JPH03238342A - Apparatus for measuring mechanical characteristic of surface - Google Patents
Apparatus for measuring mechanical characteristic of surfaceInfo
- Publication number
- JPH03238342A JPH03238342A JP3394490A JP3394490A JPH03238342A JP H03238342 A JPH03238342 A JP H03238342A JP 3394490 A JP3394490 A JP 3394490A JP 3394490 A JP3394490 A JP 3394490A JP H03238342 A JPH03238342 A JP H03238342A
- Authority
- JP
- Japan
- Prior art keywords
- spring
- displacement
- measurement
- indenter
- pushing piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005259 measurement Methods 0.000 claims abstract description 87
- 238000006073 displacement reaction Methods 0.000 claims abstract description 51
- 238000003754 machining Methods 0.000 abstract description 6
- 230000005489 elastic deformation Effects 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- A Measuring Device Byusing Mechanical Method (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は固体の表面の機械特性測定装置に関し、特に磁
気ディスク装置、ＬＳＩ、超伝導素子、光メモリ等のマ
イクロニュートンオーダの摩擦力や凝着力、ナノメート
ルオーダの摩耗、表面形状、加工力の測定装置に関する
。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a device for measuring mechanical properties of the surface of a solid, and in particular, it relates to a device for measuring mechanical properties on the surface of a solid, and particularly for measuring micronewton-order frictional force and adhesive force of magnetic disk devices, LSIs, superconducting elements, optical memories, etc. , concerning a measurement device for nanometer-order wear, surface shape, and machining force.
［従来の技術］
従来の表面機械特性測定装置は、摩擦力、凝着力、微小
な加工力、および表面の微細な形状等の測定毎に個別の
装置となっていた。[Prior Art] Conventional surface mechanical property measuring devices are separate devices for each measurement of frictional force, adhesive force, minute processing force, minute surface shape, and the like.
［発明が解決しようとする課題］
上述した従来の表面機械特性測定装置は、摩擦力、凝着
力、加工力、および表面形状の測定毎に個別の装置とな
っており、同一の装置で測定しようとすると、測定面に
垂直な方向にたわむ垂直方向ばねの中心軸と、測定面に
平行な方向にたわむ平行方向ばねの中心軸が直交するた
め、この２方向のばねの変位を検出するための変位セン
サや、変位センサを微動させるための機構を同時に取付
けることが困難になり、同一装置で摩擦力、凝着力、加
工力、および表面形状の測定はできないという欠点があ
る。[Problems to be Solved by the Invention] The conventional surface mechanical property measuring devices described above are separate devices for measuring frictional force, adhesion force, processing force, and surface shape, and it is difficult to measure them with the same device. Then, since the center axis of the vertical spring that bends in the direction perpendicular to the measurement surface and the center axis of the parallel spring that bends in the direction parallel to the measurement surface are orthogonal, it is necessary to detect the displacement of the spring in these two directions. This method has the disadvantage that it is difficult to simultaneously install a displacement sensor and a mechanism for finely moving the displacement sensor, and that frictional force, adhesion force, processing force, and surface shape cannot be measured with the same device.
本発明の目的は、１台の装置で摩擦力、凝着力、加工力
および表面形状のマイクロニュートン、ナノメートルオ
ーダの測定が可能な表面機械特性、測定装置を提供する
ことである。An object of the present invention is to provide a surface mechanical property measuring device capable of measuring frictional force, adhesion force, processing force, and surface shape on the order of micronewtons and nanometers with a single device.
［課題を解決するための手段］
本発明の表面機械特性測定装置は、
一方の端部がベースに固定された、測定面に平行な方向
にたわむばねの自由端に、ばねの中心軸が前記測定面に
平行な方向にたわむばねの中心軸の延長線上に一致し、
または該中心軸の延長線に平行になるように一方の端部
が固定され、他方の端部に圧子が取付けられた、測定面
に垂直な方向にたわむばねを有している。[Means for Solving the Problems] The surface mechanical property measuring device of the present invention has a free end of a spring whose one end is fixed to a base and which bends in a direction parallel to the measurement surface. It corresponds to the extension line of the central axis of the spring that bends in the direction parallel to the measurement plane,
Alternatively, it has a spring that is fixed at one end so as to be parallel to the extension line of the central axis, has an indenter attached to the other end, and is deflected in a direction perpendicular to the measurement surface.
［作用コ
測定面を圧子に接触させ、さらに、測定面に組成変形が
発生しない程度に押付け、測定面に垂直な方向に圧子な
引離すように測定面を下降させ、前記接触位置から引離
された点迄の垂直ばねの変位量を変位センサで読み、そ
の変位量と、ばね定数から凝着力を算出し、測定面を塑
性変形が発生しない程度に圧子に押付け、圧子に付勢し
て圧子を測定表土を測定面に平行に移動させたときの平
行方向にたわむばねの端部の変位量を変位センサで読み
、その変位量と、ばね定数と、平行方向にたわむばねが
支持体に接する点から平行方向にたわむばねの自由端の
変位測定点までの長さと、平行方向にたわむばねが支持
体に接する点から圧子の測定面に接する位置までの長さ
とから摩擦力を算出し、次に、測定面を圧子に接触して
測定面の表面にわずかに弾性変形が発生する程度に押付
は圧子を測定面に沿って摩擦力測定時と同じ方向に動か
し、その時の垂直方向にたわむばねの変位を読んで表面
形状を知り、圧子を測定面に加工深度に押込んで測定面
上を移動する時の測定面と平行方向にたわむばねの端部
の変位測定点の変位を読み、その変位量と、ばね定数と
、測定面に平行にたわむばねが支持体に接する点から該
平行方向にたわむばねの自由端の変位測定点までの長さ
と、該平行方向にたわむばねの支持体に接する点から圧
子が測定面に接する位置までの長さとから加工力を算出
することにより、この１台の表面機械特性測定装置で摩
擦力、凝着力、加工力および表面形状の測定を行なうこ
とができる。[Operation] Bring the measurement surface into contact with the indenter, further press it to the extent that compositional deformation does not occur on the measurement surface, lower the measurement surface in a direction perpendicular to the measurement surface so as to separate the indenter, and then pull it away from the contact position. A displacement sensor reads the displacement of the vertical spring up to the point where the vertical spring is pressed, calculates the adhesion force from the displacement and the spring constant, presses the measurement surface against the indenter to the extent that no plastic deformation occurs, and applies force to the indenter. Measure the indenter When the topsoil is moved parallel to the measurement surface, a displacement sensor reads the displacement of the end of the spring that bends in the parallel direction, and calculates the amount of displacement, the spring constant, and the spring that bends in the parallel direction on the support. Calculate the frictional force from the length from the contact point to the displacement measurement point of the free end of the spring that bends in the parallel direction, and the length from the point where the spring that bends in the parallel direction contacts the support body to the position where it touches the measurement surface of the indenter, Next, the measurement surface is brought into contact with the indenter, and the indenter is moved along the measurement surface in the same direction as when measuring the friction force, and the indenter is deflected in the vertical direction at that time. Read the displacement of the spring to know the surface shape, and when the indenter is pushed into the measurement surface to the machining depth and moves on the measurement surface, read the displacement at the measurement point of the end of the spring that deflects in the direction parallel to the measurement surface. The amount of displacement, the spring constant, the length from the point where the spring that bends parallel to the measurement plane contacts the support to the displacement measurement point of the free end of the spring that bends in the parallel direction, and the length of the spring that bends in the parallel direction to the support of the spring that bends in the parallel direction. By calculating the processing force from the length from the contact point to the position where the indenter contacts the measurement surface, this single surface mechanical property measuring device can measure friction force, adhesion force, processing force, and surface shape. can.
［実施例］
次に、本発明の実施例について図面を参照して説明する
。[Example] Next, an example of the present invention will be described with reference to the drawings.
第１図は本発明の表面機械特性測定装置の一実施例の斜
視図、第２図は第１図のばね３を１枚ばねとした実施例
の斜視図、第３図は電磁石を用いた場合の実施例の斜視
図である。Fig. 1 is a perspective view of an embodiment of the surface mechanical property measuring device of the present invention, Fig. 2 is a perspective view of an embodiment in which the spring 3 in Fig. 1 is a single spring, and Fig. 3 is a perspective view of an embodiment using an electromagnet. FIG.
この表面機械特性測定装置は圧子１と、ばね３．４と、
支持体５と、変位センサ６．７と、試片固定台１１と、
ベース（不図示）からなる。圧子１はダイヤモンド製で
その先端は目的に応じて加工されているが測定先端の曲
率半径はサブミクロンオーダに仕上げられた角錐で、測
定面の形状をナノメートルオーダで測定可能にする。試
片固定台１１はベース（不図示）に対して垂直方向に移
動させて固定することが可能なように取付けられ、表面
に被測定片が測定面２を水平に固定される被測定片の搭
載台である。ばね４は、ベース（不図示）に固定された
支持体５に一方の端部が固定され、測定面２に平行な方
向にたわむ２枚の板ばねな離間対向させた組合せばねで
ある。ばね３は一方の端部がばね４の自由端に中心軸が
ばね４の中心軸の延長線上に一致するように固定され、
測定面２に垂直な方向にたわむ、２枚の板ばねを離間対
向させた組合せばねで、自由端近くに圧子１が先端を測
定面２に垂直になるように固定されている。また、ばね
３，４の材質は弾性が高いステンレス鋼で、そのばね定
数は、マイクロニュートン以下の力を測定可能なように
Ｎ ／ ｍのオーダーあるいはそれ以下である。変位セ
ンサ６はばね３の端部の変位測定点の変位（ばね３のた
わみ量）を検出するセンサである。変位センサ７はばね
４の自由端位置の変位測定点の変位（ばね４のたわみ量
）を検出するセンサである。This surface mechanical property measuring device includes an indenter 1, a spring 3.4,
A support body 5, a displacement sensor 6.7, a specimen fixing table 11,
It consists of a base (not shown). The indenter 1 is made of diamond, and its tip is processed according to the purpose, and the measurement tip is a pyramid whose radius of curvature is on the order of submicrons, making it possible to measure the shape of the measurement surface on the order of nanometers. The sample fixing table 11 is attached to a base (not shown) so that it can be moved and fixed in the vertical direction, and the sample to be measured is fixed on the surface of the sample to be measured with the measurement surface 2 horizontally fixed. It is a mounting platform. The spring 4 is a combination of two leaf springs spaced apart and facing each other, one end of which is fixed to a support 5 fixed to a base (not shown), and deflected in a direction parallel to the measurement surface 2. One end of the spring 3 is fixed to the free end of the spring 4 so that its central axis is aligned with the extension of the central axis of the spring 4,
It is a combination spring made up of two leaf springs spaced apart and facing each other, which bends in a direction perpendicular to the measurement surface 2, and an indenter 1 is fixed near the free end so that the tip is perpendicular to the measurement surface 2. The springs 3 and 4 are made of highly elastic stainless steel, and their spring constants are on the order of N/m or less so that forces of less than micronewtons can be measured. The displacement sensor 6 is a sensor that detects the displacement (the amount of deflection of the spring 3) at a displacement measurement point at the end of the spring 3. The displacement sensor 7 is a sensor that detects the displacement (the amount of deflection of the spring 4) at a displacement measurement point at the free end position of the spring 4.
次に、この実施例による測定について説明する。Next, measurement according to this example will be explained.
まず凝着力の測定の場合は、試片固定台ＩＩ上に被測定
片をその測定面２を水平にして固定する。First, in the case of measuring the adhesive force, the sample to be measured is fixed on the sample fixing table II with its measurement surface 2 horizontal.
その後、試片固定台１１を上昇させて測定面２を圧子１
に接触させ、ばね３の自由端の変位測定点の位置を変位
センサ６で読む。その後、さらに付勢手段により、測定
面２を表面に塑性変形が起きない程度の力で圧子１に押
付ける。つぎに、付勢手段により試片固定台１１を徐々
に降下させて測定面２を圧子ｌから離反する方向に移動
する。前記離反動作を継続すると、圧子１と測定面２と
の間に作用する凝着力でばね３が測定面２の方向にたわ
む。さらに、離反動作を継続すると、ばね３がたわむこ
とによって発生する力が圧子１と測定面２との間に作用
する凝着力を超えて、圧子１が測定面２から離反する。After that, the specimen fixing table 11 is raised and the measurement surface 2 is placed on the indenter 1.
The position of the displacement measuring point on the free end of the spring 3 is read by the displacement sensor 6. Thereafter, the measuring surface 2 is further pressed against the indenter 1 by the biasing means with a force that does not cause plastic deformation on the surface. Next, the specimen fixing table 11 is gradually lowered by the biasing means to move the measurement surface 2 in a direction away from the indenter l. When the separation operation continues, the spring 3 is bent in the direction of the measurement surface 2 due to the adhesive force acting between the indenter 1 and the measurement surface 2. Furthermore, if the separation operation continues, the force generated by the deflection of the spring 3 exceeds the adhesive force acting between the indenter 1 and the measurement surface 2, causing the indenter 1 to separate from the measurement surface 2.
この離反したときのばね３の自由端の変位測定点の位置
を変位センサ６で読み、このようにして圧子１が測定面
２に接触した位置から、圧子１が測定面２から離反した
位置までのばね３自出端のたわみ量を、変位センサ６に
よってミクロンメートルあるいはそれ以下の精度で測定
すれば、圧子１と測定面２との間に作用するマイクロニ
ュートン以下の凝着力がばね３のたわみ量と、ばね３の
ばね定数から算出できる。さらに、付勢手段を用いて、
前記凝着力の測定を測定面２に沿った方向で、しかもげ
ね４がたわむ方向で繰り返し行なうことにより、凝着力
の分布を測定できる。The position of the displacement measurement point of the free end of the spring 3 when the spring 3 is separated is read by the displacement sensor 6, and in this way from the position where the indenter 1 contacts the measurement surface 2 to the position where the indenter 1 separates from the measurement surface 2. If the amount of deflection of the protruding end of the spring 3 is measured with an accuracy of micrometers or less using the displacement sensor 6, the adhesive force of less than micronewtons acting between the indenter 1 and the measurement surface 2 will cause the deflection of the spring 3. It can be calculated from the amount and the spring constant of spring 3. Furthermore, using a biasing means,
By repeatedly measuring the adhesive force in the direction along the measurement surface 2 and in the direction in which the brace 4 is deflected, the distribution of the adhesive force can be measured.
凝着力の分布の測定に引き続いて摩擦力を測定するには
、前記同様の付勢手段により、測定面２を表面間に塑性
変形が起きない程度の力で圧子１に押付け、ばね４の自
由端の変位測定点の位置を変位センサ７で読む。その後
に、付勢手段を用いて、圧子ｌを測定面に沿ってばね３
の軸に直角な方向に移動させる。圧子１を前記方向に移
動させた時、圧子１と測定面２との摩擦力によってばね
４がたわむので、ばね４の自由端の変位測定点の値を変
位センサ７で読み、このようにして圧子１を測定面に押
し付けた位置からのばね４の自由端のたわみ量を、変位
センサ７の測定によってミクロンメートルあるいはそれ
以下の精度で検出すれば、圧子１と測定面２との間に作
用するマイクロニュートン以下の摩擦力は、ばね４のた
わみ量と、ばね４のばね定数と、ばね４が支持体５に接
する点からばね４の変位測定点までの長さと、ばね４が
支持体５に接する点から圧子ｌが測定面２に接する位置
までの長さとから算出することができる。To measure the frictional force subsequent to the measurement of the adhesive force distribution, the measurement surface 2 is pressed against the indenter 1 using the same biasing means as described above with a force that does not cause plastic deformation between the surfaces, and the spring 4 is free. The position of the displacement measurement point at the end is read by the displacement sensor 7. Thereafter, using the biasing means, the indenter l is moved along the measurement surface by the spring 3.
move in a direction perpendicular to the axis of When the indenter 1 is moved in the above direction, the spring 4 is deflected by the frictional force between the indenter 1 and the measurement surface 2, so the value at the displacement measurement point of the free end of the spring 4 is read by the displacement sensor 7, and in this way, If the amount of deflection of the free end of the spring 4 from the position where the indenter 1 is pressed against the measurement surface is detected with an accuracy of micrometers or less by measurement with the displacement sensor 7, it is possible to detect an effect between the indenter 1 and the measurement surface 2. The frictional force of micronewtons or less is determined by the amount of deflection of the spring 4, the spring constant of the spring 4, the length from the point where the spring 4 contacts the support 5 to the displacement measurement point of the spring 4, and the distance between the spring 4 and the support 5. It can be calculated from the length from the point where the indenter l contacts the measurement surface 2 to the position where the indenter l contacts the measurement surface 2.
摩擦力の測定に引き続いて表面形状を測定するには、ま
ず、付勢手段を用いて、試片固定台１１を上昇させ圧子
１に測定面２を押付け、表面がわずかに弾性変形する程
度にし、このときのばね３の自由端の変位測定点の位置
を変位センサ６で読む。つぎに、付勢手段を用いて、測
定面２を前記摩擦力の測定を行なった方向に移動させる
。この時、ばね３は測定面の形状に応じて変位する。こ
の時の変位測定点の変位を変位センサ６によってミクロ
ンメートルあるはそれ以下の精度で測定すれば、ナノメ
ートルオーダの表面形状は測定面に沿う方向への圧子１
の移動量と測定面２に対向する方向へのばね３の変位を
知ることができる。To measure the surface shape subsequent to the measurement of the frictional force, first, use the biasing means to raise the specimen fixing table 11 and press the measurement surface 2 against the indenter 1 to the extent that the surface is slightly elastically deformed. At this time, the position of the displacement measurement point of the free end of the spring 3 is read by the displacement sensor 6. Next, the measurement surface 2 is moved in the direction in which the frictional force was measured using the biasing means. At this time, the spring 3 is displaced according to the shape of the measurement surface. If the displacement of the displacement measurement point at this time is measured by the displacement sensor 6 with an accuracy of micrometers or less, the surface shape of the nanometer order will be obtained by the indenter 1 in the direction along the measurement surface.
The amount of movement of the spring 3 and the displacement of the spring 3 in the direction facing the measurement surface 2 can be determined.
表面形状の測定に引き続いて加工力を測定するには、試
片固定台１１を上昇させて、加工深度まで圧子１を測定
面２に押込み、このときのばね４の自由端の変位測定点
の位置を変位センサ７で読む。その後、付勢手段を用い
て、圧子１を測定面２に沿った方向で、しかも、ばね４
がたわむ測定面２に平行な方向に測定面２に沿って摩擦
力測定のときと同様に移動させる。この時、圧子１によ
り測定面２が加工される際の加工力によってばね４がた
わむので、圧子１を測定面に押付けた位置からのばね４
の自由端の変位測定点のたわみ量を、変位センサ７によ
ってミクロンメートルあるいはそれ以下の精度で測定す
れば、圧子１と測定面２との間に作用するマイクロニュ
ートン以下の加工力は、ばね４のたわみ量と、ばね４の
ばね定数と、ばね４が支持体５と接する点からばね４の
変位測定点までの長さと、ばね４が支持体５と接する点
から圧子１が測定面２に接する点までの長さとから算出
できる。To measure the machining force subsequent to the measurement of the surface shape, raise the sample fixing table 11, push the indenter 1 into the measurement surface 2 to the machining depth, and measure the displacement measurement point of the free end of the spring 4 at this time. The position is read by the displacement sensor 7. Thereafter, using the biasing means, the indenter 1 is moved in the direction along the measurement surface 2, and the spring 4
It is moved along the measurement surface 2 in a direction parallel to the measurement surface 2 where the surface is bent in the same manner as when measuring the frictional force. At this time, the spring 4 is bent by the processing force when the measurement surface 2 is processed by the indenter 1, so the spring 4 is bent from the position where the indenter 1 is pressed against the measurement surface.
If the amount of deflection at the displacement measurement point of the free end is measured with an accuracy of micrometers or less using the displacement sensor 7, the processing force of less than micronewtons acting between the indenter 1 and the measurement surface 2 will be the same as that of the spring 4. the amount of deflection, the spring constant of the spring 4, the length from the point where the spring 4 contacts the support 5 to the displacement measurement point of the spring 4, and the distance from the point where the spring 4 contacts the support 5 to the measurement surface 2 of the indenter 1. It can be calculated from the length to the point of contact.
前述した凝着力、摩擦力、表面形状および加工量の測定
を測定面２上の複数の位置で繰り返し行なうことにより
、表面の機械特性を詳細に知ることができる。By repeatedly measuring the adhesion force, friction force, surface shape, and processing amount described above at a plurality of positions on the measurement surface 2, the mechanical properties of the surface can be known in detail.
このようにして、同一の装置でマイクロニュートン以下
の凝着力、摩擦力および加工力や、ナノメートルオーダ
の表面形状を繰り返し測定することが可能であり、表面
の機械特性を高精度で測定できる。In this way, it is possible to repeatedly measure adhesion forces, frictional forces, and processing forces of micronewtons or less, as well as surface shapes on the order of nanometers, with the same device, and the mechanical properties of the surface can be measured with high precision.
以上の実施例では、代表的な表面機械特性装置について
第１図により説明を行なったが、第２図に示すように、
測定面に垂直な方向にたわむばねが１枚のばね１２であ
っても、凝着力、表面形状、摩擦力、加工力の測定がで
きる。また、試片固定台１１を水平に移動可能とした場
合第３図に示すように、付勢手段を用いて、測定面２を
表面に塑性変形が起きない程度の力で圧子ｌに押付け、
その後に、付勢手段を用いて、測定面２をばね４がたわ
む測定面２に平行な方向に移動させる際に、圧子１と測
定面２との摩擦力によるばね４のたわみ量が零となるよ
うに、ベース（不図示）に固定された電磁石支持体ＩＯ
上に支持された電磁石８でばね４の測定点に固定されて
いる鉄片９を吸引する制御電流を制御し、前記制御電流
を測定することによっても、摩擦力が測定できる。In the above embodiments, a typical surface mechanical property device was explained using FIG. 1, but as shown in FIG.
Even if there is only one spring 12 that bends in the direction perpendicular to the measurement surface, adhesive force, surface shape, frictional force, and processing force can be measured. In addition, when the specimen fixing table 11 is made horizontally movable, as shown in FIG.
After that, when the biasing means is used to move the measuring surface 2 in a direction parallel to the measuring surface 2 where the spring 4 is deflected, the amount of deflection of the spring 4 due to the frictional force between the indenter 1 and the measuring surface 2 becomes zero. An electromagnetic support IO fixed to a base (not shown) so that
The frictional force can also be measured by controlling a control current that attracts an iron piece 9 fixed to a measurement point of the spring 4 using an electromagnet 8 supported above and measuring the control current.
［発明の効果コ
以上述べたように、本発明は、一方の端部が固定され、
測定面に平行にたわむばねの他方の端部に、該ばねの中
心軸の延長線上または該延長線に平行な中心軸を有する
ように、一方の端部が固定され、他方の端部に圧子が取
付けられた垂直方向にたわむばねを用いることにより、
マイクロニュートン以下の凝着力、摩擦力および加工力
やナノメートルオーダの表面形状を同一の装置で容易に
観測することが可能になり、表面層や薄膜の機械特性を
高精度で測定できる効果がある。[Effects of the Invention] As described above, the present invention has one end fixed,
One end is fixed to the other end of the spring that bends parallel to the measurement plane, and an indenter is attached to the other end so that the spring has a central axis on or parallel to the central axis of the spring. By using a vertically deflecting spring attached to
It is now possible to easily observe adhesion forces, frictional forces, and processing forces of micronewtons or less, as well as surface shapes on the order of nanometers, with the same device, making it possible to measure the mechanical properties of surface layers and thin films with high precision. .
第１図は本発明の表面機械特性測定装置の一実施例の斜
視図、第２図は第１図のばね３を一枚ばねとした実施例
の斜視図、第３図は電磁石を用いた場合の実施例の斜視
図である。
１・・・圧子、 ２・・・測定面、３．４．１
２・・・ばね、 ５・・・支持体、６．７・・・変
位センサ、 ８・・・電磁石、９・・・鉄片、
１０・・・電磁石支持体、１１・・・試片固定台。Fig. 1 is a perspective view of an embodiment of the surface mechanical property measuring device of the present invention, Fig. 2 is a perspective view of an embodiment in which the spring 3 in Fig. 1 is a single piece spring, and Fig. 3 is a perspective view of an embodiment using an electromagnet. FIG. 1... Indenter, 2... Measurement surface, 3.4.1
2... Spring, 5... Support, 6.7... Displacement sensor, 8... Electromagnet, 9... Iron piece,
10... Electromagnet support, 11... Sample fixing stand.
Claims (1)
行または垂直のいずれか一方向にたわむばねと、該ばね
の他方の端部に取付けられた圧子と、該圧子の測定面上
の変位を検出する変位センサを有する表面機械特性測定
装置において、 一方の端部がベースに固定された、測定面に平行な方向
にたわむばねの自由端に、ばねの中心軸が前記測定面に
平行な方向にたわむばねの中心軸の延長線上に一致し、
または該中心軸の延長線に平行になるように一方の端部
が固定され、他方の端部に圧子が取付けられた、測定面
に垂直な方向にたわむばねを有することを特徴とする表
面機械特性測定装置。[Claims] 1. A spring whose one end is fixed to a base and bends in one direction either parallel or perpendicular to the measurement surface, and an indenter attached to the other end of the spring; In a surface mechanical property measuring device having a displacement sensor that detects the displacement of the indenter on the measurement surface, a spring whose one end is fixed to the base and which is deflected in a direction parallel to the measurement surface has a center of the spring. the axis coincides with an extension of the central axis of the spring that bends in a direction parallel to the measurement plane;
or a surface machine characterized by having a spring that is fixed at one end so as to be parallel to the extension line of the central axis, has an indenter attached to the other end, and is deflected in a direction perpendicular to the measuring surface. Characteristic measuring device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3394490A JP2755333B2 (en) | 1990-02-16 | 1990-02-16 | Surface mechanical property measuring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3394490A JP2755333B2 (en) | 1990-02-16 | 1990-02-16 | Surface mechanical property measuring device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03238342A true JPH03238342A (en) | 1991-10-24 |
| JP2755333B2 JP2755333B2 (en) | 1998-05-20 |
Family
ID=12400621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3394490A Expired - Lifetime JP2755333B2 (en) | 1990-02-16 | 1990-02-16 | Surface mechanical property measuring device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2755333B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5859357A (en) * | 1995-12-25 | 1999-01-12 | Fujitsu Limited | Apparatus for measuring friction force between a magnetic head and a magnetic disk |
| JP2007271318A (en) * | 2006-03-30 | 2007-10-18 | Japan Science & Technology Agency | Agglutination simulator for contact mode atomic force microscope, agglutination simulation program, recording medium recorded with agglutination simulation program, and agglutination simulation method |
| CN117238812A (en) * | 2023-11-10 | 2023-12-15 | 四川省农业机械科学研究院 | Substrate warp measuring device and measuring method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7557933B2 (en) | 2006-02-14 | 2009-07-07 | Japan Science And Technology Agency | Measuring probe, sample surface measuring apparatus and sample surface measuring method |
-
1990
- 1990-02-16 JP JP3394490A patent/JP2755333B2/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5859357A (en) * | 1995-12-25 | 1999-01-12 | Fujitsu Limited | Apparatus for measuring friction force between a magnetic head and a magnetic disk |
| JP2007271318A (en) * | 2006-03-30 | 2007-10-18 | Japan Science & Technology Agency | Agglutination simulator for contact mode atomic force microscope, agglutination simulation program, recording medium recorded with agglutination simulation program, and agglutination simulation method |
| CN117238812A (en) * | 2023-11-10 | 2023-12-15 | 四川省农业机械科学研究院 | Substrate warp measuring device and measuring method |
| CN117238812B (en) * | 2023-11-10 | 2024-04-05 | 四川省农业机械科学研究院 | Substrate warp measuring device and measuring method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2755333B2 (en) | 1998-05-20 |
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