JPH0381601U - - Google Patents
Info
- Publication number
- JPH0381601U JPH0381601U JP14212589U JP14212589U JPH0381601U JP H0381601 U JPH0381601 U JP H0381601U JP 14212589 U JP14212589 U JP 14212589U JP 14212589 U JP14212589 U JP 14212589U JP H0381601 U JPH0381601 U JP H0381601U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- terminals
- component element
- brought
- pair
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims 2
Landscapes
- Thermistors And Varistors (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
- Details Of Resistors (AREA)
Description
第１図ａ，ｂ，ｃは本考案の一実施例を組立て
順序に沿つて説明する断面図、第２図ａ，ｂ，ｃ
は従来例を組立て順序に沿つて説明する断面図で
ある。
１……電子部品素子、２……電極、３……外装
パツケージ、４ａ，４ｂ……端子。
Figures 1a, b, and c are cross-sectional views explaining one embodiment of the present invention along the assembly order; Figures 2a, b, and c
FIG. 2 is a sectional view illustrating a conventional example in the order of assembly. DESCRIPTION OF SYMBOLS 1...Electronic component element, 2...Electrode, 3...Exterior package, 4a, 4b...Terminal.
Claims (1)
子を外装パツケージ内に収納し、外装パツケージ
内に設けられた一対の端子を前記各電極に圧接さ
せることにより電子部品素子を端子間に挟持させ
た電子部品において、 前記一対の端子のうち少なくとも一方の端子を
形状記憶合金によつて形成し、形状記憶合金製の
端子を記憶形状に復帰させることにより両端子を
前記電子部品素子の電極に圧接させていることを
特徴とする電子部品。[Claims for Utility Model Registration] An electronic component element having electrodes formed on two opposing outer surfaces is housed in an exterior package, and a pair of terminals provided inside the exterior package are brought into pressure contact with each of the electrodes. In an electronic component in which a component element is sandwiched between terminals, at least one of the pair of terminals is formed of a shape memory alloy, and both terminals are made by returning the shape memory alloy terminal to its memorized shape. An electronic component, characterized in that the electronic component is brought into pressure contact with an electrode of the electronic component element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14212589U JPH0381601U (en) | 1989-12-08 | 1989-12-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14212589U JPH0381601U (en) | 1989-12-08 | 1989-12-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0381601U true JPH0381601U (en) | 1991-08-21 |
Family
ID=31688966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14212589U Pending JPH0381601U (en) | 1989-12-08 | 1989-12-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0381601U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003100959A (en) * | 2001-09-25 | 2003-04-04 | Nippon Chemicon Corp | Resin-sealed electronic component |
-
1989
- 1989-12-08 JP JP14212589U patent/JPH0381601U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003100959A (en) * | 2001-09-25 | 2003-04-04 | Nippon Chemicon Corp | Resin-sealed electronic component |
| JP4614038B2 (en) * | 2001-09-25 | 2011-01-19 | 日本ケミコン株式会社 | Resin-sealed electronic components |