JPH0379401U - - Google Patents
Info
- Publication number
- JPH0379401U JPH0379401U JP14195489U JP14195489U JPH0379401U JP H0379401 U JPH0379401 U JP H0379401U JP 14195489 U JP14195489 U JP 14195489U JP 14195489 U JP14195489 U JP 14195489U JP H0379401 U JPH0379401 U JP H0379401U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- current interrupting
- electrode
- melting point
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000008018 melting Effects 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000012212 insulator Substances 0.000 claims description 2
Landscapes
- Thermistors And Varistors (AREA)
Description
第１図は本考案の一実施例を示す断面図、第２
図は同上の一部を拡大して示す断面図、第３図は
同上の異常発熱時の作用を説明する断面図、第４
図は従来例の断面図である。
１……電子部品素子、２……電極、３……端子
、４……電流遮断用素子、５……絶縁体、６……
低融点導電被膜。
Fig. 1 is a sectional view showing one embodiment of the present invention;
The figure is an enlarged cross-sectional view of a part of the same as above, FIG.
The figure is a sectional view of a conventional example. DESCRIPTION OF SYMBOLS 1... Electronic component element, 2... Electrode, 3... Terminal, 4... Current interrupting element, 5... Insulator, 6...
Low melting point conductive coating.
Claims (1)
子を一対の端子間に挟持させた電子部品であつて
、 絶縁体の表面に低融点導電被膜を形成して電流
遮断用素子を構成し、前記端子のうち少なくとも
一方の端子を前記電流遮断用素子を介して電子部
品素子の電極に押圧させ、電流遮断用素子表面の
低融点導電被膜によつて端子と電極とを電気的に
接続させたことを特徴とする電子部品。[Scope of Claim for Utility Model Registration] An electronic component in which an electronic component element having electrodes formed on two opposing outer surfaces is sandwiched between a pair of terminals, the electronic component having a low melting point conductive film formed on the surface of the insulator. A current interrupting element is configured, and at least one of the terminals is pressed against an electrode of an electronic component element through the current interrupting element, and the terminal and the electrode are connected by a low melting point conductive coating on the surface of the current interrupting element. An electronic component characterized by being electrically connected to.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14195489U JPH0379401U (en) | 1989-12-07 | 1989-12-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14195489U JPH0379401U (en) | 1989-12-07 | 1989-12-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0379401U true JPH0379401U (en) | 1991-08-13 |
Family
ID=31688809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14195489U Pending JPH0379401U (en) | 1989-12-07 | 1989-12-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0379401U (en) |
-
1989
- 1989-12-07 JP JP14195489U patent/JPH0379401U/ja active Pending
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