JPS5931269U - Double-sided chip attachment device - Google Patents
Double-sided chip attachment deviceInfo
- Publication number
- JPS5931269U JPS5931269U JP12708382U JP12708382U JPS5931269U JP S5931269 U JPS5931269 U JP S5931269U JP 12708382 U JP12708382 U JP 12708382U JP 12708382 U JP12708382 U JP 12708382U JP S5931269 U JPS5931269 U JP S5931269U
- Authority
- JP
- Japan
- Prior art keywords
- double
- printed circuit
- circuit board
- attachment device
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のプリント基板の半田付は方法を説明する
ための断面図、第２図はこの考案の両面チップ取付装置
の一実施例の断面図、第３図は同上両面チップ取付装置
の平面図である。
１・・・・・・プリント基板、２・・・・・・銅箔、３
・・曲接着剤、４・・・・・・半田、５・・・・・・チ
ップ部品１．６・・・・・・半田メッキ、７・・・・・
・スルーホール。Fig. 1 is a cross-sectional view for explaining the conventional soldering method for printed circuit boards, Fig. 2 is a cross-sectional view of an embodiment of the double-sided chip attaching device of this invention, and Fig. 3 is a cross-sectional view of the double-sided chip attaching device of the same invention. FIG. 1...Printed circuit board, 2...Copper foil, 3
...Curved adhesive, 4...Solder, 5...Chip parts 1.6...Solder plating, 7...
・Through hole.
Claims (1)
おいてプリント基板の両面にチップ部品を接着剤で接着
し、このチップ部品に隣接してプリント基板に半田メッ
キを施したスルーホールを形成し、半田デイツプ槽より
上記スルーホールを通して半田デイツプ槽よりの半田で
上記プリント基板の両面のチップ部品を半田付けしてな
る両面チップ取付装置。Copper foil is formed on both sides of the printed circuit board, chip components are glued to both sides of the printed circuit board near this copper foil, and through holes are formed with solder plating on the printed circuit board adjacent to the chip components. and a double-sided chip mounting device in which chip components on both sides of the printed circuit board are soldered with solder from the solder dip tank through the through holes from the solder dip tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12708382U JPS5931269U (en) | 1982-08-23 | 1982-08-23 | Double-sided chip attachment device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12708382U JPS5931269U (en) | 1982-08-23 | 1982-08-23 | Double-sided chip attachment device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5931269U true JPS5931269U (en) | 1984-02-27 |
Family
ID=30288753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12708382U Pending JPS5931269U (en) | 1982-08-23 | 1982-08-23 | Double-sided chip attachment device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5931269U (en) |
-
1982
- 1982-08-23 JP JP12708382U patent/JPS5931269U/en active Pending
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