JPH0345641U - - Google Patents
Info
- Publication number
- JPH0345641U JPH0345641U JP1989106076U JP10607689U JPH0345641U JP H0345641 U JPH0345641 U JP H0345641U JP 1989106076 U JP1989106076 U JP 1989106076U JP 10607689 U JP10607689 U JP 10607689U JP H0345641 U JPH0345641 U JP H0345641U
- Authority
- JP
- Japan
- Prior art keywords
- electrode metal
- metal film
- metal plate
- area
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 230000004888 barrier function Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Description
第１図は従来の半導体装置の断面構造図、第２
図は本考案の実施例をしめす。断面構造図であり
、１は半導体チツプ、２は電極金属膜、３は第１
の電極金属板、４は第２の電極金属板、５，６は
半田材、７は絶縁膜である。
Figure 1 is a cross-sectional structural diagram of a conventional semiconductor device;
The figure shows an embodiment of the invention. 1 is a cross-sectional structural diagram, in which 1 is a semiconductor chip, 2 is an electrode metal film, and 3 is a first
4 is a second electrode metal plate, 5 and 6 are solder materials, and 7 is an insulating film.
Claims (1)
を被着し、該電極金属膜上に第１の電極金属板を
配設し、又、該半導体チツプの主表面の他方に第
２の電極金属板を配設し、それらを半田材で接着
した半導体装置において、第１の電極金属板の面
積を電極金属膜の面積の１／２以下とし、又、第
２の電極金属板の面積を前記半導体チツプと同等
又はそれ以上とすると共に、第１の電極金属板と
電極金属膜を接着する半田材の形状を第１の電極
金属板の上部又は側部近傍から電極金属膜の外周
に向つて薄くなるように形成したことを特徴とす
る半導体装置。 (2) 電極金属膜と半導体チツプとの間にシヨツ
トキーバリアを形成した実用新案登録請求の範囲
第(1)項の半導体装置。[Claims for Utility Model Registration] (1) An electrode metal film is deposited on one of the main surfaces of a semiconductor chip, a first electrode metal plate is disposed on the electrode metal film, and In a semiconductor device in which a second electrode metal plate is disposed on the other main surface and these are bonded together with a solder material, the area of the first electrode metal plate is 1/2 or less of the area of the electrode metal film, and The area of the second electrode metal plate is equal to or larger than the semiconductor chip, and the shape of the solder material for bonding the first electrode metal plate and the electrode metal film is set to the upper or side area of the first electrode metal plate. 1. A semiconductor device characterized in that an electrode metal film is formed so as to become thinner from the vicinity toward the outer periphery of the electrode metal film. (2) The semiconductor device according to claim (1) of the utility model registration, in which a Schottky barrier is formed between an electrode metal film and a semiconductor chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989106076U JPH0345641U (en) | 1989-09-08 | 1989-09-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989106076U JPH0345641U (en) | 1989-09-08 | 1989-09-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0345641U true JPH0345641U (en) | 1991-04-26 |
Family
ID=31654823
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989106076U Pending JPH0345641U (en) | 1989-09-08 | 1989-09-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0345641U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100684496B1 (en) * | 2006-11-22 | 2007-02-22 | 비엠케이 주식회사 | Powder filling apparatus for tube assembly |
| KR101009098B1 (en) * | 2008-05-08 | 2011-01-18 | 주식회사 에스디티 | Lifter for large-capacity tablets storage hopper |
| JP2012182253A (en) * | 2011-02-28 | 2012-09-20 | Sanken Electric Co Ltd | Semiconductor device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6066847A (en) * | 1983-09-24 | 1985-04-17 | Nippon Denso Co Ltd | Semiconductor rectifying device |
-
1989
- 1989-09-08 JP JP1989106076U patent/JPH0345641U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6066847A (en) * | 1983-09-24 | 1985-04-17 | Nippon Denso Co Ltd | Semiconductor rectifying device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100684496B1 (en) * | 2006-11-22 | 2007-02-22 | 비엠케이 주식회사 | Powder filling apparatus for tube assembly |
| KR101009098B1 (en) * | 2008-05-08 | 2011-01-18 | 주식회사 에스디티 | Lifter for large-capacity tablets storage hopper |
| JP2012182253A (en) * | 2011-02-28 | 2012-09-20 | Sanken Electric Co Ltd | Semiconductor device |