JPH03198975A - Soldering method - Google Patents
Soldering methodInfo
- Publication number
- JPH03198975A JPH03198975A JP27011889A JP27011889A JPH03198975A JP H03198975 A JPH03198975 A JP H03198975A JP 27011889 A JP27011889 A JP 27011889A JP 27011889 A JP27011889 A JP 27011889A JP H03198975 A JPH03198975 A JP H03198975A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- soldering
- cooling
- electric wire
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims description 12
- 229910000679 solder Inorganic materials 0.000 claims abstract description 26
- 238000001816 cooling Methods 0.000 claims abstract description 15
- 238000010438 heat treatment Methods 0.000 claims abstract description 4
- 230000005611 electricity Effects 0.000 claims description 5
- 238000003825 pressing Methods 0.000 abstract description 20
- 230000007547 defect Effects 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 239000000498 cooling water Substances 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000000155 melt Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、ハンダ付けの方法に関する。[Detailed description of the invention] (Industrial application field) The present invention relates to a method of soldering.
（従来の技術及び解決すべき課題）
低融点のろうづけ用合金としてのハンダは、広範囲に亘
り使用されており、特に、電子機器部品のプリント基板
に配設された各素子、或いは接続端子や各種スイッチ類
とリード線（以下単に［電線Ｊという）との接続には不
可欠である。例えば、第１５図に示すようにスイッチ等
の接続端子２０に電線２１の芯線（撚線）２２をハンダ
２３により接続する場合には、各芯線２２を出来るだけ
奇麗に揃えて断面が第１６図に示すような蒲鉾状に接続
することが好ましい。(Prior Art and Problems to be Solved) Solder, which is a low-melting brazing alloy, is used over a wide range of applications, especially for each element arranged on the printed circuit board of electronic equipment components, or for connection terminals and It is essential for connecting various switches and lead wires (hereinafter simply referred to as "wire J"). For example, when connecting the core wires (stranded wires) 22 of the electric wire 21 to the connection terminal 20 of a switch or the like using solder 23 as shown in FIG. It is preferable to connect them in a semi-cylindrical shape as shown in FIG.
ところで、プリント基板に配設した多数の素子をプリン
ト配線にハンダ付けする場合におけるハンダ付けの工程
は自動化されているが、上述したような端子２０に電線
２１をハンダ付けする工程は手作業により行われている
のが現状である。これは、端子２０に電線２１の芯線２
２を押し付けた状態でハンダこてを当ててハンダを溶融
させた後、当該溶融したハンダが凝固するまでの開端子
２０と芯線２２との接続部が動かないように押さえてお
く必要があることが大きな要因である。従って、接続箇
所を１箇所づつ手作業でハンダ付けしているために作業
能率が悪い。しかも、第１７図に示すように接続時に芯
線２２に「こて」を強く押し当てると、芯線２２がバラ
バラになってはみ出し、他の部品と接触する虞れがある
。Incidentally, the soldering process for soldering a large number of elements arranged on a printed circuit board to printed wiring is automated, but the process of soldering the electric wire 21 to the terminal 20 as described above is performed manually. This is the current situation. This means that the core wire 2 of the electric wire 21 is connected to the terminal 20.
After melting the solder by applying a soldering iron while pressing 2, it is necessary to hold the connection between the open terminal 20 and the core wire 22 so that it does not move until the molten solder solidifies. is a major factor. Therefore, work efficiency is low because each connection point is manually soldered one by one. Furthermore, as shown in FIG. 17, if a "trowel" is strongly pressed against the core wire 22 during connection, the core wire 22 may break apart and protrude, potentially coming into contact with other parts.
また、ハンダ付けは以外に難しく、接続すべき電線やワ
ークの材質によりハンダの溶融状態が微妙に異なり、所
謂「いもはん」等の接着不良を起こし易く、電気的及び
機械的に良好に、且つ各接続箇所を均一に接続するため
には相当の熟練が必要である。In addition, soldering is extremely difficult, and the molten state of the solder differs slightly depending on the wire and workpiece material to be connected, which tends to cause adhesion failures such as so-called "Imohan". In addition, considerable skill is required to uniformly connect each connection point.
また、ハンダこては、常時加熱した状態にあるためにど
うしても過熱ぎみとなり、ハンダの溶融に悪影響を及ぼ
すこととなる。更に、ハンダ付けの際にペーストに起因
して発生するガスが有害であるために、このガスを吸わ
ないようにする必要があり、換気に十分注意を払う必要
がある。Furthermore, since the soldering iron is always in a heated state, it inevitably becomes overheated, which adversely affects the melting of the solder. Furthermore, since the gas generated by the paste during soldering is harmful, it is necessary to avoid inhaling this gas, and it is necessary to pay sufficient attention to ventilation.
本発明は上述の点に鑑みてなされたもので、ハンダ付け
の自動化が可能なハンダ付け方法を提供することを目的
とする。The present invention has been made in view of the above points, and an object of the present invention is to provide a soldering method that can automate soldering.
（課題を解決するための手段）
上記目的を達成するために本発明によれば、ハンダによ
りワークに電線を接続するハンダ付け方法において、電
極と支持部材との少な（とも一方を常時強制冷却してお
き、これらの電極と支持部材との間に接続すべき電線と
ワークとを加圧挟持し、前記電極を通電加熱させてハン
ダ付けを行ない、前記強制冷却により通電終了直後の溶
融せるハンダを急速に冷却させた後、加圧力を解除する
ようにしたものである。(Means for Solving the Problem) According to the present invention, in order to achieve the above object, in a soldering method for connecting an electric wire to a workpiece by soldering, an electrode and a support member (one of which is forcedly cooled at all times) is provided. Then, the electric wires to be connected and the workpiece are held between these electrodes and the support member under pressure, the electrodes are energized and heated to perform soldering, and the forced cooling causes the solder to melt immediately after the energization ends. After rapid cooling, the pressure is released.
更に、電極の電線との当接部位に所要の型を形成して接
続部を所定形状に成形するようにしたものである。Furthermore, a required mold is formed at the portion where the electrode contacts the electric wire, so that the connection portion is molded into a predetermined shape.
（作用）
電極と支持部材との間に接続すべき電線とワークとを加
圧挾持した状態で、当該電極に通電して加熱させる。こ
の電極の加熱により接続部のハンダを溶融させて両者を
ハンダ付けする。電極又は支持部材の少なくとも一方は
常時強制冷却されているために電極への通電を終了する
と溶融せるハンダは急速に冷却されて凝固する。接続部
のハンダを凝固させた後加圧力を解除し、接続部を取り
出す。(Operation) While the electric wire to be connected and the workpiece are held between the electrode and the support member under pressure, the electrode is energized to heat it. The heating of this electrode melts the solder at the connection part, and the two are soldered together. Since at least one of the electrodes or the support member is constantly forcedly cooled, the solder that melts when electricity is turned off to the electrodes is rapidly cooled and solidified. After solidifying the solder at the connection part, release the pressure and take out the connection part.
電極は、電線との当接部位に形成された型により接続部
における電線を所要の形状に成形する。The electrode molds the wire at the connection portion into a desired shape using a mold formed at the portion where the electrode comes into contact with the wire.
これにより接続部の形状は一定形状とされる。As a result, the shape of the connecting portion is made constant.
（実施例） 以下本発明の一実施例を添付図面に基づいて詳述する。(Example) An embodiment of the present invention will be described in detail below with reference to the accompanying drawings.
第１図は本発明方法を実施するためのハンダ付け装置で
、ハンダ付け装置１は、フレーム２に配設された電極３
、押圧部材４、エアシリンダ５と、電源６等により構成
されている。電極３は電極ホルダ７によりフレーム２の
基台にその先端を上方に向けて垂直に固定され、押圧部
材４は電極３の上方に当該電極と対向して配置されてい
る。この押圧部材４はフレーム２に固定支持されたシリ
ンダ５の伸縮により上下動可能とされており、電極３と
協働して接続すべき電線とワークとを押圧挾持するよう
になっている。FIG. 1 shows a soldering device for carrying out the method of the present invention.
, a pressing member 4, an air cylinder 5, a power source 6, and the like. The electrode 3 is vertically fixed to the base of the frame 2 by an electrode holder 7 with its tip facing upward, and the pressing member 4 is disposed above the electrode 3 and facing the electrode. This pressing member 4 can be moved up and down by the expansion and contraction of a cylinder 5 fixedly supported by the frame 2, and cooperates with the electrode 3 to press and clamp the electric wire to be connected and the workpiece.
電極３は、第２図に示すように先端３ａに断面半円形状
の溝（型）３ｂが設けられている。この溝３ｂの内径は
、接続すべき電線２１の芯線２２（２点鎖線で示す）の
外径よりも僅かに大径とされており、ハンダ付けの際に
第３図に示すように端子２０に、溝３ｂ内に配置した芯
線２２を押し付けた状態で当該芯線２２を蒲鉾状に、且
つ密に押圧支持するようにされている。この電極３の両
側部３ｃ１３ｄの先端は、電源６に接続されている。尚
、電極部材としては例えば、タングステン（Ｗ）、モリ
ブデン（Ｍｏ）等がある。As shown in FIG. 2, the electrode 3 is provided with a groove (mold) 3b having a semicircular cross section at its tip 3a. The inner diameter of this groove 3b is slightly larger than the outer diameter of the core wire 22 (indicated by the two-dot chain line) of the electric wire 21 to be connected, and when soldering, the terminal 20 In addition, the core wire 22 disposed in the groove 3b is pressed and supported tightly in a semi-cylindrical shape. The tips of both side portions 3c13d of this electrode 3 are connected to a power source 6. In addition, examples of the electrode member include tungsten (W) and molybdenum (Mo).
抑圧部材４は、前述したように電極３と協働して接続す
べき電線とワークとを押圧挾持するためのもので、熱伝
導性の良好な例えば、金属部材により形成され、内部に
ジャケット（図示せず）が設けられており、当該ジャケ
ットに連通ずる冷却水人口４ａ、出口４ｂが設けられて
いる。これらの入口４ａ、出口４ｂは図示しない冷却水
供給源に接続されている。そして、この押圧部材４は、
前記ジャケットを循環する冷却水により常時強制冷却さ
れており、端面４ｃを介して溶融せるハンダを強制的に
冷却して急速に凝固させるようになっている。As mentioned above, the suppressing member 4 is for pressing and holding the electric wire to be connected and the work in cooperation with the electrode 3, and is formed of a metal member with good thermal conductivity, for example, and has a jacket ( (not shown) is provided, and a cooling water outlet 4a and an outlet 4b communicating with the jacket are provided. These inlet 4a and outlet 4b are connected to a cooling water supply source (not shown). This pressing member 4 is
It is constantly forcedly cooled by cooling water circulating through the jacket, so that the solder melted through the end face 4c is forcedly cooled and rapidly solidified.
エアシリンダ５は、エアホースを介してエア供給源（共
に図示せず）に接続されており、例えば、０．２〜１０
ｋｇ／ｃｒｌの範囲で加圧力を調節することが可能と
されている。The air cylinder 5 is connected to an air supply source (both not shown) via an air hose, and has an air pressure of, for example, 0.2 to 10
It is said that it is possible to adjust the pressing force within a range of kg/crl.
電＃６は、例えば、２００Ｖ、 ５０サイクルの商用交
流電源が使用されており、接続すべき電線とワークの種
類等に応じて印加電圧、印加電流、印加時間等を任意に
調節可能とされている。これによりハンダ付けの温度を
任意の温度に設定することが可能であり、ワークに応じ
て最適な温度に調節することができる。Electrical #6 uses, for example, a 200V, 50-cycle commercial AC power source, and the applied voltage, applied current, applied time, etc. can be adjusted as desired depending on the type of wire and workpiece to be connected. There is. This allows the soldering temperature to be set to an arbitrary temperature, and can be adjusted to the optimum temperature depending on the workpiece.
以下に作用を説明する。The action will be explained below.
先ず、第４図に示すように抑圧部材４を上方に移動させ
た状態で電極３の溝３ｂ内に電線２１の芯線２２を載置
する。尚、芯線２２には予めノ＼ンダ２３を盛って（所
謂ハンダあげ）あるものとする。そして、当該芯線２２
上にワーク例えば、基板２５に設けられた接続端子２６
の接続部２６ａを載置する。この基板２５の接続端子２
６は基板２５の両面に延びて一体的に形成されており、
−端即ち、接続部２６ａは当該基板２５の一面に、他端
は他面に形成されている。First, as shown in FIG. 4, the core wire 22 of the electric wire 21 is placed in the groove 3b of the electrode 3 while the suppressing member 4 is moved upward. It is assumed that a solder 23 is applied to the core wire 22 in advance (so-called soldering). Then, the core wire 22
For example, a connection terminal 26 provided on a substrate 25 is placed on the workpiece.
The connecting portion 26a is placed thereon. Connection terminal 2 of this board 25
6 extends and is integrally formed on both sides of the substrate 25,
The - end, that is, the connecting portion 26a is formed on one surface of the substrate 25, and the other end is formed on the other surface.
次いで、エアシリンダ５を伸長させて押圧部材４を下降
させ、２点鎖線で示すように端面４ｃを基板２５の接続
端子２６に当接させ、基板２５を押圧する。即ち、押圧
部材４は一定の加圧力で電極２６の接続部２６ａを芯線
２２に押圧する。次に、電源６により電極３に所定時間
、所定の電流を通電して加熱させ、芯線２２に予め盛っ
であるハンダ２３を溶融する。このハンダ２３の溶融に
伴い芯線２２が電極３の溝３ｂにより当該溶融せるハン
ダと共に蒲鉾状にされ、第５図に示すように端面３ａが
接続部２６ａに当接する。電極３への通電時間は、溶接
電流にもよるが、数サイフルル２０サイクル程度のごく
短時間である。Next, the air cylinder 5 is extended to lower the pressing member 4, and the end surface 4c is brought into contact with the connection terminal 26 of the board 25 as shown by the two-dot chain line, thereby pressing the board 25. That is, the pressing member 4 presses the connecting portion 26a of the electrode 26 against the core wire 22 with a constant pressing force. Next, a predetermined current is applied to the electrode 3 for a predetermined period of time by the power source 6 to heat it, thereby melting the solder 23 that has been applied to the core wire 22 in advance. As the solder 23 melts, the core wire 22 is formed into a semicircular shape by the groove 3b of the electrode 3 together with the melted solder, and the end surface 3a abuts the connecting portion 26a as shown in FIG. The time for which electricity is applied to the electrode 3 depends on the welding current, but it is a very short time of several cycles, about 20 cycles.
接続端子２６は、押圧部材４により常時強制冷却されて
おり、電極３への通電終了と共に溶融せるハンダ２３が
強制冷却されて急速に凝固し、芯線２２が接続端子２６
に強固に接続される。従って、電極３への通電終了後極
めて短時間で接続端子２６と芯線２２との間に加えてい
る押圧力を解除することができる。The connection terminal 26 is constantly forcibly cooled by the pressing member 4, and the solder 23 that melts when the electrode 3 is energized is forcedly cooled and rapidly solidifies, and the core wire 22 is forced to the connection terminal 26.
firmly connected to the Therefore, the pressing force applied between the connection terminal 26 and the core wire 22 can be released in a very short time after the energization of the electrode 3 ends.
接続端子２６と電線２１とのノ１ンダ付けが完了した後
即ち、電極３の通電終了後エアシリンダ５を短縮させて
抑圧部材４を上動させ、接続部即ち、電線２１の芯線２
２と接続端子２６との間の押圧力を解除する。斯くして
、第６図及び第７図に示すように接続端子２６に電線２
１を略蒲鉾状に接続することができる。これにより接続
部の形状を一定にすることができ、画像処理等による接
続部の良否を判断をすることが容易となる。After the soldering between the connecting terminal 26 and the electric wire 21 is completed, that is, after the electricity supply to the electrode 3 is completed, the air cylinder 5 is shortened and the suppressing member 4 is moved upward to remove the connecting portion, that is, the core wire 2 of the electric wire 21.
2 and the connecting terminal 26 is released. In this way, as shown in FIGS. 6 and 7, the electric wire 2 is connected to the connection terminal 26.
1 can be connected in a substantially semi-cylindrical shape. As a result, the shape of the connecting portion can be made constant, and it becomes easy to judge whether the connecting portion is good or bad by image processing or the like.
第８図は電極３の他の実施例を示し、電極３の先端３ａ
に断面矩形状の浅い溝（型）３ｅを設けたもので、これ
によれば第９図に示すような形状でワーク２７に電線２
Ｉの芯線２２を／＼ンダ付けすることができ、ワーク２
７の表面からの高さｈを低くすることができる。これは
高さが制限されているような箇所のハンダ付けに有効で
ある。FIG. 8 shows another embodiment of the electrode 3, in which the tip 3a of the electrode 3 is
According to this, a shallow groove (mold) 3e with a rectangular cross section is provided in the workpiece 27 with a shape as shown in FIG.
The core wire 22 of I can be attached to workpiece 2.
7 can be lowered from the surface. This is effective for soldering in places where height is restricted.
また、第１０図はワーク３０の一端面に同一平面上に突
出して配置された複数例えば、３個の接続端子３１〜３
３に３本の電線３４〜３６を同時にハンダ付けする場合
の電極及び押圧部材の形状を示し、電極ＩＯの端面１０
ａの対応する箇所に断面半円形の溝（型）１０ｂ−１０
ｄを形成したものである。押圧部材１１は平板状で各接
続端子３１〜３３を一体的に押圧する。第１Ｉ図は、外
径の異なる段差状をなすワーク４０の各表面の異なる高
さにある複数例えば３個の接続端子４１〜４３に３本の
電線３４〜３６を同時にハンダ付けする場合の電極と押
圧部材との形状を示し、電極１２の端面１２ａ及び押圧
部材１３をワーク４０の接続端子４１〜４３の位置に応
じて段差状に形成したものである。勿論、電極１２は、
段差状の各端面に半円形状の溝（型）１２ｂ−１２ｄが
形成されている。更に、電極の先端に半球状の凹み（型
）を形成することにより、第１２図に示すように半球状
に盛り上げたハンダ２３によりプリント配線５０の接続
部５０ａに電線２１の芯線２２を接続することもできる
。FIG. 10 also shows a plurality of connection terminals 31 to 3, for example, three connection terminals 31 to 3, which are arranged protrudingly on the same plane on one end surface of the workpiece 30.
3 shows the shapes of the electrodes and the pressing member when three electric wires 34 to 36 are soldered at the same time, and the end surface 10 of the electrode IO is shown in FIG.
Groove (mold) 10b-10 with a semicircular cross section in the corresponding location of a
d. The pressing member 11 has a flat plate shape and presses each of the connection terminals 31 to 33 integrally. FIG. 1I shows electrodes when three electric wires 34 to 36 are simultaneously soldered to a plurality of, for example, three connection terminals 41 to 43 at different heights on each surface of a step-shaped workpiece 40 having different outer diameters. The end face 12a of the electrode 12 and the pressing member 13 are formed in a stepped shape according to the positions of the connection terminals 41 to 43 of the workpiece 40. Of course, the electrode 12 is
Semicircular grooves (molds) 12b to 12d are formed in each stepped end face. Furthermore, by forming a hemispherical recess (mold) at the tip of the electrode, the core wire 22 of the electric wire 21 is connected to the connection portion 50a of the printed wiring 50 with the solder 23 raised in a hemispherical shape as shown in FIG. You can also do that.
尚、電極３の通電電流、通電時間等は、前述したように
接続すべき電線とワークの種類等の他に、電極の形状、
大きさ、冷却状態等に応じて最適値に設定する。これに
より常に最良のノ１ンダ付けを行なうことができる。Note that the current, current, etc. of the electrode 3 depend on the shape of the electrode, the type of wire and workpiece to be connected as described above, etc.
Set the optimum value depending on the size, cooling condition, etc. This makes it possible to always perform the best soldering.
第１３図及び第１４図は電極３自体を強制冷却するよう
にしたもので、第１３図は、電極３の先端３ａ、両側部
３Ｃ１３ｄ内に冷却水通路３ｆを設けて冷却水を循環さ
せ、電極３の先端３ａを直接冷却するようにしたもので
ある。また、第１４図は電極３の両側部３Ｃ１３ｄに夫
々冷却水ジャケット１５．１５を設けて冷却するように
したものである。このように電極３を常時冷却しておき
、通電終了直後の溶融せるハンダを急速に冷却させるよ
うにしてもよい。13 and 14 show the electrode 3 itself being forcibly cooled. In FIG. 13, a cooling water passage 3f is provided in the tip 3a of the electrode 3 and both sides 3C13d to circulate cooling water. The tip 3a of the electrode 3 is directly cooled. Further, in FIG. 14, cooling water jackets 15 and 15 are provided on both sides 3C13d of the electrode 3 for cooling. In this way, the electrode 3 may be constantly cooled to rapidly cool the melted solder immediately after energization ends.
また、電極３を強制冷却する手段としては、第１４図に
示す先端３ａの加熱部３ａ’の断面積を小さくすると共
に両側部３ｃ、３ｄの断面積を大きくして当該電極３自
体にシートタンクを形成するようにしてもよい。この場
合には冷却水ジャケット１５．１６は不要である。Further, as a means for forcibly cooling the electrode 3, the cross-sectional area of the heating part 3a' of the tip 3a shown in FIG. may be formed. In this case, the cooling water jackets 15, 16 are not required.
更に、電極３の先端３ａ近傍に当該先端３ａに臨ませて
空気吹出口を設け、電極３の先端３ａに常時空気を吹き
付けることにより強制冷却を行なうようにしてもよい。Furthermore, an air outlet may be provided near the tip 3a of the electrode 3 so as to face the tip 3a, and forced cooling may be performed by constantly blowing air onto the tip 3a of the electrode 3.
また、本実施例においては、電線の芯線に予めハンダを
盛った場合について記述したが、これに限るものではな
く、電極３により加熱した接続部に固形又は溶融状態に
あるハンダを一定量供給するようにしてもよい。更に、
ハンダの他にペースト等を供給するようにしてもよい。Further, in this embodiment, a case has been described in which solder is applied to the core wire of the electric wire in advance, but the present invention is not limited to this, and a fixed amount of solder in a solid or molten state is supplied to the connection portion heated by the electrode 3. You can do it like this. Furthermore,
In addition to solder, paste or the like may be supplied.
更に、本実施例においては電極を下側に、押圧部材を上
側に配置した場合について記述したが、これに限るもの
ではなく、電極を上側、且つ上下動可能に配置し、下側
にワークの載置台又は支持部材を配置して、電極自体に
より接続すべき電線とワークとの接続部を一定加圧力に
より加圧するようにしてもよい。Furthermore, in this embodiment, the case is described in which the electrode is placed on the lower side and the pressing member is placed on the upper side, but the present invention is not limited to this. A mounting table or a support member may be arranged to apply a constant pressure to the connection portion between the electric wire and the workpiece to be connected by the electrode itself.
（発明の効果）
４゜
以上説明したように本発明によれば、ノ１ンダによりワ
ークに電線を接続するノ１ンダ付け方法において、電極
と支持部材との少なくとも一方を常時強制冷却しておき
、これらの電極と支持部材との間に接続すべき電線とワ
ークとを加圧挾持し、前記電極を通電加熱させてハンダ
付けを行ない、前記強制冷却により通電終了直後の溶融
せるノ１ンダを急速に冷却させた後、加圧力を解除する
ようにしたことにより、迅速に且つ常に一定の条件でノ
１ンダ付けを行なうことが可能となるために接続不良等
を無くすことができる。更に、電極の電線との当接部位
に所要の型を形成しておけば、接続部の形状を一定にす
ることができるために画像処理等が容易となり、電線と
端子等のワークとの／％ンダ付け作業の自動化を図るこ
とが可能となり、これに伴い品質の向上、生産性の向上
、コストの低減を図ることが出来る等の優れた効果があ
る。(Effects of the Invention) 4. As explained above, according to the present invention, at least one of the electrode and the support member is forcedly cooled at all times in the soldering method of connecting the electric wire to the workpiece using the soldering. The electric wires and the workpiece to be connected are held between these electrodes and the support member under pressure, the electrodes are energized and heated to perform soldering, and the forced cooling causes the melted solder immediately after the energization ends. By releasing the pressurizing force after rapid cooling, it becomes possible to perform soldering quickly and always under constant conditions, thereby eliminating connection failures and the like. Furthermore, if a required mold is formed at the part where the electrode contacts the electric wire, the shape of the connection part can be made constant, making it easier to perform image processing, etc. It becomes possible to automate the soldering work, which has excellent effects such as improving quality, improving productivity, and reducing costs.
第１図は本発明に係る／％ンダ付け方法を実施しするた
めのハンダ付け装置の概略図、第２図は第１図の電極の
要部拡大図、第３図は第２図の電極と接続すべき電線と
の関係を示す図、第４図及び第５図は第１図のハンダ付
け装置によりワークに電線をハンダ付けする場合の説明
図、第６図は第５図に示すハンダ付け後の電線とワーク
との接続部の斜視図、第７図は第６図の矢線■−■に沿
う断面図、第８図は第２図に示す本発明に適用する電極
の他の実施例を示す要部拡大図、第９図は第８図の電極
を使用した場合の接続部の断面図、第１Ｏ図及び第１１
図は本発明に適用する電極の他の実施例を示す要部拡大
図、第１２図は電線とワークとのハンダ付けの状態の他
の例を示す要部拡大斜視図、第１３図及び第１４図は電
極を直接冷却する場合の電極の要部拡大図、第１５図及
び第１７図は電線とワークとのハンダ付けの態様を示す
斜視図、第１６図は第１５図の矢線ＸＶＩ−ＸＶＩに沿
う断面図である。
１・・・ハンダ付け装置、３．１Ｏ１１２・・・電極、
４・・・押圧部材、５・・・エアシリンダ、６・・・電
源、７・・・電極ホルダ、２０．２６．３１〜３３．４
１〜４３・・・接続端子、２１電線、
芯線、２３・・・ハンダ、３０゜
・・・プリント配線。
２２．３４〜３６・・・
４０・・・ワーク、Figure 1 is a schematic diagram of a soldering device for carrying out the /% soldering method according to the present invention, Figure 2 is an enlarged view of the main part of the electrode in Figure 1, and Figure 3 is the electrode in Figure 2. Figures 4 and 5 are explanatory diagrams for soldering wires to a workpiece using the soldering device shown in Figure 1, and Figure 6 is an illustration showing the relationship between A perspective view of the connection between the electric wire and the workpiece after attachment, FIG. 7 is a sectional view taken along the arrow line ■-■ in FIG. 6, and FIG. 8 is a perspective view of another electrode applied to the present invention shown in FIG. An enlarged view of the main part showing the embodiment, FIG. 9 is a sectional view of the connection part when the electrode of FIG. 8 is used, FIG. 1O and FIG.
The figure is an enlarged view of the main part showing another example of the electrode applied to the present invention, FIG. 12 is an enlarged perspective view of the main part showing another example of the state of soldering between the electric wire and the workpiece, Figure 14 is an enlarged view of the main part of the electrode when the electrode is directly cooled, Figures 15 and 17 are perspective views showing how the wire and workpiece are soldered, and Figure 16 is the arrow line XVI in Figure 15. - It is a sectional view along XVI. 1... Soldering device, 3.1O112... Electrode,
4... Pressing member, 5... Air cylinder, 6... Power supply, 7... Electrode holder, 20.26.31 to 33.4
1 to 43... Connection terminal, 21 electric wire, core wire, 23... Solder, 30°... Printed wiring. 22. 34-36... 40... Work,
Claims (2)
方法において、電極と支持部材との少なくとも一方を常
時強制冷却しておき、これらの電極と支持部材との間に
接続すべき電線とワークとを加圧挾持し、前記電極を通
電加熱させてハンダ付けを行ない、前記強制冷却により
通電終了直後の溶融せるハンダを急速に冷却させた後、
加圧力を解除することを特徴とするハンダ付け方法。(1) In a soldering method in which electric wires are connected to a workpiece by soldering, at least one of the electrode and the support member is constantly forcedly cooled, and the electric wire and the workpiece to be connected between the electrode and the support member are forcedly cooled. The electrodes are held under pressure and soldered by heating them with electricity, and the forced cooling rapidly cools the melted solder immediately after the electricity is applied.
A soldering method characterized by releasing pressure.
し、接続部を所定形状に成形することを特徴とする請求
項１記載のハンダ付け方法。(2) The soldering method according to claim 1, wherein the electrode is formed with a required mold at a portion where it comes into contact with the electric wire, and the connecting portion is molded into a predetermined shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27011889A JP2742454B2 (en) | 1989-10-16 | 1989-10-16 | Soldering equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27011889A JP2742454B2 (en) | 1989-10-16 | 1989-10-16 | Soldering equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03198975A true JPH03198975A (en) | 1991-08-30 |
| JP2742454B2 JP2742454B2 (en) | 1998-04-22 |
Family
ID=17481799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27011889A Expired - Lifetime JP2742454B2 (en) | 1989-10-16 | 1989-10-16 | Soldering equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2742454B2 (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010007375A3 (en) * | 2008-07-15 | 2010-04-22 | Cxr Limited | X-ray tube anodes |
| JP2012185985A (en) * | 2011-03-04 | 2012-09-27 | Auto Network Gijutsu Kenkyusho:Kk | Electric wire with terminal fitting, and method for manufacturing electric wire with terminal fitting |
| US8824637B2 (en) | 2008-09-13 | 2014-09-02 | Rapiscan Systems, Inc. | X-ray tubes |
| US9001973B2 (en) | 2003-04-25 | 2015-04-07 | Rapiscan Systems, Inc. | X-ray sources |
| US9208988B2 (en) | 2005-10-25 | 2015-12-08 | Rapiscan Systems, Inc. | Graphite backscattered electron shield for use in an X-ray tube |
| JP2016004846A (en) * | 2014-06-14 | 2016-01-12 | 株式会社アンド | Soldering device |
| US9420677B2 (en) | 2009-01-28 | 2016-08-16 | Rapiscan Systems, Inc. | X-ray tube electron sources |
| US9726619B2 (en) | 2005-10-25 | 2017-08-08 | Rapiscan Systems, Inc. | Optimization of the source firing pattern for X-ray scanning systems |
| US10483077B2 (en) | 2003-04-25 | 2019-11-19 | Rapiscan Systems, Inc. | X-ray sources having reduced electron scattering |
| CN110521060A (en) * | 2017-04-13 | 2019-11-29 | 泰科电子法国公司 | Device for welding together electric conductor and attachment device |
| US10901112B2 (en) | 2003-04-25 | 2021-01-26 | Rapiscan Systems, Inc. | X-ray scanning system with stationary x-ray sources |
| US10976271B2 (en) | 2005-12-16 | 2021-04-13 | Rapiscan Systems, Inc. | Stationary tomographic X-ray imaging systems for automatically sorting objects based on generated tomographic images |
| US11212902B2 (en) | 2020-02-25 | 2021-12-28 | Rapiscan Systems, Inc. | Multiplexed drive systems and methods for a multi-emitter X-ray source |
-
1989
- 1989-10-16 JP JP27011889A patent/JP2742454B2/en not_active Expired - Lifetime
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10483077B2 (en) | 2003-04-25 | 2019-11-19 | Rapiscan Systems, Inc. | X-ray sources having reduced electron scattering |
| US11796711B2 (en) | 2003-04-25 | 2023-10-24 | Rapiscan Systems, Inc. | Modular CT scanning system |
| US9001973B2 (en) | 2003-04-25 | 2015-04-07 | Rapiscan Systems, Inc. | X-ray sources |
| US10901112B2 (en) | 2003-04-25 | 2021-01-26 | Rapiscan Systems, Inc. | X-ray scanning system with stationary x-ray sources |
| US9208988B2 (en) | 2005-10-25 | 2015-12-08 | Rapiscan Systems, Inc. | Graphite backscattered electron shield for use in an X-ray tube |
| US9726619B2 (en) | 2005-10-25 | 2017-08-08 | Rapiscan Systems, Inc. | Optimization of the source firing pattern for X-ray scanning systems |
| US10976271B2 (en) | 2005-12-16 | 2021-04-13 | Rapiscan Systems, Inc. | Stationary tomographic X-ray imaging systems for automatically sorting objects based on generated tomographic images |
| GB2473592A (en) * | 2008-07-15 | 2011-03-16 | Cxr Ltd | X ray tube anodes |
| WO2010007375A3 (en) * | 2008-07-15 | 2010-04-22 | Cxr Limited | X-ray tube anodes |
| US8824637B2 (en) | 2008-09-13 | 2014-09-02 | Rapiscan Systems, Inc. | X-ray tubes |
| US9420677B2 (en) | 2009-01-28 | 2016-08-16 | Rapiscan Systems, Inc. | X-ray tube electron sources |
| JP2012185985A (en) * | 2011-03-04 | 2012-09-27 | Auto Network Gijutsu Kenkyusho:Kk | Electric wire with terminal fitting, and method for manufacturing electric wire with terminal fitting |
| JP2016004846A (en) * | 2014-06-14 | 2016-01-12 | 株式会社アンド | Soldering device |
| CN110521060A (en) * | 2017-04-13 | 2019-11-29 | 泰科电子法国公司 | Device for welding together electric conductor and attachment device |
| US11212902B2 (en) | 2020-02-25 | 2021-12-28 | Rapiscan Systems, Inc. | Multiplexed drive systems and methods for a multi-emitter X-ray source |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2742454B2 (en) | 1998-04-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH03198975A (en) | Soldering method | |
| US3750265A (en) | Method of preforming solder to a plurality of terminals | |
| CN107464909A (en) | The welding method of battery modules | |
| CN110100357A (en) | Device and method thereof for being welded on terminal on the glass pane of vehicle | |
| CN106238848B (en) | Non-contact type heating tin brazing method for metal structural part and PCB | |
| JPH10505191A (en) | Method of contacting high-current connecting members of an electrical component and an assembly manufactured using this method | |
| KR940002675B1 (en) | Apparatus for heating workpieces | |
| JPS63235081A (en) | Spot welding machine | |
| US5109147A (en) | Soldering tip for magnetic wire hookup | |
| US20200220277A1 (en) | Electric component having a connection region and method for producing a connection | |
| JP2008073728A (en) | Joining method of metallic member | |
| CN112820652B (en) | Method for removing Jin Tang tin from L-shaped welding terminal of QFN packaging device | |
| JP3211580B2 (en) | Soldering equipment | |
| US3916139A (en) | Method of soldering conductor ends to terminal | |
| EP1378308A1 (en) | Method for solder connection of coated lead wire to terminal of coil bobbin | |
| JP2006315043A (en) | Reflow welding equipment | |
| US3340600A (en) | Method of interconnecting conductors located on opposite sides of an insulating base | |
| JPH04137516A (en) | Method and device for connecting magnet wire with lead wire | |
| JPS60257587A (en) | Soldering method | |
| CN217114855U (en) | Binding post and motor | |
| CN217071063U (en) | Soldering bit for welding QFN (quad Flat No lead) packaging device | |
| JPH01221873A (en) | Conductor rail with contact pin | |
| JPS6348625B2 (en) | ||
| US3941971A (en) | Resistance brazing of solid copper parts to stranded copper parts with phos-silver | |
| CN1275047A (en) | Method for assembling coil on integrated circuit on small-sized electronic component by soldering |