JPH0321096A - Soldering device - Google Patents
Soldering deviceInfo
- Publication number
- JPH0321096A JPH0321096A JP15473889A JP15473889A JPH0321096A JP H0321096 A JPH0321096 A JP H0321096A JP 15473889 A JP15473889 A JP 15473889A JP 15473889 A JP15473889 A JP 15473889A JP H0321096 A JPH0321096 A JP H0321096A
- Authority
- JP
- Japan
- Prior art keywords
- furnace
- soldering
- printed wiring
- conveyor
- conveyer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 39
- 238000011144 upstream manufacturing Methods 0.000 claims abstract description 10
- 229910000679 solder Inorganic materials 0.000 claims abstract description 4
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 abstract description 4
- 230000035939 shock Effects 0.000 abstract description 2
- 230000006866 deterioration Effects 0.000 abstract 1
- 230000032258 transport Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】 ［発明の目的］ （産業上の利用分野） 本発明は、プリント配線板のはんだ付装置に関する。[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a soldering device for printed wiring boards.
（従来の技術）
従来のプリント配線板（以下、基板という）のはんだ付
装置を示す第４図において、鉄板で囲まれたケース１内
には横にチェーンコンベア５が設けられ、図示しない電
動機と減速機で矢印５Ｉ］のように反時計方向に駆動さ
れ、ケース１の右端上部にはこのコンベア５に図示しな
い供給装置から図示しない基板を矢印５ａのように供給
される供給口が設けられ、ケースの左端上部には矢印５
ｂ方向に送られてきた基板を取出す取出口が設けられて
いる。(Prior Art) In FIG. 4, which shows a conventional soldering device for printed wiring boards (hereinafter referred to as "boards"), a chain conveyor 5 is provided horizontally in a case 1 surrounded by an iron plate, and a motor and a motor (not shown) are connected to each other. The conveyor 5 is driven counterclockwise as shown by an arrow 5I by a speed reducer, and a supply port is provided at the upper right end of the case 1 to supply substrates (not shown) from a supply device (not shown) to the conveyor 5 as shown by an arrow 5a. At the top left end of the case is an arrow 5.
An ejection port is provided to take out the substrate sent in the b direction.
又、コンベア５の上側には、右側から紫外線照射炉２，
予備加熱炉３Ａ，１段目の予備保温炉３Ｂと２段目の予
備保温炉３Ｃが順に設けられ、更にリフローはんだ付さ
れるリフロー炉４が最下流に設けられている。Further, above the conveyor 5, from the right side, an ultraviolet irradiation furnace 2,
A preheating furnace 3A, a first preheating furnace 3B, and a second preheating furnace 3C are provided in this order, and a reflow oven 4 for reflow soldering is provided at the most downstream position.
そして、予備加熱炉３Ａ，１段目の予備保温炉３Ｂ，２
段目の予備保温炉３Ｃとリフロー炉４の天井部にはファ
ン６が取付られていて、矢印５ａ方向から紫外線照射炉
２に搬入された基板は、塗布された仮止め用のＵＶイン
クが硬化された後、予備加熱炉３Ａで第５図に示すよう
に約１５０℃に加熱され、予備保温炉３Ｂ，３Ｃでその
温度をｔ２時間維持されて、リフロー炉４で急速に２３
０℃にｔ１時間加熱されてはんだ付される。Then, the preheating furnace 3A, the first stage preheating furnace 3B, 2
A fan 6 is attached to the ceiling of the preheating furnace 3C and the reflow furnace 4 in the stage, and the substrates carried into the ultraviolet ray irradiation furnace 2 from the direction of the arrow 5a are cured by the applied UV ink for temporary fixing. After that, it is heated to about 150°C in the preheating furnace 3A as shown in FIG.
It is heated to 0° C. for t1 hours and soldered.
（発明が解決しようとする課題）
ところがこのように構或されたはんだ付装置では、基板
を予備保温炉３Ｂ，３Ｃで所定の温度で所定の時間維持
しようとすると、リフロー炉４でのはんだ付に必要な温
度２００℃以上の経過時間が長くなって、電子部品の寿
命を落すおそれがあり、反対に、リフロー炉４での２０
０℃以上の経過時間を電子部品の寿命を損なわない範囲
に抑えると、はんだ付に必要な予熱時間が不足してくる
。(Problem to be Solved by the Invention) However, in the soldering apparatus constructed in this way, when trying to maintain the board at a predetermined temperature for a predetermined time in the preheating ovens 3B and 3C, the soldering in the reflow oven 4 is difficult. There is a risk that the elapsed time at a temperature of 200°C or higher, which is necessary for
If the elapsed time above 0° C. is kept within a range that does not impair the life of electronic components, the preheating time necessary for soldering becomes insufficient.
リフロー炉４の幅を狭くして通過時間を減らすことも考
えられるが、すると、リフロー炉４で急速に温度を上げ
なければならなくなって、ピーク値が２３０℃をはるか
に超えて電子部品の寿命を損なうおそれもある。又、保
温炉の数を増やしてコンベア５の速度を落とすと、はん
だ付装置の外形が大きくなる。It may be possible to reduce the passage time by narrowing the width of the reflow oven 4, but then the temperature in the reflow oven 4 would have to be raised rapidly, and the peak value would far exceed 230°C, which would shorten the lifespan of electronic components. There is also a risk of damaging the Furthermore, if the number of insulating furnaces is increased and the speed of the conveyor 5 is reduced, the external size of the soldering device will become larger.
そこで、本発明の目的は、外形を小形化でき、実装され
た電子部品を損うことなく、最適条件ではんだ付するこ
とのできるブリン１・配線板のはんだ付装置を得ること
である。SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to obtain a soldering device for a wiring board, which can reduce the external size and perform soldering under optimal conditions without damaging mounted electronic components.
［発明の構成］
（課題を解決するための手段と作用）
本発明は、プリント配線板を予熱炉からリフロー炉に送
って電子部品をはんだ付するプリント配線板のはんだ付
装置において、外部からはんだ付装置に送られてきたプ
リント配線板を予備炉を経てリフロー炉に搬送する上流
コンベアと、この上流コンベアからリフロー炉に送られ
てきたプリント配線板をはんだ付装置の下流端に搬送す
る下流コンベアを設けることで、予熱条件とはんだ付条
件を最適にして電子部品の寿命を損うことなく、はんだ
付の信頼性を上げたプリント配線板のはんだ付装置であ
る。[Structure of the Invention] (Means and Effects for Solving the Problems) The present invention provides a printed wiring board soldering device that sends a printed wiring board from a preheating furnace to a reflow furnace and solders electronic components thereon. An upstream conveyor that transports printed wiring boards sent to the soldering equipment to the reflow oven via a preliminary furnace, and a downstream conveyor that transports the printed wiring boards sent from the upstream conveyor to the reflow oven to the downstream end of the soldering equipment. This is a printed wiring board soldering device that optimizes preheating conditions and soldering conditions to improve soldering reliability without impairing the lifespan of electronic components.
（実施例）
以下、本発明のはんだ付装置の一実施例を図面を参照し
て説明する。但し、第４図と重複する部分は省く。(Embodiment) Hereinafter, an embodiment of the soldering apparatus of the present invention will be described with reference to the drawings. However, parts that overlap with Figure 4 are omitted.
第１図において、ケースエの内部に｛ま、右端から予倫
保温炉３Ｃの下流端の下部に入側コンベア１５Ａが設け
られ、リフロー炉４の上流端とケース■の左端の下側に
は、出側コンベア１５Ｂが設けられ、これらのコンベア
のスプロケットには、それぞれ図示しない駆動用の電動
機が接続されている。In FIG. 1, an inlet conveyor 15A is provided inside the case (from the right end to the lower part of the downstream end of the insulating furnace 3C), and below the upstream end of the reflow oven 4 and the left end of the case (2). Output conveyors 15B are provided, and driving electric motors (not shown) are connected to the sprockets of these conveyors, respectively.
このように構成されたはんだ付装置においては、最適温
度に設定された予備保温炉やリフロー炉４を通過する基
板の加熱時間は、、各コンベアの速度を変えることで最
適値に設定できるので、電子部品の温度ショックによる
劣化を防ぎ、最適条件ではんだ付することのできるはん
だ付装置となる。In the soldering apparatus configured in this way, the heating time of the board passing through the preheating oven and reflow oven 4, which are set at the optimum temperature, can be set to the optimum value by changing the speed of each conveyor. This is a soldering device that prevents electronic components from deteriorating due to temperature shock and enables soldering under optimal conditions.
すなわち、第２図は加熱工程を示す図で、コンベア１５
Ｂの速度だけをあげて、２００℃以上の経過時間ｔｌ１
を第５図の従来のはんだ付装置のリフロー炉４内の２０
０℃以上の経過時間をｔ，より減らした例を示す。That is, FIG. 2 is a diagram showing the heating process, in which the conveyor 15
Elapsed time tl1 of 200℃ or more by increasing only the speed of B
20 in the reflow oven 4 of the conventional soldering device shown in FIG.
An example is shown in which the elapsed time above 0°C is further reduced by t.
第３図は、本発明のはんだ付装置の他の実施例を示す。FIG. 3 shows another embodiment of the soldering device of the present invention.
同図においては、ケース１１内の右端の紫外線照５
射炉２の下流側には、予備加熱室３Ａと予備保温炉３Ｂ
が順に各一組設けられ、最下流には従来どおりのリフロ
ー炉４が設けられて、紫外線照射炉２，予備加熱炉３Ａ
と予備保温炉３Ｂの下側には短いコンベア１５Ｃが設け
られている。In the figure, on the downstream side of the ultraviolet ray irradiation furnace 2 at the right end in the case 11, there is a preheating chamber 3A and a preheating furnace 3B.
are installed in each set in order, and a conventional reflow oven 4 is provided at the most downstream, an ultraviolet irradiation oven 2, a preheating oven 3A, and a conventional reflow oven 4.
A short conveyor 15C is provided below the preheating furnace 3B.
この場合には、第１図のコンベア１５Ａと比べてコンベ
ア＋５０の速度を落とすことで対応できるので、より小
形のはんだ付装置となる利点がある。In this case, it can be handled by reducing the speed of the conveyor +50 compared to the conveyor 15A in FIG. 1, so there is an advantage that the soldering apparatus becomes smaller.
なお、上記実施例では、はんだ付装置の上流端に紫外線
照射炉２が設けられたときで説明し，たが、例えば、片
面実装基板などでこれがないときには、上流のコンベア
を更に短くすることで同様に対応できる。In the above embodiment, the explanation was given for the case where the ultraviolet ray irradiation furnace 2 was installed at the upstream end of the soldering device. However, if this is not provided, for example, for a single-sided mounting board, the upstream conveyor can be further shortened. The same can be done.
［発明の効果］
以上、本発明によれば、プリント配線板をコンベアで予
熱炉からリフロー炉に送って電子部品をはんだ付するは
んだ付装置において、外部から送られてきたプリント配
線板を載置して予熱炉からリフロー炉に搬送する上流コ
ンベアと、リフロー炉に送られてきたプリント配線板を
はんだ付装置６
の下流端に搬出する下流コンベアを設けて、それぞれ最
適温度と最適時間で運転できるようにしたので、電子部
品の寿命を損うことなく、はんだ付の信頼性をあげるこ
とのできるはんだ付装置を得ることができる。[Effects of the Invention] As described above, according to the present invention, a printed wiring board sent from the outside is placed in a soldering apparatus that sends a printed wiring board from a preheating furnace to a reflow oven using a conveyor and solders electronic components thereon. An upstream conveyor is provided to transport printed wiring boards from the preheating furnace to the reflow furnace, and a downstream conveyor is provided to transport the printed wiring boards sent to the reflow furnace to the downstream end of the soldering device 6, allowing each to operate at the optimum temperature and time. As a result, it is possible to obtain a soldering device that can improve the reliability of soldering without impairing the life of electronic components.
第１図は本発明のはんだ付装置の一実施例を示す正面図
、第２図は本発明のはんだ付装置の作用を示す図、第３
図は本発明のはんだ付装置の他の実施例を示す正面図、
第４図は従来のはんだ付装置を示す正面図、第５図は従
来のはんだ付装置の作用を示す図である。
３Ａ・・・予備加熱炉
３Ｂ，３Ｃ・・・予備保温炉
４・・・リフロー炉
＋５Ａ・・・上流コンベア
１５Ｂ・・・下流コンベア
（８７３３）代理人 弁理士 猪 股 祥 晃（ほか
」名）
７FIG. 1 is a front view showing an embodiment of the soldering device of the present invention, FIG. 2 is a diagram showing the operation of the soldering device of the present invention, and FIG.
The figure is a front view showing another embodiment of the soldering device of the present invention.
FIG. 4 is a front view showing a conventional soldering device, and FIG. 5 is a diagram showing the operation of the conventional soldering device. 3A...Preheating furnace 3B, 3C...Preheating furnace 4...Reflow oven +5A...Upstream conveyor 15B...Downstream conveyor (8733) Agent: Yoshiaki Inomata, patent attorney (and others)
” name) 7
Claims (1)
をはんだ付するプリント配線板のはんだ付装置において
、 外部から前記はんだ付炉に送られてきた前記プリント配
線板を前記予熱炉を経て前記リフロー炉に搬送する上流
コンベアと、この上流コンベアから前記リフロー炉に送
られてきた前記プリント配線板を前記はんだ付装置の下
流端に搬送する下流コンベアを設けたことを特徴とする
はんだ付装置。[Scope of Claims] A printed wiring board soldering apparatus that sends a printed wiring board from a preheating furnace to a reflow furnace to solder components, wherein the printed wiring board that is sent from the outside to the soldering furnace is preheated. The present invention is characterized by providing an upstream conveyor that conveys the printed wiring board to the reflow oven via a furnace, and a downstream conveyor that conveys the printed wiring board sent from the upstream conveyor to the reflow oven to the downstream end of the soldering device. Soldering equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15473889A JPH0321096A (en) | 1989-06-19 | 1989-06-19 | Soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15473889A JPH0321096A (en) | 1989-06-19 | 1989-06-19 | Soldering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0321096A true JPH0321096A (en) | 1991-01-29 |
Family
ID=15590847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15473889A Pending JPH0321096A (en) | 1989-06-19 | 1989-06-19 | Soldering device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0321096A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0458163A2 (en) * | 1990-05-21 | 1991-11-27 | Systronic Maschinenbau GmbH | Method and apparatus for reflow-soldering of electronic devices on a circuit board |
-
1989
- 1989-06-19 JP JP15473889A patent/JPH0321096A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0458163A2 (en) * | 1990-05-21 | 1991-11-27 | Systronic Maschinenbau GmbH | Method and apparatus for reflow-soldering of electronic devices on a circuit board |
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