JPH03505230A - プリント配線基板用の多軸配向熱変性ポリマー支持体 - Google Patents
プリント配線基板用の多軸配向熱変性ポリマー支持体Info
- Publication number
- JPH03505230A JPH03505230A JP1507527A JP50752789A JPH03505230A JP H03505230 A JPH03505230 A JP H03505230A JP 1507527 A JP1507527 A JP 1507527A JP 50752789 A JP50752789 A JP 50752789A JP H03505230 A JPH03505230 A JP H03505230A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- board support
- copper
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0008—Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
- B32B2255/205—Metallic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/514—Oriented
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/542—Shear strength
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/546—Flexural strength; Flexion stiffness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/724—Permeability to gases, adsorption
- B32B2307/7242—Non-permeable
- B32B2307/7246—Water vapor barrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/14—Corona, ionisation, electrical discharge, plasma treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31533—Of polythioether
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Thermal Sciences (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (20)
- (1)分子配向した熱変性液晶ポリマーフィルムから製造される、製品としての プリント配線基板支持体。
- (2)更に下記の特徴: (a)非導電性である、及び (b)吸湿性が低い、 を有することを特徴とする請求項1に記載のプリント配線基板支持体。
- (3)分子配向したポリマーがXydarまたはVectraから選択されるこ とを特徴とする請求項2に記載のプリント配線基板支持体。
- (4)更に前記支持体に結合された銅層を含むことを特徴とする請求項3に記載 のプリント配線基板支持体。
- (5)その他の特性として、適するように変化させ得る熱膨張係数(CTE)( X−Y方向)が約3〜7×10−6インチ/インチ/℃の範囲であることを特徴 とする請求項3に記載のプリント配線基板支持体。
- (6)その他の特性として、厚さ方向(Z方向)のCTEが銅のCTEに近いこ とを特徴とする請求項4に記載のプリント配線基板支持体。
- (7)その他の特性として、吸湿率が小さい、すなわち、飽和状態において約0 .5%以下であることを特徴とする請求項3に記載のプリント配線基板支持体。
- (8)更に、規則正しく並んだ複数のポリマー層を含んで一つの多層積層板を構 築していることを特徴とする請求項3に記載のプリント配線基板支持体。
- (9)更に前記支持体に結合された銅層を含むことを特徴とする請求項8に記載 のプリント配線基板支持体。
- (10)その他の特性として、単層の最大厚さが約0.0025インチ以下であ ることを特徴とする請求項8に記載のプリント配線基板支持体。
- (11)その他の特性として、層間のせん断強さがガラス/Kerimid60 1より大きいか又はガラス/エポキシと等しいことを特徴とする請求項8に記載 のプリント配線基板支持体。
- (12)その他の特性として、曲げ強度がガラス/ポリイミドと同等であること を特徴とする請求項8に記載のプリント配線基板支持体。
- (13)その他の特性として、機能周波数IKH2〜500MH2に対する誘電 率が約3.5以下であることを特徴とする請求項8に記載のプリント配線基板支 持体。
- (14)高密度無鉛化ペリメーターとして及びグリッドアレイセラミックチップ パッケージ中で用いることができることを特徴とする請求項8に記載のプリント 配線基板支持体。
- (15)チップ実装密度要求が、ペリメーター型パッケージに関しては中心間距 離0.020インチで1装置あたり300までの入力/出力(1/0)を有し、 グリッドアレイ型パッケージに関しては、中心間距離0.050インチで1装置 あたり240までの1/0を有することを特徴とする請求項14に記載のプリン ト配線基板支持体。
- (16)銅がプラズマコーティングによって付着されていることを特徴とする請 求項4に記載の銅でコーティングされたPWB支持体。
- (17)銅がイオンめっきによって付着されていることを特徴とする請求項4に 記載の銅でコーティングされたPWB支持体。
- (18)銅がプラズマコーティングによって付着されていることを特徴とする請 求項9に記載の銅でコーティングされたPWB支持体。
- (19)銅がイオンめっきによって付着されていることを特徴とする請求項9に 記載の銅でコーティングされたPWB支持体。
- (20)どの厚さも約0.0025インチ以下である数個のXydar及び/ま たはVectraフィルム層を一緒に結合することにより、多軸配向フィルム層 が複数積層した多層基板を形成することを特徴とする多層PWB支持体の形成方 法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US209,281 | 1988-06-20 | ||
US07/209,281 US4975312A (en) | 1988-06-20 | 1988-06-20 | Multiaxially oriented thermotropic polymer substrate for printed wire board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03505230A true JPH03505230A (ja) | 1991-11-14 |
JP2587510B2 JP2587510B2 (ja) | 1997-03-05 |
Family
ID=22778137
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50752789A Expired - Lifetime JP2587510B2 (ja) | 1988-06-20 | 1989-06-15 | プリント配線基板用の多軸配向熱変性ポリマー支持体 |
Country Status (8)
Country | Link |
---|---|
US (1) | US4975312A (ja) |
EP (1) | EP0420938B1 (ja) |
JP (1) | JP2587510B2 (ja) |
AT (1) | ATE173671T1 (ja) |
AU (1) | AU3869989A (ja) |
CA (1) | CA1322083C (ja) |
DE (1) | DE68928861T2 (ja) |
WO (1) | WO1989012550A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11307896A (ja) * | 1998-04-22 | 1999-11-05 | Kuraray Co Ltd | プリント配線板およびこれを用いた実装回路基板 |
JP2000269616A (ja) * | 1999-03-17 | 2000-09-29 | Kuraray Co Ltd | 高周波回路基板 |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5288529A (en) * | 1989-06-16 | 1994-02-22 | Foster-Miller Inc. | Liquid crystal polymer film |
WO1993006191A1 (en) * | 1991-09-17 | 1993-04-01 | Foster-Miller, Inc. | Controlling the coefficient of thermal expansion of liquid crystalline polymer based components |
US5259110A (en) * | 1992-04-03 | 1993-11-09 | International Business Machines Corporation | Method for forming a multilayer microelectronic wiring module |
US6027771A (en) * | 1993-02-25 | 2000-02-22 | Moriya; Akira | Liquid crystal polymer film and a method for manufacturing the same |
US5681624A (en) * | 1993-02-25 | 1997-10-28 | Japan Gore-Tex, Inc. | Liquid crystal polymer film and a method for manufacturing the same |
JP2939477B2 (ja) | 1994-08-16 | 1999-08-25 | エイチエヌエイ・ホールディングス・インコーポレーテッド | 液晶重合体−金属積層品および該積層品の製造法 |
US5545475A (en) * | 1994-09-20 | 1996-08-13 | W. L. Gore & Associates | Microfiber-reinforced porous polymer film and a method for manufacturing the same and composites made thereof |
US6320257B1 (en) * | 1994-09-27 | 2001-11-20 | Foster-Miller, Inc. | Chip packaging technique |
DE69632222T2 (de) * | 1995-03-31 | 2004-08-26 | Sumitomo Chemical Co., Ltd. | Verbundstoff aus flüssigkristallinem Polyesterharzzusammensetzungsfilm und Metallfolie und Leiterplatte daraus |
EP0737707B1 (en) * | 1995-04-12 | 2005-09-28 | Sumitomo Chemical Company, Limited | Liquid crystal polyester resin composition film |
US5814393A (en) * | 1995-10-19 | 1998-09-29 | Nitto Denko Corporation | Flexible printed circuit |
US5995361A (en) * | 1997-01-10 | 1999-11-30 | Foster-Miller, Inc. | Liquid crystalline polymer capacitors |
DE19838266A1 (de) | 1998-08-22 | 2000-02-24 | Mannesmann Vdo Ag | Einrichtung und Verfahren zum Vergießen elektrischer Schaltungen mittels Spritzguß |
US6528164B1 (en) | 1999-09-03 | 2003-03-04 | Sumitomo Chemical Company, Limited | Process for producing aromatic liquid crystalline polyester and film thereof |
US20040247921A1 (en) * | 2000-07-18 | 2004-12-09 | Dodsworth Robert S. | Etched dielectric film in hard disk drives |
US6403211B1 (en) | 2000-07-18 | 2002-06-11 | 3M Innovative Properties Company | Liquid crystal polymer for flexible circuits |
US6696163B2 (en) | 2000-07-18 | 2004-02-24 | 3M Innovative Properties Company | Liquid crystal polymers for flexible circuits |
US6923919B2 (en) * | 2000-07-18 | 2005-08-02 | 3M Innovative Properties Company | Liquid crystal polymers for flexible circuits |
WO2002049405A2 (en) | 2000-08-15 | 2002-06-20 | World Properties, Inc. | Multi-layer circuits and methods of manufacture thereof |
US20020064701A1 (en) * | 2000-09-11 | 2002-05-30 | Hand Doris I. | Conductive liquid crystalline polymer film and method of manufacture thereof |
AU2001292823A1 (en) | 2000-09-20 | 2002-04-02 | World Properties Inc. | Electrostatic deposition of high temperature, high performance thermoplastics |
US6372992B1 (en) | 2000-10-05 | 2002-04-16 | 3M Innovative Properties Company | Circuit protective composites |
JP2004516662A (ja) | 2000-12-14 | 2004-06-03 | ワールド・プロパティーズ・インコーポレイテッド | 液晶ポリマー接着層および該接着層から形成された回路 |
US20050208278A1 (en) * | 2001-08-22 | 2005-09-22 | Landi Vincent R | Method for improving bonding of circuit substrates to metal and articles formed thereby |
US6977187B2 (en) * | 2002-06-19 | 2005-12-20 | Foster-Miller, Inc. | Chip package sealing method |
US20040258885A1 (en) * | 2002-09-05 | 2004-12-23 | Kreutter Nathan P. | Etched dielectric film in microfluidic devices |
US20060234042A1 (en) * | 2002-09-05 | 2006-10-19 | Rui Yang | Etched dielectric film in microfluidic devices |
WO2004026009A1 (en) * | 2002-09-16 | 2004-03-25 | World Properties, Inc. | Liquid crystalline polymer composites, method of manufacture thereof, and articles formed therefrom |
US7142083B2 (en) | 2002-09-17 | 2006-11-28 | Lindsey Raymond A | Electronics component and method for fabricating same |
US7227179B2 (en) * | 2002-09-30 | 2007-06-05 | World Properties, Inc. | Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof |
US7180172B2 (en) * | 2003-06-19 | 2007-02-20 | World Properties, Inc. | Circuits, multi-layer circuits, and methods of manufacture thereof |
JP3968068B2 (ja) * | 2003-09-30 | 2007-08-29 | 株式会社クラレ | 液晶ポリマーフィルムの製造方法 |
US7549220B2 (en) * | 2003-12-17 | 2009-06-23 | World Properties, Inc. | Method for making a multilayer circuit |
CN1914961A (zh) * | 2004-01-20 | 2007-02-14 | 环球产权公司 | 电路材料、电路、多层电路及其制造方法 |
US7524388B2 (en) * | 2005-05-10 | 2009-04-28 | World Properties, Inc. | Composites, method of manufacture thereof, and articles formed therefrom |
US20070120089A1 (en) * | 2005-11-28 | 2007-05-31 | 3M Innovative Properties Company | Polymer etchant and method of using same |
US20080003404A1 (en) * | 2006-06-30 | 2008-01-03 | 3M Innovative Properties Company | Flexible circuit |
JP2011080170A (ja) * | 2009-10-09 | 2011-04-21 | Sumitomo Chemical Co Ltd | ガラスクロス含浸基材の製造方法およびプリント配線板 |
US9909063B2 (en) | 2010-11-03 | 2018-03-06 | 3M Innovative Properties Company | Polymer etchant and method of using same |
US9564672B2 (en) * | 2011-03-22 | 2017-02-07 | Intel Corporation | Lightweight cavity filter structure |
US10207916B2 (en) | 2014-05-28 | 2019-02-19 | 3M Innovative Properties Company | MEMS devices on flexible substrate |
US10189145B2 (en) * | 2015-12-30 | 2019-01-29 | Saint-Gobain Abrasives, Inc. | Abrasive tools and methods for forming same |
TWI740515B (zh) | 2019-12-23 | 2021-09-21 | 長春人造樹脂廠股份有限公司 | 液晶高分子膜及包含其之積層板 |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59206803A (ja) * | 1983-05-11 | 1984-11-22 | Nippon Telegr & Teleph Corp <Ntt> | 光フアイバ心線 |
JPS6058829A (ja) * | 1983-09-12 | 1985-04-05 | Nippon Telegr & Teleph Corp <Ntt> | 低線膨張率で高弾性率な液晶ポリマ−成形品の製造方法 |
JPS61102234A (ja) * | 1984-10-25 | 1986-05-20 | Asahi Chem Ind Co Ltd | ポリエステルフイルムの製造方法 |
JPS61130041A (ja) * | 1984-11-28 | 1986-06-17 | ポリプラスチックス株式会社 | 寸法安定性の良好な成形品の製造方法 |
JPS6295214A (ja) * | 1985-10-22 | 1987-05-01 | Yamaha Motor Co Ltd | Frp製品の成形用型 |
JPS6298792A (ja) * | 1985-10-25 | 1987-05-08 | 旭化成株式会社 | フレキシブルプリント配線用基板 |
JPS62174227A (ja) * | 1986-01-29 | 1987-07-31 | Nippon Oil Co Ltd | 高密度磁気記録体用液晶性ポリエステルフイルム |
JPS6374622A (ja) * | 1986-09-19 | 1988-04-05 | Asahi Chem Ind Co Ltd | フイルムの製造法 |
JPS6395930A (ja) * | 1986-10-14 | 1988-04-26 | Idemitsu Petrochem Co Ltd | 液晶性ポリエステルフイルムの製造方法 |
JPH01132195A (ja) * | 1987-11-18 | 1989-05-24 | Nippon Telegr & Teleph Corp <Ntt> | Vlsiチップ塔載用配線板 |
EP0428568A1 (en) * | 1988-06-13 | 1991-05-29 | Foster Miller Inc | MULTIAXIAL ORIENTATION THERMOTROPIC POLYMERIC FILMS AND PREPARATION METHOD. |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1136133A (en) * | 1966-05-26 | 1968-12-11 | Ici Ltd | New oriented films and tapes of polyethylene-1,2-diphenoxyethane-4,4'-dicarboxylate |
US3598637A (en) * | 1969-01-29 | 1971-08-10 | Celanese Corp | Metal-coated fibrillated products |
US3681297A (en) * | 1970-11-10 | 1972-08-01 | Gaetano Francis D Alelio | Synthesis of polybenzothiazolines and polybenzothiazoles by reacting a dialdehyde with an aromatic bis-mercaptoamine |
US4041206A (en) * | 1974-03-03 | 1977-08-09 | Toray Industries, Inc. | Laminated polyester film |
JPS5116363A (ja) * | 1974-07-31 | 1976-02-09 | Unitika Ltd | Hokozokuhoriamidofuirumuno seizohoho |
CH641400A5 (de) * | 1979-07-26 | 1984-02-29 | Tetra Pak Dev | Verfahren zur herstellung einer gereckten kunststoff-folie mit biaxialer molekuelorientierung. |
US4353974A (en) * | 1980-02-28 | 1982-10-12 | Ciba-Geigy Ag | Process for the production of photographic images and photographic materials used in this process |
US4332759A (en) * | 1980-07-15 | 1982-06-01 | Celanese Corporation | Process for extruding liquid crystal polymer |
GB2089276B (en) * | 1980-11-19 | 1984-09-05 | Metal Box Co Ltd | Thermoplastics tubular articles |
US4384016A (en) * | 1981-08-06 | 1983-05-17 | Celanese Corporation | Mutiaxially oriented high performance laminates comprised of uniaxially oriented sheets of thermotropic liquid crystal polymers |
JPS5832489A (ja) * | 1981-08-20 | 1983-02-25 | 日東電工株式会社 | 印刷回路用ポリエステルフイルム |
US4772089A (en) * | 1982-04-02 | 1988-09-20 | Polyplastics Co., Ltd. | Optical fiber cable and method for producing same |
US4533692A (en) * | 1982-09-17 | 1985-08-06 | Sri International | Liquid crystalline polymer compositions, process, and products |
US4533693A (en) * | 1982-09-17 | 1985-08-06 | Sri International | Liquid crystalline polymer compositions, process, and products |
WO1984001161A1 (en) * | 1982-09-17 | 1984-03-29 | Stanford Res Inst Int | Liquid crystalline poly(2,6-benzothiazole) compositions, process and products |
US4554119A (en) * | 1983-04-11 | 1985-11-19 | Celanese Corporation | Process for heat treating shaped articles of poly {[benzo(1,2-d:4,5-d')bisthiazole-2,6-diyl]-1,4-phenylene}, its cis isomer or mixtures thereof |
US4487735A (en) * | 1983-04-11 | 1984-12-11 | Celanese Corporation | Process for preparing film of poly{[benzo(1,2-d:4,5-d')bisthiazole-2,6-diyl]-1,4-phenylene}, its cis isomer or mixtures thereof |
EP0129372A3 (en) * | 1983-06-20 | 1987-04-15 | Imperial Chemical Industries Plc | Improved optical fibre cable |
US4600765A (en) * | 1984-02-17 | 1986-07-15 | Owens-Corning Fiberglas Corporation | Melt processable optically anisotropic polymers |
US4659408A (en) * | 1984-05-29 | 1987-04-21 | American Can Company | Multi-layer sheet structure, method of making same and containers made therefrom |
US4624872A (en) * | 1984-08-13 | 1986-11-25 | Celanese Corporation | Liquid crystalline polymer substrates with orthogonal molecular orientation |
JPS6178863A (ja) * | 1984-09-27 | 1986-04-22 | Toray Ind Inc | 二軸配向ポリエステルフイルム |
JPS626211A (ja) * | 1985-02-06 | 1987-01-13 | Sumitomo Electric Ind Ltd | 高配向性樹脂製補強部材およびその製造方法 |
US4699821A (en) * | 1985-08-19 | 1987-10-13 | Minnesota Mining & Manufacturing Company | Heat-recoverable sheet for use as protective closure |
JPH0816066B2 (ja) * | 1986-07-18 | 1996-02-21 | エーザイ株式会社 | 持続性薬効製剤 |
JPS6333427A (ja) * | 1986-07-25 | 1988-02-13 | Diafoil Co Ltd | ポリフエニレンスルフイドフイルム |
US4871595A (en) * | 1986-12-16 | 1989-10-03 | Foster Miller, Inc. | Lyotropic liquid crystalline oriented polymer substrate for printed wire board |
US4786348A (en) * | 1987-01-05 | 1988-11-22 | E. I. Du Pont De Nemours And Company | Method of making transparent oriented sheets |
US4774632A (en) * | 1987-07-06 | 1988-09-27 | General Electric Company | Hybrid integrated circuit chip package |
-
1988
- 1988-06-20 US US07/209,281 patent/US4975312A/en not_active Expired - Lifetime
-
1989
- 1989-06-15 AU AU38699/89A patent/AU3869989A/en not_active Abandoned
- 1989-06-15 JP JP50752789A patent/JP2587510B2/ja not_active Expired - Lifetime
- 1989-06-15 DE DE68928861T patent/DE68928861T2/de not_active Expired - Lifetime
- 1989-06-15 WO PCT/US1989/002620 patent/WO1989012550A1/en active IP Right Grant
- 1989-06-15 EP EP89908095A patent/EP0420938B1/en not_active Expired - Lifetime
- 1989-06-15 AT AT89908095T patent/ATE173671T1/de not_active IP Right Cessation
- 1989-06-16 CA CA 603063 patent/CA1322083C/en not_active Expired - Lifetime
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59206803A (ja) * | 1983-05-11 | 1984-11-22 | Nippon Telegr & Teleph Corp <Ntt> | 光フアイバ心線 |
JPS6058829A (ja) * | 1983-09-12 | 1985-04-05 | Nippon Telegr & Teleph Corp <Ntt> | 低線膨張率で高弾性率な液晶ポリマ−成形品の製造方法 |
JPS61102234A (ja) * | 1984-10-25 | 1986-05-20 | Asahi Chem Ind Co Ltd | ポリエステルフイルムの製造方法 |
JPS61130041A (ja) * | 1984-11-28 | 1986-06-17 | ポリプラスチックス株式会社 | 寸法安定性の良好な成形品の製造方法 |
JPS6295214A (ja) * | 1985-10-22 | 1987-05-01 | Yamaha Motor Co Ltd | Frp製品の成形用型 |
JPS6298792A (ja) * | 1985-10-25 | 1987-05-08 | 旭化成株式会社 | フレキシブルプリント配線用基板 |
JPS62174227A (ja) * | 1986-01-29 | 1987-07-31 | Nippon Oil Co Ltd | 高密度磁気記録体用液晶性ポリエステルフイルム |
JPS6374622A (ja) * | 1986-09-19 | 1988-04-05 | Asahi Chem Ind Co Ltd | フイルムの製造法 |
JPS6395930A (ja) * | 1986-10-14 | 1988-04-26 | Idemitsu Petrochem Co Ltd | 液晶性ポリエステルフイルムの製造方法 |
JPH01132195A (ja) * | 1987-11-18 | 1989-05-24 | Nippon Telegr & Teleph Corp <Ntt> | Vlsiチップ塔載用配線板 |
EP0428568A1 (en) * | 1988-06-13 | 1991-05-29 | Foster Miller Inc | MULTIAXIAL ORIENTATION THERMOTROPIC POLYMERIC FILMS AND PREPARATION METHOD. |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11307896A (ja) * | 1998-04-22 | 1999-11-05 | Kuraray Co Ltd | プリント配線板およびこれを用いた実装回路基板 |
JP2000269616A (ja) * | 1999-03-17 | 2000-09-29 | Kuraray Co Ltd | 高周波回路基板 |
Also Published As
Publication number | Publication date |
---|---|
WO1989012550A1 (en) | 1989-12-28 |
DE68928861T2 (de) | 1999-06-02 |
DE68928861D1 (de) | 1999-01-07 |
CA1322083C (en) | 1993-09-14 |
EP0420938B1 (en) | 1998-11-25 |
US4975312A (en) | 1990-12-04 |
ATE173671T1 (de) | 1998-12-15 |
AU3869989A (en) | 1990-01-12 |
JP2587510B2 (ja) | 1997-03-05 |
EP0420938A1 (en) | 1991-04-10 |
EP0420938A4 (en) | 1991-09-25 |
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