JPH033799U - - Google Patents

Info

Publication number
JPH033799U
JPH033799U JP6507289U JP6507289U JPH033799U JP H033799 U JPH033799 U JP H033799U JP 6507289 U JP6507289 U JP 6507289U JP 6507289 U JP6507289 U JP 6507289U JP H033799 U JPH033799 U JP H033799U
Authority
JP
Japan
Prior art keywords
electronic
adhesive
copper foil
coated copper
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6507289U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6507289U priority Critical patent/JPH033799U/ja
Publication of JPH033799U publication Critical patent/JPH033799U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案による電子部品のシールド構造
の一実施例を示す斜視図である。 １１……印刷配線板、１１ａ……グランド配線
パターン、１２……ＤＩＰ形ＩＣ、１２ａ……Ｄ
ＩＰ形ＩＣ表面、１２ｂ……グランド端子、１３
……接着剤付き銅箔、１３ａ……グランド接続用
リード部。 FIG. 1 is a perspective view showing an embodiment of a shielding structure for electronic components according to the present invention. 11...Printed wiring board, 11a...Ground wiring pattern, 12...DIP type IC, 12a...D
IP type IC surface, 12b...Ground terminal, 13
... Copper foil with adhesive, 13a ... Lead part for ground connection.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 印刷配線板に電子部品を搭載してなる電子回路
パツケージの電子部品のシールド構造において、
前記電子部品の上面に接着剤付銅箔を貼付固定す
るとともに前記接着剤付銅箔に連設されているグ
ランド接続用リード部を電子部品のグランド端子
まで導びき、ハンダ付けするようにした電子部品
のシールド構造。 In the shielding structure of electronic components of an electronic circuit package which is made by mounting electronic components on a printed wiring board,
An electronic device in which an adhesive-coated copper foil is pasted and fixed on the top surface of the electronic component, and a ground connection lead connected to the adhesive-coated copper foil is led to a ground terminal of the electronic component and soldered. Part shield structure.
JP6507289U 1989-06-02 1989-06-02 Pending JPH033799U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6507289U JPH033799U (en) 1989-06-02 1989-06-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6507289U JPH033799U (en) 1989-06-02 1989-06-02

Publications (1)

Publication Number Publication Date
JPH033799U true JPH033799U (en) 1991-01-16

Family

ID=31596577

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6507289U Pending JPH033799U (en) 1989-06-02 1989-06-02

Country Status (1)

Country Link
JP (1) JPH033799U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8976530B2 (en) 2008-12-23 2015-03-10 Nexsan Technologies Limited Data storage apparatus
US9269401B2 (en) 2008-12-23 2016-02-23 Nexsan Technologies Limited Apparatus for storing data

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8976530B2 (en) 2008-12-23 2015-03-10 Nexsan Technologies Limited Data storage apparatus
US9269401B2 (en) 2008-12-23 2016-02-23 Nexsan Technologies Limited Apparatus for storing data

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