JPH1062408A - Detecting method of solder defect - Google Patents
Detecting method of solder defectInfo
- Publication number
- JPH1062408A JPH1062408A JP8241239A JP24123996A JPH1062408A JP H1062408 A JPH1062408 A JP H1062408A JP 8241239 A JP8241239 A JP 8241239A JP 24123996 A JP24123996 A JP 24123996A JP H1062408 A JPH1062408 A JP H1062408A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- air
- pressure sensor
- air outlet
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Investigating And Analyzing Materials By Characteristic Methods (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電気部品の半田付け不
良を自動で検出する半田不良検出方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for automatically detecting a defective soldering of an electric component.
【０００２】[0002]
【従来の技術】従来より、電気部品の組立行程におい
て、半田付け作業は手作業または半田槽相等を使用する
自動半田により行われている。2. Description of the Related Art Conventionally, in the process of assembling electric components, soldering work is performed manually or by automatic soldering using a solder bath phase or the like.
【０００３】従来の半田付け対象部分の拡大図を図２に
示す。図２において、ケース10の内壁に沿って接合体20
が挿入されている。前記ケース10の上面部分には貫通孔
があり、接合体20を挿入時にこの接合体の一端の一部が
露出するようになっている。この貫通孔は、ケース10に
接合体20を挿入後半田を流したときに半田溜まり12を形
成し、この半田作用によりケース10と接合体20との接合
を行っている。FIG. 2 shows an enlarged view of a conventional portion to be soldered. In FIG. 2, the joined body 20 extends along the inner wall of the case 10.
Is inserted. The upper surface of the case 10 has a through hole, and a part of one end of the joined body is exposed when the joined body 20 is inserted. The through-hole forms a solder pool 12 when the solder flows after the joining body 20 is inserted into the case 10, and the case 10 and the joining body 20 are joined by the soldering action.
【０００４】上記構成の半田付け対象物への半田付け作
業においては、他の検査と同様に半田不良を検出する検
査が行われている。[0004] In the soldering work to the soldering object having the above configuration, an inspection for detecting a solder defect is performed in the same manner as other inspections.
【０００５】上記半田付けの不良検査手段としては、機
械的な手半田付けに対して、目で見て半田の流れ、まわ
り具合などから判断する視覚検査がある。[0005] As a means for inspecting the defective soldering, there is a visual inspection for mechanical hand soldering, which is visually judged based on the flow of solder, the degree of surroundings, and the like.
【０００６】別の手段として半田の特性から発生する、
例えば光沢、色、温度等を非接触センサにより検出する
ものもある。[0006] As another means, generated from the characteristics of solder,
For example, there is a type in which gloss, color, temperature, and the like are detected by a non-contact sensor.
【０００７】また、非接触センサであってもセンシング
部分を直接半田付け部分に当たり、または接触センサを
使用することで半田付け不良を検出している。Further, even in the case of a non-contact sensor, a soldering defect is detected by directly touching a sensing portion to a soldering portion or by using a contact sensor.
【０００８】上記各種センサは、例えば光電スイッチや
温度センサといった製品として提供されているものを使
用している。As the various sensors, those provided as products such as photoelectric switches and temperature sensors are used.
【０００９】[0009]
【発明が解決しようとする課題】上述した構成の半田付
け対象物における半田付け不良検出手段については、次
のような問題がある。視覚検査では、検査基準が人によ
り異なるために信頼性にばらつきが生じ品質の低下を招
くことになり、また未検査品を流してしまう危険があ
る。The means for detecting defective soldering of a soldering object having the above-described structure has the following problems. In the visual inspection, since the inspection standard is different for each person, the reliability is varied and the quality is deteriorated, and there is a danger that an uninspected product is washed away.
【００１０】非接触センサでは、光沢、色、温度による
判定となるが、センサは半田付け対象物と、半田自体と
の明確な区別を行うのが困難であり、正確なセンシング
が行えないものがある。In a non-contact sensor, the determination is made based on gloss, color, and temperature. However, it is difficult for the sensor to make a clear distinction between an object to be soldered and the solder itself. is there.
【００１１】また、接触センサによる半田不良検出は、
半田付け対象物の半田接合部が数ミリメートル程度と狭
く、また、半田のなじみ、濡れ角、量を判定するには少
なくとも３本以上のセンサヘッドが必要であるが、検査
機の取付寸法上これらの取付が不可能であり、検査が行
えないといった不具合が生じている。[0011] Further, the detection of solder failure by the contact sensor is as follows.
The solder joint of the object to be soldered is as narrow as several millimeters, and at least three sensor heads are required to determine the familiarity, wetting angle, and amount of solder. Cannot be mounted, and the inspection cannot be performed.
【００１２】本発明は上記不具合に鑑み、実用的な自動
半田不良検出方法を提供するを目的とする。The present invention has been made in view of the above problems, and has as its object to provide a practical automatic solder defect detection method.
【００１３】[0013]
【課題を解決するための手段】上記課題を解決するため
に本発明では、エア吹出口によって密閉可能な半田溜ま
りが形成できる半田付け接合部と、前記エア吹出口に圧
力センサと、この圧力センサにエアを送り出す空圧機械
とを備え、前記圧力センサがエア吹出口から送り出され
るエアの圧力を監視することを特徴とする半田不良検出
方法とし、半田不良時の検出手段として圧力センサの出
力結果で表示器もしくはブザを備えても良い。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, according to the present invention, there is provided a solder joint which can form a solder pool which can be hermetically sealed by an air outlet, a pressure sensor at the air outlet, and a pressure sensor. And a pneumatic machine for sending air to the device, wherein the pressure sensor monitors the pressure of the air sent from the air outlet, and a method for detecting a defective solder. A display or a buzzer may be provided.
【００１４】[0014]
【実施例】本発明の実施例とする半田不良検出方法を図
１に示す。図１は従来技術で述べた半田付け対象部分に
半田不良検出装置を装着するときの概略図を示してい
る。図１における半田付け対象部分は、従来技術でも述
べたが以下の通りとなっている。ケース10の内壁に沿っ
て接合体20が挿入され、前記ケース10の上面部分には貫
通孔があり、接合体20を挿入時にこの接合体の一端の一
部が露出するようになっており、この貫通孔は、ケース
10に接合体20を挿入後半田を流したときに半田溜まり12
を形成し、この半田作用によりケース10と接合体20との
接合を行っている。FIG. 1 shows a method for detecting a solder defect according to an embodiment of the present invention. FIG. 1 is a schematic diagram when a solder defect detection device is mounted on a soldering target portion described in the prior art. The parts to be soldered in FIG. 1 are as follows, as described in the prior art. The joined body 20 is inserted along the inner wall of the case 10, and there is a through hole in an upper surface portion of the case 10, and a part of one end of the joined body is exposed when the joined body 20 is inserted, This through hole is
Solder pool 12 when solder is poured after joining body 20 to 10
Is formed, and the case 10 and the joined body 20 are joined by the soldering action.
【００１５】次に半田不良検出装置の構成を述べると、
空圧機械80とエアレギュレータ70、圧力センサ60、エア
吹出口50間がそれぞれエアチューブ52を介して接続され
ることで形成されている。Next, the configuration of the solder defect detecting device will be described.
The pneumatic machine 80 is connected to the air regulator 70, the pressure sensor 60, and the air outlet 50 via an air tube 52.
【００１６】上記半田不良検出装置の動作および作用を
以下に述べる。エア吹出口50をケース10と接合体20とが
形成する半田付け接合部にあて、半田溜まり12を密閉状
態にする。この後に空圧機械80からエア吹出口50に向け
て空気（エア）を送り出す。この両者間には空圧機械80
から送り出されるエアの量を所定の値に保つエアレギュ
レータ70があり、このエアレギュレータ70から送り出さ
れる所定のエアは圧力センサ60に送り出され、ここでエ
ア吹出口から送り出されるエアの圧力を監視する。した
がって半田溜まり12中の半田30の量が十分でないか、ま
たは半田付け状態が不良である場合には、半田接合部分
からエアが漏れるためにエア吹出口50からのエア吹出量
が正常状態と比較してずれるので、これにより半田付け
不良が検出できる。The operation and operation of the above-described solder failure detecting device will be described below. The air outlet 50 is applied to the solder joint formed by the case 10 and the joined body 20, and the solder pool 12 is sealed. Thereafter, air (air) is sent from the pneumatic machine 80 to the air outlet 50. Pneumatic machine 80
There is an air regulator 70 that keeps the amount of air sent out from the air regulator at a predetermined value, and the predetermined air sent out from the air regulator 70 is sent out to a pressure sensor 60, where the pressure of the air sent out from the air outlet is monitored. . Therefore, if the amount of the solder 30 in the solder pool 12 is not sufficient or the soldering state is poor, the air leaks from the solder joint and the amount of air blown out from the air outlet 50 is compared with the normal state. Therefore, a soldering defect can be detected.
【００１７】本実施例では、エア吹出口50の外径は半田
溜まり12の外周寸法とほぼ同じで形成しているが、半田
不良検出時に半田溜まり12から空気が逃げない程度の大
きさであれば、これ以上大きくても小さくても適宜変更
でき、断面形状についても円形だけでなく角状であって
も、エアチューブであってもよい。In this embodiment, the outer diameter of the air outlet 50 is formed to be substantially the same as the outer diameter of the solder pool 12. However, the outer diameter of the air outlet 50 may be small enough to prevent air from escaping from the solder pool 12 when detecting a defective solder. If it is larger or smaller than this, it can be changed as appropriate, and the cross-sectional shape may be not only circular but also angular or air tube.
【００１８】また前記圧力センサ60の結果により半田不
良を検出した場合には、検出結果（圧力変化の上限また
は下限の信号）に応じて表示器やブザーを連動する構成
としてもよい。さらに、本実施例では半田付け対象物を
ケース10と接合体20とにしたが、半田溜まり12がエア吹
出口50により完全に密閉できる空間を形成するものであ
れば、他のあらゆる半田付け部であっても不良検出が行
えるものである。When a solder defect is detected based on the result of the pressure sensor 60, a display and a buzzer may be linked in accordance with the detection result (upper or lower limit signal of pressure change). Further, in the present embodiment, the object to be soldered is the case 10 and the joined body 20, but any other soldering portion may be used as long as the solder pool 12 forms a space that can be completely sealed by the air outlet 50. Even in this case, defect detection can be performed.
【００１９】[0019]
【発明の効果】上記構成により従来視覚検査でなければ
判断不能であった半田のなじみ、濡れ角、量の検出が容
易に行え、且つ人的な視覚検査ではなく自動で半田不良
を検出できるので生産性の向上と共に品質の良い製品が
提供できる。According to the above configuration, it is possible to easily detect the familiarity, the wetting angle and the amount of the solder, which could not be determined by the conventional visual inspection, and it is possible to automatically detect the solder defect instead of the human visual inspection. High quality products can be provided along with improvement in productivity.
【図１】本発明の半田不良検出方法の概略図を示す。FIG. 1 shows a schematic diagram of a method for detecting a solder failure according to the present invention.
【図２】半田付け対象部分の拡大図を示す。FIG. 2 shows an enlarged view of a portion to be soldered.
図において同一符号は同一、または相当部分を示す。 １２ 半田溜まり ３０ 半田 ５０ エア吹出口 ５２ エアチューブ ６０ 圧力センサ ７０ エアレギュレータ ８０ 空圧機械 In the drawings, the same reference numerals indicate the same or corresponding parts. 12 solder pool 30 solder 50 air outlet 52 air tube 60 pressure sensor 70 air regulator 80 pneumatic machine
Claims (2)
りが形成できる半田付け接合部と、前記エア吹出口に圧
力センサと、この圧力センサにエアを送り出す空圧機械
とを備え、前記圧力センサがエア吹出口から送り出され
るエアの圧力を監視することを特徴とする半田不良検出
方法。An air outlet for forming a solder pool that can be hermetically sealed by the air outlet; a pressure sensor at the air outlet; and a pneumatic machine for sending air to the pressure sensor. A method for detecting a defective solder, which comprises monitoring the pressure of air sent from an air outlet.
の出力結果で表示器もしくはブザを備えたことを特徴と
する請求項１記載の半田不良検出方法。2. The method according to claim 1, further comprising a display or a buzzer based on an output result of the pressure sensor as a means for detecting a defective solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8241239A JPH1062408A (en) | 1996-08-23 | 1996-08-23 | Detecting method of solder defect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8241239A JPH1062408A (en) | 1996-08-23 | 1996-08-23 | Detecting method of solder defect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1062408A true JPH1062408A (en) | 1998-03-06 |
Family
ID=17071282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8241239A Pending JPH1062408A (en) | 1996-08-23 | 1996-08-23 | Detecting method of solder defect |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1062408A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018079515A1 (en) | 2016-10-28 | 2018-05-03 | 株式会社アンド | Method for determining state of iron tip |
| JP2019195810A (en) * | 2018-05-07 | 2019-11-14 | 株式会社アンド | Soldering device |
-
1996
- 1996-08-23 JP JP8241239A patent/JPH1062408A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018079515A1 (en) | 2016-10-28 | 2018-05-03 | 株式会社アンド | Method for determining state of iron tip |
| US11691210B2 (en) | 2016-10-28 | 2023-07-04 | And Co., Ltd. | Method of determining state of iron tip |
| JP2019195810A (en) * | 2018-05-07 | 2019-11-14 | 株式会社アンド | Soldering device |
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