、第１
表に示す。Reference Examples 3 to 9 Polymerization was carried out in the same manner as in Reference Example 1, except that the amount charged in the polymerization pot and its composition, the composition and amount of the dropping liquid, the polymerization temperature, and the dropping time were as shown in Table 1. After drying, seven types of epoxy group-containing thermoplastic resins were obtained, and the unreacted monomer and solid content after zero polymerization were examined in the same manner as in Reference Example 1. Regarding unreacted monomers, none of glycidyl methacrylate, methyl methacrylate, and maleimide compounds were detected. The measurement results of the amount of unreacted acrylonitrile and the solid content, together with the weight average molecular weight of the resin examined in the same manner as above, and the results of Reference Example 1.2,
Shown in the table.
なお、第１表中、Ｓｔはスチレン、α−Ｍｅ −Ｓｔは
α−メチルスチレン、ＡＮはアクリロニトリル、ＧＭＡ
はグリシジルメタクリレート、ＣＨＭｌはＮ−シクロヘ
キシルマレイミド、ＰＭＩはＮ−フェニルマレイミド、
ＭＭＡはメチルメタクリレート、ＢＰＯはベンゾイルパ
ーオキサイドである。In Table 1, St is styrene, α-Me-St is α-methylstyrene, AN is acrylonitrile, GMA
is glycidyl methacrylate, CHMl is N-cyclohexylmaleimide, PMI is N-phenylmaleimide,
MMA is methyl methacrylate and BPO is benzoyl peroxide.
参考例１０
撹拌機付き四つロフラスコに脱イオン水６３０部および
ポリビニルアルコール〔ポバールＰＶＡ２２０、■クレ
ラ製）０．３２部を仕込み、窒素置換後昇温して８０℃
でポリビニルアルコールを溶解した。これを冷却して４
０℃にし、これにあらかじめアクリロニトリル２０部、
Ｎ−フェニルマレイミド４３部、グリシジルメタクリレ
ート６部およびベンゾイルパーオキサイド９．２部をス
チレン２００部に溶解しておいた溶液を加え、窒素ガス
雰囲気下、４２Ｏｒｐｍの撹拌でよく混合しながら１５
分かかつて懸濁状態にし、昇温して８０’Ｃにし、重合
を開始した。その後９時間かかつて重合をつづけ、さら
に９０℃にして２時間かかって重合を完結させた。Reference Example 10 630 parts of deionized water and 0.32 parts of polyvinyl alcohol (Poval PVA220, ■ manufactured by Kurera) were placed in a four-roof flask equipped with a stirrer, and after purging with nitrogen, the temperature was raised to 80°C.
Polyvinyl alcohol was dissolved. Cool this and 4
0°C, add 20 parts of acrylonitrile in advance,
A solution of 43 parts of N-phenylmaleimide, 6 parts of glycidyl methacrylate, and 9.2 parts of benzoyl peroxide dissolved in 200 parts of styrene was added, and the mixture was stirred at 42 Orpm under a nitrogen gas atmosphere for 15 minutes.
The mixture was suspended for a few minutes and then heated to 80'C to initiate polymerization. Thereafter, the polymerization was continued for about 9 hours, and then the temperature was raised to 90° C. for 2 hours to complete the polymerization.
このようにして得られた水懸濁液をろ過し、脱イオン水
で充分に洗ったのち乾燥して、粒状のエポキシ基含有熱
可塑性樹脂を得た。この樹脂の重量平均分子量を前記同
様にして調べたところ、１６３．０００であった。The aqueous suspension thus obtained was filtered, thoroughly washed with deionized water, and then dried to obtain a granular epoxy group-containing thermoplastic resin. The weight average molecular weight of this resin was determined in the same manner as above and was found to be 163.000.
参考例１１
単量体組成をグリシジルメタクリレート６部、メチルメ
タクリレート２６５部およびベンゾイルパーオキサイド
７．４部とした以外は、参考例１０と同様にして、粒状
のエポキシ基含有熱可塑性樹脂を得た。この樹脂の重量
平均分子量を前記同様にして調べたところ、１７９，０
００であった。Reference Example 11 A granular epoxy group-containing thermoplastic resin was obtained in the same manner as Reference Example 10, except that the monomer composition was 6 parts of glycidyl methacrylate, 265 parts of methyl methacrylate, and 7.4 parts of benzoyl peroxide. When the weight average molecular weight of this resin was examined in the same manner as above, it was found to be 179.0.
It was 00.
参考例１２
単量体組成をグリシジルメタクリレート５部、メチルメ
タクリレート２００部、アクリロニトリル６０部および
ベンゾイルパーオキサイド８．９部とした以外は、参考
例１０と同様にして、粒状のエポキシ含有熱可塑性樹脂
を得た。この樹脂の重量平均分子量を前記同様にして調
べたところ、１３４．０００であった。Reference Example 12 A granular epoxy-containing thermoplastic resin was prepared in the same manner as Reference Example 10, except that the monomer composition was 5 parts of glycidyl methacrylate, 200 parts of methyl methacrylate, 60 parts of acrylonitrile, and 8.9 parts of benzoyl peroxide. Obtained. The weight average molecular weight of this resin was determined in the same manner as above and was found to be 134.000.
〈Ｃ成分の熱可塑性樹脂の製造〉
参考例１３
重合釜にスチレン５５０部とアクリロニトリル４５部と
を仕込み、よく混合したのち、撹拌しながら窒素置換し
て１０５℃まで昇温し、この温度に達すると、Ｎ−シク
ロヘキシルマレイミド７０部およびベンゾイルパーオキ
サイド０．２７部をスチレン５００部に溶解した溶液を
３７４分かかつて定量的に滴下し、重合を続けた。<Manufacture of thermoplastic resin of component C> Reference Example 13 550 parts of styrene and 45 parts of acrylonitrile were placed in a polymerization kettle, mixed well, and then replaced with nitrogen while stirring and heated to 105°C. Then, a solution of 70 parts of N-cyclohexylmaleimide and 0.27 parts of benzoyl peroxide dissolved in 500 parts of styrene was quantitatively added dropwise over 374 minutes to continue polymerization.
滴下終了後、反応系の温度を５０℃まで急冷し、少量の
サンプルを取り出して固形分を調べたところ４２．４％
であった。また、重合液中のスチレン以外の未反応単量
体を参考例１と同様に調べたとコロ、Ｎ−シクロへキシ
ルマレイミドは検出されなかったが、アクリロニトリル
は０．７３％（対重合液）含まれていた。この重合液を
減圧乾燥して、熱可塑性樹脂を得た。この樹脂の重量平
均分子量を前記同様にして調べたところ、１８４，００
０であった。After the dropwise addition was completed, the temperature of the reaction system was rapidly cooled to 50°C, a small sample was taken out, and the solid content was examined and found to be 42.4%.
Met. In addition, when unreacted monomers other than styrene in the polymerization solution were examined in the same manner as in Reference Example 1, no coro-N-cyclohexylmaleimide was detected, but 0.73% (based on the polymerization solution) of acrylonitrile was detected. It was. This polymerization solution was dried under reduced pressure to obtain a thermoplastic resin. The weight average molecular weight of this resin was examined in the same manner as above and was found to be 184,000.
It was 0.
参考例１４〜２１
重合釜仕込量とその組成、滴下液の組成とその量、重合
温度および重合時間を、第２表に示すようにした以外は
、参考例１３と同様に重合し、減圧乾燥して８種の熱可
塑性樹脂を得た０重合後の未反応単量体および固形分を
参考例１と同様にして調べた。未反応単量体については
、無水マレイン酸、マレイミド化合物およびメチルメタ
クリレートはいずれも検出されなかった。未反応のアク
リロニトリル量および固形分の測定結果を、前記同様に
して調べた樹脂の重量平均分子量とともに、参考例１３
の結果と併せて、第２表に示す。Reference Examples 14-21 Polymerization was carried out in the same manner as in Reference Example 13, except that the amount charged in the polymerization pot and its composition, the composition and amount of the dropping liquid, the polymerization temperature, and the polymerization time were as shown in Table 2, and then dried under reduced pressure. Eight types of thermoplastic resins were obtained, and the unreacted monomer and solid content after zero polymerization were examined in the same manner as in Reference Example 1. Regarding unreacted monomers, maleic anhydride, maleimide compound, and methyl methacrylate were not detected. The measurement results of the amount of unreacted acrylonitrile and the solid content, together with the weight average molecular weight of the resin examined in the same manner as above, were measured in Reference Example 13.
The results are shown in Table 2.
なお、第２表中、ＭＡＮは無水マレイン酸を示し、他は
第１表と同様である。In addition, in Table 2, MAN represents maleic anhydride, and the others are the same as in Table 1.
く塩化ビニル系樹脂組成物の調製〉
実施例Ｉ
Ａ成分の塩化ビニル樹脂〔住人化学■製のスミリット５
Ｘ−１１Ｆ、重合度１，０５０）１００部と、参考例２
で得られたＢ成分のエポキシ基含有熱可塑性樹脂２部と
、参考例１４で得られたＣ成分の熱可塑性樹脂１０部と
、下記に示す各種の添加剤とを、ヘンシェルミキサーで
混合した。Preparation of vinyl chloride resin composition> Example I Vinyl chloride resin of component A [Sumilit 5 manufactured by Juju Kagaku ■
X-11F, degree of polymerization 1,050) 100 parts and Reference Example 2
2 parts of the epoxy group-containing thermoplastic resin as component B obtained in Reference Example 14, 10 parts of the thermoplastic resin as component C obtained in Reference Example 14, and various additives shown below were mixed in a Henschel mixer.
ステアリン酸鉛 １．０部ステアリン
酸バリウム ０．７部３塩基性硫酸鉛
１．９部つぎに、この混合物を表面温度が
１８５℃に加熱された熱ロールで５分間混練してシート
とし、これを平板プレスを用いて１９０℃、１００ｋｇ
／−の条件で１０分間プレス成形して、塩化ビニル系樹
脂組成物からなる試験片を作製した。Lead stearate 1.0 part Barium stearate 0.7 part Tribasic lead sulfate
1.9 parts Next, this mixture was kneaded for 5 minutes with a hot roll heated to a surface temperature of 185°C to form a sheet, which was then kneaded using a flat plate press at 190°C and 100 kg.
A test piece made of a vinyl chloride resin composition was prepared by press molding for 10 minutes under the conditions of /-.
つぎに、この試験片を用いて、下記の要領で、ビカット
軟化温度、アイゾツト衝撃強度およびメルトフローレー
トを測定した。また、試験片の色相として、スガ試験機
■製のＳＭオカラ−ンピューターを用いて、白色度を測
定した。これらの測定結果を、後記の第３表に示す。Next, using this test piece, the Vicat softening temperature, Izod impact strength, and melt flow rate were measured in the following manner. In addition, as for the hue of the test piece, the whiteness was measured using an SM Ocolor computer manufactured by Suga Test Instruments. These measurement results are shown in Table 3 below.
ビカット軟化温度 ： ＪＩＳ Ｋ７２０６． Ａ報ア
イゾツト衝撃強度： ＪＩＳ Ｋ７１１０．ノツチ付実
施例２〜１６および比較例１〜１４
Ｂ成分のエポキシ基含有熱可塑性樹脂、Ｃ成分の熱可塑
性樹脂の種類および量を、第３表に示すように変更した
以外は、実施例１と同様にして、塩化ビニル系樹脂組成
物からなる種々の試験片を作製した。この各試験片につ
き、実施例１と同様に物性を測定した結果を、第３表に
示す。Vicat softening temperature: JIS K7206. A report Izot impact strength: JIS K7110. Notched Examples 2 to 16 and Comparative Examples 1 to 14 Example 1 except that the type and amount of the epoxy group-containing thermoplastic resin as component B and the thermoplastic resin as component C were changed as shown in Table 3. In the same manner as above, various test pieces made of vinyl chloride resin compositions were prepared. The physical properties of each test piece were measured in the same manner as in Example 1, and the results are shown in Table 3.
実施例１７
日成分のエポキシ基含有熱可塑性樹脂として、エチレン
−酢酸ビニル−グリシジルメタクリレート共重合体〔ボ
ンドファース）２Ｂ （住友化学工業■製）〕を用い、
第３表に示す配合組成とし、他は実施例１と同様にして
試験片を作製した。この試験片を用いて、実施例１と同
様に物性を測定した結果を、第３表に示す。Example 17 Ethylene-vinyl acetate-glycidyl methacrylate copolymer [Bondfirth 2B (manufactured by Sumitomo Chemical Co., Ltd.)] was used as the epoxy group-containing thermoplastic resin of Nichiseng.
A test piece was prepared in the same manner as in Example 1 except that the composition shown in Table 3 was used. Using this test piece, the physical properties were measured in the same manner as in Example 1, and the results are shown in Table 3.
比較例１５
Ａ成分の塩化ビニル樹脂の使用部数を１００部に変更し
、Ｂ成分のエポキシ基含有熱可塑性樹脂とＣ成分の熱可
塑性樹脂を全く使用せず、他は実施例１と同様にして試
験片を作製した。この試験片を用いて、実施例１と同様
に物性を測定した結果を、第３表に示す。Comparative Example 15 The number of parts used of the vinyl chloride resin of the A component was changed to 100 parts, and the epoxy group-containing thermoplastic resin of the B component and the thermoplastic resin of the C component were not used at all, but the other conditions were the same as in Example 1. A test piece was prepared. Using this test piece, the physical properties were measured in the same manner as in Example 1, and the results are shown in Table 3.
上記の第３表の結果から明らかなように、本発明の塩化
ビニル系樹脂組成物は、いずれも非常に改善された耐熱
性を有するうえに、良好な加工性をも備えており、また
耐衝撃性や色相の面でも満足できるものであることがわ
かる。As is clear from the results in Table 3 above, the vinyl chloride resin compositions of the present invention not only have greatly improved heat resistance, but also have good processability. It can be seen that the impact resistance and hue are also satisfactory.
Claims (1)
キシ基含有ビニル単量体０．３〜５重量％とこれと共重
合可能なビニル単量体９５〜９９．７重量％との共重合
体からなるエポキシ基含有熱可塑性樹脂０．３〜１０重
量部と、 Ｃ）不飽和ジカルボン酸無水物０．３〜５重量％とマレ
イミド化合物５〜４０重量％とアクリル酸アルキルエス
テルおよび／またはメタクリル酸アルキルエステル０〜
２５重量％とシアン化ビニル単量体５〜２５重量％と芳
香族ビニル単量体４５〜８９．７重量％との共重合体か
らなる熱可塑性樹脂５〜５０重量部とを、 ブレンドしたことを特徴とする塩化ビニル系樹脂組成物
。(1) A) 100 parts by weight of vinyl chloride resin, B) 0.3 to 5% by weight of an epoxy group-containing vinyl monomer and 95 to 99.7% by weight of a vinyl monomer copolymerizable therewith. 0.3 to 10 parts by weight of an epoxy group-containing thermoplastic resin consisting of a copolymer, C) 0.3 to 5% by weight of an unsaturated dicarboxylic anhydride, 5 to 40% by weight of a maleimide compound, an acrylic acid alkyl ester, and/or or methacrylic acid alkyl ester 0~
25% by weight and 5 to 50 parts by weight of a thermoplastic resin consisting of a copolymer of 5 to 25% by weight of vinyl cyanide monomer and 45 to 89.7% by weight of aromatic vinyl monomer. A vinyl chloride resin composition characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14351789A JPH039942A (en) | 1989-06-06 | 1989-06-06 | Vinyl chloride resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14351789A JPH039942A (en) | 1989-06-06 | 1989-06-06 | Vinyl chloride resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH039942A true JPH039942A (en) | 1991-01-17 |
Family
ID=15340583
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14351789A Pending JPH039942A (en) | 1989-06-06 | 1989-06-06 | Vinyl chloride resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH039942A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116162202A (en) * | 2022-12-09 | 2023-05-26 | 江苏越科新材料有限公司 | Epoxy chain extender, and preparation method and application thereof |
-
1989
- 1989-06-06 JP JP14351789A patent/JPH039942A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116162202A (en) * | 2022-12-09 | 2023-05-26 | 江苏越科新材料有限公司 | Epoxy chain extender, and preparation method and application thereof |
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