JPH03203291A - Bonding of conductive plastic molding member mixed with metal fiber - Google Patents
Bonding of conductive plastic molding member mixed with metal fiberInfo
- Publication number
- JPH03203291A JPH03203291A JP1344820A JP34482089A JPH03203291A JP H03203291 A JPH03203291 A JP H03203291A JP 1344820 A JP1344820 A JP 1344820A JP 34482089 A JP34482089 A JP 34482089A JP H03203291 A JPH03203291 A JP H03203291A
- Authority
- JP
- Japan
- Prior art keywords
- joining
- bonding
- metal fibers
- joint
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 32
- 239000002184 metal Substances 0.000 title claims abstract description 32
- 239000000835 fiber Substances 0.000 title claims abstract description 29
- 238000010137 moulding (plastic) Methods 0.000 title 1
- 238000000034 method Methods 0.000 claims abstract description 16
- 239000003973 paint Substances 0.000 claims abstract description 8
- 229920003023 plastic Polymers 0.000 claims description 16
- 239000004033 plastic Substances 0.000 claims description 16
- 230000000694 effects Effects 0.000 abstract description 6
- 238000000465 moulding Methods 0.000 abstract description 3
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011231 conductive filler Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 2
- 244000062175 Fittonia argyroneura Species 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 206010040844 Skin exfoliation Diseases 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は金属繊維混入導電性プラスチックで成型された
電子機器用シールドケース・ハウジング等の成型部材の
接合部の接合方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for joining joints of molded members such as shield cases and housings for electronic devices molded from conductive plastic mixed with metal fibers.
（従来の技術）
従来、ＯＡ機器等の電子機器より放射される高周波電磁
波が他の機器への雑音源、又は電磁波障害の原因となっ
て悪影響を与えている。(Prior Art) Conventionally, high-frequency electromagnetic waves emitted from electronic equipment such as office automation equipment have adversely affected other equipment by causing noise or electromagnetic interference.
そこで、この電磁波障害を防止するために、ＯＡ機器等
の電子機器のハウジングを、プラスチックに金属繊維、
金属粉等の導電性フィラーが混入された導電性プラスチ
ックにより成型することが研究されている。Therefore, in order to prevent this electromagnetic interference, the housings of electronic devices such as OA equipment are made of plastic and metal fibers.
Research is being conducted on molding from conductive plastic mixed with conductive filler such as metal powder.
（発明が解決しようとする課題）
前記のように樹脂に導電性フィラーが混入された導電性
プラスチックは、導電性フィラーとプラスチックとが一
体となっているために、樹脂の表面にメツキや塗装を施
した場合のように剥離する虞れはないが、二つの成型部
材の接合部が導通しにくいという問題があった。すなわ
ち、導電性プラスチック成型品の表面には数１０μｍの
厚みを有する樹脂スキン層が必然的に形成されているた
め、二つの成型部材を単に接合させるだけでは画成型部
材の表面の相互の導通をはかることは困難であった。(Problems to be Solved by the Invention) As mentioned above, in the case of conductive plastics in which conductive fillers are mixed into resin, since the conductive fillers and plastics are integrated, it is difficult to plate or paint the surface of the resin. Although there is no risk of peeling as in the case where the two molded members are applied, there is a problem in that the joint between the two molded members is difficult to conduct. In other words, since a resin skin layer with a thickness of several tens of micrometers is inevitably formed on the surface of a conductive plastic molded product, simply joining two molded members will not allow mutual conduction between the surfaces of the defined molded members. It was difficult to measure.
（発明の目的）
本発明の目的は、前記成型部材の接合部からの電磁波の
漏洩を確実に防止できるようにした金属繊維混入導電性
プラスチック成型部材の接合方法を提供することにある
。(Objective of the Invention) An object of the present invention is to provide a method for joining conductive plastic molded members mixed with metal fibers that can reliably prevent leakage of electromagnetic waves from the joined portions of the molded members.
（問題点を解決する為の手段）
本発明の金属繊維混入導電性プラスチック成型部材の接
合部の接合方法は第１図〜第３図のように、相互に接触
する成型部材１．２の接合部３．４の表面に金属繊維５
を１ｃｍ”当り０．０３ｃｍ”以上露出させたのち、同
接合部３．４を当接させ、ついで当該接合部を０．５ｋ
ｇ／ｃｍ２以上接合圧力で接合するか、或は同接合部３
．４間に導電性塗料の塗布、導電性ガスケットを介在さ
せた場合には０．］、ｋｇ／ｃｍ”以上の接合圧力で接
合することを特徴とするものである。(Means for Solving the Problems) The method for joining the joints of the conductive plastic molded parts mixed with metal fibers of the present invention is as shown in FIGS. 1 to 3. Metal fiber 5 on the surface of part 3.4
After exposing more than 0.03 cm per 1 cm, the joint part 3.4 is brought into contact, and then the joint part is
Join with a joining pressure of g/cm2 or more, or the same joint 3
．． 0.0 when applying conductive paint or interposing a conductive gasket between 4. ], kg/cm'' or more.
ここで金属繊維５を露出させる方法は特に限定されるも
のではないが、例えばサンドペーパーグラインダー等に
より研磨する方法、アセトン等の有機溶剤で表面処理し
て成型部材１．２の接合部３．４の表面の樹脂スキン層
を除去する方法、レーザー、ショツトブラスト等で処理
する方法等が挙げられる。Here, the method of exposing the metal fibers 5 is not particularly limited, but for example, a method of polishing with a sandpaper grinder etc., a method of surface treatment with an organic solvent such as acetone, etc. Examples include a method of removing the resin skin layer on the surface, a method of treating with a laser, shot blasting, etc.
これらの方法により樹脂スキン層が取り除かれた成型部
材１．２の接合部３．４は、単に接合するだけでは電磁
波の漏洩を防ぐことはできない。The joint portion 3.4 of the molded member 1.2 from which the resin skin layer has been removed by these methods cannot prevent leakage of electromagnetic waves simply by joining.
そこで本発明では鋭意研究した結果、成型部材１．２の
接合部３．４の表面の金属繊維５の露出量と接合圧力に
ある限界値があり、その両方を満足しないと実用的なシ
ールド効果が得られないことを見出した。それによると
成型部材１．２の接合部３．４の表面には１ｃｍ”あた
り０．０３ｃｍ２以上の金属繊維５が露出しており、か
つ接合圧力は直接当接した場合は０．５ｋｇ／ｃｍ”以
上、両種合部間に導電性塗料の塗布、又は導電性ガスケ
ット等を介在させて当接した場合には０゜１ｋｇ／ｃｍ
２以上であると、接合部３．４からの電磁波の漏洩が実
用上無視できるというものである。このどちらか一方の
限界値を下まわっても接合部３．４からの電磁波の漏洩
は防ぐことができない。Therefore, as a result of extensive research in the present invention, we have found that there are limits to the amount of exposed metal fibers 5 on the surface of the joint 3.4 of the molded member 1.2 and the joint pressure, and unless both of these are satisfied, practical shielding effects cannot be achieved. It was found that it was not possible to obtain According to this, more than 0.03 cm2 of metal fibers 5 per 1 cm are exposed on the surface of the joint 3.4 of the molded member 1.2, and the joining pressure is 0.5 kg/cm when in direct contact. ``In the case where the two types contact with each other by applying conductive paint or interposing a conductive gasket between the two parts, 0゜1kg/cm
When it is 2 or more, leakage of electromagnetic waves from the joint portion 3.4 can be practically ignored. Even if the value falls below one of these limits, leakage of electromagnetic waves from the joint 3.4 cannot be prevented.
次に、本発明において直接当接させて接合圧力を０．５
ｋｇ／ｃｍ”以上にするには、成型部材１．２の接合部
３．４を第１図〜第４図に示すような接合構造にするこ
とが考えられるが、これらの構造に限られるものではな
い。Next, in the present invention, the welding pressure is set to 0.5 by direct contact.
kg/cm" or more, it is conceivable to make the joint part 3.4 of the molded member 1.2 into a joint structure as shown in Figs. 1 to 4, but it is limited to these structures. isn't it.
このうち第１図に示すものは一方の成型部材ｌの接合部
３に形成された突子６を、他方の成型部材２の接合部４
に形成された嵌合溝７に嵌入させる構造である。この場
合、突子６の幅を嵌合溝７の幅より少し広くすることに
より所望の接合圧力が得られる。この幅はプラスチック
の種類によって適宜決定される。Among these, the one shown in FIG.
It has a structure in which it is fitted into a fitting groove 7 formed in. In this case, the desired joining pressure can be obtained by making the width of the protrusion 6 slightly wider than the width of the fitting groove 7. This width is appropriately determined depending on the type of plastic.
第２図に示すものは二つの成型部材１、２の接合部３．
４が横に重ね合わされ、この接合部３．４をボルト８と
ナツト９とにより連結して、当該接合部３．４に圧力を
加えるようにしたものである。What is shown in FIG. 2 is a joint 3.
4 are overlapped horizontally, and this joint portion 3.4 is connected by a bolt 8 and a nut 9 to apply pressure to the joint portion 3.4.
第３図に示すものは下方から上方に向ｃｔで僅かに外側
床がりにした下方の成型部材１の接合部３の外側に、上
方の成型部材２の重直な接合部４を被せることにより、
下方の成型部材１の接合部３を内側に押圧して、同接合
部３の外側に広がろうとする復元力により、同接合部３
が上方の成型部材の接合部４に圧接するようにしたもの
である。The one shown in Fig. 3 is made by placing the vertical joint 4 of the upper molded member 2 on the outside of the joint 3 of the lower molded member 1, which is slightly slanted outward in the direction ct from the bottom to the top. ,
The joint portion 3 of the lower molded member 1 is pressed inward and the restoring force tries to spread outward of the joint portion 3, causing the joint portion 3 to
is in pressure contact with the joint portion 4 of the upper molded member.
第４図に示すものはＬ字状に曲げた下方の成型部材１の
接合部３と下方成型部材２の接合部４とを上下に突合わ
せ、同接合部３．４をボルト８、ナツト９により連結し
て当該接合部３．４に圧力を加えるようにしたものであ
る。In the case shown in FIG. 4, the joint part 3 of the lower molded member 1 bent into an L-shape and the joint part 4 of the lower molded member 2 are butted vertically, and the joint part 3.4 is fixed with a bolt 8 and a nut 9. 3.4 to apply pressure to the joint 3.4.
なお、上述した種々の接合方法において成型部材１．２
の接合部３．４の表面に更に銀糸、銅系、ニッケル系、
あるいはカーボン系などの導電性の塗料を塗布したり、
例えば金属線編組、ゴム状弾性体に金属線編組を巻いた
もの、ゴム状弾性体に導電性フィラーを混入したものな
どの導電性ガスケットを挿入したり、金属箔を挿入或は
挟み込んだりしてやれば当該接合部３．４に加える接合
圧力は０．１ｋｇ／ｃｍ”まで下げることができる。In addition, in the various joining methods described above, the molded member 1.2
Further, on the surface of the joint 3.4, silver thread, copper-based, nickel-based,
Alternatively, apply conductive paint such as carbon-based paint,
For example, by inserting a conductive gasket such as a metal wire braid, a metal wire braid wrapped around a rubber-like elastic body, a rubber-like elastic body mixed with a conductive filler, or by inserting or sandwiching metal foil. The bonding pressure applied to the bonded portion 3.4 can be lowered to 0.1 kg/cm''.
本発明における金属繊維混入導電性プラスチックの金属
繊維５としては、ステンレス、アルミニウム、銅、黄銅
、リン青銅等からなる断面積が０．０Ｏ０５〜０．００
５ｍｍ２の繊維状物が挙げられるが、特に銅系合金製繊
維が望ましく、又その配合量は５〜５０重量％重量％中
られるまた、本発明における金属繊維混入導電性プラス
チックのプラスチックとしてはＡＢＳ、スチレン、変性
ＰＰＯ、ポリカーボネート等の、これまでの電子機器の
ハウジングに使用されているもので６よいが、それら以
外のものでもよい。The metal fibers 5 of the conductive plastic mixed with metal fibers in the present invention are made of stainless steel, aluminum, copper, brass, phosphor bronze, etc. and have a cross-sectional area of 0.0005 to 0.00.
Examples of the metal fiber-mixed conductive plastic in the present invention include ABS, 5 mm2 fibrous material, and copper-based alloy fibers are particularly desirable, and the amount thereof is 5 to 50% by weight. Materials such as styrene, modified PPO, and polycarbonate that have been used in the housings of electronic devices to date may be used, but materials other than these materials may also be used.
（実施例）
実施例１
本発明の一実施例として、前記金属繊維５として断面積
０．００２５ｍｍ ２の黄銅繊維が使用され、それが１
５重量％混入されたＡＢＳ樹脂組成物を射出成形してシ
ートを成形した。このシートをサンドペーパーにより研
磨して前記金属繊維５を露出させ、同シートを２枚を重
ね合わせてボルトとナツトで連結して接合面に圧力を加
えた。而して作製した接合体について電磁波シールド効
果をアトパンテスト法により測定した。この時の金属繊
維５の露出量、接合圧力と電磁波シールド効果との関係
を表１に示した。(Example) Example 1 As an example of the present invention, a brass fiber with a cross-sectional area of 0.0025 mm 2 is used as the metal fiber 5, and
An ABS resin composition containing 5% by weight was injection molded to form a sheet. This sheet was polished with sandpaper to expose the metal fibers 5, and the two sheets were overlapped and connected with bolts and nuts, and pressure was applied to the joint surfaces. The electromagnetic shielding effect of the thus fabricated bonded body was measured using the atpan test method. Table 1 shows the relationship between the exposed amount of the metal fibers 5, the bonding pressure, and the electromagnetic shielding effect at this time.
（以下余白）
表１
実施例１と同様にして接合部を形成し、当該接合部につ
いて実施例１と同様にして金属繊維の露出量、接合圧力
と電磁波シールド効果の関係を測定した。得られた結果
を表２に示した。(Margin below) Table 1 A joint was formed in the same manner as in Example 1, and the relationship between the exposed amount of metal fibers, the joining pressure, and the electromagnetic shielding effect was measured in the same manner as in Example 1. The results obtained are shown in Table 2.
表２
実施例２
接合部に金属繊維を露出させた後、当該部分に銀糸導電
性塗料［商品名ドータイトＤ−５００、睦合化成（株）
製］を塗布したことを除いて他は ０
（発明の効果）
前記のように本発明の金属繊維混入導電性プラスチック
成型部材の接合方法によれば、成型部材相互の接合部３
．４から電磁波が良好に遮蔽され、電磁波漏洩が防止さ
れる。Table 2 Example 2 After exposing the metal fibers at the joint, a silver thread conductive paint [trade name Dotite D-500, manufactured by Mutsugo Kasei Co., Ltd.] was applied to the part.
(Effects of the Invention) As described above, according to the method for joining conductive plastic molded parts mixed with metal fibers of the present invention, the joint parts 3 of the molded parts are
．． 4, electromagnetic waves are well shielded and leakage of electromagnetic waves is prevented.
第１図〜第４図は本発明の成型部材の接合部の接合方法
の各種実施例の説明図である。
１．２は成型部材
３．４は接合部
５は金属繊維FIGS. 1 to 4 are explanatory diagrams of various embodiments of the method for joining the joint portions of molded members according to the present invention. 1.2 is a molded member 3.4 is a joint 5 made of metal fibers
Claims (2)
材１、２の接合部３、４の接合方法において、相互に接
触する接合部３、４の表面に金属繊維５を１ｃｍ＾２当
り０．０３ｃｍ＾３以上露出させたのち、同接合部３、
４を当接させ、ついで当該接合部を０．５ｋｇ／ｃｍ＾
２以上の接合圧力で接合することを特徴とする金属繊維
混入導電性プラスチック成型部材の接合方法。(1) In the method of joining two or more metal fiber-containing conductive plastic molded members 1 and 2 at the joints 3 and 4, metal fibers 5 are added at 0.000% per cm^2 on the surfaces of the joints 3 and 4 that are in contact with each other. After exposing more than 03cm^3, the same joint part 3,
4, and then apply a pressure of 0.5 kg/cm^ to the joint.
A method for joining conductive plastic molded parts mixed with metal fibers, characterized by joining with two or more joining pressures.
材１、２の接合部３、４の接合方法において、相互に接
触する接合部３、４の表面に金属繊維５を１ｃｍ＾２当
り０．０３ｃｍ＾２以上露出させたのち、該接合部３、
４の表面に導電性塗料の塗布、又は導電性ガスケットを
介在させて両者を当接させ、ついで同接合部３、４を０
．１ｋｇ／ｃｍ＾２以上の接合圧力で接合することを特
徴とする金属繊維混入導電性プラスチック成型部材の接
合方法。(2) In the method of joining two or more metal fiber-containing conductive plastic molded members 1 and 2 at the joints 3 and 4, metal fibers 5 are added at 0.00% per cm^2 on the surfaces of the joints 3 and 4 that are in contact with each other. After exposing more than 03cm^2, the joint part 3,
Apply conductive paint to the surface of 4 or interpose a conductive gasket to bring them into contact, and then connect the joint parts 3 and 4 to 0.
．． A method for joining conductive plastic molded members mixed with metal fibers, characterized by joining with a joining pressure of 1 kg/cm^2 or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1344820A JPH03203291A (en) | 1989-12-28 | 1989-12-28 | Bonding of conductive plastic molding member mixed with metal fiber |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1344820A JPH03203291A (en) | 1989-12-28 | 1989-12-28 | Bonding of conductive plastic molding member mixed with metal fiber |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03203291A true JPH03203291A (en) | 1991-09-04 |
Family
ID=18372225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1344820A Pending JPH03203291A (en) | 1989-12-28 | 1989-12-28 | Bonding of conductive plastic molding member mixed with metal fiber |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03203291A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005262458A (en) * | 2004-03-16 | 2005-09-29 | Seiko Epson Corp | Liquid cartridge |
| JP2008546193A (en) * | 2005-06-02 | 2008-12-18 | ナムローゼ・フェンノートシャップ・ベーカート・ソシエテ・アノニム | Polymer EMI housing containing conductive fibers |
| JP2013215904A (en) * | 2012-04-04 | 2013-10-24 | Honda Motor Co Ltd | Resin molded member comprising conductive resin material, conductive resin component comprising the resin molded member and coupling member, and method for coupling of the resin molded member and the coupling member |
| WO2014125999A1 (en) * | 2013-02-12 | 2014-08-21 | ポリプラスチックス株式会社 | Grooved resin molded part |
| JP2015016575A (en) * | 2013-07-09 | 2015-01-29 | ポリプラスチックス株式会社 | Composite molding |
| WO2015146767A1 (en) * | 2014-03-25 | 2015-10-01 | ポリプラスチックス株式会社 | Composite molded article and method for manufacturing same |
| CN105291449A (en) * | 2014-06-26 | 2016-02-03 | 宝理塑料株式会社 | Composite molding product and manufacturing method thereof |
| JP2016032917A (en) * | 2014-07-31 | 2016-03-10 | ポリプラスチックス株式会社 | Method for manufacturing resin molding with groove and composite molding, hollow-shaped resin molding with groove, and composite molding |
| CN105848854A (en) * | 2013-09-09 | 2016-08-10 | 宝理塑料株式会社 | Grooved resin molding, composite molding, and composite molding manufacturing method |
| JP2019130866A (en) * | 2018-02-02 | 2019-08-08 | 信越ポリマー株式会社 | Insert molding, method for manufacturing the same, and container for accommodating substrate |
-
1989
- 1989-12-28 JP JP1344820A patent/JPH03203291A/en active Pending
Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005262458A (en) * | 2004-03-16 | 2005-09-29 | Seiko Epson Corp | Liquid cartridge |
| JP4581440B2 (en) * | 2004-03-16 | 2010-11-17 | セイコーエプソン株式会社 | Liquid cartridge |
| JP2008546193A (en) * | 2005-06-02 | 2008-12-18 | ナムローゼ・フェンノートシャップ・ベーカート・ソシエテ・アノニム | Polymer EMI housing containing conductive fibers |
| JP2013215904A (en) * | 2012-04-04 | 2013-10-24 | Honda Motor Co Ltd | Resin molded member comprising conductive resin material, conductive resin component comprising the resin molded member and coupling member, and method for coupling of the resin molded member and the coupling member |
| CN108788470A (en) * | 2013-02-12 | 2018-11-13 | 宝理塑料株式会社 | The synthetic resin of trough of belt |
| JP5632567B1 (en) * | 2013-02-12 | 2014-11-26 | ポリプラスチックス株式会社 | Grooved resin molded product |
| CN108788470B (en) * | 2013-02-12 | 2021-07-06 | 宝理塑料株式会社 | Grooved resin molded article |
| CN104995011A (en) * | 2013-02-12 | 2015-10-21 | 宝理塑料株式会社 | Grooved resin molded part |
| US9610713B2 (en) | 2013-02-12 | 2017-04-04 | Polyplastics Co., Ltd. | Grooved resin molded part |
| WO2014125999A1 (en) * | 2013-02-12 | 2014-08-21 | ポリプラスチックス株式会社 | Grooved resin molded part |
| JP2015016575A (en) * | 2013-07-09 | 2015-01-29 | ポリプラスチックス株式会社 | Composite molding |
| TWI610809B (en) * | 2013-09-09 | 2018-01-11 | Polyplastics Co., Ltd. | Resin molded product having groove, composite molded product, and manufacturing method of composite molded product |
| CN105848854A (en) * | 2013-09-09 | 2016-08-10 | 宝理塑料株式会社 | Grooved resin molding, composite molding, and composite molding manufacturing method |
| JPWO2015146767A1 (en) * | 2014-03-25 | 2017-04-13 | ポリプラスチックス株式会社 | Composite molded article and manufacturing method thereof |
| KR20160103155A (en) | 2014-03-25 | 2016-08-31 | 포리프라스틱 가부시키가이샤 | Composite molded article and method for manufacturing same |
| JP5918451B2 (en) * | 2014-03-25 | 2016-05-18 | ポリプラスチックス株式会社 | Composite molded article and manufacturing method thereof |
| US10232547B2 (en) | 2014-03-25 | 2019-03-19 | Polyplastics Co., Ltd. | Composite molded article and method for manufacturing same |
| DE112015001385B4 (en) | 2014-03-25 | 2020-08-06 | Polyplastics Co., Ltd. | Process for producing a composite molded article |
| WO2015146767A1 (en) * | 2014-03-25 | 2015-10-01 | ポリプラスチックス株式会社 | Composite molded article and method for manufacturing same |
| CN105291449A (en) * | 2014-06-26 | 2016-02-03 | 宝理塑料株式会社 | Composite molding product and manufacturing method thereof |
| CN105291449B (en) * | 2014-06-26 | 2018-11-20 | 宝理塑料株式会社 | Composite molded article and its manufacturing method |
| JP2016032917A (en) * | 2014-07-31 | 2016-03-10 | ポリプラスチックス株式会社 | Method for manufacturing resin molding with groove and composite molding, hollow-shaped resin molding with groove, and composite molding |
| JP2019130866A (en) * | 2018-02-02 | 2019-08-08 | 信越ポリマー株式会社 | Insert molding, method for manufacturing the same, and container for accommodating substrate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH03203291A (en) | Bonding of conductive plastic molding member mixed with metal fiber | |
| CA2215117A1 (en) | Apparatus and methods of providing corrosion resistant conductive path across non conductive joints or gaps | |
| CA1219328A (en) | Method of integrally bonding a radiation shielding and thermally conductive gasket to a surface and article fabricated by same | |
| JPH03104195A (en) | Sealing and shielding structure | |
| US3347978A (en) | Electrically conductive joints and gaskets | |
| DE2810416C2 (en) | Semiconductor component with plastic coating | |
| EP0140664A2 (en) | Radio wave shielding materials and a method of producing the same | |
| CN103980711B (en) | Directional metal wire-filled anti-EMI silica gel liner and preparation method thereof | |
| TW201129293A (en) | Electrical module and enclosure thereof | |
| JPS61269399A (en) | Improved wood for shielding electromagnetic shield | |
| JP4983477B2 (en) | gasket | |
| KR100740175B1 (en) | Gasket for absorbing and shielding electron waves and Method for manufacturing gasket | |
| CN108617084A (en) | A kind of electromagnetism interference flexible circuit board and production method | |
| JP3022804B2 (en) | Packing manufacturing method | |
| JP2001111283A5 (en) | ||
| WO2012010623A1 (en) | Conductive grounding pad | |
| JPH0711519Y2 (en) | Shield structure for the joints of conductive plastic moldings | |
| KR101116144B1 (en) | Bonding method using adhesive film and ultrasonic wave | |
| JPH0263725A (en) | Method for assembling carbon fiber reinforced plastic member | |
| Bardi et al. | Parameter estimation for PMLs used with 3D finite element codes | |
| JPS6251427A (en) | Joining of electromagnetic wave shielding sheet to body to be joined | |
| JPH0128715Y2 (en) | ||
| JPH0420375B2 (en) | ||
| WO2024058705A1 (en) | Method for manufacturing a gasket for electromagnetic shielding | |
| JPS63184398A (en) | Electromagnetic wane shielding composite material |