JPH0394988A - Method for cutting prepreg - Google Patents
Method for cutting prepregInfo
- Publication number
- JPH0394988A JPH0394988A JP1229494A JP22949489A JPH0394988A JP H0394988 A JPH0394988 A JP H0394988A JP 1229494 A JP1229494 A JP 1229494A JP 22949489 A JP22949489 A JP 22949489A JP H0394988 A JPH0394988 A JP H0394988A
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- prepreg
- resin
- cut
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title claims abstract description 23
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910002092 carbon dioxide Inorganic materials 0.000 claims abstract description 4
- 239000001569 carbon dioxide Substances 0.000 claims abstract description 4
- 239000011347 resin Substances 0.000 abstract description 13
- 229920005989 resin Polymers 0.000 abstract description 13
- 239000000835 fiber Substances 0.000 abstract description 11
- 230000003749 cleanliness Effects 0.000 abstract description 5
- 239000000428 dust Substances 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 8
- 239000010410 layer Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、プリプレグの切断加工方法に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for cutting prepreg.
各種電子機器に使用される印刷配線板は、ブリプレグと
銅箔を重ね合せた後檀層戒形し、銅張積層板の鋼箔をエ
ッチング処理を施こすことにより、ｂ路を形戒させたも
のであり、さらに多層印刷配線板は、回路形成を施こし
た内層材とプリプレグを重ね合せた後成形したものであ
る。広く使われているプリプレグは・檀Ｎ戒形前に所定
０大きさに切断し利用されている。Printed wiring boards used in various electronic devices are made by layering B-preg and copper foil, then etching the steel foil of the copper-clad laminate to form the b-line. Moreover, the multilayer printed wiring board is formed by laminating an inner layer material on which a circuit is formed and a prepreg, and then molding the board. Prepreg, which is widely used, is cut into a predetermined size before being used.
従来のプリプレグの切断加工方法には、ぜん断力による
スコープシャーが主として用いられ、また別な方法とし
ては、一転のこ歯、目転ダイヤモンドカッター等により
切断加工処理が施こされ、いずれも刃物により実施され
ていた、
〔発明が解決しようとする課題・〕
一般にプリント配線基板は、銅張檀層板から戒り、プリ
プレグと銅箔を所要の大きさに切断した後、片面銅張積
層板の場合は接着層のプリプレグ１枚以上の上に銅箔を
１枚重ね加熱硬化したものである○
一方、両面銅張橿層板の場合は、プリプレグを１枚以上
と銅箔２枚を樹脂含浸基材の上下に重ね加熱硬化したも
のである。Conventional prepreg cutting methods mainly use a scope shear using shear force, and other methods include cutting with a saw tooth or a diamond cutter, both of which require cutting tools. [Problem to be solved by the invention] Printed wiring boards are generally made from copper-clad laminates, and after cutting the prepreg and copper foil to the required size, they are made from single-sided copper-clad laminates. In the case of , one layer of copper foil is placed on one or more sheets of adhesive layer prepreg and cured by heating. On the other hand, in the case of double-sided copper-clad laminate, one or more sheets of prepreg and two sheets of copper foil are combined with resin. It is layered on top and bottom of an impregnated base material and cured by heating.
さらに公知のテンティング、金属レジスト方式にまり銅
箔のエッチング処理を施こすことにより回路を形或し、
プリント配線板が得られるが、鋼張槓層板の檀層戒形時
において、プリプレグと銅箔を櫨層丁る際、上記の従来
の切断加工処理を施こされたプリプレグは、基材の端面
部から銅箔の上に繊維クズが落下付着し、打こんを生じ
るなどの問題がある。また、樹脂クズが銅箔の上に落下
付看し、樹脂の付着硬化などの問題点がある。Furthermore, the circuit is formed by etching the copper foil using the known tenting and metal resist methods.
A printed wiring board can be obtained, but when cutting the prepreg and copper foil into the wood layer of the steel-clad laminated board, the prepreg that has been subjected to the conventional cutting process described above is There are problems such as fiber debris falling and adhering to the copper foil from the end face, causing dents. Further, there are problems such as resin debris falling onto the copper foil and resin adhesion and hardening.
なお、第２図は従来の切断加工方法のシャーにより、０
．１ｔのＦＢ−４ブリプレグシ一トを切断した断面を示
すもので、図において、ｌはプリプレグ、２は樹脂、３
は繊維、◆はクランクを示す。In addition, Fig. 2 shows that the shear of the conventional cutting method
．． This shows a cross section of a 1t FB-4 prepreg sheet. In the figure, l is prepreg, 2 is resin, and 3 is prepreg.
indicates fiber, and ◆ indicates crank.
すなわち、上記の従来切断加工方法の場合、レジストを
ラミネートする際、打こんによるレジストの密着力の低
下、向路形成のエッチング処理の際は、導体パターンの
欠け、断線、樹脂付着により所望の導体パターンが得る
のが困難であるなどＤ問題点があった。In other words, in the case of the above-mentioned conventional cutting method, when laminating the resist, the adhesion of the resist decreases due to denting, and during the etching process for forming the direction path, the desired conductor may be damaged due to chipping, disconnection, or resin adhesion of the conductor pattern. There were problems D, such as difficulty in obtaining a pattern.
この発明は従来のプリプレグの切断加工方法における上
記問題点を解消するためになされたもので、従来０方法
に比べ切断加工端面部の仕上り精度を向上させ、さらに
切断加工端面部の清浄性の高いもσ〕を得る方法を提供
下るものである。This invention was made to solve the above-mentioned problems in the conventional prepreg cutting method, and it improves the finishing accuracy of the cutting end surface compared to the conventional method 0, and also improves the cleanliness of the cutting end surface. We also provide a method for obtaining σ].
この発明に係るブリプレグＯＪ切断加工方法は、プリブ
レグを炭酸ガスレーザ装置を使用して切断するものであ
る。The pre-preg OJ cutting method according to the present invention cuts the pre-preg using a carbon dioxide laser device.
この発明の切断加工方法によれば、切断加工端面部の樹
脂層のクランク、樹脂クズを防止し、さらに繊維の突き
出し、繊維クズを防止し、従来の切断加工方法に比べて
、切断端面部の清浄性を大巾に向上するもので、その仕
上り精度は著しく向上する。According to the cutting method of the present invention, it is possible to prevent cranking and resin waste of the resin layer at the cut end surface, and further prevent fiber protrusion and fiber waste, and to improve the cutting end surface area compared to the conventional cutting method. This greatly improves cleanliness and the finishing accuracy.
以下、この発明の実施例を第１図を用いて説明する。な
お第１図において、１はプリプレグ、２は樹脂、３は繊
維を示丁。An embodiment of the present invention will be described below with reference to FIG. In Fig. 1, 1 indicates prepreg, 2 indicates resin, and 3 indicates fiber.
ｌ）レーザ加工機を用いて、Ｏ．ｔｔを有丁る多層プリ
ント配１ｇ板ＦＲ−４ブリプレグシ一トを、アシストガ
スとして、アルゴンガス、出力５０ Ｗ ％パルス周波
数５００ＨＺ，７１０工運度５ｍ／分の条件下において
切断加工処理を実施し、第１図に示すような切断端面の
断面を得た。l) Using a laser processing machine, O. Cutting process was carried out on a multilayer printed 1g board FR-4 preg sheet with tt under the conditions of argon gas as assist gas, output of 50 W%, pulse frequency of 500 Hz, and 710 speed of 5 m/min. A cross section of the cut end surface as shown in FIG. 1 was obtained.
２）ｏ．２ｔを有するＥＲ−４ブリプレグシ一トを、ア
シストガスとしてアルゴンガス、出力５０Ｗ％パルス周
波数７００Ｈｚ，加工速度５ｍｌ分の条件下において切
断加工処理を実施し、第１図に示Ｔような破断面を得た
。2) o. An ER-4 blip sheet with a weight of 2t was cut under the conditions of argon gas as an assist gas, an output of 50W%, a pulse frequency of 700Hz, and a processing speed of 5ml, resulting in a fracture surface as shown in Fig. 1. Obtained.
本発明の上記の切断加工方法によれば、切断加工の際、
切断応力による樹脂層のクランク発生、樹脂クズを防止
し、さらに繊維の突き出し、繊維クズを防止し、他への
汚染を防ぐことができ、従来の切断加工方法に比べて、
切断端面部の清浄性を大巾に向上させ、その仕上り寸法
も著しく向上させるものである。According to the above cutting method of the present invention, during cutting,
This method prevents cranking of the resin layer due to cutting stress and resin waste, as well as protrusion of fibers and fiber waste, and prevents contamination of others, compared to conventional cutting methods.
This greatly improves the cleanliness of the cut end surface and also significantly improves the finished dimensions.
なお上記実施例では、ＦＲ−４材のブリプレグシ一トの
切断加工方法について説明したが、ＢＴ材、ポリイミド
材の切断加工であってもよく、上記実施例と同様の効果
を奏する〇
〔発明の効果〕
以上のようにこの発明によれば、プリプレグの切断端面
部が従来のものに比べ、大巾に清浄性が向上し、さらに
仕上り寸法精度が著しく向上丁る。In the above embodiment, the method of cutting the FR-4 material Brippleg sheet was explained, but it may also be a cutting process of BT material or polyimide material, and the same effect as in the above embodiment can be achieved. Effects] As described above, according to the present invention, the cleanliness of the cut end face of the prepreg is greatly improved compared to the conventional one, and the finished dimensional accuracy is also significantly improved.
したがって、本発明の切断方法により得られたプリブレ
グは、他への汚染を防止することができる。Therefore, the pre-reg obtained by the cutting method of the present invention can be prevented from contaminating others.
第１図はこの発明の切断方法により得られたプリプレグ
の一部の断面図、第２図は従来の切断方法により得られ
たブリプレグの一部の断面図である。
図中、１はブリプレグ、２は樹脂、３は繊維である。
なお図中向一符号は向−または相当部分を示丁。FIG. 1 is a sectional view of a portion of a prepreg obtained by the cutting method of the present invention, and FIG. 2 is a sectional view of a portion of a prepreg obtained by a conventional cutting method. In the figure, 1 is Bripreg, 2 is resin, and 3 is fiber. In addition, the direction symbol in the figure indicates the direction or the corresponding part.
Claims (1)
いて切断加工することを特徴とするプリプレグの切断加
工方法。A method for cutting prepreg, the method comprising cutting the prepreg using a carbon dioxide laser.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1229494A JPH0394988A (en) | 1989-09-05 | 1989-09-05 | Method for cutting prepreg |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1229494A JPH0394988A (en) | 1989-09-05 | 1989-09-05 | Method for cutting prepreg |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0394988A true JPH0394988A (en) | 1991-04-19 |
Family
ID=16893048
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1229494A Pending JPH0394988A (en) | 1989-09-05 | 1989-09-05 | Method for cutting prepreg |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0394988A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1323505A2 (en) * | 2001-12-25 | 2003-07-02 | Matsushita Electric Works, Ltd. | Method and apparatus for cutting prepreg |
| JP2008277415A (en) * | 2007-04-26 | 2008-11-13 | Kyocera Corp | Substrate having built-in electronic component and manufacturing method thereof |
| JP2012087190A (en) * | 2010-10-18 | 2012-05-10 | Mitsubishi Rayon Co Ltd | Method for production of prepreg having discontinuous fiber |
| JP2012087191A (en) * | 2010-10-18 | 2012-05-10 | Mitsubishi Rayon Co Ltd | Method for production of prepreg having discontinuous fiber |
-
1989
- 1989-09-05 JP JP1229494A patent/JPH0394988A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1323505A2 (en) * | 2001-12-25 | 2003-07-02 | Matsushita Electric Works, Ltd. | Method and apparatus for cutting prepreg |
| US6621046B2 (en) | 2001-12-25 | 2003-09-16 | Matsushita Electric Works, Ltd. | Method of manufacturing prepreg |
| EP1323505A3 (en) * | 2001-12-25 | 2004-01-02 | Matsushita Electric Works, Ltd. | Method and apparatus for cutting prepreg |
| JP2008277415A (en) * | 2007-04-26 | 2008-11-13 | Kyocera Corp | Substrate having built-in electronic component and manufacturing method thereof |
| JP2012087190A (en) * | 2010-10-18 | 2012-05-10 | Mitsubishi Rayon Co Ltd | Method for production of prepreg having discontinuous fiber |
| JP2012087191A (en) * | 2010-10-18 | 2012-05-10 | Mitsubishi Rayon Co Ltd | Method for production of prepreg having discontinuous fiber |
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