JPH0343925A - Flat thermal fuse - Google Patents
Flat thermal fuseInfo
- Publication number
- JPH0343925A JPH0343925A JP17838189A JP17838189A JPH0343925A JP H0343925 A JPH0343925 A JP H0343925A JP 17838189 A JP17838189 A JP 17838189A JP 17838189 A JP17838189 A JP 17838189A JP H0343925 A JPH0343925 A JP H0343925A
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- tip
- flat
- flattened
- lead conductors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 239000002184 metal Substances 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 14
- 238000002844 melting Methods 0.000 claims abstract description 12
- 230000008018 melting Effects 0.000 claims abstract description 12
- 238000009413 insulation Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- 230000006835 compression Effects 0.000 abstract 1
- 238000007906 compression Methods 0.000 abstract 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 7
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 7
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 7
- 230000004907 flux Effects 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 239000000155 melt Substances 0.000 description 2
- 229910000846 In alloy Inorganic materials 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- SXDBWCPKPHAZSM-UHFFFAOYSA-M bromate Inorganic materials [O-]Br(=O)=O SXDBWCPKPHAZSM-UHFFFAOYSA-M 0.000 description 1
- SXDBWCPKPHAZSM-UHFFFAOYSA-N bromic acid Chemical compound OBr(=O)=O SXDBWCPKPHAZSM-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- CBPYOHALYYGNOE-UHFFFAOYSA-M potassium;3,5-dinitrobenzoate Chemical compound [K+].[O-]C(=O)C1=CC([N+]([O-])=O)=CC([N+]([O-])=O)=C1 CBPYOHALYYGNOE-UHFFFAOYSA-M 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は電気機器を異師昇速がら保護するために使用す
る合金型の平型温度ヒユーズに関するものである。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to an alloy-type flat temperature fuse used to protect electrical equipment from abnormal speed increases.
〈従来の技術〉
ヒユーズエレメントに低融点可溶金属片を使用せる合金
型平型温度ヒユーズにおいては、保護すべき電気機器が
過電流発熱すると、その発生熱によりヒユーズエレメン
トを溶断して機器への通電を遮断する。かかる合金型温
度ヒヱーズのうち、本体部分を平型にしたものは、薄型
コンパクト化、配置の安定化等の点において有利であり
、従来、第５図、第６図に示すものが知られている。<Prior art> In alloy type flat temperature fuses that use a piece of low-melting-point fusible metal for the fuse element, when electrical equipment to be protected generates heat due to overcurrent, the generated heat melts the fuse element and prevents damage to the equipment. Cut off electricity. Among such alloy-type temperature fuses, those with a flat main body are advantageous in terms of thinness and compactness, stabilization of arrangement, etc. Conventionally, the ones shown in FIGS. 5 and 6 have been known. There is.
第５図に示す平型温度ヒユーズにおいて（ま、絶縁基板
２′の片面に一対の膜状電極１３” −１３′を並設し
、先端部１２′を扁平化したリード導体ｌ′・１′の当
該扁平部１２′ ・１２’を電極１３′ ・１３′に
溶接し、電極間に低融点可溶金属片３′を橋設し、該金
属片上にフラックス層４′を設け、絶縁基板の片面上に
絶縁層５′を被覆しである。In the flat temperature fuse shown in FIG. The flat parts 12' and 12' of the insulating substrate are welded to the electrodes 13' and 13', a low melting point fusible metal piece 3' is bridged between the electrodes, a flux layer 4' is provided on the metal piece, and the insulating substrate is An insulating layer 5' is coated on one side.
他方の第６図に示す平型温度ヒエーズにおいては、先端
部１２′を扁平化した一対のリード導体１′ ・１′を
並行に配し、これらリード導体の扁平部間に低融点可溶
金属片３′を橋設し、該金属片にフラックス４′を塗布
し、これらを絶縁体５′（シート状絶縁体）で包囲しで
ある。In the other flat-type thermal conductor shown in FIG. 6, a pair of lead conductors 1' and 1' with flattened tips 12' are arranged in parallel, and a low melting point fusible metal is placed between the flat parts of these lead conductors. A piece 3' is bridged, a flux 4' is applied to the metal piece, and these are surrounded by an insulator 5' (sheet-like insulator).
く解決しようとする課題〉
しかしながら、第５図に示すものでは、絶縁基板上に膜
状電極を形成する必要があり、製造工数が多く不利であ
る。これに対し、第６図に示すものでは、かかる不利は
ない。しかし、第５図、第６図に示す何れの温度ヒユー
ズにＪ３いても、一対のリード導体１′ ・１′が近接
しており、ヒユーズエレメント溶断後での電圧課電中に
、リード導体間の絶縁体表面に沿って沿面放電が生じ易
い。Problems to be Solved> However, the method shown in FIG. 5 is disadvantageous in that it is necessary to form a film-like electrode on an insulating substrate, which requires a large number of manufacturing steps. In contrast, the arrangement shown in FIG. 6 does not have this disadvantage. However, no matter which temperature fuse J3 shown in FIGS. creeping discharge is likely to occur along the insulator surface.
この沿面放電を防止するためにはリード線１′１′の間
隔を広くすることが有効であるが、これでは温度ヒユー
ズ本体の巾が広くなって温度ヒユーズのコンパクト化に
不利である。In order to prevent this creeping discharge, it is effective to widen the interval between the lead wires 1'1', but this increases the width of the temperature fuse body, which is disadvantageous for making the temperature fuse compact.
もっとも上記の沿面放電、あるいは寸法増大は、温度ヒ
ユーズをアキシャルタイプにすることにより排除し得る
が、第５図または第６図に示す温度ヒユーズを単にアキ
シャルタイプにしただけでは、リード導体に引張力また
は捩りモーメントが作用すると、機械的損傷を避は難い
。However, the above-mentioned creeping discharge or size increase can be eliminated by making the temperature fuse an axial type, but simply making the temperature fuse shown in Fig. 5 or 6 an axial type will not cause tensile force on the lead conductor. Or, if a torsional moment acts, mechanical damage is inevitable.
本発明の目的は、引張力・捩れモーメントに対して充分
な強度を付与できるアキシャルタイプの平型温度ヒユー
ズを提供することにある。An object of the present invention is to provide an axial type flat temperature fuse that can provide sufficient strength against tensile force and torsional moment.
く課題を解決するための手段〉
本発明に係る平型温度ヒユーズは、丸線導体の先端部を
扁平化し、該扁平部の先端部両脇に突子を設けた一対の
リード導体を一直線状で対向して配し、各リード導体の
扁平部を絶縁基板の片面に当設し、各扁平部の先端部両
脇の突子を絶縁基板に埋着し、両扁平部間に低融点可溶
金属片を橋設し、絶縁基板上に絶縁層を被覆したことを
特徴とする構成である。Means for Solving the Problems> The flat temperature fuse according to the present invention is provided by flattening the tip of a round wire conductor, and forming a pair of lead conductors with protrusions on both sides of the tip of the flat portion in a straight line. The flat part of each lead conductor is placed on one side of the insulating substrate, and the protrusions on both sides of the tip of each flat part are embedded in the insulating substrate, and a low melting point conductor is placed between both flat parts. This structure is characterized in that a piece of molten metal is bridged and an insulating layer is coated on an insulating substrate.
〈実施例の説明〉
以下、図面により本発明の実施例について説明する。第
１図は本発明の一実施例を示す一部欠切上面図、第２図
並びに第３図は第１図における■■断面図並びにｍ−ｍ
断面図である。<Description of Examples> Examples of the present invention will be described below with reference to the drawings. FIG. 1 is a partially cutaway top view showing an embodiment of the present invention, and FIGS. 2 and 3 are cross-sectional views and mm-m in FIG. 1.
FIG.
第１図乃至第３図において、１・１は一対のリード導体
であり、−直線状にて対向して配しである。In FIGS. 1 to 3, reference numerals 1 and 1 indicate a pair of lead conductors, which are arranged facing each other in a straight line.
このリード導体には、第４図にも示すように丸線導体（
例えば、銅線〉１１の先端部を圧潰加工により扁平化し
、該扁平部１２の先端部両脇を直角に折曲げて突子１３
・１３に形成したものを使用している。This lead conductor is a round wire conductor (as shown in Fig. 4).
For example, the tip of the copper wire 11 is flattened by crushing, and both sides of the tip of the flat portion 12 are bent at right angles to form the protrusion 13.
・The one formed in 13 is used.
２は絶縁基板であり、上記各リード導体１・１の扁平部
１２・１２を該絶縁基板の片面に当設し、扁平部の先端
部両脇の突子１３・１３を該絶縁基板に埋着しである。2 is an insulating substrate, the flat portions 12 of each of the lead conductors 1 and 1 are placed on one side of the insulating substrate, and the projections 13 on both sides of the tips of the flat portions are embedded in the insulating substrate. It's a dress.
この埋着には、絶縁基板がプラスチックの場合、突子先
端を刃形にし、これを基板面に圧入する方法、突子を加
熱し基板に押込溶着する方法等を使用できる。絶縁基板
がセラミックス板、ガラス板のような無機質板の場合は
、絶縁板に突子埋着用溝を設け、該溝に突子を嵌入する
方法を使用できる。３は両リード導体１・１の扁平部１
２・１２間に橋設せる低融点可溶金属片であり、断面丸
形、平形の何れをも使用でき、各扁平部と低融点可溶金
属片との間は溶接しである。この低融点可溶金属片の組
成は温度ヒユーズの作動温度に応じて選定し、例えば、
５ｎ−Ｐｂをベースとし、Ｂｉ、Ｃｄ等を適量添加して
融点を調整したものを用いることができる。４は低融点
可溶金属片上に塗布したフラックスであり、ロジン（天
然ロジン、精製ロジン、重合ロジン、変成ロジン、水添
ロジン、不均化ロジン）を主成分とし、必要に応じて活
性剤（ジエチルアミンの塩酸塩、臭酸塩）を添加したも
のを使用できる。５は絶縁基板上に被覆した絶縁層であ
り、例えばエポキシ樹脂層を使用できる。When the insulating substrate is made of plastic, this embedding can be performed by making the tip of the protrusion into a blade shape and press-fitting it into the substrate surface, or by heating the protrusion and welding it to the substrate by pressing it into the substrate. When the insulating substrate is an inorganic plate such as a ceramic plate or a glass plate, a method can be used in which grooves for embedding the protrusions are provided in the insulating plate and the protrusions are inserted into the grooves. 3 is the flat part 1 of both lead conductors 1.
It is a piece of low melting point fusible metal that is installed as a bridge between 2. The composition of this low melting point fusible metal piece is selected depending on the operating temperature of the temperature fuse, for example:
A material based on 5n-Pb with appropriate amounts of Bi, Cd, etc. added thereto to adjust the melting point can be used. 4 is a flux coated on a piece of low melting point fusible metal, the main component of which is rosin (natural rosin, purified rosin, polymerized rosin, modified rosin, hydrogenated rosin, disproportionated rosin), and optionally contains an activator ( Diethylamine hydrochloride, bromate) can be used. 5 is an insulating layer coated on the insulating substrate, and for example, an epoxy resin layer can be used.
上記において、リード導体に引張力Ｆまたは捩りモーメ
ントＭが作用すると、各リード導体扁平部と絶縁基板と
の接触面並びに同扁平部と絶縁層との接触面に引張り反
力またはモーメント反力が作用する。扁平郡単位長さ当
りの反力をαまたはβとし、扁平部の先端部の手前まで
の距離をＬとすると、同先端部に作用する引張力ｆ、捩
りモーメントｍは
ｆ−Ｆ−５ｏＬα ｄｘ ■ｍ＝Ｍ−５ｏＬ
β ｄｘ ■であり、α、βが比較的小さい
ためにｆ、ｍは大である。しかしながら、先端部の両脇
を突子により絶縁基板に埋着しであるから、先端部の耐
引張強度、耐捩りモーメント強度を大きくでき、上記ｆ
、ｍに対して先端部を安定に固定できる。従って、低融
点可溶金属片（低強度）を上記引張力、捩りモーメント
から良好に保護できる。In the above, when a tensile force F or a torsional moment M acts on the lead conductor, a tensile reaction force or a moment reaction force acts on the contact surface between each lead conductor flat part and the insulating substrate, and the contact surface between the flat part and the insulating layer. do. If the reaction force per unit length of the flat part is α or β, and the distance to this side of the flat part is L, the tensile force f and torsional moment m acting on the flat part are f-F-5oLα dx ■m=M-5oL
β dx (2), and since α and β are relatively small, f and m are large. However, since both sides of the tip are embedded in the insulating substrate by protrusions, the tensile strength and torsional moment resistance of the tip can be increased, and the above f
, m, the tip can be stably fixed. Therefore, the low melting point fusible metal piece (low strength) can be well protected from the above-mentioned tensile force and twisting moment.
」−記において、リード導体扁平部の突子を絶縁火板の
絶縁側に設けると、第の式、第０式においてＬ ＝ Ｏ
となって、ｆ＝Ｆ、ｍ＝Ｍとなり、この突子形成部分よ
りも先におけるリード導体扁平部と絶縁基板または絶縁
層との接触界面を引張り力負担または捩りモーメント負
担に何ら寄与させ得す、全てを突子に負担させることに
なり、機械的に不利である。しかし本発明においては、
上記第の式、第０式からも明らかなように、突子以外の
部分にも引張り力または捩りモーメン１〜を負担させて
おり、かかる不利がない。'', if the protrusion of the flat part of the lead conductor is provided on the insulating side of the insulating fire plate, L = O in the equations 1 and 0.
Therefore, f=F, m=M, and the contact interface between the flat part of the lead conductor and the insulating substrate or the insulating layer beyond the protrusion forming part cannot contribute to the burden of tensile force or torsional moment. , all of the burden is placed on the protrusion, which is mechanically disadvantageous. However, in the present invention,
As is clear from the above equations 1 and 0, tensile force or torsional moment 1~ is applied to parts other than the protrusions, so there is no such disadvantage.
〈発明の効果〉
上述した通り、本発明に係る平型温度ヒユーズは、引張
りまたは捩りモーメン１〜に対する強度を充分に備えた
アキシャルタイプであり、低融点可溶金属片が溶断した
ときの両リード導体間の清面絶縁距離が絶縁基板の半周
にわたる長距離であるから、同−Ｌ溶断時での絶縁強度
を充分に確保でき、絶縁基板ｒｊ１を小さくしても、こ
の絶縁強度をよく保有させ得るから、平型温度ヒユーズ
本体の小型化を図り得る。<Effects of the Invention> As described above, the flat temperature fuse according to the present invention is an axial type that has sufficient strength against tensile or torsional moments of 1 or more, and both leads are strong when a piece of low melting point fusible metal is fused. Since the clean surface insulation distance between the conductors is a long distance covering half the circumference of the insulating board, sufficient insulation strength can be ensured when the -L melts, and even if the insulating board rj1 is made small, this insulation strength can be maintained well. As a result, the flat temperature fuse body can be made smaller.
第１図は本発明の一実施例を示す一部矢切上面図、第２
図並びに第３図はそれぞれ第１図におけるＩｌ−■断面
図並びにｌ−１１１断面図、第４図は本発明において使
用するリード導体を示す斜視図、第５図並びに第６図は
それぞれ従来例を示す説明図である。FIG. 1 is a partially cut-away top view showing one embodiment of the present invention, and FIG.
3 and 3 are a sectional view taken along line Il and 111 in FIG. 1, respectively, FIG. 4 is a perspective view showing a lead conductor used in the present invention, and FIGS. FIG.
Claims (1)
に突子を設けた一対のリード導体を対向して配し、各リ
ード導体の扁平部を絶縁基板の片面に当接し、各扁平部
の先端部両脇の突子を絶縁基板に埋着し、両扁平部問に
低融点可溶金属片を橋設し、絶縁基板上に絶縁層を被覆
したことを特徴とする平型温度ヒューズ。The tip of a round wire conductor is flattened, a pair of lead conductors with protrusions provided on both sides of the tip of the flat portion are arranged facing each other, and the flat portion of each lead conductor is brought into contact with one side of an insulating substrate, The protrusions on both sides of the tip of each flat part are embedded in an insulating substrate, a piece of low melting point fusible metal is bridged between both flat parts, and the insulating substrate is covered with an insulating layer. type thermal fuse.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17838189A JPH0795418B2 (en) | 1989-07-10 | 1989-07-10 | Flat thermal fuse |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17838189A JPH0795418B2 (en) | 1989-07-10 | 1989-07-10 | Flat thermal fuse |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0343925A true JPH0343925A (en) | 1991-02-25 |
| JPH0795418B2 JPH0795418B2 (en) | 1995-10-11 |
Family
ID=16047499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17838189A Expired - Fee Related JPH0795418B2 (en) | 1989-07-10 | 1989-07-10 | Flat thermal fuse |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0795418B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03226933A (en) * | 1990-01-31 | 1991-10-07 | Kazuyoshi Yamadera | Temperature fuse and its manufacture |
| JP2010522421A (en) * | 2007-03-26 | 2010-07-01 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Thermal fuse |
| JP2011077023A (en) * | 2009-10-01 | 2011-04-14 | Samsung Sdi Co Ltd | Current breaking element, and secondary battery equipped with the same |
-
1989
- 1989-07-10 JP JP17838189A patent/JPH0795418B2/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03226933A (en) * | 1990-01-31 | 1991-10-07 | Kazuyoshi Yamadera | Temperature fuse and its manufacture |
| JP2010522421A (en) * | 2007-03-26 | 2010-07-01 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Thermal fuse |
| JP2011077023A (en) * | 2009-10-01 | 2011-04-14 | Samsung Sdi Co Ltd | Current breaking element, and secondary battery equipped with the same |
| CN102035186A (en) * | 2009-10-01 | 2011-04-27 | 三星Sdi株式会社 | Current interrupting device and secondary battery including current interrupting device |
| US8741453B2 (en) | 2009-10-01 | 2014-06-03 | Samsung Sdi Co., Ltd. | Current interrupting device and secondary battery including current interrupting device |
| EP2306485B1 (en) * | 2009-10-01 | 2016-07-27 | Samsung SDI Co., Ltd. | Current interrupting device and secondary battery including current interrupting device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0795418B2 (en) | 1995-10-11 |
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