JPH0387341A - Manufacture of high strength phosphor bronze having good bendability - Google Patents
Manufacture of high strength phosphor bronze having good bendabilityInfo
- Publication number
- JPH0387341A JPH0387341A JP22152589A JP22152589A JPH0387341A JP H0387341 A JPH0387341 A JP H0387341A JP 22152589 A JP22152589 A JP 22152589A JP 22152589 A JP22152589 A JP 22152589A JP H0387341 A JPH0387341 A JP H0387341A
- Authority
- JP
- Japan
- Prior art keywords
- phosphor bronze
- strength
- workability
- bronze
- bending workability
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000906 Bronze Inorganic materials 0.000 title claims abstract description 40
- 239000010974 bronze Substances 0.000 title claims abstract description 40
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 title claims abstract description 40
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims abstract description 38
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 19
- 229910000765 intermetallic Inorganic materials 0.000 claims abstract description 18
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 16
- 238000000137 annealing Methods 0.000 claims abstract description 15
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 4
- 239000012535 impurity Substances 0.000 claims abstract description 4
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 4
- 229910052742 iron Inorganic materials 0.000 claims abstract description 3
- 229910052745 lead Inorganic materials 0.000 claims abstract description 3
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 3
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 3
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 3
- 229910052782 aluminium Inorganic materials 0.000 claims abstract 2
- 229910052710 silicon Inorganic materials 0.000 claims abstract 2
- 238000005452 bending Methods 0.000 claims description 35
- 239000013078 crystal Substances 0.000 claims description 11
- 239000002244 precipitate Substances 0.000 claims description 7
- 238000001953 recrystallisation Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims 2
- 229910002092 carbon dioxide Inorganic materials 0.000 claims 1
- 239000001569 carbon dioxide Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 abstract description 4
- 229910052748 manganese Inorganic materials 0.000 abstract description 2
- 230000001105 regulatory effect Effects 0.000 abstract 2
- 230000002542 deteriorative effect Effects 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 13
- 239000000463 material Substances 0.000 description 12
- 229910000679 solder Inorganic materials 0.000 description 9
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 7
- 230000007797 corrosion Effects 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 6
- 239000010949 copper Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000005096 rolling process Methods 0.000 description 5
- 238000005482 strain hardening Methods 0.000 description 5
- 238000005097 cold rolling Methods 0.000 description 4
- 238000005336 cracking Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 239000006104 solid solution Substances 0.000 description 4
- 238000005728 strengthening Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 3
- 241000238413 Octopus Species 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- -1 Al5Si Substances 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 239000010956 nickel silver Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明の製造方法は、電子部品を始めとする高強度でか
つ良好な曲げ加工性が要求され、場合によっては高いば
ね性が要求されるあらゆる分野の製品に利用可能である
。[Detailed Description of the Invention] [Industrial Field of Application] The manufacturing method of the present invention is applicable to electronic parts and other products that require high strength and good bending workability, and in some cases, high springiness. It can be used for products in all fields.
［従来の技術］
従来強度が要求される電子部品には、黄銅、洋白、りん
青銅、ベリリウム銅等の銅合金や、ステンレス等の鉄合
金が用いられている。これらの電子部品用の材料の中で
、りん青銅は強度も高く、曲げ加工性、耐食性、耐応力
腐食割れ性も良好であり、広く利用されている。しかし
、近年、部品の小型化に伴ない、電子部品用の材料も薄
肉化の傾向があり、そうした場合、材料には高強度であ
ることが要求されるようになった。ところかりん青銅の
強化機構はＣｕ中へのＳｎの固溶強化と冷間加工（圧延
）による加工硬化の組み合せによるものであり、高強度
なりん青銅を得ようとすると、冷間圧延の加工度を高く
しなければならず、そのため曲げ加工性が悪くなる。特
に曲げ軸が圧延方向に対し平行方向の曲げ加工性が悪く
なる。また、りん青銅の加工硬化による強度の向上もお
のずと限界がある。[Prior Art] Conventionally, copper alloys such as brass, nickel silver, phosphor bronze, and beryllium copper, and iron alloys such as stainless steel have been used for electronic components that require strength. Among these materials for electronic components, phosphor bronze has high strength, good bending workability, corrosion resistance, and stress corrosion cracking resistance, and is widely used. However, in recent years, as parts have become smaller, materials for electronic parts have also tended to become thinner, and in such cases, materials are required to have high strength. However, the strengthening mechanism of phosphor bronze is due to the combination of solid solution strengthening of Sn in Cu and work hardening due to cold working (rolling). must be made high, which results in poor bending workability. In particular, the bending workability in the direction in which the bending axis is parallel to the rolling direction becomes poor. Furthermore, there are naturally limits to the improvement in strength of phosphor bronze through work hardening.
そのため、強度が要求される部位には、ベリリウム銅が
一般に用いられている。しかしベリリウム銅は高価であ
り、又、プレス加工後に熱処理が必要な場合もあり、か
なりトータルコストが高くなる。Therefore, beryllium copper is generally used in areas where strength is required. However, beryllium copper is expensive and may require heat treatment after press working, resulting in a considerably high total cost.
［発明が解決しようとする課題］
上述のように、部品の小型化に伴ない、高強度の材料が
要求されるようになってきているが、従来のりん青銅で
は限界があり、又ベリリウム銅では高価すぎるため、安
価で高強度でかつ曲げ加工性も良好である材料が待ち望
まれている。[Problem to be solved by the invention] As mentioned above, with the miniaturization of parts, high-strength materials are required, but conventional phosphor bronze has its limitations, and beryllium copper Since these materials are too expensive, there is a need for materials that are inexpensive, have high strength, and have good bending properties.
［課題を解決するための手段］
本発明はこのような点に鑑み、高強度で安価でかつ曲げ
加工性に優れたりん青銅の製造方法を提供するものであ
る。[Means for Solving the Problems] In view of these points, the present invention provides a method for producing phosphor bronze that is high in strength, inexpensive, and has excellent bending workability.
すなわち、本発明は、Ｓ ｎ ３．５〜９．０ｗｔ％
、Ｐ ０．００１〜０．３０ｗｔ％、Ｎ ｉ （１
，ＱＯ１〜０．５０ｗｔ％を含み、あるいはさらに副成
分としてＦｅ５Ｍｇ。That is, in the present invention, S n 3.5 to 9.0 wt%
, P 0.001-0.30wt%, N i (1
, QO1 to 0.50 wt%, or further contains Fe5Mg as a subcomponent.
Ａ Ｉ ＳＳ ｌ ％Ｃｒ ％ Ｍ ｎ ｓ Ｃｏ、Ｚ
ｎ、Ｔｉ。A I SS l % Cr % M n s Co, Z
n, Ti.
Ｚｒ５Ｐｂの中から１種又は２１５ｉ以上を０．００１
〜２．０ｗｔ％含み、残部Ｃｕおよび不可避的な不純物
からなるりん青銅において、１５０〜６５０℃の温度で
結晶粒が０．０（１１〜０．０２５ｍａ＋になり、かつ
ＮｉとＰが金属間化合物として析出する様に焼鈍するこ
とを特徴とする曲げ加工性の良好な高強度りん青銅の製
造方法であり、かつ、上記結晶粒が０．００１〜０．０
２５ｍｍに成長したりん青銅を９０％以下の加工度で冷
間圧延することを特徴とする曲げ加工性が良好な高強度
りん青銅の製造方性であり、かつ、上記９０％以下の加
工度で冷間圧延したりん青銅を１５０〜６５０℃の温度
で再結晶しない程度の時間歪取焼鈍を行うことを特徴と
する曲げ加工性の良好な高強度りん青銅の製造方法に関
するものである。One type from Zr5Pb or 0.001 of 215i or more
In phosphor bronze containing ~2.0 wt%, the balance being Cu and unavoidable impurities, the crystal grains become 0.0 (11 to 0.025 ma+) at a temperature of 150 to 650°C, and Ni and P form an intermetallic compound. A method for producing high-strength phosphor bronze with good bending workability, characterized in that annealing is performed so that the crystal grains are 0.001 to 0.0
A method for producing high-strength phosphor bronze with good bending workability, characterized by cold rolling phosphor bronze grown to 25 mm at a working degree of 90% or less, and at the above-mentioned working degree of 90% or less. The present invention relates to a method for producing high-strength phosphor bronze with good bending workability, which comprises subjecting cold-rolled phosphor bronze to strain relief annealing at a temperature of 150 to 650° C. for a time that does not cause recrystallization.
以下に本発明により曲げ加工性が良好な高強度りん青銅
が得られる理由を述べる。The reason why high-strength phosphor bronze with good bending workability can be obtained by the present invention will be described below.
前にも述べたように、りん青銅はＣｕ中へのＳｎの固溶
強化と冷間加工（圧延）による加工硬化を組合せたもの
であるが、Ｓｎ、ｉｌを３．５〜９、Ｏｗｔ％とするの
は、３゜５ｗｔ％未満では強度は若干向上するものの不
十分であり、９．０ｗｔ％を超えると、製造性及び加工
性が困難になるためである。すなわち、Ｓｎｍが９．Ｏ
ｗｔ％を超えると溶解鋳造時の凝固収縮量が大きくなり
、インゴットの内部欠陥が発生し易くなり、又、冷間加
工性も著しく劣化するためである。Ｐを添加するのは脱
酸及び靭性を持たせるためであるが、添加量を０．００
１〜０．３０ｗｔ％とするのは、０．００１ｖＬ％未満
ではその効果がなく 、０．３０ｗｔ％を超えると導電
率が低下し、耐ＳＣＣ性及び錫又ははんだめっきの耐熱
剥離性が著しく劣化するためである。Ｎｉを０．００１
〜０．５０ｗｔ％添加する理由は、Ｎｉによる固溶強化
に合わせて、ＮｉはＰと金属間化合物を作り易く、この
粒子を析出させることにより、強度を向上させるためで
ある。As mentioned before, phosphor bronze is a combination of solid solution strengthening of Sn in Cu and work hardening by cold working (rolling). The reason for this is that if the content is less than 3.5 wt%, the strength will improve slightly, but it will be insufficient, and if it exceeds 9.0 wt%, manufacturability and processability will become difficult. That is, Snm is 9. O
This is because if it exceeds wt%, the amount of solidification shrinkage during melting and casting will increase, internal defects will easily occur in the ingot, and cold workability will also deteriorate significantly. The purpose of adding P is to deoxidize and provide toughness, but the amount added is 0.00
The reason why the content is 1 to 0.30 wt% is that if it is less than 0.001 vL%, there is no effect, and if it exceeds 0.30 wt%, the conductivity will decrease and the SCC resistance and heat peeling resistance of tin or solder plating will deteriorate significantly. This is to do so. Ni 0.001
The reason for adding ~0.50 wt% is that Ni easily forms an intermetallic compound with P in conjunction with solid solution strengthening by Ni, and by precipitating these particles, the strength is improved.
添加量を０．００１〜０．５０ｗｔ％とするのは、０．
００１ｗｔ％未満ではその効果がなく、また、０．５０
ｗｔ％を超えると導電率が低下し、錫又ははんだ耐熱剥
離性が劣化するためである。The addition amount is 0.001 to 0.50 wt%.
If it is less than 0.001 wt%, it has no effect, and if it is less than 0.50 wt%, it has no effect.
This is because if it exceeds wt%, the electrical conductivity will decrease and the heat peeling resistance of tin or solder will deteriorate.
副成分としてＦｅ、Ｍｇ、Ａｌ５Ｓ ｉ、Ｃｒ、Ｍｎ、
Ｃ０％ Ｚｎ、Ｔ ｉ、Ｚ ｒ、Ｐｂの中から１種又は
２種以上をｏ、ｏｏｔ〜２．０ｗｔ％添加するのは、強
度を向上させるためであるが、添加量を０．００１〜２
．Ｏｗｔ％とする理由は、０．００１ｗｔ％未満ではそ
の効果がなく、２．０ｗｔ％を超えると加工性が著しく
劣化し、導電率、はんだ付は性が劣化するためである。Sub-components include Fe, Mg, Al5Si, Cr, Mn,
The reason why one or more of C0% Zn, Ti, Zr, and Pb is added at o, oot to 2.0 wt% is to improve the strength, but the addition amount is 0.001 to 2.0 wt%. 2
．． The reason why it is set as Owt% is that if it is less than 0.001wt%, there is no effect, and if it exceeds 2.0wt%, the workability is significantly deteriorated, and the conductivity and soldering properties are deteriorated.
このような成分の合金を１５０〜６５０℃の温度で結晶
粒がｏ、ｏｏｉ〜０．０２５ｍｍになり、かつＮｉとＰ
が金属間化合物として析出させるように焼鈍する理由は
、結晶粒をｏ、ｏｏｔ〜０．０２５■と微細に成長させ
ることにより、曲げ加工性を良好にし、かつＮｉとＰの
金属間化合物を析出させ、強度を向上させるためである
。結晶粒を０．００１〜０．０２！ｌｖｍとするのは、
０．００１℃ｍ未満では未再結晶部がほとんどであり、
加工組織が残り、曲げ性は著しく悪（，０，０２５ａｏ
＋を超えると、曲げ加工を施したときに肌荒れし易くな
るためである。１５０〜６５０℃の温度で焼鈍するのは
、再結晶と同時にＮｉとＰの金属間化合物を析出させる
ためであるが、１５０℃未満では再結晶するのに間開が
かかりすぎ、コスト高となり、工業的には無理であり、
６５０℃を超えると、Ｃｕ中へのＮ１５Ｐの固溶量が多
くなり、ＮｉとＰの金属間化合物が析出せず、強度が向
上しないためである。このような条件で焼鈍したりん青
銅において、さらに強度を向上させるため、９０％以下
の加工度で冷間圧延を行う。加工度を９０％未満とする
のは、９０％を超える加工度で冷間圧延を行うと、曲げ
加工性が劣化し、強度もそれ以上あまり向上しないため
である。更にこの冷間圧延したりん青銅を１５０〜６５
０℃の温度で歪取り焼鈍を行うのは、ばね性及び曲げ加
工性を向上させるためであり、テンション・アニーリン
グ・ラインで行えば、良好な形状の材料が得られる。焼
鈍温度を１５０〜６５０℃とするのは１５０℃未満では
焼鈍時間が長すぎ、コスト高になるためであり、６５０
℃を超える適正な焼鈍時間が短くなり、炉の温度、炉を
通板する速度のばらつきの影響を受は易くなり、安定し
た強度、ばね性の材料が得られないためである。When an alloy with such components is heated to a temperature of 150 to 650°C, the crystal grains become o, ooi to 0.025 mm, and Ni and P
The reason for annealing so that Ni and P precipitate as intermetallic compounds is that by growing the crystal grains as fine as o,oot~0.025■, the bending workability is improved, and the intermetallic compounds of Ni and P are precipitated. This is to improve strength. 0.001 to 0.02 crystal grains! lvm is
Below 0.001°Cm, most of the parts are unrecrystallized,
Processed structure remains, and bendability is extremely poor (0,025ao
This is because if it exceeds +, the skin tends to become rough when bending is performed. The reason for annealing at a temperature of 150 to 650°C is to precipitate an intermetallic compound of Ni and P at the same time as recrystallization, but if it is less than 150°C, it will take too much space for recrystallization, resulting in high costs. It is industrially impossible,
This is because if the temperature exceeds 650°C, the amount of solid solution of N15P in Cu increases, and the intermetallic compound of Ni and P does not precipitate, resulting in no improvement in strength. In order to further improve the strength of the phosphor bronze annealed under such conditions, cold rolling is performed at a working ratio of 90% or less. The reason why the degree of workability is set to less than 90% is that if cold rolling is performed at a degree of workability exceeding 90%, the bending workability will deteriorate and the strength will not improve much further. Furthermore, this cold-rolled phosphor bronze is 150 to 65
The reason why strain relief annealing is performed at a temperature of 0° C. is to improve spring properties and bending workability, and if it is performed on a tension annealing line, a material with a good shape can be obtained. The reason why the annealing temperature is set to 150 to 650°C is that if it is less than 150°C, the annealing time is too long and the cost is high.
This is because the proper annealing time exceeding 0.degree. C. becomes shorter, the material becomes more susceptible to variations in the furnace temperature and the speed at which the sheet passes through the furnace, and a material with stable strength and springiness cannot be obtained.
以上の製造方法により、曲げ加工性の良好な高強度りん
青銅が得られる。By the above manufacturing method, high-strength phosphor bronze with good bending workability can be obtained.
［実施例］ 本発明を実施例をもって具体的に説明する。[Example] The present invention will be specifically explained using examples.
第１表にかかる成分のりん青銅を表中に示した製造条件
にて焼２１ｔ１１圧延を行い、０．２５＋ｎｍの厚さの
板材を得た。表中、比較例のＮｏ、２０は市販のベリリ
ウム銅（Ｃ１７２０−８８）の０．２５１１１１１の板
材である。これらの例について、引張強さ、伸び、ばね
限界値、導電率、Ｎ１−Ｐ金属間化合物密度、曲げ加工
性、耐食性、耐応力腐食割れ性（以下耐ＳＣＣ性と称す
）、はんだ付は性、はんた耐熱剥離性を調査した。引張
強さ、伸びはＪＩＳ５号引張試験片を用い測定した。ば
ね限界値は１０■幅で１１００１ａ長さの短所に加工し
測定した。導電率は１０ｍｍ幅で１００１長さの短所に
加圧し、４端子法により測定した。Ｎ１−Ｐ金属間化合
物密度は、Ｘ線マイクロアナライザーにより５０００倍
の視野で観察し、確認できる０、０５μｍから １．０
μｍまでの化合物数を５０μｍ×５０μｍの範囲につい
て求めた。耐食性はＪＩＳＨ６５０２に準じ、試料表面
を１２００工メリー紙にて研摩後、４０℃、９０％ＲＨ
において２５ｐｐｍ Ｓ Ｏ２雰囲気に１４日間暴露し
、暴露前後の重量変化を測定した。この単αは腐食減量
を示す。（ｍｄｄ ：ｍ ｇ ／ ｄ ｍ ２／ｄａｙ
）
耐ＳＣＣ性は１２．５１幅で１５０ｍｍ長さの短ｍ試験
片に加工し、第１図に示すようにこの短Ｆｇ＋ｌをルー
プ状にタコ糸２で縛り、２倍に純水で希釈したアンモニ
ア水３交を含む２０交デシケータ内に暴露し、割れが発
生するまでの日数を調査した。はんだ付は性は試料表面
を＃ １２００工メリー紙にて研摩した後１０ＩＩＩ１
幅で５０ＩＩＩＩ１１の長さに加工し、沸騰蒸気に１時
間暴露後ロジン系フラックスを用い、２３０℃の６０Ｓ
ｎ／ ４０Ｐｂはんだに５秒間浸漬し、外観を観察し、
９５％以上の面積がはんだにより被覆されている場合を
良好とした。はんだめっき耐熱剥離性は試料表面を６１
２００工メリー紙にて研摩後、６０Ｓｎ／ ４０Ｐｂは
んだを電気めっきし、１５０℃にて加熱し、１００時間
毎に取り出し、板厚（０，２５ＩＩＩｍ）の内側曲げ半
径で９０°曲げを往復１回行い、曲げ部のはんだめっき
の剥離の有無を調べた。また、曲げ加工性は、１００１
１１幅に試料を加工した後、ＣＥ Ｓ ＭＯＯＯ２に準
じ、Ｗ曲げ試験を行い、曲げ部の外観を観察した。Phosphor bronze having the components shown in Table 1 was subjected to baking 21t11 rolling under the production conditions shown in the table to obtain a plate material with a thickness of 0.25+nm. In the table, Comparative Example No. 20 is a plate material of commercially available beryllium copper (C1720-88) with a thickness of 0.2511111. For these examples, tensile strength, elongation, spring limit value, electrical conductivity, N1-P intermetallic compound density, bending workability, corrosion resistance, stress corrosion cracking resistance (hereinafter referred to as SCC resistance), soldering properties , the solder heat peeling properties were investigated. Tensile strength and elongation were measured using a JIS No. 5 tensile test piece. The spring limit value was measured by machining it into a width of 10cm and a length of 11001a. The electrical conductivity was measured by applying pressure to a short point of 10 mm width and 1001 length using a four-terminal method. The N1-P intermetallic compound density can be confirmed by observing with an X-ray microanalyzer with a field of view magnified 5000 times, from 0.05 μm to 1.0
The number of compounds up to μm was determined for a range of 50 μm×50 μm. Corrosion resistance is in accordance with JISH6502, after polishing the sample surface with 1200mm merry paper, 40℃, 90%RH
The samples were exposed to a 25 ppm SO2 atmosphere for 14 days, and weight changes before and after exposure were measured. This single α indicates corrosion loss. (mdd:mg/dm2/day
) For SCC resistance, a short m test piece with a width of 12.51 and a length of 150 mm was processed, and as shown in Figure 1, this short Fg+l was tied into a loop with octopus thread 2 and diluted twice with pure water. The sample was exposed to a 20-cycle desiccator containing 3-cycle ammonia water, and the number of days until cracking occurred was investigated. For soldering, the surface of the sample was polished with #1200 merry paper.
It was processed into a width of 50III and a length of 11, and after being exposed to boiling steam for 1 hour, it was heated to 60S at 230℃ using a rosin-based flux.
Immerse it in n/40Pb solder for 5 seconds, observe the appearance,
A case where 95% or more of the area was covered with solder was considered good. Solder plating heat peelability is 61 on the sample surface.
After polishing with 200mm merry paper, electroplated with 60Sn/40Pb solder, heated at 150℃, taken out every 100 hours, and bent 90° back and forth once with the inner bending radius of the board thickness (0.25IIIm). The presence or absence of peeling of the solder plating on the bent portion was examined. In addition, the bending workability is 1001
After processing the sample to a width of 11, a W bending test was conducted according to CE S MOOO2, and the appearance of the bent portion was observed.
曲げ軸は圧延方向に平行方向（Ｂａｄ ｗａｙ）とし、
内側曲げ半径は板厚（０，２５■）と同一とした。The bending axis is parallel to the rolling direction (Bad way),
The inner bending radius was the same as the plate thickness (0.25 mm).
＋Ｉｈげ加工性のｉ１１定は外観により、良好、肌荒れ
、割れ発生と３段階とした。The i11 constant of +Ihing workability was classified into 3 levels depending on the appearance: good, rough skin, and cracking.
第１表中、本発明例は、Ｃｕ−５，１ｗＬ％５ｎ−０，
０４ｗＬ％Ｐ −０，２３ｗｔ％Ｎｉを基本成分とした
ものと、Ｃｕ−７，６ｗｔ％５ｎ−０，口９ｗｔＰ −
０，３７ｗｔ％Ｎｉを基本成分としたものに副成分を添
加した合金において、３５０〜４００ ”Ｃにて０．０
０７〜０．０１５ｍｍに結晶粒が成長するまで焼鈍した
後、５０〜７０％の加工度で冷間圧延を行い、その後歪
取焼業屯を行ったものであり、Ｎｔ−Ｐ金属間化合物も
かなりの量析出していて、高強度でばね性も高く、曲げ
加工性も良好で他の特性も良好であることがわかる。In Table 1, the present invention example shows Cu-5,1wL%5n-0,
04wL%P -0.23wt%Ni as the basic component and Cu-7.6wt%5n-0,9wtP-
0.0 at 350-400''C in an alloy with 0.37wt%Ni as the basic component and subcomponents added.
After annealing until crystal grains grow to a size of 0.07 to 0.015 mm, cold rolling was performed at a workability of 50 to 70%, and then strain relief was performed, and the Nt-P intermetallic compound was also It can be seen that a considerable amount of precipitate was present, and that the material had high strength, high spring properties, good bending workability, and other properties.
一方、比較例でＮｏ、１２は結晶粒が０．００１■未満
であるため、曲げ加工性が悪く、Ｎ１−Ｐ金属間化合物
の析出量も少ない。Ｎｏ、１３は結晶粒が０．０４０＋
ｍと大きいため、曲げ加工の際肌荒れが生じる。Ｎｏ、
１４は加工度が９５％と高いため、曲げ加工性が悪い。On the other hand, in Comparative Example No. 12, the crystal grain size was less than 0.001 square centimeters, so the bending workability was poor and the amount of N1-P intermetallic compound precipitated was also small. No. 13 has a crystal grain of 0.040+
Since it is large (m), roughness occurs during bending. No,
No. 14 has a high degree of workability of 95%, so the bending workability is poor.
Ｎｏ、１５は高温で焼鈍したため、ＮｉとＰの金属間化
合物がほとんど析出せず、強度があまり高くなく、導電
率も低温焼鈍したＮｏ、１に比べて低い。Ｎｏ、１Ｂは
Ｎｉを添加していないため、Ｎ１−Ｐ金属間化合物は生
成せず、Ｃｕ中へ全てＰが固溶するため、Ｎｏ、６と比
較し導電率が低く、強度も高くない。Ｎｏ。Since No. 15 was annealed at a high temperature, almost no intermetallic compound of Ni and P was precipitated, the strength was not very high, and the electrical conductivity was lower than No. 1 which was annealed at a low temperature. No. 1B does not contain Ni, so no N1-P intermetallic compound is formed, and all P is dissolved in Cu, so the conductivity is lower and the strength is not higher than No. 6. No.
１７はＰｆｉが多すぎるため、耐ＳＣＣ性、はんだ耐熱
剥離性が極めて悪く、導電率も低い。Ｎｏ。Since No. 17 contains too much Pfi, its SCC resistance and solder heat peeling resistance are extremely poor, and its electrical conductivity is also low. No.
１８は副成分の添加量が４．２ｗｔ％と多いため、導電
率が低く、はんだ付は性も悪い。Ｎ、１９は５ｎｆｉが
多すぎるため、強度は高いが曲げ加工性が悪い。Ｎｏ、
２０は市販のベリリウム銅であり、本発明の例に比べて
高強度であり、導電率も高いが、曲げ加工性が悪く、耐
ＳＣＣ性もあまり良好でない。Since No. 18 has a large additive amount of auxiliary components of 4.2 wt%, the conductivity is low and the soldering properties are poor. N, 19 has too much 5nfi, so it has high strength but poor bending workability. No,
No. 20 is commercially available beryllium copper, which has higher strength and higher conductivity than the examples of the present invention, but has poor bending workability and poor SCC resistance.
［発明の効果］
本発明は曲げ加工性を損わずにりん青銅を高強度化する
製造方法であり、電子部品小型化、薄肉化に対し、安価
に対応し得る製造方法である。[Effects of the Invention] The present invention is a manufacturing method for increasing the strength of phosphor bronze without impairing bending workability, and is a manufacturing method that can be used to reduce the size and thickness of electronic components at low cost.
第１図は耐ＳＣＣ性試験片の斜視図を示す。 １・・・短所、２・・・タコ糸。 FIG. 1 shows a perspective view of the SCC resistance test piece. 1... Disadvantages, 2... Octopus thread.
Claims (6)
３０ｗｔ％、Ｎｉ０．００１〜０．５０ｗｔ％を含み、
残部Ｃｕおよび不可避的な不純物からなるりん青銅にお
いて、１５０〜６５０℃の温度で結晶粒が０．００１〜
０．０２５ｍｍになり、かつＮｉとＰが金属間化合物と
して析出する様に焼鈍することを特徴とする曲げ加工性
の良好な高強度りん青銅の製造方法。(1) Sn3.5-9.0wt%, P0.001-0.
30 wt%, Ni 0.001 to 0.50 wt%,
In phosphor bronze consisting of the balance Cu and unavoidable impurities, the crystal grain size is 0.001 to
A method for producing high-strength phosphor bronze with good bending workability, characterized by annealing so that the thickness becomes 0.025 mm and Ni and P precipitate as an intermetallic compound.
２５ｍｍであり、かつＮｉとＰが金属間化合物として析
出する様に焼鈍したりん青銅において、さらに９０％以
下の加工度で冷間圧延を行うことを特徴とする曲げ加工
性の良好な高強度りん青銅の製造方法。(2) The crystal grains according to claim (1) are 0.001 to 0.0
A high-strength phosphor bronze with good bending workability characterized in that it is phosphor bronze having a thickness of 25 mm and annealed so that Ni and P precipitate as intermetallic compounds, and is further cold-rolled at a workability of 90% or less. Method of manufacturing bronze.
延を行ったりん青銅において、１５０〜６５０℃の温度
で再結晶しない時間歪取焼鈍を行うことを特徴とする曲
げ加工性の良好な高強度りん青銅の製造方法。(3) A bending process characterized by performing time strain relief annealing at a temperature of 150 to 650°C without recrystallization on phosphor bronze cold-rolled with a working degree of 90% or less as described in claim (2). A method for producing high-strength phosphor bronze with good properties.
３０ｗｔ％、Ｎｉ０．００１〜０．５０ｗｔ％を含み、
さらに副成分としてＦｅ、Ｍｇ、Ａｌ、Ｓｉ、Ｃｒ、Ｍ
ｎ、Ｃｏ、Ｚｎ、Ｔｉ、Ｚｒ、Ｐｂの中から１種又は２
種以上を０．００１〜２．０ｗｔ％含み、残部Ｃｕおよ
び不可避的な不純物からなるりん青銅において、１５０
〜６５０℃の温度で結晶粒が０．００１〜０．０２５ｍ
ｍになり、かつＮｉとＰが金属間化合物として析出する
様に焼鈍することを特徴とする曲げ加工性の良好な高強
度りん青銅の製造方法。(4) Sn3.5-9.0wt%, P0.001-0.
30 wt%, Ni 0.001 to 0.50 wt%,
Furthermore, as subcomponents Fe, Mg, Al, Si, Cr, M
One or two of n, Co, Zn, Ti, Zr, and Pb
In phosphor bronze containing 0.001 to 2.0 wt% of carbon dioxide or more, and the balance consisting of Cu and unavoidable impurities,
Grain size is 0.001~0.025m at a temperature of ~650℃
1. A method for producing high-strength phosphor bronze with good bending workability, characterized by annealing so that Ni and P precipitate as an intermetallic compound.
２５ｍｍであり、かつＮｉとＰが金属間化合物として析
出する様に焼鈍したりん青銅において、さらに９０％以
下の加工度で冷間圧延を行うことを特徴とする曲げ加工
性の良好な高強度りん青銅の製造方法。(5) The crystal grains according to claim (4) are 0.001 to 0.0
A high-strength phosphor bronze with good bending workability characterized in that it is phosphor bronze having a thickness of 25 mm and annealed so that Ni and P precipitate as intermetallic compounds, and is further cold-rolled at a workability of 90% or less. Method of manufacturing bronze.
延を行ったりん青銅において、１５０〜６５０℃の温度
で再結晶しない時間歪取焼鈍を行うことを特徴とする曲
げ加工性の良好な高強度りん青銅の製造方法。(6) A bending process characterized by performing time strain relief annealing at a temperature of 150 to 650°C without recrystallization on phosphor bronze cold-rolled with a working degree of 90% or less as described in claim (5). A method for producing high-strength phosphor bronze with good properties.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22152589A JPH0387341A (en) | 1989-08-30 | 1989-08-30 | Manufacture of high strength phosphor bronze having good bendability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22152589A JPH0387341A (en) | 1989-08-30 | 1989-08-30 | Manufacture of high strength phosphor bronze having good bendability |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0387341A true JPH0387341A (en) | 1991-04-12 |
Family
ID=16768081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22152589A Pending JPH0387341A (en) | 1989-08-30 | 1989-08-30 | Manufacture of high strength phosphor bronze having good bendability |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0387341A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0841408A2 (en) * | 1996-11-07 | 1998-05-13 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
| US5865910A (en) * | 1996-11-07 | 1999-02-02 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
| US6149741A (en) * | 1996-07-30 | 2000-11-21 | Establissements Griset | Copper-based alloy having a high electrical conductivity and a high softening temperature for application in electronics |
| US6436206B1 (en) | 1999-04-01 | 2002-08-20 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
| US6471792B1 (en) | 1998-11-16 | 2002-10-29 | Olin Corporation | Stress relaxation resistant brass |
| EP1862560A1 (en) * | 2005-03-02 | 2007-12-05 | The Furukawa Electric Co., Ltd. | Copper alloy and method for production thereof |
| JP5873590B1 (en) * | 2015-05-22 | 2016-03-01 | 株式会社藤井製作所 | Free-cutting phosphor bronze rod |
| CN114214530A (en) * | 2021-12-06 | 2022-03-22 | 宁波金田铜业(集团)股份有限公司 | Preparation method of corrosion-resistant tin-phosphor bronze wire |
-
1989
- 1989-08-30 JP JP22152589A patent/JPH0387341A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6149741A (en) * | 1996-07-30 | 2000-11-21 | Establissements Griset | Copper-based alloy having a high electrical conductivity and a high softening temperature for application in electronics |
| EP0841408A2 (en) * | 1996-11-07 | 1998-05-13 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
| WO1998020176A1 (en) * | 1996-11-07 | 1998-05-14 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
| US5820701A (en) * | 1996-11-07 | 1998-10-13 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
| US5865910A (en) * | 1996-11-07 | 1999-02-02 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
| EP0841408A3 (en) * | 1996-11-07 | 1999-03-03 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
| US6471792B1 (en) | 1998-11-16 | 2002-10-29 | Olin Corporation | Stress relaxation resistant brass |
| US6436206B1 (en) | 1999-04-01 | 2002-08-20 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
| EP1862560A1 (en) * | 2005-03-02 | 2007-12-05 | The Furukawa Electric Co., Ltd. | Copper alloy and method for production thereof |
| EP1862560A4 (en) * | 2005-03-02 | 2013-09-18 | Furukawa Electric Co Ltd | Copper alloy and method for production thereof |
| JP5873590B1 (en) * | 2015-05-22 | 2016-03-01 | 株式会社藤井製作所 | Free-cutting phosphor bronze rod |
| CN114214530A (en) * | 2021-12-06 | 2022-03-22 | 宁波金田铜业(集团)股份有限公司 | Preparation method of corrosion-resistant tin-phosphor bronze wire |
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