JPH0345641U - - Google Patents

Info

Publication number
JPH0345641U
JPH0345641U JP1989106076U JP10607689U JPH0345641U JP H0345641 U JPH0345641 U JP H0345641U JP 1989106076 U JP1989106076 U JP 1989106076U JP 10607689 U JP10607689 U JP 10607689U JP H0345641 U JPH0345641 U JP H0345641U
Authority
JP
Japan
Prior art keywords
electrode metal
metal film
metal plate
area
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989106076U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989106076U priority Critical patent/JPH0345641U/ja
Publication of JPH0345641U publication Critical patent/JPH0345641U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は従来の半導体装置の断面構造図、第２
図は本考案の実施例をしめす。断面構造図であり
、１は半導体チツプ、２は電極金属膜、３は第１
の電極金属板、４は第２の電極金属板、５，６は
半田材、７は絶縁膜である。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 半導体チツプの主表面の一方に電極金属膜
    を被着し、該電極金属膜上に第１の電極金属板を
    配設し、又、該半導体チツプの主表面の他方に第
    ２の電極金属板を配設し、それらを半田材で接着
    した半導体装置において、第１の電極金属板の面
    積を電極金属膜の面積の１／２以下とし、又、第
    ２の電極金属板の面積を前記半導体チツプと同等
    又はそれ以上とすると共に、第１の電極金属板と
    電極金属膜を接着する半田材の形状を第１の電極
    金属板の上部又は側部近傍から電極金属膜の外周
    に向つて薄くなるように形成したことを特徴とす
    る半導体装置。 (2) 電極金属膜と半導体チツプとの間にシヨツ
    トキーバリアを形成した実用新案登録請求の範囲
    第(1)項の半導体装置。
JP1989106076U 1989-09-08 1989-09-08 Pending JPH0345641U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989106076U JPH0345641U (ja) 1989-09-08 1989-09-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989106076U JPH0345641U (ja) 1989-09-08 1989-09-08

Publications (1)

Publication Number Publication Date
JPH0345641U true JPH0345641U (ja) 1991-04-26

Family

ID=31654823

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989106076U Pending JPH0345641U (ja) 1989-09-08 1989-09-08

Country Status (1)

Country Link
JP (1) JPH0345641U (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100684496B1 (ko) * 2006-11-22 2007-02-22 비엠케이 주식회사 튜브 어셈블리 분말 충진장치
KR101009098B1 (ko) * 2008-05-08 2011-01-18 주식회사 에스디티 대용량 정제저장호퍼 리프터
JP2012182253A (ja) * 2011-02-28 2012-09-20 Sanken Electric Co Ltd 半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6066847A (ja) * 1983-09-24 1985-04-17 Nippon Denso Co Ltd 半導体整流装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6066847A (ja) * 1983-09-24 1985-04-17 Nippon Denso Co Ltd 半導体整流装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100684496B1 (ko) * 2006-11-22 2007-02-22 비엠케이 주식회사 튜브 어셈블리 분말 충진장치
KR101009098B1 (ko) * 2008-05-08 2011-01-18 주식회사 에스디티 대용량 정제저장호퍼 리프터
JP2012182253A (ja) * 2011-02-28 2012-09-20 Sanken Electric Co Ltd 半導体装置

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