JPH0279041U - - Google Patents
Info
- Publication number
- JPH0279041U JPH0279041U JP15862488U JP15862488U JPH0279041U JP H0279041 U JPH0279041 U JP H0279041U JP 15862488 U JP15862488 U JP 15862488U JP 15862488 U JP15862488 U JP 15862488U JP H0279041 U JPH0279041 U JP H0279041U
- Authority
- JP
- Japan
- Prior art keywords
- device hole
- hole structure
- chip
- inner lead
- recesses
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Description
第１図はこの考案がわかる実施例のインナーキ
ヤリアデバイス部の平面図、第２図は第１図の断
面図、第３図は従来のフイルムキヤリアとＩＣチ
ツプの関係を示す説明図である。
１……ＩＣチツプ、２……バンプ、３……フイ
ルム、４……銅箔パターン、５……インナーリー
ド、６……凹み。
FIG. 1 is a plan view of an inner carrier device portion of an embodiment in which this invention can be understood, FIG. 2 is a sectional view of FIG. 1, and FIG. 3 is an explanatory diagram showing the relationship between a conventional film carrier and an IC chip. 1...IC chip, 2...bump, 3...film, 4...copper foil pattern, 5...inner lead, 6...dent.
Claims (1)
アのＩＣチツプを実装するデバイス穴構造におい
て、デバイス穴の４つのコーナに、凹みを付けた
事を特徴とするフイルムキヤリアのデバイス穴構
造。 A device hole structure of a film carrier for inner lead bonding in which an IC chip is mounted, the device hole structure having recesses at four corners of the device hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15862488U JPH0279041U (en) | 1988-12-06 | 1988-12-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15862488U JPH0279041U (en) | 1988-12-06 | 1988-12-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0279041U true JPH0279041U (en) | 1990-06-18 |
Family
ID=31439116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15862488U Pending JPH0279041U (en) | 1988-12-06 | 1988-12-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0279041U (en) |
-
1988
- 1988-12-06 JP JP15862488U patent/JPH0279041U/ja active Pending