JPH0436530Y2 - - Google Patents
Info
- Publication number
- JPH0436530Y2 JPH0436530Y2 JP5908787U JP5908787U JPH0436530Y2 JP H0436530 Y2 JPH0436530 Y2 JP H0436530Y2 JP 5908787 U JP5908787 U JP 5908787U JP 5908787 U JP5908787 U JP 5908787U JP H0436530 Y2 JPH0436530 Y2 JP H0436530Y2
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- point metal
- low melting
- metal body
- temperature fuse
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000002844 melting Methods 0.000 claims description 22
- 230000008018 melting Effects 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Description
【考案の詳細な説明】
<産業上の利用分野>
本考案は温度ヒユーズの改良に関するものであ
る。[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to an improvement of a temperature fuse.
<従来の技術>
温度ヒユーズにおいては、保護すべき電気機器
に付設して使用し、該電気機器が過電流により異
常に温度上昇すると、その熱のために温度ヒユー
ズが加熱され、該ヒユーズの主体である低融点金
属体がその融点に達すると、その溶融と溶融体に
作用する表面張力とによつて低融点金属体が溶断
し、この溶断によつて機器への通電が遮断され
る。<Prior art> Temperature fuses are attached to electrical equipment to be protected, and when the temperature of the electrical equipment rises abnormally due to overcurrent, the temperature fuse is heated due to the heat, and the main body of the fuse is heated. When the low melting point metal body reaches its melting point, the low melting point metal body fuses due to the melting and the surface tension acting on the molten body, and this melting cuts off the power supply to the device.
<解決しようとする問題点>
この温度ヒユーズの作動の迅速化には、低融点
金属体の温度上昇の迅速化、溶融金属体の溶断の
迅速化が密接に関連し、その迅速化のためには、
低融点金属体の線径を小さくすることが有効であ
る。<Problem to be solved> Speeding up the operation of this temperature fuse is closely related to speeding up the temperature rise of the low melting point metal body and speeding up the fusing of the molten metal body. teeth,
It is effective to reduce the wire diameter of the low melting point metal body.
しかしながら、低融点金属体を細線化すると、
電気抵抗が増大し、従来の温度ヒユーズにおいて
は、かかる通電抵抗の点から、低融点金属体の細
線化が困難である。 However, when the low melting point metal body is thinned,
Electrical resistance increases, and in conventional temperature fuses, it is difficult to thin the low melting point metal body due to such current carrying resistance.
本考案の目的は、低融点金属体を細線化しても
電流容量を充分に確保できる温度ヒユーズを提供
することにある。 An object of the present invention is to provide a temperature fuse that can ensure sufficient current capacity even when the low-melting point metal body is thinned.
<問題点を解決するための技術的手段>
本考案に係る温度ヒユーズは、絶縁基板上に一
対の櫛状電極を交互に入込ませて設け、これらの
電極にまたがつて低融点金属の線条体を付設した
ことを特徴とする構成である。<Technical means for solving the problem> The temperature fuse according to the present invention is provided with a pair of comb-shaped electrodes inserted alternately on an insulating substrate, and a wire made of a low melting point metal is installed across these electrodes. This structure is characterized by the addition of strips.
<実施例> 以下、図面により本考案を説明する。<Example> The present invention will be explained below with reference to the drawings.
第1図において、1は絶縁基板であり、耐熱性
並びに絶縁性に秀れたもの、例えばセラミツクス
を用いることができる。2a,2bは絶縁基板の
片面上に設けた少なくとも一対の櫛状電極であ
り、交互に入込ませてある。この電極は、銅箔積
層絶縁板の銅箔のエツチング、あるいは、絶縁基
板上への導電性塗料の印刷、焼付け等により形成
できる。3は低融点金属体の線条体であり、上記
両電極にまたがつて少なくとも1本は付設し、線
条体と電極との接触面は電気的に導通させてあ
る。この線条体3には線径が0.01〜0.5mmφの細
線、あるいは厚みが0.01〜0.5の箔状体を用いる
ことができる。4は絶縁基板の片面全体に被覆せ
る絶縁層、例えば、エポキシ樹脂のモールド層で
ある。5a,5bは各電極に接続せるリード線で
ある。上記において、低融点金属体上または電極
上には、フラツクスを塗布するが、図示は省略し
てある。 In FIG. 1, reference numeral 1 denotes an insulating substrate, and a material having excellent heat resistance and insulation properties, such as ceramics, can be used. Reference numerals 2a and 2b are at least a pair of comb-shaped electrodes provided on one side of the insulating substrate, and are inserted alternately. This electrode can be formed by etching the copper foil of the copper foil laminated insulating board, or by printing or baking a conductive paint onto the insulating substrate. Reference numeral 3 denotes a filamentous body made of a low melting point metal, at least one of which is attached across both of the electrodes, and the contact surface between the filamentous body and the electrode is electrically conductive. The filament 3 may be a thin wire with a diameter of 0.01 to 0.5 mm, or a foil with a thickness of 0.01 to 0.5 mm. Reference numeral 4 denotes an insulating layer, such as an epoxy resin mold layer, which covers the entire surface of the insulating substrate. 5a and 5b are lead wires connected to each electrode. In the above, flux is applied onto the low melting point metal body or the electrode, but illustration is omitted.
上記において、一方の電極2aの櫛の歯数をn
(例えば4箇)、他方の電極2bの櫛の歯数をn+
1(例えば5箇)とすれば、低融点金属体3は両
電極間に2n箇(例えば8箇)の並例路で橋設さ
れていることになる。従つて、通常の直列接続
(従来の温度ヒユーズ)に較べて低融点金属体に
基づく電気抵抗を著しく低減できる。 In the above, the number of teeth of the comb of one electrode 2a is n
(for example, 4), and the number of teeth of the comb of the other electrode 2b is n+
1 (for example, 5), the low melting point metal body 3 is bridged with 2n (for example, 8) parallel paths between both electrodes. Therefore, the electrical resistance due to the low melting point metal body can be significantly reduced compared to a normal series connection (conventional temperature fuse).
上記温度ヒユーズにおいて、低融点金属体が溶
融すると、その溶融金属が電極の銅(または銀)
材に、表面張力作用により引張られて分断する
が、溶融金属が多数箇所で電極に接触しているの
で、その分断は第2図に示すように多数の箇所で
なされる。而して、一分断箇所あたりの低融点金
属材料が少量であるから、その分断を迅速に行な
わしめ得る。 In the above temperature fuse, when the low melting point metal body melts, the molten metal becomes the copper (or silver) of the electrode.
The material is pulled and divided by the action of surface tension, but since the molten metal is in contact with the electrode at many locations, the division occurs at multiple locations as shown in FIG. Since the amount of low melting point metal material per cutting point is small, the cutting can be done quickly.
<考案の効果>
上述した通り、本考案に係る温度ヒユーズは、
上述した通りの構成であり、低融点金属体の付設
に基づく電気抵抗分を充分に小さくし得るから、
低融点金属体に高電気抵抗の細線を用いても、電
流容量を充分に確保できる。従つて、温度ヒユー
ズの低融点金属体の細線化により、温度ヒユーズ
の作動の迅速化を良好に図り得る。<Effects of the invention> As mentioned above, the temperature fuse according to the invention has the following effects:
The configuration is as described above, and the electrical resistance due to the attachment of the low melting point metal body can be sufficiently reduced.
Even if a thin wire with high electrical resistance is used for the low melting point metal body, sufficient current capacity can be ensured. Therefore, by making the low melting point metal body of the temperature fuse thinner, the temperature fuse can be operated more quickly.
第1図は本考案に係る温度ヒユーズを示す説明
図、第2図は同ヒユーズの作動状態を示す説明図
である。
図において、1は絶縁基板、2a,2bは櫛状
電極、3は低融点金属の線条体である。
FIG. 1 is an explanatory diagram showing a temperature fuse according to the present invention, and FIG. 2 is an explanatory diagram showing the operating state of the fuse. In the figure, 1 is an insulating substrate, 2a and 2b are comb-shaped electrodes, and 3 is a filament made of a low melting point metal.
Claims (1)
て設け、これらの電極にまたがつて低融点金属の
線条体を付設したことを特徴とする温度ヒユー
ズ。 A temperature fuse characterized in that a pair of comb-shaped electrodes are provided alternately on an insulating substrate, and a filament made of a low melting point metal is attached astride these electrodes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5908787U JPH0436530Y2 (en) | 1987-04-17 | 1987-04-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5908787U JPH0436530Y2 (en) | 1987-04-17 | 1987-04-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63165737U JPS63165737U (en) | 1988-10-28 |
JPH0436530Y2 true JPH0436530Y2 (en) | 1992-08-28 |
Family
ID=30890252
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5908787U Expired JPH0436530Y2 (en) | 1987-04-17 | 1987-04-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0436530Y2 (en) |
-
1987
- 1987-04-17 JP JP5908787U patent/JPH0436530Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS63165737U (en) | 1988-10-28 |
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