CN117238812B - Substrate warp measuring device and measuring method - Google Patents
Substrate warp measuring device and measuring method Download PDFInfo
- Publication number
- CN117238812B CN117238812B CN202311491279.3A CN202311491279A CN117238812B CN 117238812 B CN117238812 B CN 117238812B CN 202311491279 A CN202311491279 A CN 202311491279A CN 117238812 B CN117238812 B CN 117238812B
- Authority
- CN
- China
- Prior art keywords
- substrate
- measured
- measuring
- pressure sensor
- carrying platform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 111
- 238000000034 method Methods 0.000 title claims abstract description 18
- 239000000523 sample Substances 0.000 claims abstract description 37
- 238000005259 measurement Methods 0.000 claims abstract description 36
- 230000035772 mutation Effects 0.000 claims abstract description 17
- 230000008859 change Effects 0.000 claims description 8
- 238000000691 measurement method Methods 0.000 claims description 6
- 238000001914 filtration Methods 0.000 claims description 5
- 238000001179 sorption measurement Methods 0.000 claims description 4
- 238000009795 derivation Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 2
- 238000009434 installation Methods 0.000 abstract description 2
- 230000008569 process Effects 0.000 description 8
- 238000004364 calculation method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Landscapes
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
The invention relates to the technical field of measurement and discloses a substrate warpage measuring device and a substrate warpage measuring method, wherein the device comprises a top seat, a measuring assembly and a carrying platform; the top seat is arranged above the carrying platform, and the measuring assembly is arranged on the top seat; the carrier is used for placing the substrate to be measured; the measuring assembly comprises a pressure sensor, an elastic assembly and a measuring probe which are sequentially arranged in the shell from top to bottom; the upper end of the elastic component is contacted with the pressure sensor, and the lower end of the elastic component is connected with the measuring probe; the measuring probe is contacted with the substrate to be measured; the distance sensor is arranged on the lower surface of the top seat. The device detects primary mutation points and secondary mutation points of the pressure value after the probe contacts with the substrate through the pressure sensor, and obtains position data S1 and S2 of the secondary mutation points through the distance sensor; warpage = S2-S1. The device has simple structure and high measurement precision, and can reduce the requirement on the installation precision of a measurement system.
Description
Technical Field
The invention relates to the technical field of measurement, in particular to a substrate warpage measuring device and a substrate warpage measuring method.
Background
The photovoltaic agriculture combines solar energy utilization with agriculture, and utilizes modern biotechnology, control technology, information technology, sensor technology, new materials and advanced equipment to realize ecological agriculture and circulating agriculture mode integration and innovation. The solar technology in the agricultural system comprises a flexible solar cell of a glass substrate and a PET (polyethylene terephthalate) plastic substrate, and in order to ensure the process stability of the solar cell, the uniformity of the substrate, namely the warpage, needs to be ensured in a controllable range in the production process. The warpage of the substrate can affect processes such as logistics, printing, exposure, etching, lamination and the like, resulting in uncontrollable quality. Therefore, there is a need to monitor the warpage of the substrate in the solar cell production process in real time; in view of the above, there is a need for a substrate warpage measuring device and a substrate warpage measuring method that are convenient to operate and have high accuracy.
Disclosure of Invention
In order to solve the problems, the invention aims to provide the substrate warpage measuring device and the substrate warpage measuring method, which are convenient to operate, improve the measurement accuracy and effectively improve the measurement efficiency.
In order to achieve the above purpose, the present invention adopts the technical scheme that:
the substrate warp measuring device comprises a top seat, a measuring assembly, a carrying platform and a control system; the top seat is arranged above the carrying platform through a lifting device, and the measuring assembly is arranged on the top seat; the carrier is used for placing the substrate to be measured; the measuring assembly comprises a pressure sensor, an elastic assembly and a measuring probe which are sequentially arranged in the shell from top to bottom; the upper end of the elastic component is contacted with the pressure sensor, and the lower end of the elastic component is connected with the measuring probe; the measuring probe is contacted with the substrate to be measured; a distance sensor is arranged on the lower surface of the top seat; the lifting device, the pressure sensor and the distance sensor are all electrically connected with the control system.
As a preferred embodiment, the substrate to be measured is mounted on the stage by a fixing means; the fixing device comprises a fixing strip and an adsorption body; the adsorbing body is arranged on the lower surface of the fixing strip and acts on the upper surface of the carrying platform.
As a preferred embodiment, the lifting device comprises a lifting module and a horizontal movement module; two stand columns are arranged on the carrying platform; the horizontal movement module is arranged between the two upright posts and is positioned at the upper parts of the upright posts; the lifting module is arranged on the horizontal movement module and moves left and right on the horizontal movement module; the top seat is arranged on the lifting module and moves up and down on the lifting module; the lifting module and the horizontal movement module are electrically connected with the control system.
As a preferred embodiment, the elastic component comprises a sliding block and a spring; the upper part of the sliding block is contacted with the pressure sensor; the lower part of the sliding block is connected with one end of the spring; the other end of the spring is connected with the upper part of the measuring probe.
As a preferred implementation scheme, the carrying platform is provided with switch keys and a control panel.
The measuring method of the substrate warpage measuring device comprises the following steps:
s01: mounting the substrate to be measured, so that the measuring probe corresponds to a point to be measured of the substrate to be measured;
s02: the lifting device is started to drive the footstock to move downwards until the measuring probe contacts with the point to be measured of the substrate to be measured; the pressure sensor detects a pressure value to generate a primary mutation point, and the distance sensor acquires a current numerical value as S1;
s03: the top seat continuously moves downwards until the lower surface of the substrate to be measured point to be measured is contacted with the upper surface of the carrier; the pressure sensor detects a pressure value to generate a secondary mutation point, and the distance sensor acquires a current numerical value as S2;
s04: closing the lifting device; the amount of warpage is calculated, warpage = S2-S1.
As a preferred embodiment, the elastic modulus of the spring in the elastic component is much greater than the elastic modulus of the substrate to be measured.
As a preferred embodiment, the step S01 further includes dividing the effective area and the ineffective area of the measured substrate; and the invalid area of the measured substrate is used as a point to be measured of the measured substrate.
As a preferred implementation scheme, the primary abrupt change point and the secondary abrupt change point of the detection pressure value of the pressure sensor are calculated through differential approximate derivation of discrete data, and then are obtained through filtering processing.
The invention has the beneficial effects that:
1. the device measures the warp of the substrate based on the pressure data of the pressure sensor, utilizes the pressure sensor and the distance sensor to form a measuring closed loop, accurately acquires the deformation process of the substrate to be measured, calculates the deformation pressure abrupt change point of the substrate to be measured to indirectly measure the warp, has high measuring precision and strong environment adaptation capability;
2. in the measuring process of the device, the pressure of the deformation of the measured substrate is only related to the relative position of the distance sensor, is not related to the absolute position of the measuring system, and can reduce the requirement on the installation precision of the measuring system.
Drawings
FIG. 1 is a schematic diagram of a device structure in an embodiment of the invention;
FIG. 2 is a schematic diagram of a measurement assembly according to an embodiment of the present invention;
FIG. 3 is a schematic diagram showing the effective area of the substrate to be measured according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of pressure sensor data in an embodiment of the invention;
fig. 5 is a flowchart of a measurement method according to an embodiment of the invention.
In the figure: 1. a top base; 2. a measurement assembly; 201. a housing; 202. a pressure sensor; 203. a slide block; 204. a spring; 205. a measurement probe; 3. a carrier; 4. a control system; 5. a lifting device; 501. a lifting module; 502. a horizontal movement module; 6. a substrate to be measured; 7. a fixing device; 8. a column; 9. a distance sensor.
Detailed Description
The present invention will be further described with reference to the accompanying drawings, in order to make the objects, technical solutions and advantages of the present invention more apparent. In the description of the present invention, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present invention and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
As shown in fig. 1-2, the present embodiment provides a substrate warpage measuring device, which includes a top base 1, a measuring assembly 2, a carrier 3 and a control system 4; the top seat 1 is arranged above the carrying platform 3 through a lifting device 5, and the measuring assembly 2 is arranged on the top seat 1; the carrier 3 is used for placing a substrate 6 to be measured; the measuring assembly 2 comprises a pressure sensor 202, an elastic assembly and a measuring probe 205 which are sequentially arranged in a shell 201 from top to bottom; the upper end of the elastic component is in contact with the pressure sensor 202, and the lower end of the elastic component is connected with the measuring probe 205; the measurement probe 205 is in contact with the substrate 6 to be measured; a distance sensor 9 is arranged on the lower surface of the top seat 1; the lifting device 5, the pressure sensor 202 and the distance sensor 9 are all electrically connected with the control system 4.
The substrate warp measuring device comprises a top seat 1, a measuring assembly 2, a lifting device 5 and a control unit, wherein the top seat 1 is used for installing the measuring assembly 2 and is driven to move up and down by the lifting device 5; the pressure sensor 202 is used for detecting deformation of the measuring probe 205 after contacting the substrate 6 to be measured; the measurement probe 205 is used for contacting with the substrate 6 to be measured and causing the substrate 6 to be measured to deform by the operation of the lifting device 5; the substrate 6 to be measured may be a glass substrate, a thin steel plate substrate, a flexible organic layer substrate, or the like; the carrying platform 3 is used for placing the substrate 6 to be measured, and the carrying platform 3 is required to ensure that the surface flatness, roughness, levelness, electrostatic protection and the like meet the measurement requirements; the distance sensor 9 is used for detecting the descending amount of the measuring assembly 2 and feeding back the position information in real time. The lifting device 5 is controlled by the control system 4 to drive the top seat 1 to move for position adjustment, and detection values of the pressure sensor 202 and the distance sensor 9 are received, so that the warping degree of the substrate is obtained through calculation. The control system 4 is preferably an industrial personal computer, and the industrial personal computer adopts RS485 to directly drive a servo controller and acquire position data of the distance sensor 9; the industrial personal computer carries a PCI ADC board card to collect analog signals of the pressure sensor 202; and the industrial personal computer is programmed to finish the measurement of the warpage of the substrate. Preferably, the top seat 1 and the carrying platform 3 are made of marble materials, so that rigidity and vibration resistance are ensured, and detection precision of the device is improved. The measurement probe 205 is preferably made of an organic material with extremely high rigidity, so that the contact area between the measurement probe and the substrate 6 to be measured is ensured to be large, and the damage to the substrate 6 to be measured in the measurement process is reduced. The pressure sensor 202 is preferably a weighing sensor, the measuring range is adjustable, and the output is 4-20 mA or 0-10V. The invention utilizes the pressure sensor 202 and the distance sensor 9 to form a measuring closed loop, accurately obtains the deformation process of the measured substrate 6, calculates the deformation pressure mutation point indirect measurement warping amount of the measured substrate 6, has high measurement precision and strong environment adaptation capability; and the pressure of the deformation of the measured substrate 6 is only related to the relative position of the distance sensor 9, and is not related to the absolute position of the measuring system, the requirement of the mounting accuracy of the measuring system can be reduced.
As shown in fig. 1-2, the present embodiment is developed on the basis of the above embodiment, and in particular, the present embodiment provides a substrate warp measuring device, in which the substrate 6 to be measured is mounted on the stage 3 by a fixing device 7; the fixing device 7 comprises a fixing strip and an adsorption body; the adsorbing body is arranged on the lower surface of the fixing strip and acts on the upper surface of the carrying platform 3. Preferably, the adsorbing body is a sucking disc or a magnetic block, can act on the carrier 3 to be fixed, and is convenient to adjust the position, when in use, one side of the substrate 6 to be measured is abutted with the edge of the carrier 3, the other side is abutted through the fixing strip, the substrate 6 to be measured is fixed between the fixing strip and the carrier 3, the substrate 6 to be measured is prevented from moving during measurement, and the fixing device 7 is fixed with the carrier 3 in an adsorption mode to facilitate the movement of the position according to the size of the substrate 6 to be measured.
As a preferred embodiment, the lifting device 5 includes a lifting module 501 and a horizontal movement module 502; two stand columns 8 are arranged on the carrying platform 3; the horizontal movement module 502 is installed between the two upright posts 8 and is positioned at the upper part of the upright posts 8; the lifting module 501 is mounted on the horizontal movement module 502 and moves left and right on the horizontal movement module 502; the top seat 1 is mounted on the lifting module 501 and moves up and down on the lifting module 501; the lifting module 501 and the horizontal movement module 502 are electrically connected with the control system 4. The lifting module 501 and the horizontal movement module 502 are controlled by the control system 4 to adjust the position of the top seat 1, so that the position of the measuring assembly 2 is adjusted, the measuring assembly 2 corresponds to the measuring point of the measured substrate 6, and further the measurement is realized. Lifting module 501 and horizontal migration module 502 are preferably lead screw slider track, through motor drive, drive the slider through the lead screw and remove on the track to realize vertical or horizontal direction's removal, this part of structure technical staff can consult prior art and set up according to the actual operating mode, and this application is not repeated.
As a preferred embodiment, the elastic component comprises a slider 203 and a spring 204; the upper part of the slider 203 is in contact with the pressure sensor 202; the lower part of the sliding block 203 is connected with one end of the spring 204; the other end of the spring 204 is connected to the upper part of the measurement probe 205. It should be noted that, the pressure value of the pressure sensor 202 is zero before the measurement probe 205 is not in contact with the substrate 6 to be measured, and the value fed back by the distance sensor 9 is the distance between the probe and the substrate 6 to be measured. When the measuring probe 205 contacts with the upper surface of the substrate 6 to be measured, pressure is generated, the measuring probe 205 acts on the pressure sensor 202 through the spring 204 and the slider 203, and the pressure sensor 202 detects the pressure value at this time; while the distance sensor 9 collects current position data.
As a preferred embodiment, the carrying platform 3 is provided with switch keys and a control panel; the operation of each structure can be controlled by the control panel, so that the measurement is realized.
As shown in fig. 1 to 5, the present embodiment is developed on the basis of the above embodiment, and specifically, the present embodiment provides a measurement method of a substrate warp measurement device, including the following steps:
s01: mounting the substrate 6 to be measured, and enabling the measuring probes 205 to correspond to points to be measured of the substrate 6 to be measured; as a preferred embodiment, as shown in fig. 3, the step S01 further includes dividing the effective area and the ineffective area of the measured substrate 6; the inactive area of the measured substrate 6 is used as a point to be measured of the measured substrate 6. The effective area and the ineffective area of the measured substrate 6 are divided according to the measured substrate 6, one end of the measured substrate 6 is taken as a division starting point, the bulge is taken as an ineffective area, the effective area is gently taken as an effective area, and when the surface of the substrate is fluctuated from one end to the other end, the effective area is converted into an area corresponding to an adjacent area; the different structural designs of the effective area and the ineffective area lead to different stress between areas, and the to-be-measured point is the ineffective area of the measured substrate 6, so that the damage to the measured substrate 6 in the measuring process is reduced.
S02: the lifting device 5 is started to drive the footstock 1 to move downwards until the measuring probe 205 contacts with the to-be-measured point of the substrate 6 to be measured; the pressure sensor 202 detects the pressure value to generate a primary mutation point, and the distance sensor 9 collects the current value as S1; the measuring probe 205 is not contacted with the measured substrate 6, the pressure sensor 202 has no pressure value, and the value fed back by the distance sensor 9 is the gap between the probe and the measured substrate 6; the measuring probe 205 is contacted with the measured substrate 6 to generate a pressure mutation, and the distance value at the moment is collected; the pressure sensor 202 detects the pressure abrupt change transmission signal to the control system 4, and the control system 4 controls the distance sensor 9 to detect the position data at this time as S1.
S03: the top seat 1 continues to move downwards until the lower surface of the substrate 6 to be measured is contacted with the upper surface of the carrier 3; the pressure sensor 202 detects a pressure value to generate a secondary mutation point, and the distance sensor 9 acquires the current value as S2; the pressure sensor 202 detects the secondary pressure abrupt change to transmit a signal to the control system 4, and the control system 4 controls the distance sensor 9 to detect the position data at this time as S2; it should be noted that, according to the value of the abrupt change of the secondary pressure detected by the pressure sensor 202, the point to be measured of the substrate 6 to be measured contacts the carrier 3 under the action of the measurement probe 205, and the control system 4 controls the distance sensor 9 to collect data and controls the lifting device 5 to stop running, so as to prevent the substrate 6 to be measured from being damaged by pressure.
S04: closing the lifting device 5; the amount of warpage is calculated, warpage = S2-S1.
As a preferred embodiment, the elastic modulus of the spring 204 in the elastic component is much larger than that of the substrate 6 to be measured, so that deformation of the spring 204 is avoided to affect the measurement accuracy.
As a preferred embodiment, the primary mutation point and the secondary mutation point of the detected pressure value of the pressure sensor 202 are calculated by differential approximation derivative of discrete data, and then obtained by filtering. The basic idea is to approximate the primary mutation point when the measuring probe 205 contacts with the point to be measured of the substrate 6 to be measured by the differential calculation of discrete data, and approximate the secondary mutation point when the lower surface of the substrate 6 to be measured contacts with the upper surface of the carrier 3 by the differential approximate derivation calculation. The pressure value is filtered to prevent data fluctuation and noise from interfering differential calculation, the filtering method is preferably time domain smoothing filtering, and the filter is preferably a third-order filter or a fifth-order filter.
As a preferred embodiment, in the measuring method, for the purpose of multipoint measurement, a single measuring module 2 can be used for measuring a plurality of times in succession or a plurality of measuring modules 2 can be used for measuring at one time.
The pressure-displacement curve of the measuring process of the device of the embodiment is shown in fig. 4, and includes stages D1, D2 and D3, wherein stage D1 is a stage where the pressure sensor 202 has no pressure value; stage D2 is the strain pressure of the substrate 6 to be measured; stage D3 is the deformation pressure of spring 204; s1 is primary mutation point position data when the measuring probe 205 contacts with the upper surface of the substrate 6 to be measured; s2, secondary mutation point position data are obtained when the lower surface of a to-be-measured point of the substrate 6 to be measured is contacted with the upper surface of the carrier 3; warpage = S2-S1.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (9)
1. Substrate warpage measuring device, its characterized in that: comprises a top seat (1), a measuring assembly (2), a carrying platform (3) and a control system (4); the top seat (1) is arranged above the carrying platform (3) through a lifting device (5), and the measuring assembly (2) is arranged on the top seat (1); the carrying platform (3) is used for placing a substrate (6) to be measured; the measuring assembly (2) comprises a pressure sensor (202), an elastic assembly and a measuring probe (205) which are sequentially arranged in the shell (201) from top to bottom; the upper end of the elastic component is contacted with the pressure sensor (202), and the lower end of the elastic component is connected with the measuring probe (205); the measurement probe (205) is in contact with the substrate (6) to be measured; a distance sensor (9) is arranged on the lower surface of the top seat (1); the lifting device (5), the pressure sensor (202) and the distance sensor (9) are electrically connected with the control system (4).
2. The substrate warp measurement device according to claim 1, wherein: the substrate (6) to be measured is arranged on the carrying platform (3) through a fixing device (7); the fixing device (7) comprises a fixing strip and an adsorption body; the adsorbing body is arranged on the lower surface of the fixing strip and acts on the upper surface of the carrying platform (3).
3. The substrate warp measurement device according to claim 1, wherein: the lifting device (5) comprises a lifting module (501) and a horizontal movement module (502); two stand columns (8) are arranged on the carrying platform (3); the horizontal movement module (502) is arranged between the two upright posts (8) and is positioned at the upper part of the upright posts (8); the lifting module (501) is mounted on the horizontal movement module (502) and moves left and right on the horizontal movement module (502); the top seat (1) is arranged on the lifting module (501) and moves up and down on the lifting module (501); the lifting module (501) and the horizontal movement module (502) are electrically connected with the control system (4).
4. The substrate warp measurement device according to claim 1, wherein: the elastic component comprises a sliding block (203) and a spring (204); an upper portion of the slider (203) is in contact with the pressure sensor (202); the lower part of the sliding block (203) is connected with one end of the spring (204); the other end of the spring (204) is connected to the upper part of the measuring probe (205).
5. The substrate warp measurement device according to claim 1, wherein: the carrying platform (3) is provided with switch keys and a control panel.
6. The measurement method of the substrate warp measurement device according to any one of claims 1 to 5, characterized in that: the method comprises the following steps:
s01: mounting the substrate (6) to be measured, and enabling the measuring probes (205) to correspond to points to be measured of the substrate (6) to be measured;
s02: the lifting device (5) is started to drive the footstock (1) to move downwards to enable the measuring probe (205) to be in contact with the point to be measured of the substrate (6) to be measured; the pressure sensor (202) detects a pressure value to generate a primary mutation point, and the distance sensor (9) acquires the current value as S1;
s03: the top seat (1) continuously moves downwards until the lower surface of the point to be measured of the substrate (6) to be measured is contacted with the upper surface of the carrying platform (3); the pressure sensor (202) detects a pressure value to generate a secondary mutation point, and the distance sensor (9) acquires the current value as S2;
s04: closing the lifting device (5); the amount of warpage is calculated, warpage = S2-S1.
7. The measurement method of the substrate warp measurement device according to claim 6, wherein: the elastic modulus of the spring (204) in the elastic component is far greater than the elastic modulus of the measured substrate (6).
8. The measurement method of the substrate warp measurement device according to claim 6, wherein: the step S01 is preceded by dividing an effective area and an ineffective area of the substrate (6) to be measured; and the invalid area of the substrate (6) to be measured is used as a point to be measured of the substrate (6) to be measured.
9. The measurement method of the substrate warp measurement device according to claim 6, wherein: the primary abrupt change point and the secondary abrupt change point of the detected pressure value of the pressure sensor (202) are calculated through differential approximate derivation of discrete data, and then are obtained through filtering processing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311491279.3A CN117238812B (en) | 2023-11-10 | 2023-11-10 | Substrate warp measuring device and measuring method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311491279.3A CN117238812B (en) | 2023-11-10 | 2023-11-10 | Substrate warp measuring device and measuring method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117238812A CN117238812A (en) | 2023-12-15 |
| CN117238812B true CN117238812B (en) | 2024-04-05 |
Family
ID=89098532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311491279.3A Active CN117238812B (en) | 2023-11-10 | 2023-11-10 | Substrate warp measuring device and measuring method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117238812B (en) |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03238342A (en) * | 1990-02-16 | 1991-10-24 | Nippon Telegr & Teleph Corp <Ntt> | Apparatus for measuring mechanical characteristic of surface |
| CN1677052A (en) * | 2004-03-31 | 2005-10-05 | 日东电工株式会社 | Surface shape measuring apparatus and surface shape measuring method |
| JP2006135087A (en) * | 2004-11-05 | 2006-05-25 | Canon Inc | Aligner and device manufacturing method |
| CN103673971A (en) * | 2013-11-29 | 2014-03-26 | 京东方科技集团股份有限公司 | Backlight source flatness detecting jig and backlight source flatness detecting method |
| CN105806301A (en) * | 2014-12-30 | 2016-07-27 | 宁波江丰电子材料股份有限公司 | Surface warpage measurement device and method |
| CN107431030A (en) * | 2015-04-06 | 2017-12-01 | 科磊股份有限公司 | For determining the method and system of plane internal deformation in the substrate |
| CN207351422U (en) * | 2017-08-24 | 2018-05-11 | 苏州阿特斯阳光电力科技有限公司 | A kind of height measuring device |
| CA3081821A1 (en) * | 2017-11-24 | 2019-05-31 | Primetals Technologies Japan, Ltd. | Shape measurement apparatus, warpage correction apparatus, and continuous plating facility for metal strip, and warpage correction method for metal strip |
| CN215967785U (en) * | 2021-09-23 | 2022-03-08 | 商丘金振源电子科技有限公司 | Flatness detection equipment |
| CN114467007A (en) * | 2019-10-11 | 2022-05-10 | 信越半导体株式会社 | Method for measuring wafer shape |
| CN115646843A (en) * | 2022-11-02 | 2023-01-31 | 河南晋成陶瓷有限公司 | Thickness detection device for ceramic tile |
| CN116137240A (en) * | 2021-11-17 | 2023-05-19 | Tes股份有限公司 | Substrate processing apparatus |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102420524B1 (en) * | 2015-03-30 | 2022-07-14 | 삼성디스플레이 주식회사 | Device for measuring flatness of plate |
-
2023
- 2023-11-10 CN CN202311491279.3A patent/CN117238812B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03238342A (en) * | 1990-02-16 | 1991-10-24 | Nippon Telegr & Teleph Corp <Ntt> | Apparatus for measuring mechanical characteristic of surface |
| CN1677052A (en) * | 2004-03-31 | 2005-10-05 | 日东电工株式会社 | Surface shape measuring apparatus and surface shape measuring method |
| JP2006135087A (en) * | 2004-11-05 | 2006-05-25 | Canon Inc | Aligner and device manufacturing method |
| CN103673971A (en) * | 2013-11-29 | 2014-03-26 | 京东方科技集团股份有限公司 | Backlight source flatness detecting jig and backlight source flatness detecting method |
| CN105806301A (en) * | 2014-12-30 | 2016-07-27 | 宁波江丰电子材料股份有限公司 | Surface warpage measurement device and method |
| CN107431030A (en) * | 2015-04-06 | 2017-12-01 | 科磊股份有限公司 | For determining the method and system of plane internal deformation in the substrate |
| CN207351422U (en) * | 2017-08-24 | 2018-05-11 | 苏州阿特斯阳光电力科技有限公司 | A kind of height measuring device |
| CA3081821A1 (en) * | 2017-11-24 | 2019-05-31 | Primetals Technologies Japan, Ltd. | Shape measurement apparatus, warpage correction apparatus, and continuous plating facility for metal strip, and warpage correction method for metal strip |
| CN114467007A (en) * | 2019-10-11 | 2022-05-10 | 信越半导体株式会社 | Method for measuring wafer shape |
| CN215967785U (en) * | 2021-09-23 | 2022-03-08 | 商丘金振源电子科技有限公司 | Flatness detection equipment |
| CN116137240A (en) * | 2021-11-17 | 2023-05-19 | Tes股份有限公司 | Substrate processing apparatus |
| CN115646843A (en) * | 2022-11-02 | 2023-01-31 | 河南晋成陶瓷有限公司 | Thickness detection device for ceramic tile |
Non-Patent Citations (2)
| Title |
|---|
| PCB翘曲的测量与预测;Bill Foran, Teresa Gentry, 丁志廉;印制电路信息(03);45-48 * |
| 用电测法测定球罐角变形及错边处附加弯曲应力的研究;月兰;大庆石油学院学报;19(01);128-131 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117238812A (en) | 2023-12-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1891422B (en) | Apparatus for scribing a substrate in use for a flat panel display | |
| CN201166564Y (en) | Non-contact test system for solar wafer | |
| CN207636025U (en) | A kind of automatic high speed glass monitor station | |
| CN108731604B (en) | Radial gas film thickness and rigidity detection system of gas static pressure main shaft | |
| CN117238812B (en) | Substrate warp measuring device and measuring method | |
| CN102689171A (en) | Automatic accurate adjustment system for instrument movement clearance | |
| CN108760025B (en) | Vibration detection device and method for multiple flexible boards | |
| CN116974152A (en) | Material conveying device with multiple degrees of freedom leveling and non-contact exposure equipment | |
| CN102680743B (en) | Template fast approximation and in-situ detection device and method in micro-nano instruments and equipment | |
| CN102176139B (en) | Multi-shaft synchronous operation control system | |
| CN209706751U (en) | A kind of intelligence ceramic stone board size deformation comprehensive tester | |
| CN206627076U (en) | A kind of glass contours degree automatic detection device | |
| CN210375035U (en) | Flatness detection device | |
| CN211527262U (en) | Curved surface screen cell-phone glass's arc size detection device | |
| JP2003243286A (en) | Substrate processing apparatus | |
| CN112003501B (en) | Output compensation method and device for motor sinusoidal error in interference magnetic field | |
| CN108007626B (en) | A kind of localized contact formula membrane tension measuring device and method | |
| CN2579539Y (en) | Contact band steel wave shape detector | |
| CN219028858U (en) | Automatic thick film circuit printing machine dolly printing platform of detection net piece interval | |
| CN208860468U (en) | Flexible board bending vibration detection control apparatus | |
| CN207007136U (en) | A kind of sheet metal part thickness test equipment | |
| CN202668042U (en) | Automatic precision adjustment device for clearance of instrument movement | |
| CN215572818U (en) | Segment difference detection device | |
| CN220575779U (en) | Angle-adjustable jig frame for steel plate assembly | |
| CN101118795B (en) | Last one substrates sensing device used for substrates decomposing equipment and regulation means thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |