JPH0327865A - Soldering defect detector - Google Patents
Soldering defect detectorInfo
- Publication number
- JPH0327865A JPH0327865A JP16306289A JP16306289A JPH0327865A JP H0327865 A JPH0327865 A JP H0327865A JP 16306289 A JP16306289 A JP 16306289A JP 16306289 A JP16306289 A JP 16306289A JP H0327865 A JPH0327865 A JP H0327865A
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- air
- fluctuation
- differential pressure
- shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 41
- 230000007547 defect Effects 0.000 title claims description 11
- 238000001514 detection method Methods 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 7
- 239000010935 stainless steel Substances 0.000 abstract description 7
- 230000002950 deficient Effects 0.000 abstract description 4
- 230000002159 abnormal effect Effects 0.000 abstract 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 4
- 239000004677 Nylon Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 230000001953 sensory effect Effects 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、ディスクリート挿入部品の半田付部形状によ
る半田付の良否判定検出に用いることができる半田付不
良検出装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a soldering defect detection device that can be used to determine the quality of soldering based on the shape of the soldered portion of a discrete insertion component.
従来の技術
従来、ディスクリート挿入部品のプリント基板への半田
付箇所の良否判断は、人の目視による点検であυ、官能
作業になっていた。Conventional Technology In the past, determining the acceptability of the soldered parts of discrete insertion components to printed circuit boards was done by human visual inspection, which was a sensory process.
発明が解決しようとする課題
ところが人による半田付箇所の良否判定は官能作業だけ
に、ばらつきがあυ，又，見逃しによる半田付不良漏れ
が発生しダプルチェｙクが必要となシ半田付良否検出精
度に限界が生じるとともに、その生産性が低いという課
題があった。Problems to be Solved by the Invention However, human judgment of the quality of soldered parts is only a sensory process, so there is variation, and double checks are required as failures in soldering may occur due to oversights. There was a problem that there was a limit to accuracy and productivity was low.
課題を解決するための手段
上記課題を解決するために本発明の半田付不良検出装置
は、空気ブリッジ回路と電気比較回路を組み合わせた空
気微差圧スイッチを利用し、通常真空状態で使用するも
のを逆利用して、半田付箇所に直接ノズルによってエア
ーを吹きつけ、半田付形状の違いによ多空気ブリッジ回
路で生じた差圧を検出し、半田付形状の良否判定をさせ
るよう％とことを特徴とする。Means for Solving the Problems In order to solve the above problems, the soldering defect detection device of the present invention utilizes an air slight differential pressure switch that combines an air bridge circuit and an electric comparison circuit, and is normally used in a vacuum state. By using this inversely, air is blown directly onto the soldering location using a nozzle, and the differential pressure generated in the air bridge circuit due to the difference in soldering shape is detected, and the soldering shape is determined to be good or bad. It is characterized by
作 用
上記構成によシ半田付形状の違いによる半田付良否の判
定を自動化することが可能となり、プリント基板へのデ
ィスクリート挿入部品の半田付形状良否検出の信頼性向
上において著しく改善できうるものである。Function The above configuration makes it possible to automate the judgment of soldering quality based on differences in soldering shape, and can significantly improve the reliability of detecting soldering shape of discrete inserted parts on printed circuit boards. be.
実施例
以下、本発明の一実施例の半田付不良検出装置を図面を
用いて説明する。第１図に示すように、この実施例の半
田付不良検出装置は、空気微差圧スイッチ１．上下駆動
シリンダー２．横スライドシリンダー３．スプリング４
．ステンレスパイデノス／Ｉ／６．横スライドベース６
，ノズルホルダー支持ペース７．ノズルホルダー８を具
備している。Embodiment Hereinafter, a soldering defect detection device according to an embodiment of the present invention will be explained with reference to the drawings. As shown in FIG. 1, the soldering defect detection device of this embodiment includes an air slight differential pressure switch 1. Vertical drive cylinder 2. Horizontal slide cylinder 3. spring 4
．． Stainless Pidenos/I/6. Horizontal slide base 6
, nozzle holder support pace7. A nozzle holder 8 is provided.
本例においては、先ず、リード径の約２倍の内径をもつ
ステンレスパイプ６をノズルホルダー８に固定する。次
いでノズルホルダー支持ペース７にシャフ｝４ａを介し
て、ノズルホルダー８を保持シ、シャフト４ａにはスプ
リング４を取付ける。In this example, first, a stainless steel pipe 6 having an inner diameter approximately twice the lead diameter is fixed to the nozzle holder 8. Next, the nozzle holder 8 is held on the nozzle holder support pace 7 via the shaft 4a, and the spring 4 is attached to the shaft 4a.
ノズルホルダー支持ペーヌ７は、横スライドベース６に
固定された上下駆動シリンダー２によって装置のベース
部分に連結されている。又横スライドペース６は、横ス
ライド駆動シリンダー３と連結金具３ａを介して取付ベ
ース９に固定されてある。The nozzle holder support page 7 is connected to the base part of the device by a vertical drive cylinder 2 fixed to a lateral slide base 6. Further, the lateral slide space 6 is fixed to the mounting base 9 via the lateral slide drive cylinder 3 and a connecting fitting 3a.
第２図は，ステンレスパイプノズノレ６と空気微差圧ス
イッチ１の取付関係を示す側面図である。FIG. 2 is a side view showing the attachment relationship between the stainless steel pipe nozzle 6 and the air differential pressure switch 1.
第２図に示すように、ステンレスパイプノズ／Ｌ／６と
空気微差圧スイノチ１は、ソフトナイロンチューブ１ｏ
によって連結されエアーが供給されるようになっている
。As shown in Figure 2, the stainless steel pipe nozzle/L/6 and air slight differential pressure suinochi 1 are
are connected and air is supplied.
次に動作について説明する。コンベア１３上を移送され
この検出装置の下方に位置するように停止された治具パ
レット１１に位置決め固定された７ノレミナ基板１２の
半田付箇所１５に、ノズルホルダー支持ベース７に取シ
付けられたステンレスパイプノズ）Ｖ６を上下駆動シリ
ンダー２によって下降し、半田付箇所１６に密着させる
。その際、空気微差圧スイッチ１よりンフトナイロンチ
ューフ゛１０を介してヌテンレヌパイプノズル６にエア
一を供給し、半田付箇所１６にエアーをふきつける。そ
の時、半田付の良否判定方法としては、一ステンレスパ
イプノズ／Ｌ／６を第２図に示すような円錐状の半田が
形或された半田付箇所１６に密着させるため、第２図に
示すような正常な円錐状（山形）の半田付形状の場合は
密閉状態となシ、エアー変動は或る一定のばらつきとし
て空気微差圧スイッチ１によシ検出できる。又、逆に半
田付形状が正常でない場合、すなわち、半田に貫通する
ような穴があるとき、あるいは半田の一部が欠けたとき
にはステンレスパイプノズル６と半田との間が密閉状態
とならずエアーが漏れる為上述の密閉状態である正常時
とは明らかに異なったエアー変動が発生する。これらの
空気圧の差異をエアー微差圧スイッチ１で電気的信号に
変換し検出することで、エアー変動が一定の微小範囲で
発生するときには半田付良、これ以外のときは半田付不
良として半田付形状の良否判定を行うことができる。Next, the operation will be explained. The nozzle holder support base 7 is attached to the soldering point 15 of the 7-remina board 12, which is positioned and fixed on the jig pallet 11, which has been transferred on the conveyor 13 and stopped so as to be positioned below the detection device. Stainless steel pipe nozzle) V6 is lowered by the vertical drive cylinder 2 and brought into close contact with the soldering location 16. At this time, air is supplied from the air slight differential pressure switch 1 to the cotton pipe nozzle 6 through the soft nylon tube 10, and the soldering location 16 is blown with air. At that time, the method for determining the quality of the soldering is as shown in FIG. In the case of a normal conical (chevron-shaped) soldering shape, it is not in a sealed state, and air fluctuations can be detected by the air slight differential pressure switch 1 as certain fluctuations. On the other hand, if the soldering shape is not normal, that is, if there is a hole that penetrates the solder, or if a part of the solder is chipped, the space between the stainless steel pipe nozzle 6 and the solder will not be sealed, and air will leak out. Because of this leakage, air fluctuations occur that are clearly different from those in the normal sealed state described above. By converting these differences in air pressure into electrical signals using the air differential pressure switch 1 and detecting them, if air fluctuations occur within a certain minute range, the soldering is determined to be good, otherwise, the soldering is determined to be poor. It is possible to judge whether the shape is good or bad.
更に具体的には、例えば、エアー（空気圧）変動を電気
的信号として変換し出力するエアー微差圧スイッチの出
力を比１絞器に入力し、この比較器に入力した基準値よ
り信号変動が小さーとき半田付良、基準値より信号変動
が大きなときに半田付け不良と判定するように構成する
。More specifically, for example, the output of an air differential pressure switch that converts air (air pressure) fluctuations into electrical signals and outputs them is input to a ratio 1 throttle, and the signal fluctuation is compared to the reference value input to this comparator. The configuration is such that when the signal fluctuation is small, it is determined that the soldering is good, and when the signal fluctuation is larger than the reference value, it is determined that the soldering is defective.
発明の効果
本発明によれば、空気微差圧スイソチを利用し、半田付
箇Ｗ気微差圧スイソチに連結されたエアーノズルを密着
させその空気圧変動を検出することによシ半田付形状不
良（穴あき．カケ等）を検出することができ、後工程へ
の半田付不良漏れを防止することができ製品の品質を高
めることができるとともに、半田付形状良否を自動装置
で判定でき生産性を向上させることが可能となるもので
ある。Effects of the Invention According to the present invention, defective soldering shapes can be detected by making use of an air differential pressure switch, and by bringing the air nozzle connected to the soldering point W air pressure differential switch into close contact and detecting the air pressure fluctuation. It is possible to detect defects (holes, chips, etc.), prevent soldering defects from leaking into subsequent processes, improve product quality, and automatically determine whether the soldered shape is good or bad, increasing productivity. This makes it possible to improve the
第１図は本発明の第一の実施例における半田付不良検出
装置の全体図，第２図はその検出部の取付状態を示す簡
略図である。
１・・・・・・空気微差圧スイッチ、２・・・・・・上
下駆動シリンダー、３・・・・・・横スライド駆動シリ
ンダー３ａ・・・・・・連結金具、４・・・・・・スプ
リング、４ａ・・・・シャフト、６・・・・・・ステン
レスパイプノズル、６・・・・・・横スライドベース、
７・・・・・・ノズルホルダー支持ベース、８・・・・
・・ノズルホルダー、９・・・・・・取付ベス、１０・
中−・ンフトナイロンチューフ゛。FIG. 1 is an overall view of a soldering defect detection device according to a first embodiment of the present invention, and FIG. 2 is a simplified view showing the mounting state of the detection section. 1...Air slight differential pressure switch, 2...Vertical drive cylinder, 3...Horizontal slide drive cylinder 3a...Connection fittings, 4... ...Spring, 4a...Shaft, 6...Stainless steel pipe nozzle, 6...Horizontal slide base,
7...Nozzle holder support base, 8...
...Nozzle holder, 9...Mounting base, 10.
Medium-thick nylon tube.
Claims (1)
半田付形状を検出し、半田付の良否判定を行う半田付不
良検出装置であって、内部空気圧変動を検出して電気信
号に変換して出力する空気差圧スイッチと、空気差圧ス
イッチに一端が結合され他端がホルダーに結合されたノ
ズルと、上記ノズルの他端先端部を上記プリント基板の
半田とを適合するように密着させる手段とを備え、上記
空気差圧スイッチからノズルを通じて供給されるエアー
の空気圧変動を検出して半田付良否を判定するように構
成したことを特徴とする半田付不良検出装置。This is a soldering defect detection device that detects the shape of soldering where electronic component leads are soldered to a printed circuit board and determines whether the soldering is good or bad.It detects internal air pressure fluctuations, converts them into electrical signals, and outputs them. an air differential pressure switch, a nozzle having one end coupled to the air differential pressure switch and the other end coupled to a holder, and means for bringing the other end tip of the nozzle into close contact with the solder of the printed circuit board. What is claimed is: 1. A soldering defect detection device comprising: a device for detecting soldering defects, which is configured to determine whether soldering is good or bad by detecting fluctuations in air pressure of air supplied from the air differential pressure switch through a nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16306289A JP2712579B2 (en) | 1989-06-26 | 1989-06-26 | Soldering defect detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16306289A JP2712579B2 (en) | 1989-06-26 | 1989-06-26 | Soldering defect detection device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0327865A true JPH0327865A (en) | 1991-02-06 |
| JP2712579B2 JP2712579B2 (en) | 1998-02-16 |
Family
ID=15766457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16306289A Expired - Fee Related JP2712579B2 (en) | 1989-06-26 | 1989-06-26 | Soldering defect detection device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2712579B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7060203B2 (en) | 2000-10-30 | 2006-06-13 | Sysmex Corporation | Electrolyte solution for particle measuring apparatus, and particle measuring method using same |
| KR100748126B1 (en) * | 2001-09-27 | 2007-08-09 | 주식회사 포스코 | Apparatus for detecting the flaw of high speed rolling sheet |
| JP2019195810A (en) * | 2018-05-07 | 2019-11-14 | 株式会社アンド | Soldering device |
-
1989
- 1989-06-26 JP JP16306289A patent/JP2712579B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7060203B2 (en) | 2000-10-30 | 2006-06-13 | Sysmex Corporation | Electrolyte solution for particle measuring apparatus, and particle measuring method using same |
| KR100748126B1 (en) * | 2001-09-27 | 2007-08-09 | 주식회사 포스코 | Apparatus for detecting the flaw of high speed rolling sheet |
| JP2019195810A (en) * | 2018-05-07 | 2019-11-14 | 株式会社アンド | Soldering device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2712579B2 (en) | 1998-02-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |