JPH02147868A - Connection inspecting device - Google Patents
Connection inspecting deviceInfo
- Publication number
- JPH02147868A JPH02147868A JP63300482A JP30048288A JPH02147868A JP H02147868 A JPH02147868 A JP H02147868A JP 63300482 A JP63300482 A JP 63300482A JP 30048288 A JP30048288 A JP 30048288A JP H02147868 A JPH02147868 A JP H02147868A
- Authority
- JP
- Japan
- Prior art keywords
- connection
- impedance
- solder
- air
- vacuum suction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007689 inspection Methods 0.000 claims abstract description 24
- 229910000679 solder Inorganic materials 0.000 claims abstract description 13
- 230000002950 deficient Effects 0.000 claims description 9
- 230000005856 abnormality Effects 0.000 abstract description 2
- 238000012360 testing method Methods 0.000 description 10
- 238000001514 detection method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000007599 discharging Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は接続検査装置に係わり、特に外部から接続面の
視認が困難な高密度実装されて電子回路部品の接続検査
に好適な接続検査装置に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a connection inspection device, and in particular, a connection inspection device suitable for connection inspection of electronic circuit components that are mounted in high density and whose connection surfaces are difficult to see from the outside. Regarding.
従来のこの種の装置として、例えば、特開昭６１−６５
１７５号公報に記載のものがある。かかる装置は、電子
回路部品と基板とのはんだ接続部に高圧エアを吹き付け
、その吹き付は圧力によって、はんだ接続されていない
端子を振動させ、この振動を光学的に検知することによ
り接続不良を検出するように構成されている。As a conventional device of this kind, for example, Japanese Patent Application Laid-Open No. 61-65
There is one described in Publication No. 175. This device sprays high-pressure air onto the soldered joints between electronic circuit components and the board, and the pressure of the spray causes the unsoldered terminals to vibrate.This vibration is optically detected to detect poor connections. Configured to detect.
しかし、上記従来技術は電子回路部品と基板との間にエ
アを吹き付ける必要があり、はんだ接続部が外部から見
えない電子回路部品の接続検査に対してはエアの吹き付
けが困難であると共に、光学検出部の設置が困難であり
、接続検査ができない不具合があった。However, with the above conventional technology, it is necessary to blow air between the electronic circuit components and the board, and it is difficult to blow air for connection inspection of electronic circuit components where the solder joints cannot be seen from the outside. It was difficult to install the detection unit, and there was a problem that connection inspection could not be performed.
また、接続検査を光学的手段に変えて電機的手段による
方法もあるが、この場合、半断線のような欠陥を検出す
ることができず、使用している間に半断線が断線になり
、電子回路部品が作動しなくなる問題があった。There is also a method that uses electrical means instead of optical means for connection inspection, but in this case, defects such as half-broken wires cannot be detected, and half-broken wires become disconnected during use. There was a problem where electronic circuit parts stopped working.
本発明の目的は、外部から見えない場合でも接続部の断
線、半断線の欠陥を検出できるようにした接続検査装置
を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a connection inspection device that can detect defects such as disconnections and half-disconnections in connection parts even when they are not visible from the outside.
本発明の前記ならびにその他の目的と新規な特徴は、本
明細書の記述および添付図面から明らかになるであろう
。The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.
本願にふいて開示される発明のうち代表的なものの概要
を簡単に説明すれば、以下のとおりである。A brief overview of typical inventions disclosed in this application is as follows.
すなわち、本発明の接続検査装置は、回路パターンを有
する基板にパッドおよびはんだを介して接続されたモジ
ュール化電子部品に対し、エアの真空吸引と高圧加圧を
繰り返し付与するエア吸排手段と、前記基板の検査対象
の接続部に接続される回路パターンを介して前記検査対
象の接続部を含む回路ループのインピーダンスを測定し
て欠陥接続を検出する検査手段とを設けて構成したもの
である。That is, the connection inspection device of the present invention includes an air suction/exhaust means that repeatedly applies vacuum suction and high pressure pressurization to a modularized electronic component connected to a board having a circuit pattern via pads and solder; The present invention is constructed by providing an inspection means for detecting a defective connection by measuring the impedance of a circuit loop including the connection section to be inspected via a circuit pattern connected to the connection section to be inspected on the board.
上記した接続検査装置によれば、クラック等により断線
し易い状態にある半断線状態の接続部、あるいは単に接
触しているのみの機械的に接続強度を有しない欠陥接続
部に対し、応力サイクルを印加し、接続部に引っ張り力
を与えることができるので、半断線およびはんだなしの
接続部が強制的に断線状態にされ、電気的な検出手段す
なわちインピーダンスの高低に基づいて接続部の検査を
行うことができる。したがって、目視できない接続部へ
のエア吹き付けを要することなく、かつ光学的検出手段
を要することなく接続検査を行うことができる。According to the above-mentioned connection inspection device, stress cycles are applied to half-broken connections that are prone to disconnection due to cracks, etc., or defective connections that are simply in contact and do not have mechanical connection strength. By applying a tensile force to the connection, half-open and solderless connections are forced into an open state, and the connection is inspected based on electrical detection means, i.e., high or low impedance. be able to. Therefore, connection inspection can be carried out without the need to blow air to the connection parts that cannot be visually observed, and without the need for optical detection means.
以下、本発明の一実施例を図面に基づいて説明する。 Hereinafter, one embodiment of the present invention will be described based on the drawings.
第１図は本発明の一実施例である接続検査装置の一部を
示す概略構成図であり、第２図は本実施例の欠陥接続部
に対する接続検出の説明図である。FIG. 1 is a schematic configuration diagram showing a part of a connection inspection apparatus according to an embodiment of the present invention, and FIG. 2 is an explanatory diagram of connection detection for a defective connection portion according to the present embodiment.
本実施例の接続検査装置は、第１図に示すように、検査
対象の電子部品１が回路基板２上に、基板側パッド３、
該基板側パッド３に接続されている接続用はんだ４およ
び該接続用はんだ４に接続されている部品側パッド５の
各々を介して接続搭載されている。なお、第１図から明
らかなように、接続部は電子部品１と回路基板２０間に
挟まれており、外部から目視することはできない。基板
側パッド３の各々には、引出し配線６が接続され、その
他端は回路基板２上に設けられている検査用パッド７に
接続されている。As shown in FIG. 1, the connection inspection device of this embodiment has an electronic component 1 to be inspected on a circuit board 2, board side pads 3,
They are connected and mounted via the connection solder 4 connected to the board side pad 3 and the component side pad 5 connected to the connection solder 4. Note that, as is clear from FIG. 1, the connecting portion is sandwiched between the electronic component 1 and the circuit board 20 and cannot be visually observed from the outside. A lead wire 6 is connected to each of the board side pads 3, and the other end is connected to a test pad 7 provided on the circuit board 2.
検査用パッド７には、接触端子８が圧接しており、この
検査用パッド７には検査手段であるインピーダンス検査
ユニット（検査手段）９が接続されている。インピーダ
ンス検査ユニット９には、後記するエア吹排部を駆動す
るための制御ユニツ１−１０が接続されている。電子部
品ｌに対してエアを吹き出しあるいは吸引するためのニ
ア吸排口（ニア吸排手段）１１は、漏斗型を成し、頂部
には電磁弁１２を駆動源とする弁が設けられており、こ
の電磁弁１２は制御ユニット１０によって制御される。A contact terminal 8 is in pressure contact with the test pad 7, and an impedance test unit (test means) 9, which is a test means, is connected to the test pad 7. The impedance testing unit 9 is connected to a control unit 1-10 for driving an air blowing and discharging section, which will be described later. A near suction/discharge port (near suction/discharge means) 11 for blowing out or sucking air into the electronic component l has a funnel shape, and a valve driven by a solenoid valve 12 is provided at the top. The solenoid valve 12 is controlled by a control unit 10 .
電磁弁１２には、エア吸排口１１よりエアを吸引する真
空吸引ダクト１３およびエア吸排口１１にエアを圧送す
るための高圧エアダクト１４が接続されている。The electromagnetic valve 12 is connected to a vacuum suction duct 13 for sucking air from the air suction/discharge port 11 and a high-pressure air duct 14 for pumping air to the air suction/discharge port 11 .
次に、以上の構成による実施例の動作について説明する
。Next, the operation of the embodiment with the above configuration will be explained.
まず、制御ユニッ）１０によって電磁弁１２を駆動し、
弁が真空吸引ダクト１３と高圧エアダク）１４とに交互
に切り換えられるようにし、エア吸排口１１よりエアが
吸引（真空吸引）され、あるいはエアが吐出（高圧加圧
）されるようにする。First, the control unit) 10 drives the solenoid valve 12,
A valve is alternately switched between a vacuum suction duct 13 and a high pressure air duct 14, so that air is sucked (vacuum suction) or discharged (high pressure pressurized) from the air suction/discharge port 11.
このように、真空吸引と高圧加圧が交互に繰り返される
ことにより、電子部品１は上下方向に振動を受ける。In this way, by alternately repeating vacuum suction and high pressure application, the electronic component 1 is subjected to vibration in the vertical direction.
このとき、基板側パッド３→接続用はんだ４→部品側パ
ッド５→部品側パッド５−接続用はんだ４→基板側パツ
ド３のループに異常（断線、半断線）がなければ、接触
端子８（プローブ）間は低インピーダンスを示し、イン
ピーダンス検査ユニット９による検査結果は正常になる
。しかし、第２図に示すように、はんだ接合がしておら
ず単に接触しているのみの場合、欠陥接続部２０は真空
吸引によって欠陥接続部が離間し、欠陥部が拡大される
ので、検査対象の回路ループが断たれる。At this time, if there is no abnormality (breakage, half-breakage) in the loop of board side pad 3 → connection solder 4 → component side pad 5 → component side pad 5 - connection solder 4 → board side pad 3, contact terminal 8 ( (probe) shows low impedance, and the test result by the impedance test unit 9 is normal. However, as shown in FIG. 2, if there is no solder joint and there is only contact, the defective connection part 20 will be separated by vacuum suction and the defective part will be enlarged. Target circuit loop is broken.
この結果、断線状態が明白になって回路ループ内のイン
ピーダンスが高くなる。したがって、インピーダンス検
査ユニット９は、高インピーダンスを検知し、接続不良
を検出することができる。As a result, the disconnection condition becomes obvious and the impedance within the circuit loop becomes high. Therefore, the impedance test unit 9 can detect high impedance and detect poor connection.
第２図のような断線状態に限らず、半断線状態の場合で
もエア吸排口１１よりの真空吸引によって、電子部品１
が半断線状態から断線状態になり、上記の場合と同様に
電子部品１の接続検査を行うことができる。Not only in the disconnected state as shown in Fig. 2, but also in the half-broken state, the electronic component 1 can be removed by vacuum suction from the air intake/discharge port 11.
changes from a half-broken state to a broken state, and the connection of the electronic component 1 can be inspected in the same way as in the above case.
以上のように、この実施例によれば、外部から接続部を
目視することができない場合でも、断線、半断線を含め
て接続検査を実施することができる。As described above, according to this embodiment, even if the connection portion cannot be visually observed from the outside, it is possible to perform a connection inspection including disconnections and half-disconnections.
以上、本発明者によってなされた発明を実施例に基づき
具体的に説明したが、本発明は前記実施例に限定される
ものではなく、その要旨を逸脱しない範囲で種々変更可
能であることはいうまでもない。As above, the invention made by the present inventor has been specifically explained based on Examples, but it should be noted that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Not even.
本願において開示される発明のうち、代表的なものによ
って得られる効果を簡単に説明すれば、下記のとおりで
ある。Among the inventions disclosed in this application, the effects obtained by typical inventions are briefly described below.
すなわち、本発明による接続検査装置によれば、回路パ
ターンを有する基板にパッドおよびはんだを介して接続
されたモジュール化電子部品に対し、エアの真空吸引と
高圧加圧を繰り返し付与するエア吸排手段と、前記基板
の検査対象の接続部に接続される回路パターンを介して
前記検査対象の接続部を含む回路ループのインピーダン
スを測定して欠陥接続を検出する検査手段とを設けて構
成したので、外部から目視することができない接続部の
断線および半断線を容易に検出することができる。That is, according to the connection inspection device according to the present invention, the air suction/exhaustion means repeatedly applies vacuum suction and high pressure of air to the modularized electronic component connected to the board having the circuit pattern via the pad and the solder. , an inspection means for detecting a defective connection by measuring the impedance of a circuit loop including the connection part to be inspected via a circuit pattern connected to the connection part to be inspected on the board; Disconnections and half-disconnections in connections that cannot be visually observed can be easily detected.
第１図は本発明の一実施例である接続検査装置の一部を
示す概略構成図ミ
第２図は本実施例の欠陥接続部に対する接続検出の説明
図である。
１・・・電子部品、２・・・回路基板、３・・・基板側
パッド、４・・・接続用はんだ、５・・・部品側パッド
、６・・・引出し配線、７・・・検査用パッド、８・・
・接触端子、９・ビーダンス検査ユニット（検査手段）
、・制御ユニット、１１・・・エア吸排口排手段）、１
２・・・電磁弁、１３・・引ダクト、１４・・・高圧エ
アダクト、・欠陥接続部。
・・イン
１０・・
（エア吸
・真空吸
２０・・
ゝ（・〜上゛′７FIG. 1 is a schematic diagram showing a part of a connection inspection apparatus according to an embodiment of the present invention, and FIG. 2 is an explanatory diagram of connection detection for a defective connection portion according to the present embodiment. DESCRIPTION OF SYMBOLS 1...Electronic component, 2...Circuit board, 3...Board side pad, 4...Connection solder, 5...Component side pad, 6...Output wiring, 7...Inspection pad, 8...
・Contact terminal, 9 ・Beadance inspection unit (inspection means)
,・control unit, 11...air suction/exhaust port exhaust means), 1
2... Solenoid valve, 13... Pull duct, 14... High pressure air duct, Defective connection. ...in 10... (air suction/vacuum suction 20... ゝ(・〜upper゛'7
Claims (1)
介して接続されたモジュール化電子部品に対し、エアの
真空吸引と高圧加圧を繰り返し付与するエア吸排手段と
、前記基板の検査対象の接続部に接続される回路パター
ンを介して前記検査対象の接続部を含む回路ループのイ
ンピーダンスを測定して欠陥接続を検出する検査手段と
を具備することを特徴とする接続検査装置。1. An air suction/exhaust means that repeatedly applies vacuum suction and high pressure of air to modularized electronic components connected to a board having a circuit pattern via pads and solder; 1. A connection inspection device comprising: inspection means for detecting defective connections by measuring the impedance of a circuit loop including the connection portion to be inspected through a circuit pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63300482A JPH02147868A (en) | 1988-11-30 | 1988-11-30 | Connection inspecting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63300482A JPH02147868A (en) | 1988-11-30 | 1988-11-30 | Connection inspecting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02147868A true JPH02147868A (en) | 1990-06-06 |
Family
ID=17885336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63300482A Pending JPH02147868A (en) | 1988-11-30 | 1988-11-30 | Connection inspecting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02147868A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6288346B1 (en) * | 1997-07-16 | 2001-09-11 | Sharp Kabushiki Kaisha | System and method for easily inspecting a bonded state of a BGA/CSP type electronic part to a board |
| JP2015232578A (en) * | 2015-09-09 | 2015-12-24 | 株式会社東芝 | Electronic component and measuring method |
| US9500693B2 (en) | 2011-11-16 | 2016-11-22 | Kabushiki Kaisha Toshiba | Electronic apparatus, measuring method, and monitoring apparatus |
-
1988
- 1988-11-30 JP JP63300482A patent/JPH02147868A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6288346B1 (en) * | 1997-07-16 | 2001-09-11 | Sharp Kabushiki Kaisha | System and method for easily inspecting a bonded state of a BGA/CSP type electronic part to a board |
| US9500693B2 (en) | 2011-11-16 | 2016-11-22 | Kabushiki Kaisha Toshiba | Electronic apparatus, measuring method, and monitoring apparatus |
| JP2015232578A (en) * | 2015-09-09 | 2015-12-24 | 株式会社東芝 | Electronic component and measuring method |
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