JPH0328558Y2 - - Google Patents
Info
- Publication number
- JPH0328558Y2 JPH0328558Y2 JP1984110611U JP11061184U JPH0328558Y2 JP H0328558 Y2 JPH0328558 Y2 JP H0328558Y2 JP 1984110611 U JP1984110611 U JP 1984110611U JP 11061184 U JP11061184 U JP 11061184U JP H0328558 Y2 JPH0328558 Y2 JP H0328558Y2
- Authority
- JP
- Japan
- Prior art keywords
- tape
- cover film
- components
- rising
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000000630 rising effect Effects 0.000 claims description 21
- 239000013039 cover film Substances 0.000 claims description 20
- 230000002265 prevention Effects 0.000 claims description 20
- 239000010408 film Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 230000001960 triggered effect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Feeding Of Workpieces (AREA)
- Packages (AREA)
Description
【考案の詳細な説明】
(イ) 産業上の利用分野
本考案は、チツプ状電子部品を回路基板に装着
する際用いる電子部品供給装置に関する。[Detailed Description of the Invention] (a) Industrial Application Field The present invention relates to an electronic component supply device used when mounting chip-shaped electronic components onto a circuit board.
(ロ) 従来の技術
電子回路の形成にチツプ状電子部品が多用され
るようになつているが、その取り扱いにはテープ
を利用することが多い。すなわちテープに一定間
隔で設けた凹所に電子部品を１個づつ落とし込
み、上からフイルムでカバーし、このテープを、
出荷手段として、また装着時の部品供給手段とし
て、用いるものである。部品装着時、このテープ
は水平にピツチ送りされ、電子部品を１個づつ部
品取り出し手段の下へ送り込む。カバーフイルム
は部品取り出し位置の手前で剥ぎ取られる。ここ
で問題になるのは、カバーフイルムが剥がされた
後、テープ凹所の中で部品が立ち上がり、部品取
り出し手段を構成する真空チヤツクにその姿勢で
吸着される現象である。正規の吸着状態では面積
の大きい部品上面がチヤツクに接するから吸着は
安定しているが、この場合は幅の狭い側面で接し
ているため吸着が不安定であり、部品をとり落と
すことが多い。また回路基板に配置し得たとして
もそのような姿勢では殆んど装着不完全となり、
基板を不良品にしてしまう。従つて、電子部品が
側面で（以下「立つた状態で」と言う）吸着され
るような事態は避けねばならない。(b) Prior Art Chip-shaped electronic components are increasingly being used to form electronic circuits, and tape is often used to handle them. In other words, electronic components are dropped one by one into recesses provided at regular intervals on the tape, covered with a film from above, and the tape is
It is used as a means for shipping and as a means for supplying parts during installation. When mounting components, this tape is pitch-fed horizontally to feed the electronic components one by one under the component removal means. The cover film is peeled off before the part removal position. The problem here is that after the cover film is peeled off, the component stands up in the tape recess and is attracted in that position by the vacuum chuck that constitutes the component removal means. In the normal suction state, the top surface of the component with a large area is in contact with the chuck, so suction is stable, but in this case, the chuck is in contact with the narrow side, making suction unstable and parts often falling off. Furthermore, even if it could be placed on the circuit board, the installation would be incomplete in most cases in such a position.
This will make the board defective. Therefore, it is necessary to avoid a situation in which electronic components are attracted to the sides (hereinafter referred to as "in a standing position").
さて電子部品が立つ原因であるが、その最たる
ものはカバーフイルムに発生する静電気であると
考えられる。実際に使用する装置の場合、カバー
フイルムの上を金属製のテープ押さえで押さえ、
また装置そのものをアースするから、静電気の発
生は防がされる筈であるが、現実にはかなりの電
荷が生じている。そこで、剥ぎ取られるカバーフ
イルムによつて電子部品が引き起こされるのを防
ぐため、カバーフイルムが剥がされてから少しの
間、電子部品を押さえておこうとの提案がなされ
た。実開昭57−148875号公報に記載された装置が
それである。第８図によりこの装置の概要を説明
する。１は一定間隔で設けた凹所２に電子部品３
を保持したテープ、４，５はテープ１の上下面に
貼り付けられたカバーフイルム、６はテープ１を
載せる水平なガイド板、７は真空チヤツク、８は
真空チヤツク７の手前でカバーフイルム４を折り
返すフイルム剥がし板、９はカバーフイルム４を
剥がした後真空チヤツク７に至るまでテープ１の
上面を押さえる突出防止板である。電荷を帯びた
カバーフイルムが電子部品３を引き起こそうとす
るのを突出防止板９で抑える訳であるが、実際に
は、突出防止板（金属製）を付加することによつ
ても電子部品の立ち上がりを完全に防止すること
ができなかつた。これは、テープ１との摩擦によ
り突出防止板９そのものが帯電し、電子部品３の
立ち上がりモーメントを生じさせるためであり、
このため第８図から第９図に見られるように電子
部品３が立つた状態で真空チヤツク７に吸着され
るという現象がしばしば生じた。 Now, among the causes of electronic parts standing up, the most important cause is thought to be static electricity generated in the cover film. In the case of a device that will actually be used, hold down the top of the cover film with a metal tape holder.
Furthermore, since the device itself is grounded, the generation of static electricity is supposed to be prevented, but in reality, a considerable amount of electric charge is generated. Therefore, in order to prevent the electronic components from being damaged by the cover film being peeled off, a proposal has been made to hold down the electronic components for a short time after the cover film is peeled off. The device described in Japanese Utility Model Application Publication No. 57-148875 is one such device. The outline of this device will be explained with reference to FIG. 1 is an electronic component 3 placed in recesses 2 provided at regular intervals.
4 and 5 are cover films pasted on the upper and lower surfaces of the tape 1, 6 is a horizontal guide plate on which the tape 1 is placed, 7 is a vacuum chuck, and 8 is a cover film 4 pasted in front of the vacuum chuck 7. A folding film peeling plate 9 is a protrusion prevention plate that presses the upper surface of the tape 1 up to the vacuum chuck 7 after the cover film 4 is peeled off. The protrusion prevention plate 9 prevents the electrically charged cover film from causing the electronic components 3, but in reality, the addition of the protrusion prevention plate (made of metal) also prevents the electronic components from being triggered. It was not possible to completely prevent the rise of This is because the protrusion prevention plate 9 itself becomes electrically charged due to friction with the tape 1, causing a rising moment of the electronic component 3.
For this reason, as shown in FIGS. 8 to 9, a phenomenon in which the electronic component 3 is attracted to the vacuum chuck 7 while standing up often occurs.
(ハ) 考案が解決しようとする問題点
本考案は、カバーフイルム剥離地点の後に電子
部品の立ち上がり防止手段を設けるものにおい
て、この立ち上がり防止手段が本来の役割を十分
に果たすようにすることを目的とする。(c) Problems to be solved by the invention The purpose of the present invention is to ensure that when a means for preventing electronic components from rising is provided after the point where the cover film is peeled off, the means for preventing rising from rising sufficiently fulfills its original role. shall be.
(ニ) 問題点を解決するための手段
カバーフイルムの剥ぎ取り位置から部品取り出
し位置の方へ、部品の立ち上がり防止手段を設け
ると共に、この立ち上がり防止手段には、部品側
縁部を除き電子部品の上方に開放空間を生ぜしめ
る溝を、テープ送り方向に形設した。(d) Measures to solve the problem A means for preventing the components from rising is provided from the cover film peeling position to the component removal position. A groove creating an open space above was formed in the tape feeding direction.
(ホ) 作用
帯電したカバーフイルムにより電子部品が引き
起こされることは立ち上がり防止手段により阻止
される。問題はこの立ち上がり防止手段自体の帯
電だが、開放空間の下に至ると電子部品は僅かに
側縁部で立ち上がり防止手段に向き合うだけにな
り、電荷による吸引力は微弱になり、電子部品が
立ち上がるまでには至らない。(E) Effect The rising prevention means prevents the electronic components from being triggered by the charged cover film. The problem is the charging of the stand-up prevention means itself, but when it reaches the bottom of the open space, the electronic components only face the stand-up prevention means slightly at the side edges, and the attraction force due to the charge becomes weak, until the electronic parts stand up. It doesn't reach that point.
(ヘ) 実施例
第２図及び第３図に、チツプ状電子部品を供給
するテープの代表的な構造２種を示す。第２図の
テープ１０は厚紙製で、部品収納用凹所１１とな
る透孔と送り用パーフオレーシヨン１２とを一定
ピツチで打ち抜き、凹所１１にチツプ状電子部品
１３を入れ、上下面に透明なカバーフイルム１
４，１５を貼り付けたものである。第３図のテー
プ１６は合成樹脂シートに部品収納用凹所１７と
送り用パーフオレーシヨン１８を形設し、凹所１
７にチツプ状電子部品１９を入れ、上面に透明な
カバーフイルム２０を貼り付けたものである。な
お電子部品１９は両側に脚状の端子２１を突出さ
せている。(F) Embodiment FIGS. 2 and 3 show two typical structures of tapes for supplying chip-shaped electronic components. The tape 10 shown in FIG. 2 is made of cardboard. Through-holes that will become recesses 11 for storing components and perforations 12 for feeding are punched out at a constant pitch. Chip-shaped electronic components 13 are placed in the recesses 11, and the upper and lower surfaces are transparent cover film 1
4 and 15 are attached. The tape 16 shown in Fig. 3 is made by forming a recess 17 for storing parts and a perforation 18 for feeding in a synthetic resin sheet.
A chip-shaped electronic component 19 is placed in 7, and a transparent cover film 20 is pasted on the top surface. Note that the electronic component 19 has leg-shaped terminals 21 protruding from both sides.
第１図に電子部品装着装置２２の概要を示す。
上記２種のテープの内、ここではテープ１０を例
示している。２３，２４は供給リール２５から引
き出したテープ１０を水平にして間を通すテープ
押さえ板とガイド板である。テープ押さえ板２３
の先端近くにはテープ送り方向と直角なスリツト
２６を一方の側縁から切り込み形成し、カバーフ
イルム１４のみこのスリツト２６を通して折り返
し、巻き取りリール２７に巻きつける。テープ押
さえ板２３をくぐり抜けたテープ１０はスプロケ
ツト２８に巻き掛けられる。スプロケツト２８は
爪２９をパーフオレーシヨン１２に係合させてテ
ープ１０を送る。３０はスプロケツト回転軸３１
に固定されたラチエツト歯車、３２は軸３１に揺
動自在に取り付けられたラチエツトアームであ
る。ラチエツトアーム３２の一端を往復駆動杆３
３で下に引くと、ばね３４によりラチエツト歯車
３０に係合するラチエツト３５が、テープ１０が
１ピツチ進む分だけラチエツト歯車３０を回動さ
せる。駆動杆３３が上昇すると、ラチエツトアー
ム３２及びラチエツト３５はばね３６の力で原位
置に戻るが、ラチエツト歯車３０は、ばね３７に
より係合せしめられる戻り止め爪３８のため、そ
のままの位置を保つ。軸３１の回転はタイミング
ベルト３９により巻き取りリール２７に伝えられ
る。タイミングベルト３９と巻き取りリールの間
にはタイミングベルト３９の与える回転量と実際
にフイルム１４を巻き取るのに必要な回転角との
ずれを吸収する摩擦クラツチを介在させる。この
機構は実開昭57−87599号公報に示す通りである。
４０はインデツクステーブル、４１はインデツク
ステーブル４０の周縁のガイド筒４２に上下可能
に支持され、ばね４３で上方に付勢された真空チ
ヤツクである。真空チヤツク４１はテープ１０の
真空に停止し、プツシヤ４４で押し下げられて電
子部品を吸着し、然る後上昇してインデツクステ
ーブル４０の回転と共に回路基板のところまで電
子部品を運ぶ。 FIG. 1 shows an outline of the electronic component mounting apparatus 22.
Of the above two types of tapes, tape 10 is illustrated here. Reference numerals 23 and 24 denote a tape holding plate and a guide plate, through which the tape 10 pulled out from the supply reel 25 is passed horizontally. Tape holding plate 23
A slit 26 perpendicular to the tape feeding direction is cut from one side edge near the tip of the tape, and only the cover film 14 is folded back through the slit 26 and wound around a take-up reel 27. The tape 10 passing through the tape holding plate 23 is wound around the sprocket 28. Sprocket 28 engages pawl 29 with perforation 12 and feeds tape 10. 30 is the sprocket rotating shaft 31
A ratchet gear 32 is fixed to the shaft 31, and a ratchet arm 32 is swingably attached to the shaft 31. Connect one end of the ratchet arm 32 to the reciprocating drive rod 3
When pulled down at 3, the ratchet 35, which is engaged by the spring 34 to the ratchet gear 30, rotates the ratchet gear 30 by the amount by which the tape 10 advances one pitch. When the drive rod 33 is raised, the ratchet arm 32 and the ratchet 35 return to their original positions under the force of the spring 36, but the ratchet gear 30 remains in that position due to the detent pawl 38 engaged by the spring 37. Rotation of the shaft 31 is transmitted to the take-up reel 27 by a timing belt 39. A friction clutch is interposed between the timing belt 39 and the take-up reel to absorb the discrepancy between the amount of rotation given by the timing belt 39 and the rotation angle required to actually take up the film 14. This mechanism is as shown in Japanese Utility Model Application No. 57-87599.
40 is an index table, and 41 is a vacuum chuck which is vertically supported by a guide cylinder 42 on the periphery of the index table 40 and is urged upward by a spring 43. The vacuum chuck 41 stops under the vacuum of the tape 10, is pushed down by a pusher 44 to attract the electronic component, and then rises to carry the electronic component to the circuit board as the index table 40 rotates.
而してテープ押さえ板２３は、第４図に見られ
る如く、真空チヤツク４１による部品取り出し位
置の方へ、スリツト２６のところから更に延び出
しており、この延在部分が電子部品の立ち上がり
防止片４５となつている。なおテープ押さえ板２
３は金属製であり、装置本体を通じてアースをと
る。立ち上がり防止片４５には部品取り出し位置
に面した方の端からスリツト２６の方へ、テープ
送り方向に沿つた溝４６を形設する。溝４６はス
リツト２６に至る前に終わるが、その長さはテー
プ送り方向における電子部品１３の長さより大で
ある。溝４６は凹所１１の真上に位置する。溝４
６の幅は電子部品１３の幅よりやや狭く、そのた
め電子部品１３の上面の大部分には開放空間４７
が拡がる。しかしながら電子部品１３の側縁部の
上方には溝４６の縁が張り出しており、このため
電子部品１３が立ち上がつたり、凹所１１からと
び出したりすることはない。このように電子部品
１３は立ち上がり防止作用乃至とび出し防止作用
を受けるが、その上面の大部分は立ち上がり防止
片４５から離れているので、立ち上がり防止片４
５の帯電による吸引は微弱であり、立ち上がり防
止片４５から離れようとする時に引き起こされる
ことはない。従つて正規姿勢以外の姿勢で真空チ
ヤツク４１に吸着されることがない。 As shown in FIG. 4, the tape holding plate 23 further extends from the slit 26 toward the component removal position by the vacuum chuck 41, and this extended portion serves as a piece for preventing electronic components from rising. 45. Note that the tape holding plate 2
3 is made of metal and is grounded through the main body of the device. A groove 46 is formed in the rising prevention piece 45 from the end facing the component removal position toward the slit 26 along the tape feeding direction. The groove 46 ends before reaching the slit 26, but its length is greater than the length of the electronic component 13 in the tape feed direction. The groove 46 is located directly above the recess 11. Groove 4
6 is slightly narrower than the width of the electronic component 13, so that most of the upper surface of the electronic component 13 has an open space 47.
expands. However, the edges of the groove 46 protrude above the side edges of the electronic component 13, so that the electronic component 13 does not stand up or protrude from the recess 11. In this way, the electronic component 13 is subjected to a rising prevention action or a popping-out prevention action, but since most of its upper surface is separated from the rising prevention piece 45, the rising prevention piece 45
The suction caused by the electrical charge of 5 is weak and is not caused when the member 5 tries to move away from the rising prevention piece 45. Therefore, the vacuum chuck 41 will not be attracted to the vacuum chuck 41 in a posture other than the normal posture.
第６図及び第７図にはテープ１６で電子部品１
９を供給する際の状況を示す。溝４６は端子２１
を通さない程度の幅になつており、部品１９の本
体が立ち上がり防止片４５から離れる程度は部品
１３の場合より大きい。 6 and 7, the electronic component 1 is attached with tape 16.
The situation when supplying 9 is shown. The groove 46 is the terminal 21
The width is such that it cannot be passed through, and the extent to which the main body of the component 19 is separated from the rising prevention piece 45 is greater than that of the component 13.
(ト) 考案の効果
本考案によれば、カバーフイルム剥ぎ取り位置
と部品取り出し位置との間に存在する部品の立ち
上がり防止手段に溝を入れるという簡単な構成で
電子部品の不正吸着を効果的に防止し、回路基板
の製作歩留まりを向上させることができる。(g) Effects of the invention According to the invention, unauthorized suction of electronic components can be effectively prevented with a simple structure in which a groove is provided in the means for preventing the components from rising between the cover film peeling position and the component removal position. It is possible to prevent this and improve the production yield of circuit boards.
第１図乃至第７図は本考案の一実施例を示し、
第１図は装置の骨組みを示す斜視図、第２、３図
はテープの構造を示す斜視図、第４、５図は第２
図のテープと部品立ち上がり防止手段との関連を
示す部分斜視図及び断面図、第６、７図は第３図
のテープと部品立ち上がり防止手段との関連を示
す部分斜視図及び断面図である。第８、９図は従
来技術の作用説明図である。
１０，１６……テープ、１１，１７……凹所、
１３，１９……電子部品、１４，２０……カバー
フイルム、４５……立ち上がり防止片（立ち上が
り防止手段）、４６……溝、４７……開放空間。
1 to 7 show an embodiment of the present invention,
Figure 1 is a perspective view showing the framework of the device, Figures 2 and 3 are perspective views showing the structure of the tape, and Figures 4 and 5 are perspective views showing the structure of the tape.
FIGS. 6 and 7 are partial perspective views and sectional views showing the relationship between the tape shown in FIG. 3 and the component rising prevention means, and FIGS. 6 and 7 are partial perspective views and sectional views showing the relationship between the tape shown in FIG. 3 and the component rising prevention means. 8 and 9 are explanatory views of the operation of the prior art. 10, 16... tape, 11, 17... recess,
13, 19...Electronic component, 14, 20...Cover film, 45...Rising prevention piece (rising prevention means), 46...Groove, 47...Open space.
Claims (1)
るテープを部品取り出し位置に向け水平にピツ
チ送りすると共に、該テープに貼り付けたカバ
ーフイルムを部品取り出し位置の手前で剥ぎ取
つて行くものにおいて、 前記カバーフイルムの剥ぎ取り位置から部品
取り出し位置の方へ延在する部品の立ち上がり
防止手段を設け、この立ち上がり防止手段に
は、部品側縁部を除き電子部品の上方に開放空
間を生ぜしめる溝を、テープ送り方向に形設し
てなる電子部品供給装置。 ２ 開放空間が、立ち上がり防止手段の、部品取
り出し位置に面する端まで続くことを特徴とす
る実用新案登録請求の範囲第１項記載の電子部
品供給装置。 ３ テープ送り方向における開放空間の長さが、
同方向における部品の長さを越えることを特徴
とする実用新案登録請求の範囲第２項記載の電
子部品供給装置。[Scope of Claim for Utility Model Registration] 1. A tape consisting of electronic components encapsulated in recesses provided at regular intervals is pitch-feeded horizontally toward a component removal position, and a cover film attached to the tape is moved to the component removal position. In the device that is peeled off before the cover film is peeled off, there is provided means for preventing the components from rising, which extends from the peeling position of the cover film toward the component removal position, and the rising prevention means includes the electronic components except for the side edges of the components. An electronic component supply device in which a groove is formed in the tape feeding direction to create an open space above the tape. 2. The electronic component supply device according to claim 1, wherein the open space continues to the end of the rising prevention means facing the component removal position. 3 The length of the open space in the tape feeding direction is
The electronic component supply device according to claim 2, which is a utility model, and is characterized in that the length of the electronic components exceeds the length of the components in the same direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11061184U JPS6127400U (en) | 1984-07-20 | 1984-07-20 | Electronic component supply device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11061184U JPS6127400U (en) | 1984-07-20 | 1984-07-20 | Electronic component supply device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6127400U JPS6127400U (en) | 1986-02-18 |
| JPH0328558Y2 true JPH0328558Y2 (en) | 1991-06-19 |
Family
ID=30669735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11061184U Granted JPS6127400U (en) | 1984-07-20 | 1984-07-20 | Electronic component supply device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6127400U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020092111A (en) * | 2018-12-03 | 2020-06-11 | 三井金属計測機工株式会社 | Film feeder for device mount with cover film peeling function |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS622785Y2 (en) * | 1981-03-13 | 1987-01-22 | ||
| JPS60125800U (en) * | 1984-02-03 | 1985-08-24 | 日本電気株式会社 | Carrier tape feeding mechanism |
-
1984
- 1984-07-20 JP JP11061184U patent/JPS6127400U/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020092111A (en) * | 2018-12-03 | 2020-06-11 | 三井金属計測機工株式会社 | Film feeder for device mount with cover film peeling function |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6127400U (en) | 1986-02-18 |
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