JPH0321826Y2 - - Google Patents
Info
- Publication number
- JPH0321826Y2 JPH0321826Y2 JP1986116326U JP11632686U JPH0321826Y2 JP H0321826 Y2 JPH0321826 Y2 JP H0321826Y2 JP 1986116326 U JP1986116326 U JP 1986116326U JP 11632686 U JP11632686 U JP 11632686U JP H0321826 Y2 JPH0321826 Y2 JP H0321826Y2
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- torch
- laser processing
- probe
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000523 sample Substances 0.000 description 20
- 238000003754 machining Methods 0.000 description 13
- 238000001514 detection method Methods 0.000 description 11
- 238000005259 measurement Methods 0.000 description 7
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
Description
【考案の詳細な説明】
(a) 産業上の利用分野
本考案は、ワークの加工基準点を、正確に検出
することが出来るレーザ加工機に関する。[Detailed Description of the Invention] (a) Industrial Application Field The present invention relates to a laser processing machine that can accurately detect the processing reference point of a workpiece.
(b) 従来の技術
通常、レーザ加工機において、テーブル上のワ
ークをトーチにより加工する場合には、ワークを
加工する上での基準となる加工基準点を検出する
必要がある。このため、作業者は、テーブル及び
トーチを適宜移動して、レーザ光線が射出される
トーチの先端を、加工基準点に当て、その時のト
ーチの先端の座標値から、該加工基準点の座標値
を求めていた。(b) Prior Art Normally, in a laser processing machine, when processing a workpiece on a table with a torch, it is necessary to detect a processing reference point that serves as a reference for processing the workpiece. For this reason, the operator moves the table and the torch appropriately, places the tip of the torch from which the laser beam is emitted on the processing reference point, and calculates the coordinate value of the processing reference point from the coordinate value of the torch tip at that time. was looking for.
(c) 考案が解決しようとする問題点
しかし、これではワークの加工基準点の座標値
を正確に検出することが出来ず、該加工基準点に
基づいて行なわれる加工の精度も低下してしまう
不都合があつた。(c) Problems that the invention aims to solve However, with this method, it is not possible to accurately detect the coordinate values of the machining reference point of the workpiece, and the accuracy of machining performed based on the machining reference point also decreases. There was an inconvenience.
本考案は、上記の欠点を解消すべく、ワークの
加工基準点の座標値を正確に検出して、該ワーク
の加工精度を向上することが出来るレーザ加工機
を提供することを目的とする。 SUMMARY OF THE INVENTION In order to eliminate the above-mentioned drawbacks, it is an object of the present invention to provide a laser processing machine that can accurately detect the coordinate values of a processing reference point of a workpiece and improve the processing accuracy of the workpiece.
(d) 問題点を解決するための手段
即ち、本考案は、レーザ加工ヘツド６を有し、
前記レーザ加工ヘツド６に、レーザ光線を上下方
向に射出しうるトーチ９を装着したレーザ加工機
１において、前記レーザ加工ヘツド６に、前記ト
ーチとは独立した形で支持手段１３を、上下方向
に移動自在かつ回転自在に設け、前記支持手段に
該支持手段を前記トーチとは独立した形で上下方
向に移動駆動する移動駆動手段１９を接続し、前
記支持手段の先端部に非接触型の測距手段２０を
水平方向の距離を測定し得る形で、水平面内で回
転駆動自在に設けて構成される。(d) Means for solving the problem That is, the present invention has a laser processing head 6,
In the laser processing machine 1, the laser processing head 6 is equipped with a torch 9 capable of emitting a laser beam in the vertical direction. A moving drive means 19 is connected to the support means to move the support means in the vertical direction independently of the torch, and a non-contact measuring device is connected to the tip of the support means. The distance means 20 is provided in a form capable of measuring distance in the horizontal direction and is rotatably driven within a horizontal plane.
なお、括弧内の番号は、図面における対応する
要素を示す、便宜的なものであり、従つて、本記
述は図面上の記載に限定拘束されるものではな
い。以下の「(e)．作用」の欄についても同様であ
る。 Note that the numbers in parentheses are for convenience and indicate corresponding elements in the drawings, and therefore, this description is not limited to the descriptions in the drawings. The same applies to the column "(e). Effect" below.
(e) 作用
上記した構成により、本考案は、測距手段２０
を移動駆動手段１９によりトーチ９とは独立した
形で上下方向に移動駆動するとともに、水平面内
で回転させ、ワーク２１の加工基準面２１ｃ，２
１ｄ等を検出するように作用する。(e) Effect With the above-described configuration, the present invention provides distance measuring means 20.
is moved vertically by the moving drive means 19 independently of the torch 9, and is also rotated in a horizontal plane, so that the machining reference surfaces 21c, 2 of the workpiece 21 are
1d, etc.
(f) 実施例
以下、本考案の実施例を図面に基づき説明す
る。(f) Embodiments Hereinafter, embodiments of the present invention will be described based on the drawings.
第１図は、本考案によるレーザ加工機の一実施
例を示す斜視図、
第２図は、本考案によるレーザ加工機のワーク
検出器により、ワークの加工基準点を検出する場
合の様子を示す斜視図である。 Fig. 1 is a perspective view showing an embodiment of the laser processing machine according to the invention, and Fig. 2 shows how the processing reference point of a workpiece is detected by the workpiece detector of the laser processing machine according to the invention. FIG.
レーザ加工機１は、第１図に示すように、機体
２を有しており、機体２は水平部２ａ及び垂直部
２ｂにより構成されている。水平部２ａ上には、
テーブル３が、図中水平方向である矢印Ａ，Ｂ方
向に移動駆動自在に支持されており、また垂直部
２ｂには、箱状に形成されたコラム５が、テーブ
ル３上方に突出する形で設けられている。コラム
５には、２本のガイドレール５ａ，５ａが、矢印
Ａ，Ｂ方向とは直角な方向である矢印Ｃ，Ｄ方向
に並列して設けられており、ガイドレール５ａ，
５ａには、後述するレーザ加工ヘツド６を構成す
るサドル６ａが、矢印Ｃ，Ｄ方向に摺動自在に支
持されている。 As shown in FIG. 1, the laser processing machine 1 has a body 2, and the body 2 includes a horizontal portion 2a and a vertical portion 2b. On the horizontal part 2a,
A table 3 is supported so as to be movable in the directions of arrows A and B, which are horizontal directions in the figure, and a box-shaped column 5 is provided on the vertical portion 2b in a manner that projects above the table 3. It is provided. Two guide rails 5a, 5a are provided on the column 5 in parallel in the directions of arrows C and D, which are directions perpendicular to the directions of arrows A and B.
5a, a saddle 6a constituting a laser processing head 6, which will be described later, is supported so as to be slidable in the directions of arrows C and D.
サドル６ａには、外周面にボールネジ７ａが螺
設された駆動軸７が、該サドル６ａを矢印Ｃ，Ｄ
方向に貫通する形で螺合されており、駆動軸７
は、軸受２ｃ等を介して垂直部２ｂに、図中矢印
Ｇ，Ｈ方向に回転駆動自在な形で支持されてい
る。また、サドル６ａには、２本のガイドレール
６ｂ，６ｂが、図中上下方向である矢印Ｅ，Ｆ方
向に並列して設けられており、ガイドレール６
ｂ，６ｂには、断面が略Ｔ字形に形成されたホル
ダ６ｃが、矢印Ｅ，Ｆ方向に摺動自在に支持され
ている。ホルダ６ｃには、その下端よりレーザ光
線が図中上下方向、即ちＺ軸方向に射出されるト
ーチ９が装着されている。 A drive shaft 7 having a ball screw 7a screwed on the outer circumferential surface of the saddle 6a moves the saddle 6a along arrows C and D.
The drive shaft 7
is supported by the vertical portion 2b via a bearing 2c or the like so as to be rotatably driven in the directions of arrows G and H in the figure. Further, two guide rails 6b, 6b are provided on the saddle 6a in parallel in the directions of arrows E and F, which are the up and down directions in the figure.
A holder 6c having a substantially T-shaped cross section is supported on b and 6b so as to be slidable in the directions of arrows E and F. A torch 9 is attached to the holder 6c and emits a laser beam from its lower end in the vertical direction in the figure, that is, in the Z-axis direction.
更に、ホルダ６ｃには、ワーク検出器１０が装
着されており、ワーク検出器１０は、取付け部材
１１を有している。取付け部材１１には、支持部
材１２が固設されており、支持部材１２は、本体
１２ａを有している。本体１２ａにはギア１２ｂ
が、矢印Ｉ，Ｊ方向に回転自在な形で設けられて
おり、ギア１２ｂには支持シヤフト１３が、トー
チ９とは独立した形で矢印Ｅ，Ｆ方向に摺動のみ
自在な形で嵌入係合されている。なお、ギア１２
ｂには、取付け部材１１に装着されたアクチユエ
ータ１５に回転駆動自在に装着されたギア１５ａ
が噛合している。 Further, a workpiece detector 10 is attached to the holder 6c, and the workpiece detector 10 has a mounting member 11. A support member 12 is fixed to the attachment member 11, and the support member 12 has a main body 12a. The main body 12a has a gear 12b.
is provided in a form that is rotatable in the directions of arrows I and J, and a support shaft 13 is fitted into the gear 12b in a form that is slidable only in the directions of arrows E and F, independent of the torch 9. are combined. In addition, gear 12
In b, a gear 15a is attached to the actuator 15 attached to the mounting member 11 so as to be rotatably driven.
are meshing.
また、支持シヤフト１３の第１図下端には、プ
ローブ２０が設けられており、プローブ２０は、
検出面２０ａを有している。なお、プローブ２０
は、その検出面２０ａを介して、レーザ光線等の
測定光線２３を被測定物に向けて投光し、また該
被測定物から反射されてきた測定光線２３を受光
することにより、該プローブ２０と、被測定物と
の距離を測定することが出来る非接触型のプロー
ブである。 Further, a probe 20 is provided at the lower end of the support shaft 13 in FIG.
It has a detection surface 20a. In addition, the probe 20
The probe 20 emits a measurement light beam 23 such as a laser beam toward the object to be measured via its detection surface 20a, and receives the measurement light beam 23 reflected from the object to be measured. This is a non-contact type probe that can measure the distance to the object being measured.
更に、支持シヤフト１３の上端には連結板１６
が、ピン１７を介して枢着されており、連結板１
６の図中左端部には、取付け部材１１に固着され
た駆動装置１９が矢印Ｅ，Ｆ方向に突出後退自在
な形で支持されたロツド１９ａを介して接続され
ている。 Furthermore, a connecting plate 16 is provided at the upper end of the support shaft 13.
is pivotally connected via a pin 17, and the connecting plate 1
A drive device 19 fixed to the mounting member 11 is connected to the left end portion of 6 in the figure via a rod 19a supported so as to be able to protrude and retract in the directions of arrows E and F.
なお、レーザ加工機１のテーブル３上には、第
２図に示すように、板金により形成された箱状の
ワーク２１が搭載されている。 Note that, as shown in FIG. 2, a box-shaped workpiece 21 made of sheet metal is mounted on the table 3 of the laser processing machine 1. As shown in FIG.
レーザ加工機１は、以上のような構成を有する
ので、ワーク２１を加工するには、まず該ワーク
２１を、第２図に示すように、その加工面２１ａ
を図中上部にする形で、テーブル３上に搭載す
る。ワーク２１がテーブル３上に搭載されたとこ
ろで、加工面２１ａの加工基準点２１ｂの座標値
を検出する（なお、第２図に示すように、Ｘ軸は
矢印Ａ，Ｂ方向に、Ｙ軸はＣ，Ｄ方向に、Ｚ軸は
Ｅ，Ｆ方向に沿つて設けられている）。 Since the laser processing machine 1 has the above-described configuration, in order to process the workpiece 21, first the workpiece 21 is placed on its processing surface 21a as shown in FIG.
It is mounted on the table 3 in such a way that it is at the top in the figure. When the workpiece 21 is mounted on the table 3, the coordinate values of the machining reference point 21b on the machining surface 21a are detected (as shown in Fig. 2, the X axis is in the direction of arrows A and B, and the Y axis is The Z axis is provided along the C and D directions, and the Z axis is provided along the E and F directions).
このため、テーブル３を、適宜矢印Ａ方向に移
動駆動し、更に駆動軸７を矢印Ｇ方向に回転する
ことにより、該駆動軸７と螺合しているレーザ加
工ヘツドのサドル６ａを、ガイドレール５ａに沿
つて矢印Ｄ方向に移動する。次にこの状態で、ワ
ーク検出器１０の駆動装置１９を駆動して、ロツ
ド１９ａを矢印Ｆ方向に後退させる。 Therefore, by appropriately moving the table 3 in the direction of arrow A and further rotating the drive shaft 7 in the direction of arrow G, the saddle 6a of the laser processing head screwed with the drive shaft 7 can be moved to the guide rail. 5a in the direction of arrow D. Next, in this state, the drive device 19 of the workpiece detector 10 is driven to move the rod 19a backward in the direction of arrow F.
すると、支持シヤフト１３は、連結板１６及び
ピン１７を介して矢印Ｆ方向に下降し、該支持シ
ヤフト１３の下端に設けられたプローブ２０も第
１図中実線で示す待機位置から、図中想像線で示
す位置まで下降する。この際、支持シヤフト１３
及びプローブ２０はトーチ９とは独立した形で矢
印Ｆ方向に移動駆動されるので、トーチ９が下方
のワーク２１と衝突してしまうようなことは無
い。こうして、プローブ２０が、第２図に示すよ
うに、ワーク２１の加工面２１ａの下方に位置す
る、垂直な加工基準面２１ｃの図中左方に位置決
めされたところで、ワーク検出器１０のアクチユ
エータ１５を駆動して、ギア１５ａを所定角度回
転させる。すると、支持シヤフト１３は、ギア１
２ｂを介して矢印Ｉ方向に回転して、プローブ２
０の検出面２０ａは、加工基準面２１ｃと対向す
る。 Then, the support shaft 13 descends in the direction of arrow F via the connecting plate 16 and pin 17, and the probe 20 provided at the lower end of the support shaft 13 also moves from the standby position shown by the solid line in FIG. Descend to the position indicated by the line. At this time, the support shaft 13
Since the probe 20 is moved and driven in the direction of the arrow F independently of the torch 9, there is no possibility that the torch 9 will collide with the workpiece 21 below. In this way, as shown in FIG. 2, when the probe 20 is positioned to the left of the vertical machining reference plane 21c located below the machining surface 21a of the workpiece 21, the actuator 15 of the workpiece detector 10 is driven to rotate the gear 15a by a predetermined angle. Then, the support shaft 13 is connected to the gear 1
2b in the direction of arrow I, and
The detection surface 20a of 0 faces the processing reference surface 21c.
該検出面２０ａが、加工基準面２１ｃと対向し
たところで、該検出面２０ａより測定光線２３
を、該加工基準面２１ｃに向けて水平方向に投光
して、プローブ２０、該加工基準面２１ｃ上の被
測定点２１ｅ間の水平距離を測定し、該測定値
と、この際のプローブ２０のＸ，Ｙ，Ｚ座標値よ
り、被測定点２１ｅのＸ，Ｙ，Ｚ座標値を求め
る。 When the detection surface 20a faces the processing reference surface 21c, the measurement light beam 23 is transmitted from the detection surface 20a.
is projected in the horizontal direction toward the processing reference surface 21c to measure the horizontal distance between the probe 20 and the measured point 21e on the processing reference surface 21c, and the measured value and the probe 20 at this time are The X, Y, Z coordinate values of the measured point 21e are determined from the X, Y, Z coordinate values of .
即ち、プローブ２０と被測定点２１ｅは１対１
に対応するものであり、プローブ２０の座標値
は、テーブル３、レーザ加工ヘツド６、ワーク検
出機１０及びプローブ２０の各移動量により求め
ることが出来る。このため、被測定点２１ｅの座
標値は、プローブ２０の座標値に対して、前記測
定値を適宜加減算することにより求めることが出
来る。 That is, the probe 20 and the measured point 21e are in a one-to-one relationship.
The coordinate values of the probe 20 can be determined from the respective movement amounts of the table 3, laser processing head 6, workpiece detector 10, and probe 20. Therefore, the coordinate value of the measured point 21e can be determined by appropriately adding or subtracting the measured value to the coordinate value of the probe 20.
被測定点２１ｅの座標値が求められたところ
で、レーザ加工ヘツド６を矢印Ｄ方向に適宜移動
して、プローブ２０の検出面２０ａを、Ｄ方向に
平行移動させる。検出面２０ａがＤ方向に平行移
動したところで、上述したように該検出面２０ａ
より、測定光線を、該加工基準面２１ｃに向けて
投光して、プローブ２０と該加工基準面２１ｃ上
の被測定点２１ｆまでの水平距離を測定し、これ
より被測定点２１ｆの座標値を求める。 Once the coordinate values of the point to be measured 21e have been determined, the laser processing head 6 is appropriately moved in the direction of arrow D, and the detection surface 20a of the probe 20 is moved in parallel in the D direction. When the detection surface 20a moves in parallel in the D direction, the detection surface 20a moves in parallel as described above.
Then, a measuring beam is projected toward the processing reference surface 21c to measure the horizontal distance between the probe 20 and the measurement point 21f on the processing reference surface 21c, and from this, the coordinate value of the measurement point 21f is determined. seek.
被測定点２１ｆの座標値が求められたところ
で、レーザ加工ヘツド６を更に矢印Ｄ方向に、テ
ーブル３を矢印Ａ方向に移動する。次に、その状
態で、ワーク検出器１０のアクチユエータ１５を
駆動して、ギア１５ａを回転させ、支持シヤフト
１３を、ギア１２ｂを介して矢印Ｊ方向に回転さ
せる。すると、今度は、プローブ２０の検出面２
０ａは、加工基準面２１ｄよりも任意距離離れて
対向する。 Once the coordinate values of the point to be measured 21f have been determined, the laser processing head 6 is further moved in the direction of arrow D and the table 3 is further moved in the direction of arrow A. Next, in this state, the actuator 15 of the workpiece detector 10 is driven to rotate the gear 15a, and the support shaft 13 is rotated in the direction of arrow J via the gear 12b. Then, this time, the detection surface 2 of the probe 20
0a faces the processing reference surface 21d at an arbitrary distance away.
検出面２０ａが、加工基準面２１ｄから任意距
離離れて対向したところで、検出面２０ａより測
定光線２３を加工基準面２１ｄに向けて水平方向
に投光して、該加工基準面２１ｄ上の被測定点２
１ｇの座標値を求める。被測定点２１ｇの座標値
が求められたところで、テーブル３を適宜矢印Ａ
方向に移動する。そして、その状態で測定光線２
３を、加工基準面２１ｄに向けて投光して、該加
工基準面２１ｄ上の被測定点２１ｈの座標値を求
める。 When the detection surface 20a faces the processing reference surface 21d at an arbitrary distance, the measurement light beam 23 is horizontally projected from the detection surface 20a toward the processing reference surface 21d to detect the object to be measured on the processing reference surface 21d. Point 2
Find the coordinate value of 1g. When the coordinate values of the measured point 21g have been determined, move the table 3 by arrow A as appropriate.
move in the direction. Then, in that state, the measuring beam 2
3 is projected toward the processing reference surface 21d, and the coordinate values of the measured point 21h on the processing reference surface 21d are determined.
こうして、求められた各被測定点２１ｅ，２１
ｆ，２１ｇ，２１ｈの座標値より、被測定点２１
ｅ，２１ｆを結ぶ直線と、２１ｇ，２１ｈを結ぶ
直線との交点２０ｉの座標値を求め、この交点２
０ｉの座標値と既知であるワーク２１の体高Ｈ１
の値より、加工面２１ａの加工基準点２１ｂの座
標値が求められる。 In this way, each of the measured points 21e, 21
From the coordinate values of f, 21g, and 21h, the measured point 21
Find the coordinates of the intersection 20i of the straight line connecting e and 21f and the straight line connecting 21g and 21h, and
The coordinate value of 0i and the known body height H1 of the workpiece 21
The coordinate value of the machining reference point 21b on the machining surface 21a is determined from the value of .
こうして、加工基準点２１ｂの座標値が検出さ
れたところで、ワーク検出器１０の駆動装置１９
を駆動して、ロツド１９ａを矢印Ｅ方向に突出さ
せる。すると、支持シヤフト１３は、連結板１６
及びピン１７を介して矢印Ｅ方向に上昇し、該支
持シヤフト１３の下端に設けられたプローブ２０
も待機位置に位置決めされる。こうして、プロー
ブ２０が待機位置に位置決めされたところで、加
工基準点２１ｂの座標値を基準として、テーブル
３を矢印Ａ，Ｂ方向に、レーザ加工ヘツド６を矢
印Ｃ，Ｄ方向に、移動すると共に、トーチ９の図
中下端からレーザ光線を加工面２１ａに向けて射
出して、加工面２１ａに対して所定の加工を行な
う。 In this way, when the coordinate values of the processing reference point 21b are detected, the drive device 19 of the workpiece detector 10
is driven to project the rod 19a in the direction of arrow E. Then, the support shaft 13 is connected to the connecting plate 16
and a probe 20 that rises in the direction of arrow E through the pin 17 and is provided at the lower end of the support shaft 13.
is also positioned at the standby position. When the probe 20 is thus positioned at the standby position, the table 3 is moved in the directions of arrows A and B, and the laser processing head 6 is moved in the directions of arrows C and D, with reference to the coordinate values of the processing reference point 21b. A laser beam is emitted from the lower end of the torch 9 toward the processing surface 21a to perform a predetermined processing on the processing surface 21a.
また、上述したワーク２１の加工基準点２１ｂ
の座標値を求める一連の動作を、NC制御により
自動的に行なわせることも当然可能である。 Moreover, the processing reference point 21b of the workpiece 21 mentioned above
Of course, it is also possible to automatically perform a series of operations to determine the coordinate values of by NC control.
（ｇ） 考案の効果
以上、説明したように本考案によれば、レーザ
加工ヘツド６を有し、前記レーザ加工ヘツド６
に、レーザ光線を上下方向に射出しうるトーチ９
を装着したレーザ加工機１において、前記レーザ
加工ヘツド６に、前記トーチとは独立した形で支
持シヤフト１３などの支持手段を、上下方向に移
動自在かつ回転自在に設け、前記支持手段に該支
持手段を前記トーチとは独立した形で上下方向に
移動駆動する駆動装置１９等の移動駆動手段を接
続し、前記支持手段の先端部に非接触型のプロー
ブ２０などの測距手段を水平方向の距離を測定し
得る形で、水平面内で回転駆動自在に設けて構成
したので、該側距手段により、ワーク２１等のワ
ークの加工基準点２１ｂの座標値を正確に検出す
ることが出来、ワークの加工精度の向上に寄与し
得る。(g) Effect of the invention As explained above, according to the invention, the laser processing head 6 is provided, and the laser processing head 6
, a torch 9 capable of emitting a laser beam in the vertical direction
In the laser processing machine 1 equipped with the laser processing head 6, a support means such as a support shaft 13 is provided in the laser processing head 6 in a manner that is movable and rotatable in the vertical direction and is independent of the torch, and the support means is provided with a A moving driving means such as a driving device 19 is connected to move the means in the vertical direction independently of the torch, and a distance measuring means such as a non-contact type probe 20 is connected to the tip of the supporting means in a horizontal direction. Since it is configured so that it can be rotated freely in a horizontal plane in such a manner that distances can be measured, the coordinate values of the machining reference point 21b of a workpiece such as the workpiece 21 can be accurately detected by the side distance means. This can contribute to improving machining accuracy.
更に、非接触型の測距手段を用いたので、板金
により形成された箱物ワーク等の剛性の低いワー
クについても、該ワークを変形させること無く、
加工基準点２１ｂの座標値を正確に検出すること
が出来る。 Furthermore, since we use a non-contact distance measuring means, we can measure workpieces with low rigidity, such as box workpieces made of sheet metal, without deforming them.
The coordinate values of the processing reference point 21b can be detected accurately.
更に、支持手段がトーチとは独立した形で上下
方向に移動自在に設けられているので、ワークの
測定に際して、支持手段を測距手段と共に降下さ
せたとしても、トーチが降下することは無く、ト
ーチとワークが干渉してトーチを損傷させてしま
う事態の発生を未然に防止できる。このことは、
ワークが箱形などの立体ワークの場合、測距手段
により、ワーク加工面よりも下方に位置するワー
ク垂直面の位置を測定する際に、測距手段をワー
クの垂直面と対向させる必要が有ることから、ト
ーチとワークの干渉を防止して適正な測定を行な
う上で極めて重要である。 Furthermore, since the support means is provided so as to be movable in the vertical direction independently of the torch, even if the support means is lowered together with the distance measuring means when measuring a workpiece, the torch will not be lowered. It is possible to prevent the occurrence of a situation where the torch and the workpiece interfere and damage the torch. This means that
If the workpiece is a box-shaped or other three-dimensional workpiece, when measuring the position of the vertical surface of the workpiece located below the workpiece processing surface using the distance measuring means, it is necessary to place the distance measuring means opposite to the vertical surface of the workpiece. Therefore, it is extremely important to prevent interference between the torch and the workpiece and to perform proper measurements.
また、支持手段の先端部に非接触型の測距手段
を水平方向の距離を測定し得る形で、水平面内で
回転駆動自在に設けたので、箱形などの立体形状
のワークの上面を加工する場合に、複数のワーク
垂直面の座標位置から加工基準点２１ｂを求める
動作を測距手段を回転させつつ容易に行なうこと
が出来、板金加工されたワークの上面加工などに
際して極めて便利である。 In addition, a non-contact distance measuring means is installed at the tip of the support means in a form that can measure the distance in the horizontal direction and can be rotated freely in the horizontal plane, allowing machining of the top surface of three-dimensional workpieces such as boxes. In this case, the processing reference point 21b can be easily determined from the coordinate positions of a plurality of workpiece vertical surfaces while rotating the distance measuring means, which is extremely convenient when processing the upper surface of a workpiece processed by sheet metal.
第１図は、本考案によるレーザ加工機の一実施
例を示す斜視図、第２図は、本考案によるレーザ
加工機のワーク検出器により、ワークの加工基準
点を検出する場合の様子を示す斜視図である。
１……レーザ加工機、６……レーザ加工ヘツ
ド、９……トーチ、１３……支持手段（支持シヤ
フト）、１９……移動駆動手段（駆動装置）、２０
……測距手段（プローブ）。
Fig. 1 is a perspective view showing an embodiment of the laser processing machine according to the invention, and Fig. 2 shows how the processing reference point of the workpiece is detected by the workpiece detector of the laser processing machine according to the invention. FIG. DESCRIPTION OF SYMBOLS 1... Laser processing machine, 6... Laser processing head, 9... Torch, 13... Support means (support shaft), 19... Movement drive means (drive device), 20
...Distance measuring means (probe).
Claims (1)
ドに、レーザ光線を上下方向に射出しうるトーチ
を装着したレーザ加工機において、 前記レーザ加工ヘツドに、前記トーチとは独立
した形で支持手段を、上下方向に移動自在かつ回
転自在に設け、 前記支持手段に該支持手段を前記トーチとは独
立した形で上下方向に移動駆動する移動駆動手段
を接続し、 前記支持手段の先端部に非接触型の測距手段を
水平方向の距離を測定し得る形で、水平面内で回
転駆動自在に設けて構成したレーザ加工機。[Scope of Claim for Utility Model Registration] A laser processing machine having a laser processing head and equipped with a torch that can emit a laser beam in the vertical direction, wherein the laser processing head is equipped with a torch that is independent of the torch. a supporting means is provided so as to be vertically movable and rotatable; a moving driving means for driving the supporting means to move vertically independently of the torch is connected to the supporting means; A laser beam processing machine that is constructed by installing a non-contact distance measuring means at the tip of the machine so that it can be rotated freely in a horizontal plane so as to be able to measure distances in the horizontal direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986116326U JPH0321826Y2 (en) | 1986-07-29 | 1986-07-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986116326U JPH0321826Y2 (en) | 1986-07-29 | 1986-07-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6325283U JPS6325283U (en) | 1988-02-19 |
| JPH0321826Y2 true JPH0321826Y2 (en) | 1991-05-13 |
Family
ID=31000811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986116326U Expired JPH0321826Y2 (en) | 1986-07-29 | 1986-07-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0321826Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8430707B2 (en) * | 2011-05-27 | 2013-04-30 | Sage Electrochromics, Inc. | Apparatus and method for repair of defects in an electronic energy control or display device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59150688A (en) * | 1983-02-10 | 1984-08-28 | Toshiba Corp | Control device for working height |
-
1986
- 1986-07-29 JP JP1986116326U patent/JPH0321826Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59150688A (en) * | 1983-02-10 | 1984-08-28 | Toshiba Corp | Control device for working height |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6325283U (en) | 1988-02-19 |
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