JPH0344479A - Method and device for electroless plating by spinner process - Google Patents
Method and device for electroless plating by spinner processInfo
- Publication number
- JPH0344479A JPH0344479A JP17703889A JP17703889A JPH0344479A JP H0344479 A JPH0344479 A JP H0344479A JP 17703889 A JP17703889 A JP 17703889A JP 17703889 A JP17703889 A JP 17703889A JP H0344479 A JPH0344479 A JP H0344479A
- Authority
- JP
- Japan
- Prior art keywords
- turntable
- plated
- plating
- electroless plating
- soln
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007772 electroless plating Methods 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title claims description 35
- 230000008569 process Effects 0.000 title description 12
- 238000012545 processing Methods 0.000 claims abstract description 42
- 238000004140 cleaning Methods 0.000 claims abstract description 17
- 239000007788 liquid Substances 0.000 claims description 53
- 230000003287 optical effect Effects 0.000 claims description 4
- 238000007747 plating Methods 0.000 abstract description 28
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 16
- 239000000463 material Substances 0.000 abstract description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 5
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 39
- 238000005342 ion exchange Methods 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- 239000003054 catalyst Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000002585 base Substances 0.000 description 4
- 230000003750 conditioning effect Effects 0.000 description 4
- TUSDEZXZIZRFGC-UHFFFAOYSA-N 1-O-galloyl-3,6-(R)-HHDP-beta-D-glucose Natural products OC1C(O2)COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC1C(O)C2OC(=O)C1=CC(O)=C(O)C(O)=C1 TUSDEZXZIZRFGC-UHFFFAOYSA-N 0.000 description 3
- 239000001263 FEMA 3042 Substances 0.000 description 3
- LRBQNJMCXXYXIU-PPKXGCFTSA-N Penta-digallate-beta-D-glucose Natural products OC1=C(O)C(O)=CC(C(=O)OC=2C(=C(O)C=C(C=2)C(=O)OC[C@@H]2[C@H]([C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)O2)OC(=O)C=2C=C(OC(=O)C=3C=C(O)C(O)=C(O)C=3)C(O)=C(O)C=2)O)=C1 LRBQNJMCXXYXIU-PPKXGCFTSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- LRBQNJMCXXYXIU-NRMVVENXSA-N tannic acid Chemical compound OC1=C(O)C(O)=CC(C(=O)OC=2C(=C(O)C=C(C=2)C(=O)OC[C@@H]2[C@H]([C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)O2)OC(=O)C=2C=C(OC(=O)C=3C=C(O)C(O)=C(O)C=3)C(O)=C(O)C=2)O)=C1 LRBQNJMCXXYXIU-NRMVVENXSA-N 0.000 description 3
- 229940033123 tannic acid Drugs 0.000 description 3
- 235000015523 tannic acid Nutrition 0.000 description 3
- 229920002258 tannic acid Polymers 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 229910000531 Co alloy Inorganic materials 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 description 2
- -1 formate and acetate Chemical compound 0.000 description 2
- 230000005389 magnetism Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 101000767534 Arabidopsis thaliana Chorismate mutase 2 Proteins 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BDAGIHXWWSANSR-UHFFFAOYSA-M Formate Chemical compound [O-]C=O BDAGIHXWWSANSR-UHFFFAOYSA-M 0.000 description 1
- 101000986989 Naja kaouthia Acidic phospholipase A2 CM-II Proteins 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000006172 buffering agent Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003002 pH adjusting agent Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000004071 soot Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920001059 synthetic polymer Polymers 0.000 description 1
- NCPXQVVMIXIKTN-UHFFFAOYSA-N trisodium;phosphite Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])[O-] NCPXQVVMIXIKTN-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、無電解めっき方法及び装置に関するものであ
り、より詳細には、浴の管理を容易にしたスピナー法に
よる無電解めっき方法及びその装置に関するものである
。Detailed Description of the Invention (Industrial Application Field) The present invention relates to an electroless plating method and apparatus, and more particularly to an electroless plating method using a spinner method that facilitates bath management and its electroless plating method. It is related to the device.
（従来の技術及びその問題点）
無電解めっきは、電気めっ−きのように電気エネルギー
を用いずに、還元剤の働きで、めっき浴中の金属イオン
を被めっき物（基材）上に析出させめっきをする方法で
あり、電気を通さない無機絶縁材料や高分子材料などに
も通用できること、金属蒸着やスパッターなどのように
大規模な装置を必要としないこと、及び、被めっき物の
形状が複雑なものであっても通用しうるなどの利点があ
るため、装飾品としてばかりでなく、基材本来の性質に
導電性や磁性など新しい性質を付与した複合材料を作り
出すための手段としても利用され広汎な用途への対応が
検討されている。(Prior art and its problems) Electroless plating uses the action of a reducing agent to transfer metal ions in a plating bath onto the object to be plated (substrate), without using electrical energy like electroplating. It is a method of plating by depositing on the material to be plated, and can also be applied to inorganic insulating materials and polymeric materials that do not conduct electricity, does not require large-scale equipment like metal vapor deposition or sputtering, and has the following advantages: It has the advantage that it can be used even if the shape is complex, so it is not only useful as a decorative item, but also as a means to create composite materials that add new properties such as conductivity and magnetism to the original properties of the base material. It is also being used as a device, and is being considered for a wide range of applications.
ところで、従来より、無電解めっきの基本的な方法であ
る、
■ 被めっき物（基材）の表面処理（前処理）工程
■ 基材面への触媒付与工程
■ めっき浴浸漬工程
は、いずれも、それぞれの液が入っている槽中へ、基材
を順次浸漬する方法によって行われている。By the way, conventionally, the basic methods of electroless plating include: ■ surface treatment (pretreatment) process of the object to be plated (substrate) ■ process of applying catalyst to the surface of the substrate ■ process of dipping in a plating bath. This is done by sequentially immersing the substrate into a tank containing each liquid.
しかしながら、このような従来の無電解めっき方法では
、前処理液、触媒液、めっき液への浸漬が順次行われる
ことにより、多液が次の工程の槽に同伴されることにな
り、この工程がくり返し行われるうちに、多液の経時変
化を招き、めっき時間やめっき状態が安定しないばかり
でなく、めっき被膜が不均質になったり、基材との密着
性が悪くなるなどの欠点が生起する。However, in such conventional electroless plating methods, immersion in a pretreatment solution, a catalyst solution, and a plating solution are carried out sequentially, resulting in a large number of solutions being carried into the tank for the next process, and this process As this process is repeated, many liquids change over time, which not only makes the plating time and plating condition unstable, but also causes defects such as the plating film becoming non-uniform and poor adhesion to the substrate. do.
このような欠点は、めっきをする目的が、光ディスクの
マスタースタンパ−の電導膜形成や磁気ディスク基板の
コバルト合金めっき等のように、めっき面が緻密である
ことが要求される用途においては、致命的な欠点となる
。These drawbacks are fatal in applications where the purpose of plating requires a dense plating surface, such as forming a conductive film on master stampers for optical disks or cobalt alloy plating on magnetic disk substrates. This is a disadvantage.
このような欠点を防止するために、多液への浸漬後、次
の液への浸漬前に、その都度水洗を行ったりするが、こ
の方法は煩雑さを伴なうとともに、手作業によらなけれ
ばならず、極めて非能率的であるばかりでなく、水洗が
不十分である場合には、依然として前の処理液が次の処
理液に持込まれることになり、処理液の経時変化が避け
られないという欠点が存在する。In order to prevent such drawbacks, washing with water is performed each time after immersion in multiple liquids and before immersion in the next liquid, but this method is complicated and requires manual labor. Not only is it very inefficient, but if water washing is insufficient, the previous processing solution will still be carried into the next processing solution, and aging of the processing solution can be avoided. There is a drawback that there is no
（発明の目的）
そこで、本発明の目的は、緻密な表面を有するめっき物
を、効率的に、浴の変性を伴なうことなく得るための無
電解めっき方法を提供することにある。(Object of the Invention) Therefore, an object of the present invention is to provide an electroless plating method for efficiently obtaining a plated object having a dense surface without modifying the bath.
さらに、本発明の他の目的は、前記無電解めっき方法を
効率的に実施するための装置を提供することにある。Furthermore, another object of the present invention is to provide an apparatus for efficiently carrying out the electroless plating method.
（問題点を解決するための手段）
本発明によれば、回転するターンテーブル上に載置した
被めっき物表面に、処理液ならびに洗浄液を複数のノズ
ルから滴下することを特徴とする無電解めっき方法が提
供され、この無電解めっき方法は、モーターによって回
転する円板状のターンテーブルと、ターンテーブル上に
載置された被めっき物表面に、その上方から処理液及び
洗浄液を滴下するための複数のノズルとを有し、前記タ
ーンテーブルには、ターンテーブル面に接して起立した
側壁（せき）を設けたことを特徴とする無電解めっき装
置によって好適に実施することができ、前記側壁（せき
）として、ターンテーブル面から１１０乃至１７０度の
角度で上方に広がる傾斜を有するものを使用することに
よって、−層効率的な無電解めっきが達成される。(Means for Solving the Problems) According to the present invention, electroless plating is characterized in that a processing liquid and a cleaning liquid are dropped from a plurality of nozzles onto the surface of an object to be plated placed on a rotating turntable. This electroless plating method includes a disc-shaped turntable rotated by a motor, and a method for dropping a processing liquid and a cleaning liquid onto the surface of an object to be plated placed on the turntable from above. The electroless plating apparatus can be preferably carried out using an electroless plating apparatus having a plurality of nozzles, and the turntable is provided with a side wall (weir) standing upright in contact with the turntable surface, and the side wall ( Efficient electroless plating is achieved by using a weir with a slope extending upwardly from the turntable surface at an angle of 110 to 170 degrees.
（作 用）
本発明の無電解めっき方法の最も大きな特徴は、回転す
るターンテーブル上に載置した被めっき物に対して、各
処理液や洗浄液を複数のノズルから滴下する、いわゆる
スピナー法によって行うことにある。複数のノズルは、
それぞれ、前処理液、触媒液、めっき（夜及び洗浄液な
どの入った容器に連結されており、自体公知の制御機構
によって順次滴下され、無電解めっきが施されることに
なる。(Function) The most significant feature of the electroless plating method of the present invention is that it uses the so-called spinner method, in which each treatment solution and cleaning solution is dropped from a plurality of nozzles onto the object to be plated, which is placed on a rotating turntable. It's about doing. Multiple nozzles are
Each container is connected to a container containing a pretreatment solution, a catalyst solution, a plating solution, a cleaning solution, etc., and is sequentially dropped by a known control mechanism to perform electroless plating.
この方法によれば、従来の無電解めっき方法のように、
被めっき物を各処理液が入った槽に順次浸漬してゆく移
動の手間が省けると同時に、前の処理液が次の処理液に
同伴されて、液の変質を伴なうことなく、高品質のめっ
き物が得られるという特徴を有する。さらに、この方法
は、被めっき物をターンテーブル上に載置したり取外す
以外の作業は、全て自動制御装置による自動化を行うこ
とができるため、クリーンルーム内で人手を要すること
なく、自動化による無電解めっきが可能となり、被めっ
き物が例えば光ディスクのマスタースタンパ−や、磁気
ディスクのコバルト合金めっき等の高品質のめっきが要
求されるものに好適に適用することができる。According to this method, unlike the conventional electroless plating method,
This eliminates the hassle of moving the object to be plated by immersing it in a tank containing each treatment solution one after another, and at the same time, the previous treatment solution is carried along with the next treatment solution, which eliminates the problem of changing the quality of the solution. It is characterized by the ability to obtain high-quality plated products. Furthermore, with this method, all work other than placing and removing the object to be plated on the turntable can be automated using an automatic control device, so there is no need for human labor in the clean room, and electroless electroless processing can be achieved through automation. It is possible to perform plating, and it can be suitably applied to items that require high-quality plating, such as master stampers for optical disks and cobalt alloy plating for magnetic disks.
本発明によれば、前記ターンテーブルが平板でなく、例
えばお盆の様に端面を起立させた側壁を有することによ
り、ノズルから噴射された処理液や洗浄液が側壁の上端
水平面まで貯留されることになり、その分、処理液や洗
浄液と被めっき物との接触時間が長くなり、より効率的
に無電解めっきを施すことが可能になる。According to the present invention, the turntable is not a flat plate but has a side wall with an upright end surface like a tray, so that the processing liquid and cleaning liquid sprayed from the nozzle are stored up to the horizontal surface of the upper end of the side wall. Accordingly, the contact time between the processing liquid or the cleaning liquid and the object to be plated becomes longer, and it becomes possible to perform electroless plating more efficiently.
（好適態様の説明）
無電解めっきが可能な金属は、ニッケル、銅、コバルト
、金、銀、白金及びすす等であり、めっき液（めっき浴
ともいう）は、主成分である金属塩と次亜リン酸ナトリ
ウム、亜リン酸ナトリウム、ホルマリン、ヒドラジンな
どの還元剤及びギ酸塩や酢酸塩などの緩衝剤を主成分と
し、これに必要に応じて、アルカリ金属水酸化物などの
ｐＨ調整剤、錯化剤、促進剤または安定剤などを補助成
分として含むことがある。(Description of preferred embodiments) Metals that can be electrolessly plated include nickel, copper, cobalt, gold, silver, platinum, and soot. The main ingredients are reducing agents such as sodium phosphite, formalin, and hydrazine, and buffering agents such as formate and acetate, and if necessary, pH adjusting agents such as alkali metal hydroxides. Complexing agents, accelerators or stabilizers may be included as auxiliary ingredients.
無電解めっきの具体的方法は、まず、被めっき物（基材
〉の表面を、例えば、市販の処理剤である奥野製薬製０
ＰＣ−３５０コンディショナーおよびドデシルベンゼン
スルホン酸ナトリウム等の前処理剤によって、エツチン
グ、脱脂を行い、表面を極性かつ湿潤可能にすることが
必要である。この際、基材が合成高分子の場合は、水酸
化ナトリウムで処理することが好ましい。表面が処理さ
れた基材は、金属パラジウムなどの触媒液と接触させた
後、めっき液と接触させることによって還元反応が進行
し、基材表面に金属めっき層が形成される。The specific method of electroless plating is to first coat the surface of the object to be plated (substrate) with a commercially available treatment agent, such as 0 manufactured by Okuno Pharmaceutical Co., Ltd.
Pretreatment agents such as PC-350 conditioner and sodium dodecylbenzenesulfonate are required to etch, degrease, and render the surface polar and wettable. At this time, if the base material is a synthetic polymer, it is preferable to treat it with sodium hydroxide. The surface-treated base material is brought into contact with a catalyst solution such as metal palladium, and then with a plating solution, whereby a reduction reaction proceeds and a metal plating layer is formed on the surface of the base material.
被めっき物をターンテーブルに固着する場合は、通常、
ターンテーブル面心設けた吸引孔を通して真空吸着する
方法を用いるが、被めっき物が平面を持たない形状のも
のであって、真空吸着が適用できない場合には、ターン
テーブルの側壁を高くして外周押さえを兼ねるか、また
被めっき物が金属の場合には、ターンテーブルを磁性材
料で構成し、磁気による固着を行うこともできる。When fixing the object to be plated to the turntable,
A vacuum suction method is used through a suction hole provided in the face of the turntable. However, if the object to be plated has a shape that does not have a flat surface and vacuum suction cannot be applied, the side wall of the turntable is raised and the outer periphery is removed. If the object to be plated is metal, the turntable may be made of a magnetic material and fixed by magnetism.
本発明の無電解めっき装置の１例を示す第１図において
、駆動モーター３によって回転するターンテーブル１の
周辺には、端面を起立したお盆のような側壁（せき）２
が形成されている。この側壁は、処理液滴下ノズル９か
ら散布された処理液をターンテーブル上に一時貯留する
ためのものであって、被めっき物が処理液中に埋没する
程度の高さを有するものを任意に使用する。被めっき物
をターンテーブルにセットした後、ターンテーブルをモ
ーター３によって、約３０乃至１００ ｒｐｍ程度の比
較的ゆっくりした回転を与え、処理液滴下ノズル９から
前処理液の滴下を行う。被めっき物が処理液中に埋没し
た状態に達したら、処理液の供給を停止し、一定時間、
被めっき物と処理液との接触を行う。この際、ターンテ
ーブルは停止した状態でもかまわないが、より有効な処
理を行うためには、前記した程度のゆっくりした回転を
与えることが好ましい。In FIG. 1 showing an example of the electroless plating apparatus of the present invention, a turntable 1 rotated by a drive motor 3 is surrounded by a tray-like side wall 2 with an upright end.
is formed. This side wall is for temporarily storing the processing liquid sprayed from the processing liquid dripping nozzle 9 on the turntable, and may optionally have a height that allows the object to be plated to be submerged in the processing liquid. use. After the object to be plated is set on the turntable, the turntable is rotated relatively slowly at about 30 to 100 rpm by the motor 3, and the pretreatment liquid is dripped from the treatment liquid dripping nozzle 9. When the object to be plated reaches a state where it is buried in the processing solution, the supply of processing solution is stopped and the object is left for a certain period of time.
The object to be plated is brought into contact with the processing solution. At this time, the turntable may be in a stopped state, but in order to perform more effective processing, it is preferable to rotate it slowly as described above.
以上の工程を一定時間経過した後、ターンテーブルの回
転を急激に５００ ｒｐｍ以上、好ましくは７００ ｒ
ｐｍ程度の高速で行うことにより、遠心力で処理液を側
壁を越えてターンテーブルの外へ放出させる。この際、
側壁は、ターンテーブル面から上に広がる傾斜を有する
ことによって、処理液の放出が一層有効に行うことがで
きる。側壁の傾斜角度（θ）は、ターンテーブル面から
１１０乃至１７０°、好ましくは１３０乃至１６０９程
度に形成されるのがよく、この傾斜は直線状が好ましい
。処理液滴下ノズルは、処理液容器５から供給管７を通
して送られた処理液を被めっき物の表面に滴下するため
のものであって処理液の種類（通常は３ ｆｆｌ類）に
応じた数の処理液供給機構を設置することが望ましい。After the above steps have passed for a certain period of time, the turntable is rapidly rotated at 500 rpm or more, preferably 700 rpm.
By performing this at a high speed of about 100 pm, the centrifugal force causes the processing liquid to be discharged over the side wall and out of the turntable. On this occasion,
By having the side wall sloped upward from the turntable surface, the processing liquid can be discharged more effectively. The inclination angle (θ) of the side wall is preferably about 110 to 170 degrees, preferably about 130 to 1,609 degrees from the turntable surface, and this inclination is preferably linear. The processing liquid dripping nozzle is for dropping the processing liquid sent from the processing liquid container 5 through the supply pipe 7 onto the surface of the object to be plated, and the number of processing liquid dripping nozzles corresponds to the type of processing liquid (usually 3 ffl). It is desirable to install a treatment liquid supply mechanism.
処理液容器５に収容された処理液は、供給管７を通して
加圧状態で吹きこまれる窒素ガスのような加圧気体の作
用によって滴下されるものであるが、高品質のめっきを
施すためには、十分に濾過したものを用い、さらに供給
管７からノズル９に至る段階で、さらにフィルター８を
設けることが望ましい。The processing liquid stored in the processing liquid container 5 is dripped by the action of a pressurized gas such as nitrogen gas that is blown into the supply pipe 7 under pressure. It is desirable to use a filter that has been thoroughly filtered, and to further provide a filter 8 at the stage from the supply pipe 7 to the nozzle 9.
第１の処理液を遠心力によって放出させたら、ターンテ
ーブルの回転を再び３０乃至１００ ｒｐｍ程度の速度
におとし、第２の処理液の供給を別の処理液供給ノズル
（図示せず）からの滴下によって行う。この操作を繰り
返し行うことによって無電解めっきが達成された後、洗
浄液供給管１０を通してノズル１１から洗浄液が滴下さ
れる。洗浄液の供給は、めっき終了後だけでもよいが、
各処理終了後によの都度行うことがよく、洗浄液として
は通常イオン交換水が使用される。処理または洗浄後の
廃液は、チャンバーの底部に設けられた排液口４を通っ
て排出される。かくの如くして無電解めっき工程が終了
した後、ターンテーブルを停止して全工程を終了する。After the first processing liquid is discharged by centrifugal force, the turntable is rotated again at a speed of about 30 to 100 rpm, and the second processing liquid is supplied from another processing liquid supply nozzle (not shown). Perform by dripping. After electroless plating is achieved by repeating this operation, the cleaning liquid is dripped from the nozzle 11 through the cleaning liquid supply pipe 10. The cleaning solution can be supplied only after plating is completed, but
This is often carried out after each treatment, and ion-exchanged water is usually used as the cleaning solution. The waste liquid after treatment or cleaning is discharged through a drain port 4 provided at the bottom of the chamber. After the electroless plating process is thus completed, the turntable is stopped and the entire process is completed.
各処理工程や洗浄工程の時間は、被めっき物の大きさや
形状によっても異なるが、例えば、被めっき物が、光デ
ィスクのマスタースタンパーの場合には、前処理工程が
５乃至４０分、好ましくは１５分乃至２０分、触媒液接
触工程が２乃至２０分、好ましくは５乃至１５分、めっ
き液接触工程が２乃至２０分、好ましくは５乃至１０分
、洗浄工程が１乃至１０分、好ましくは３乃至５分で全
工程が終了する。そして、この場合に消費される各処理
液、めっき液及び洗浄液の量は、２００乃至４００ｃｃ
である。The time for each treatment step and cleaning step varies depending on the size and shape of the object to be plated, but for example, if the object to be plated is a master stamper for an optical disk, the pretreatment step will take 5 to 40 minutes, preferably 15 minutes. minutes to 20 minutes, catalyst liquid contact step 2 to 20 minutes, preferably 5 to 15 minutes, plating solution contact step 2 to 20 minutes, preferably 5 to 10 minutes, washing step 1 to 10 minutes, preferably 3 minutes. The entire process is completed in 5 minutes. The amount of each processing solution, plating solution, and cleaning solution consumed in this case is 200 to 400 cc.
It is.
（発明の効果）
本発明によれば、各処理液および洗浄液が別々のノズル
から供給されるため、従来の処理槽へ浸漬する方法のよ
うに、処理液が次の処理液に同伴されて液の安定を損な
うということがなく、常に一定の品質の無電解めっきが
達成されるとともに、処理種間の移動を人手によって行
うことが不必要であるために、工程が簡素化され、しか
も自体公知の自動制御装置を用いての自動化が可能であ
るため、省力化が図れ、クリーンルーム内での自動無電
解めっきによる精密なめっき製品を得ることができる。(Effects of the Invention) According to the present invention, since each processing liquid and cleaning liquid are supplied from separate nozzles, the processing liquid is entrained by the next processing liquid, unlike the conventional method of immersing it in a processing tank. Electroless plating of a constant quality is always achieved without compromising the stability of the process, and there is no need for manual transfer between treatment types, which simplifies the process and is known per se. Since automation is possible using an automatic control device, it is possible to save labor and obtain precision plated products through automatic electroless plating in a clean room.
（実施例） 以下に実施例によって本発明の詳細な説明する。(Example) The present invention will be explained in detail below by way of examples.
実施例１
第１図に示した５〜９の処理液供給機構を６ｆ！！（め
っき液については５０℃に保温しておいたもの）用意し
、各々の容器中には以下のような処理液を調製した。Example 1 The processing liquid supply mechanisms 5 to 9 shown in FIG. 1 are 6F! ! (The plating solution had been kept at 50° C.) and the following processing solution was prepared in each container.
表面調整液： 奥野製薬社（以下０社）製０ＰＣ−３５
０コンディショナー５０
ＩＩ１１にイオン交換水を加えて１０００ｍＩＬにする
。Surface conditioning liquid: 0PC-35 manufactured by Okuno Pharmaceutical Co., Ltd. (hereinafter referred to as Company 0)
0 Conditioner 50 Add ion exchange water to II11 to make 1000ml.
脱 脂 液二 〇社製ドデシルベンゼンスルホン酸ナト
リウム３００１Ｊ！にイオン交換水を加えて１００１０
０Ｏにする。Degreasing liquid 2 Sodium dodecylbenzenesulfonate 3001J made by company! Add ion exchange water to 10010
Set it to 0O.
タンニン酸水溶液： 和光純薬製 タンニン酸（化学用
）５ｇをイオン交換水１００゜ｍｊｌ中に溶解させる。Tannic acid aqueous solution: Wako Pure Chemical Industries, Ltd. Dissolve 5 g of tannic acid (chemical grade) in 100 mjl of ion-exchanged water.
触 媒 液： イオン交換水５００ｎ＋Ｊ２中に濃塩酸
３０ｍＪＺを加えた後、Ｏ社製０ＰＣ−３ＡＬＩ ７０
ｇを加えて溶解させる。ついで、Ｏ社製 ｏｐｃ−ａ。Catalyst liquid: After adding 30 mJZ of concentrated hydrochloric acid to 500 n of ion exchange water + J2, 0PC-3ALI 70 manufactured by O Company
Add g and dissolve. Next, OPC-A manufactured by O Company.
キャタリスト８０ＩＩＩｆＬを加えた後、全量が１０１
００Ｏになるようイオン交
換水を加える。After adding Catalyst 80IIIfL, the total amount is 101
Add ion exchange water to bring the temperature to 000.
活性化液： 約８００ｍｊ２のイオン交換水にＯ社製
０ＰＣ−５００アクセ
レータ（Ｍ−１）１００ Ｉｌｘ、同じくＯ社製 ０
ＰＣ−５００アクセレー
タＣＭ−２）１０ｍｕを加えた後、全
量が１００１００Ｏになるようにイオン交換水を加える
。Activation liquid: Approximately 800 mj2 of ion-exchanged water manufactured by Company O
0PC-500 accelerator (M-1) 100 Ilx, also made by O company 0
After adding 10 mu of PC-500 accelerator CM-2), add ion exchange water so that the total amount becomes 100100O.
６、めっき液二 日本カニゼン社製シューマーＳ−６８
０２００ｍｌにイオン交換
水８００＋ｎｆＬを加えて調製。6. Plating solution 2 Schumer S-68 manufactured by Nippon Kanigen Co., Ltd.
Prepared by adding 800+nfL of ion exchange water to 0200ml.
坐２」しＬ法
１）第１図に示した側壁の傾斜角度１４０度の円板状タ
ーンテーブルにレジストマスター（ガラス基板（２２０
ｍｍφ×厚さ６０１１１１）上にレジストを塗布し、レ
ーザで露光、現像処理を行ないスパイラル状の溝を形成
したもの）をセットし、裏面を真空吸着し動かないよう
固定しておく。L method 1) A resist master (glass substrate (220
(mmφ×thickness: 601111 mm) was coated with a resist, exposed and developed with a laser to form a spiral groove), and the back surface was vacuum-adsorbed to fix it so that it would not move.
表面調整液の入った容器に通ずる窒素加圧ライン６のバ
ルブを開き、処理液容器を加圧状態にし、処理液滴下ノ
ズル９から表面調整液２５０ｍ４をガラス基板上に滴下
する。The valve of the nitrogen pressurizing line 6 leading to the container containing the surface conditioning liquid is opened to pressurize the processing liquid container, and 250 m4 of the surface conditioning liquid is dripped onto the glass substrate from the processing liquid dropping nozzle 9.
ターンテーブル駆動モータ３のスイッチを入れ、ターン
テーブルを５０ ｒ、ｐ、ｍで３ｍ１ｎ間回転させる。Turn on the turntable drive motor 3 and rotate the turntable for 3 m1n at 50 r, p, m.
３ ｗｉｎ後ターンテーブルの回転数を５００「、ｐ」
まで上げ、遠心力を利用してターンテーブル内の表面調
整液を系外にブローする。3 After win, set the turntable rotation speed to 500 ",p"
The surface conditioning liquid inside the turntable is blown out of the system using centrifugal force.
２） ターンテーブルの回転数を５０ ｒ、ｐ、ｍに下
げノズル１１からイオン交換水２５０ｍＡを滴下する。2) Lower the rotation speed of the turntable to 50 r, p, m, and drop 250 mA of ion exchange water from the nozzle 11.
５分間ターンテーブルを回転させた後、ターンテーブル
の回転数を５００ ｒ、ｐ劃まで上げイオン交換水を系
外にブローする。After rotating the turntable for 5 minutes, the rotation speed of the turntable was increased to 500 rpm and ion exchange water was blown out of the system.
３）ｌ）〜２）と同じ方法で脱脂液３ ｍｉｎ ％タン
ニン酸水溶液３ｍ１ｎ、触媒液５ＩＩｌｌｎｂそして活
性化液３ ａｋｉｎの順で処理を行なう。3) In the same manner as in 1) to 2), a degreasing solution (3 min % aqueous tannic acid solution 3 ml 1n), a catalyst solution 5IIllnb and an activating solution 3 akin were used in this order.
４）活性化液で処理したガラス基板上に、温度５０℃の
めっき液を滴下し、５０ ｒ、ｐ劃の回転数で５ ｗｉ
ｎ間回転させた後、５００ ｒ、ｐ、ｍまで回転数を上
げめっき液を系外にブローする。4) Drop the plating solution at a temperature of 50°C onto the glass substrate treated with the activating solution, and rotate at 50 r and p for 5 wi.
After rotating for n times, the rotation speed was increased to 500 r, p, m, and the plating solution was blown out of the system.
５）ターンテーブルの回転数を５０ ｒ、ｐ、ｍに下げ
、ノズル１１からイオン交換水２５０ｍ１を滴下する。5) Lower the rotation speed of the turntable to 50 r, p, m, and drop 250 ml of ion exchange water from the nozzle 11.
５ ｗｉｎ間ターンテーブルを回転させた後、ターンテ
ーブルの回転数を５００ ｒ、ｐ劃まで上げ、イオン交
換水を系外にブローし、表面が１００％めっきされたレ
ジストマスターを得た。After rotating the turntable for 5 hours, the rotation speed of the turntable was increased to 500 r, p, and ion exchange water was blown out of the system to obtain a resist master whose surface was 100% plated.
この場合、めっき被膜の平均厚さは２０１０人であった
。In this case, the average thickness of the plating film was 2010.
実施例２
実施例１とターンテーブルを回転数、ならびにめっき液
温度は同一にして各試薬の処理時間を変えて実験を行っ
た場合の結果を表１に示す。Example 2 Table 1 shows the results of an experiment in which the rotation speed of the turntable and the temperature of the plating solution were the same as in Example 1, but the processing time of each reagent was changed.
表１の結果から、前処理での各試薬の処理時間は２ ｗ
ｉｎ以上であれば良い。From the results in Table 1, the processing time for each reagent in pretreatment was 2 w.
It is sufficient if it is equal to or greater than in.
第１図は、本発明の無電解めっき装置の一構成図であり
、
第２図は、本発明のターンテーブルの一例を示す断面図
である。
ターンテーブル ２：側壁（せき）
ターンテーブル駆動モーター
排液口 ５：処理液容器FIG. 1 is a configuration diagram of an electroless plating apparatus of the present invention, and FIG. 2 is a sectional view showing an example of a turntable of the present invention. Turntable 2: Side wall (weir) Turntable drive motor drain port 5: Processing liquid container
Claims (4)
表面に、処理液ならびに洗浄液を複数のノズルから滴下
することを特徴とする無電解めっき方法。(1) An electroless plating method characterized by dropping a processing liquid and a cleaning liquid from a plurality of nozzles onto the surface of an object to be plated placed on a rotating turntable.
ーである請求項（１）記載の無電解めっき方法。(2) The electroless plating method according to claim 1, wherein the object to be plated is a master stamper for an optical disk.
ルと、ターンテーブル上に載置された被めっき物表面に
、その上方から処理液及び洗浄液を滴下するための複数
のノズルとを有し、前記ターンテーブルには、ターンテ
ーブル面に接して起立した側壁を設けたことを特徴とす
る無電解めっき装置。(3) It has a turntable on a disc that is rotated by a motor, and a plurality of nozzles for dropping a processing liquid and a cleaning liquid from above onto the surface of the object to be plated placed on the turntable, and the An electroless plating apparatus characterized in that the turntable is provided with a side wall that stands up in contact with the turntable surface.
０度の角度で上方に広がる傾斜を有するものである請求
項（３）記載の無電解めっき装置。(4) The side wall is 110 to 17 mm from the turntable surface.
The electroless plating apparatus according to claim 3, wherein the electroless plating apparatus has an inclination that extends upward at an angle of 0 degrees.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17703889A JPH0344479A (en) | 1989-07-11 | 1989-07-11 | Method and device for electroless plating by spinner process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17703889A JPH0344479A (en) | 1989-07-11 | 1989-07-11 | Method and device for electroless plating by spinner process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0344479A true JPH0344479A (en) | 1991-02-26 |
Family
ID=16024061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17703889A Pending JPH0344479A (en) | 1989-07-11 | 1989-07-11 | Method and device for electroless plating by spinner process |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0344479A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0623598A (en) * | 1992-04-03 | 1994-02-01 | Kikusui Seisakusho:Kk | Device for cleaning part of tablet machine |
| US6001235A (en) * | 1997-06-23 | 1999-12-14 | International Business Machines Corporation | Rotary plater with radially distributed plating solution |
| JP2007204777A (en) * | 2006-01-31 | 2007-08-16 | Yoshinori Isomoto | Plating method |
| US7416647B2 (en) * | 2003-05-13 | 2008-08-26 | Shinko Electric Industries Co., Ltd. | Plating processing device |
-
1989
- 1989-07-11 JP JP17703889A patent/JPH0344479A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0623598A (en) * | 1992-04-03 | 1994-02-01 | Kikusui Seisakusho:Kk | Device for cleaning part of tablet machine |
| US6001235A (en) * | 1997-06-23 | 1999-12-14 | International Business Machines Corporation | Rotary plater with radially distributed plating solution |
| US7416647B2 (en) * | 2003-05-13 | 2008-08-26 | Shinko Electric Industries Co., Ltd. | Plating processing device |
| JP2007204777A (en) * | 2006-01-31 | 2007-08-16 | Yoshinori Isomoto | Plating method |
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