JPH042097U - - Google Patents
Info
- Publication number
- JPH042097U JPH042097U JP4312690U JP4312690U JPH042097U JP H042097 U JPH042097 U JP H042097U JP 4312690 U JP4312690 U JP 4312690U JP 4312690 U JP4312690 U JP 4312690U JP H042097 U JPH042097 U JP H042097U
- Authority
- JP
- Japan
- Prior art keywords
- shield case
- electronic component
- wall
- package
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Multi-Conductor Connections (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第1図の本考案の一実施例の接続構造を示す縦
断面図、第2図は本考案の他の実施例の接続構造
を示す縦断面図、第3図a及びbは従来の接続構
造の説明図である。
1……基板、2,3,7……電子部品、4……
シールドケース、5……ハンダ、6……導電性接
着剤。
Fig. 1 is a vertical sectional view showing a connection structure according to an embodiment of the present invention, Fig. 2 is a longitudinal sectional view showing a connection structure according to another embodiment of the invention, and Figs. 3 a and b are conventional connection structures. FIG. 1... Board, 2, 3, 7... Electronic components, 4...
Shield case, 5...Solder, 6...Conductive adhesive.
Claims (1)
ルドケースによつて覆つた状態で該基板を該シー
ルドケースとハンダ固定するとともに、該電子部
品のパツケージと該シールドケース内壁とを接続
した接地構造において、 前記パツケージと前記シールドケース内壁との
間を導電性接着剤にて接着固定したことを特徴と
する電子部品とシールドケースとの接地構造。[Scope of Claim for Utility Model Registration] An electronic component mounted on a printed circuit board is covered with a metal shield case, and the board is fixed to the shield case by soldering, and the package of the electronic component is connected to the inner wall of the shield case. A grounding structure between an electronic component and a shield case, characterized in that the package cage and the inner wall of the shield case are adhesively fixed with a conductive adhesive.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4312690U JPH0745992Y2 (en) | 1990-04-20 | 1990-04-20 | Grounding structure between electronic parts and shield case |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4312690U JPH0745992Y2 (en) | 1990-04-20 | 1990-04-20 | Grounding structure between electronic parts and shield case |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH042097U true JPH042097U (en) | 1992-01-09 |
JPH0745992Y2 JPH0745992Y2 (en) | 1995-10-18 |
Family
ID=31555278
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4312690U Expired - Lifetime JPH0745992Y2 (en) | 1990-04-20 | 1990-04-20 | Grounding structure between electronic parts and shield case |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0745992Y2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52116581A (en) * | 1976-03-25 | 1977-09-30 | Nippon Steel Corp | Particle conveyor |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5269657B2 (en) * | 2009-03-16 | 2013-08-21 | アルプス電気株式会社 | Electronic circuit unit |
-
1990
- 1990-04-20 JP JP4312690U patent/JPH0745992Y2/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52116581A (en) * | 1976-03-25 | 1977-09-30 | Nippon Steel Corp | Particle conveyor |
Also Published As
Publication number | Publication date |
---|---|
JPH0745992Y2 (en) | 1995-10-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |