JPH0371641U - - Google Patents
Info
- Publication number
- JPH0371641U JPH0371641U JP1990111168U JP11116890U JPH0371641U JP H0371641 U JPH0371641 U JP H0371641U JP 1990111168 U JP1990111168 U JP 1990111168U JP 11116890 U JP11116890 U JP 11116890U JP H0371641 U JPH0371641 U JP H0371641U
- Authority
- JP
- Japan
- Prior art keywords
- jaw
- frame
- arm
- depending
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 235000012431 wafers Nutrition 0.000 claims 5
- 239000012530 fluid Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
第1図は、半導体ウエハ開放可能に係合するた
めの、本考案に従つて構成された装置の平面図で
ある。第2図は、第1図の装置の断面図である。
めの、本考案に従つて構成された装置の平面図で
ある。第2図は、第1図の装置の断面図である。
Claims (1)
- 【実用新案登録請求の範囲】 (1) フレームと; 前記フレームに配設され、該フレームから外方
へ伸び、長手方向に伸びるスロツトを有する長手
アームと; 前記フレームから離れた位置で前記フレームか
ら垂下し、前記ウエハの一部分を係合することが
できる第1の顎と; 上部が前記アームの上に位置し顎部分が前記ア
ームの下に垂下するように前記スロツトを通して
伸び、前記スロツト内に滑動可能に配設されてい
ることにより、前記垂下顎部分が前記アームの下
面に沿つて前記第1の顎に対して移動可能であり
、その垂下顎部分が第1の顎によつて係合された
部分とは反対側のウエハ端部分を係合する第2の
顎と; 前記フレームと前記第2の顎の前記上部との間
に接続され、前記ウエハを保持するために、前記
第2の顎の垂下顎部分を前記第1の顎に向かつて
移動させる流体シリンダ手段と; を有することを特徴とするウエハを開放可能に係
合する装置。 (2) 前記アームは係合すべきウエハを有するカ
セツトのポケツト内に挿入できる大きさであるこ
とを特徴とする請求項1記載の装置。 (3) 前記フレームは、 第1の端部と第2の端部とを有し、前記第1の
端部がロボツトにより係合させるのに必要な大き
さである円筒状工具チヤツクと;そして、 前記アームを調整可能に配設するための、工具
チヤツクの第2の端部に固着されたプレートと; を有することを特徴とする請求項1記載の装置。 (4) 第2の垂下顎部分を移動させるための前記
手段は、エアシリンダからなることを特徴とする
請求項1記載の装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/198,347 US4900214A (en) | 1988-05-25 | 1988-05-25 | Method and apparatus for transporting semiconductor wafers |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0371641U true JPH0371641U (ja) | 1991-07-19 |
Family
ID=22733007
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1121673A Pending JPH0220041A (ja) | 1988-05-25 | 1989-05-17 | 半導体ウエハの係合方法および装置 |
JP1990111168U Pending JPH0371641U (ja) | 1988-05-25 | 1990-10-25 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1121673A Pending JPH0220041A (ja) | 1988-05-25 | 1989-05-17 | 半導体ウエハの係合方法および装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US4900214A (ja) |
JP (2) | JPH0220041A (ja) |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1228105B (it) * | 1988-12-20 | 1991-05-28 | Sgs Thomson Microelectronics | Pinza per la movimentazione, vantaggiosamente robotizzata, di una o piu' fette di silicio e/o di un supporto di tali fette |
CH680275A5 (ja) * | 1990-03-05 | 1992-07-31 | Tet Techno Investment Trust | |
JPH05235154A (ja) * | 1992-02-24 | 1993-09-10 | Mitsubishi Electric Corp | ウエハ把持装置 |
US5570987A (en) * | 1993-12-14 | 1996-11-05 | W. L. Gore & Associates, Inc. | Semiconductor wafer transport container |
US5590996A (en) * | 1994-10-13 | 1997-01-07 | Semitherm | Wafer transfer apparatus |
US5713711A (en) * | 1995-01-17 | 1998-02-03 | Bye/Oasis | Multiple interface door for wafer storage and handling container |
US5700046A (en) * | 1995-09-13 | 1997-12-23 | Silicon Valley Group, Inc. | Wafer gripper |
CH697146A5 (de) * | 1996-10-09 | 2008-05-15 | Tec Sem Ag | Greifvorrichtung zur Handhabung von Wafern. |
US5980187A (en) * | 1997-04-16 | 1999-11-09 | Kla-Tencor Corporation | Mechanism for transporting semiconductor-process masks |
US5988971A (en) * | 1997-07-09 | 1999-11-23 | Ade Optical Systems Corporation | Wafer transfer robot |
US6256555B1 (en) | 1998-12-02 | 2001-07-03 | Newport Corporation | Robot arm with specimen edge gripping end effector |
EP1135795B1 (en) | 1998-12-02 | 2008-03-12 | Newport Corporation | Specimen holding robotic arm end effector |
US6454332B1 (en) * | 1998-12-04 | 2002-09-24 | Applied Materials, Inc. | Apparatus and methods for handling a substrate |
US6322312B1 (en) | 1999-03-18 | 2001-11-27 | Applied Materials, Inc. | Mechanical gripper for wafer handling robots |
DE60034619T2 (de) * | 1999-04-01 | 2007-12-27 | Applied Materials, Inc., Santa Clara | Pneumatischer betätigbarer Biegungsgreifer für Scheibenhandhabungsroboter |
US6164899A (en) * | 1999-04-22 | 2000-12-26 | Automated Concepts, Inc. | Disk transfer apparatus |
JP4097404B2 (ja) * | 1999-05-04 | 2008-06-11 | エーディーイー コーポレーション | エッジグリッピングエンドエフェクタウエーハハンドリング装置 |
US6357996B2 (en) | 1999-05-14 | 2002-03-19 | Newport Corporation | Edge gripping specimen prealigner |
US6513848B1 (en) * | 1999-09-17 | 2003-02-04 | Applied Materials, Inc. | Hydraulically actuated wafer clamp |
US7104578B2 (en) * | 2002-03-15 | 2006-09-12 | Asm International N.V. | Two level end effector |
US7256375B2 (en) * | 2002-08-30 | 2007-08-14 | Asm International N.V. | Susceptor plate for high temperature heat treatment |
US7654596B2 (en) * | 2003-06-27 | 2010-02-02 | Mattson Technology, Inc. | Endeffectors for handling semiconductor wafers |
EP1670534B1 (en) * | 2003-07-02 | 2010-01-27 | Cook Incorporated | Coaxial Catheters |
US7181132B2 (en) | 2003-08-20 | 2007-02-20 | Asm International N.V. | Method and system for loading substrate supports into a substrate holder |
JP2005167208A (ja) * | 2003-10-24 | 2005-06-23 | Ade Corp | ノッチ化/フラット化200mmウエーハエッジグリップエンドエフェクタ |
JP3909770B2 (ja) * | 2004-03-29 | 2007-04-25 | 川崎重工業株式会社 | 基板把持装置 |
US20060065634A1 (en) * | 2004-09-17 | 2006-03-30 | Van Den Berg Jannes R | Low temperature susceptor cleaning |
US20060060145A1 (en) * | 2004-09-17 | 2006-03-23 | Van Den Berg Jannes R | Susceptor with surface roughness for high temperature substrate processing |
US7651306B2 (en) * | 2004-12-22 | 2010-01-26 | Applied Materials, Inc. | Cartesian robot cluster tool architecture |
US7819079B2 (en) * | 2004-12-22 | 2010-10-26 | Applied Materials, Inc. | Cartesian cluster tool configuration for lithography type processes |
US20060182535A1 (en) * | 2004-12-22 | 2006-08-17 | Mike Rice | Cartesian robot design |
US7396412B2 (en) | 2004-12-22 | 2008-07-08 | Sokudo Co., Ltd. | Coat/develop module with shared dispense |
US7798764B2 (en) | 2005-12-22 | 2010-09-21 | Applied Materials, Inc. | Substrate processing sequence in a cartesian robot cluster tool |
US7374391B2 (en) * | 2005-12-22 | 2008-05-20 | Applied Materials, Inc. | Substrate gripper for a substrate handling robot |
US20080166210A1 (en) * | 2007-01-05 | 2008-07-10 | Applied Materials, Inc. | Supinating cartesian robot blade |
US7694688B2 (en) | 2007-01-05 | 2010-04-13 | Applied Materials, Inc. | Wet clean system design |
US8801069B2 (en) * | 2010-02-26 | 2014-08-12 | Brooks Automation, Inc. | Robot edge contact gripper |
JP2013198960A (ja) * | 2012-03-26 | 2013-10-03 | Disco Corp | ロボットハンド |
CN109461693B (zh) * | 2017-09-06 | 2023-06-02 | 台湾积体电路制造股份有限公司 | 晶片传送装置、晶片处理***及方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5114978B1 (ja) * | 1969-10-14 | 1976-05-13 | ||
JPS584389B2 (ja) * | 1976-04-07 | 1983-01-26 | 鹿島建設株式会社 | 運搬作業自動記録装置 |
JPS5864041A (ja) * | 1981-10-13 | 1983-04-16 | Nec Corp | ウエハのハンドリング装置 |
JPS62169439A (ja) * | 1986-01-22 | 1987-07-25 | Hitachi Ltd | 保持具 |
JPS62293631A (ja) * | 1986-06-13 | 1987-12-21 | Hitachi Ltd | ウエハ把持具 |
Family Cites Families (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1232488A (en) * | 1915-05-11 | 1917-07-10 | Hugh Brooks | Lifter. |
US1606569A (en) * | 1924-10-04 | 1926-11-09 | Guess Edward Henry | Jar wrench |
US2002149A (en) * | 1934-05-28 | 1935-05-21 | Herbert De L Kneeland | Dish or pan lifter |
US2988237A (en) * | 1954-12-10 | 1961-06-13 | Jr George C Devol | Programmed article transfer |
US2992848A (en) * | 1959-07-16 | 1961-07-18 | Edward W Livensparger | Receptacle lifter |
US3233750A (en) * | 1963-07-05 | 1966-02-08 | Us Industries Inc | Gripping and releasing device for feed mechanisms |
DE1293994B (de) * | 1964-11-13 | 1969-04-30 | Gressbach Arthur | Selbstspannender Greifer |
US3750804A (en) * | 1969-03-07 | 1973-08-07 | Triax Co | Load handling mechanism and automatic storage system |
US3648854A (en) * | 1970-04-03 | 1972-03-14 | Erie Eng Co | Reach-extension attachment for work transfer device |
FR2244602A1 (en) * | 1973-09-25 | 1975-04-18 | Koch Albert | Remote handling tool for e.g. toxic material - has intersliding upper and lower arms with secondary linking lever |
DE2420320A1 (de) * | 1974-04-26 | 1975-11-06 | Christian Haertig | Zange zum oeffnen und schliessen von schraubverschluessen an glaesern u.ae. mit verstellbarer backe |
GB1513444A (en) * | 1974-09-06 | 1978-06-07 | Chemical Reactor Equip As | Pick-up devices for lifting and moving semiconductor wafers |
US4002245A (en) * | 1974-09-16 | 1977-01-11 | George Mink | Material handling apparatus having gripping means for moving articles in several directions |
SU738867A1 (ru) * | 1977-12-26 | 1980-06-05 | Севастопольский Приборостроительный Институт | Исполнительный орган промышленного робота |
US4293268A (en) * | 1979-09-21 | 1981-10-06 | George Mink | Material handling device |
US4266910A (en) * | 1979-09-04 | 1981-05-12 | Pickard Equipment, Inc. | Pipe positioner boom and head assembly for pipe laying frame |
JPS5638468A (en) * | 1979-09-06 | 1981-04-13 | Dainippon Screen Mfg Co Ltd | Loading equipment of wafer |
SU1009758A1 (ru) * | 1981-07-31 | 1983-04-07 | Предприятие П/Я А-1477 | Схват промышленного робота |
US4457661A (en) * | 1981-12-07 | 1984-07-03 | Applied Materials, Inc. | Wafer loading apparatus |
NL8105908A (nl) * | 1981-12-30 | 1983-07-18 | Metaverpa Nv | Mechanisme voor het over een bepaalde hoek draaien van een voorwerp om een vertikale as. |
US4410209A (en) * | 1982-03-11 | 1983-10-18 | Trapani Silvio P | Wafer-handling tool |
DE3219502C2 (de) * | 1982-05-25 | 1990-04-19 | Ernst Leitz Wetzlar Gmbh, 6330 Wetzlar | Vorrichtung zum automatischen Transport scheibenförmiger Objekte |
US4616971A (en) * | 1983-10-11 | 1986-10-14 | Fairchild Camera And Instrument Corp. | Robotic hand and method for manipulating printed circuit boards |
US4553069A (en) * | 1984-01-05 | 1985-11-12 | General Ionex Corporation | Wafer holding apparatus for ion implantation |
US4558984A (en) * | 1984-05-18 | 1985-12-17 | Varian Associates, Inc. | Wafer lifting and holding apparatus |
US4595221A (en) * | 1984-10-09 | 1986-06-17 | Priam Corporation | Disc transfer device |
US4639028A (en) * | 1984-11-13 | 1987-01-27 | Economic Development Corporation | High temperature and acid resistant wafer pick up device |
US4626013A (en) * | 1984-12-11 | 1986-12-02 | General Electric Company | Dual axis gripper |
JPS61226287A (ja) * | 1985-03-07 | 1986-10-08 | エプシロン テクノロジー インコーポレーテツド | 加工品を取扱うたぬの装置および方法 |
US4685852A (en) * | 1985-05-20 | 1987-08-11 | Machine Technology, Inc. | Process apparatus and method and elevator mechanism for use in connection therewith |
US4696501A (en) * | 1986-01-30 | 1987-09-29 | Honeywell Inc. | Robot gripper |
US4701096A (en) * | 1986-03-05 | 1987-10-20 | Btu Engineering Corporation | Wafer handling station |
US4699414A (en) * | 1986-04-21 | 1987-10-13 | The United States Of America As Represented By The Secretary Of The Air Force | Multi use gripper for industrial robot |
US4806057A (en) * | 1986-04-22 | 1989-02-21 | Motion Manufacturing, Inc. | Automatic wafer loading method and apparatus |
-
1988
- 1988-05-25 US US07/198,347 patent/US4900214A/en not_active Expired - Lifetime
-
1989
- 1989-05-17 JP JP1121673A patent/JPH0220041A/ja active Pending
-
1990
- 1990-10-25 JP JP1990111168U patent/JPH0371641U/ja active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5114978B1 (ja) * | 1969-10-14 | 1976-05-13 | ||
JPS584389B2 (ja) * | 1976-04-07 | 1983-01-26 | 鹿島建設株式会社 | 運搬作業自動記録装置 |
JPS5864041A (ja) * | 1981-10-13 | 1983-04-16 | Nec Corp | ウエハのハンドリング装置 |
JPS62169439A (ja) * | 1986-01-22 | 1987-07-25 | Hitachi Ltd | 保持具 |
JPS62293631A (ja) * | 1986-06-13 | 1987-12-21 | Hitachi Ltd | ウエハ把持具 |
Also Published As
Publication number | Publication date |
---|---|
JPH0220041A (ja) | 1990-01-23 |
US4900214A (en) | 1990-02-13 |