JPS6348625B2 - - Google Patents
Info
- Publication number
- JPS6348625B2 JPS6348625B2 JP56173044A JP17304481A JPS6348625B2 JP S6348625 B2 JPS6348625 B2 JP S6348625B2 JP 56173044 A JP56173044 A JP 56173044A JP 17304481 A JP17304481 A JP 17304481A JP S6348625 B2 JPS6348625 B2 JP S6348625B2
- Authority
- JP
- Japan
- Prior art keywords
- heating
- chip
- heating chip
- terminals
- block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010438 heat treatment Methods 0.000 claims description 60
- 238000005476 soldering Methods 0.000 claims description 23
- 229910000679 solder Inorganic materials 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 14
- 229910003460 diamond Inorganic materials 0.000 claims description 7
- 239000010432 diamond Substances 0.000 claims description 7
- 230000004907 flux Effects 0.000 claims description 5
- 238000007664 blowing Methods 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims 4
- 238000003825 pressing Methods 0.000 claims 4
- 239000012212 insulator Substances 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 238000001816 cooling Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
- B23K3/047—Heating appliances electric
Description
【発明の詳細な説明】
本発明は、基板に部品をはんだ付けする方法及
び装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method and apparatus for soldering components to a board.
銅張積層板を用いたプリント配線基板及びセラ
ミツクを用いた配線基板への部品の接続には材料
費、組立コスト接続信頼性等の面で有利なSn―
Pbはんだを用いている。 For connecting components to printed wiring boards using copper-clad laminates and wiring boards using ceramics, Sn-- is advantageous in terms of material costs, assembly costs, connection reliability, etc.
Uses Pb solder.
また、部品リード線の配線基板への装着法は基
板に明けられた接続用スルーホールに部品リード
線を挿入した後、スルーホールとリード線をはん
だで接続するスルーホール接続法から配線基板の
平面上に設けられた接続用パターンに部品リード
線を平行に接触させ、両者をはんだで接続する平
面接続法に変わりつつある。 In addition, there are two ways to attach component lead wires to a wiring board: the through-hole connection method, in which the component lead wires are inserted into connection through-holes drilled in the board, and then the through-holes and lead wires are connected by soldering; The planar connection method is gradually changing to a planar connection method in which component lead wires are brought into contact with the connection pattern provided above in parallel and the two are connected by soldering.
平面接続法は、配線基板の接続用電極にあらか
じめ予備はんだを施こし、その後部品リード線を
予備はんだを施こした電極に接触させて、部品リ
ード線と前記電極を加熱して前記はんだを溶融さ
せ接続を行なつている。この場合耐熱性の低い部
品に対しては、部品本体及び部品本体に近い部分
に放熱治具または断熱治具を取り付けた状態で接
続部をはんだごてで加熱し、はんだ付けを行なつ
ていた。 In the planar connection method, preliminary soldering is applied to the connecting electrodes of the wiring board in advance, and then the component lead wires are brought into contact with the preliminary soldered electrodes, and the component lead wires and the electrodes are heated to melt the solder. connection is being made. In this case, for parts with low heat resistance, a heat dissipation jig or insulation jig was attached to the part itself and the part close to the part, and the connection part was heated with a soldering iron and soldered. .
ところが、この方法では、はんだ溶融後に位置
ずれを起こし、修正を必要とする。また、部品一
個の接続に長時間を要する等の作業性の面で不具
合が多く、さらに、部品寸法の小型化にともなつ
て作業不可能なものが出現してきた。 However, with this method, positional deviation occurs after the solder is melted, requiring correction. In addition, there are many problems in terms of workability, such as the long time it takes to connect one component, and furthermore, as the size of components has become smaller, some parts have become impossible to work with.
本発明の目的は、上記した従来技術の欠点をな
くし、部品に損傷を与えず作業性が良好で、小型
部品を効率よくはんだ付けできるはんだ付け方法
及び装置を提供するにある。 SUMMARY OF THE INVENTION An object of the present invention is to provide a soldering method and apparatus that eliminates the above-mentioned drawbacks of the prior art, has good workability without damaging components, and can efficiently solder small components.
本発明においては、熱伝導の良好な加熱チツプ
と、この加熱チツプの一端を、別に設けた加熱ブ
ロツクによつて必要時間のみ加熱するような加熱
ブロツクを有し、必要最小限の加熱時間と温度で
はんだ付けを行なうようにしたものである。 The present invention has a heating chip with good heat conduction and a heating block that heats one end of this heating chip only for the necessary time using a separately provided heating block, thereby minimizing the necessary heating time and temperature. It is designed to use soldering.
以下、本発明の実施例を図によつて説明する。
第１図は本発明になるはんだ付け方法及び装置の
一実施例を示す断面図、第２図は本発明によるは
んだ付け動作を説明するための断面図である。第
１図と第２図の同符号のものは同一の内容を示し
ている。 Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a cross-sectional view showing an embodiment of the soldering method and apparatus according to the present invention, and FIG. 2 is a cross-sectional view for explaining the soldering operation according to the present invention. Components with the same reference numerals in FIG. 1 and FIG. 2 indicate the same contents.
第１図において、基板１上に設けられた接続用
端子２上には、あらかじめはんだ３及びフラツク
ス４が供給されている。部品５に設けられた部品
端子６は、前記接続用端子２上に配置される。ダ
イヤモンドにて形成された加熱チツプ７は、加熱
チツプ保持体８に装着され、別に設けた加熱チツ
プ上下移動機構（図示せず）によつて任意に上下
できる。なお、加熱チツプ保持体は、断熱ブロツ
ク９に固定されている。ヒーター１０を組み込ん
だ加熱ブロツク１１の先端には熱供給ブロツク１
２が設けられており、加熱ブロツクにより常に加
熱されている。この熱供給ブロツク１２は、加熱
ブロツク１１とともに別に設けた（図示せず）熱
供給ブロツク上下移動機構によつて、任意に上下
移動が可能になつており、下降した場合チツプ保
持体８の上面に熱供給ブロツクの下面が面接触す
る構造になつている。 In FIG. 1, solder 3 and flux 4 are supplied in advance onto connection terminals 2 provided on a substrate 1. As shown in FIG. A component terminal 6 provided on the component 5 is arranged on the connection terminal 2. A heating chip 7 made of diamond is attached to a heating chip holder 8, and can be moved up and down as desired by a separately provided heating chip vertical movement mechanism (not shown). Note that the heating chip holder is fixed to a heat insulating block 9. A heat supply block 1 is installed at the tip of a heating block 11 incorporating a heater 10.
2 is provided and is constantly heated by a heating block. This heat supply block 12 can be moved up and down as desired by a heat supply block vertical movement mechanism (not shown) provided separately together with the heating block 11, and when it is lowered, it touches the top surface of the chip holder 8. The structure is such that the lower surfaces of the heat supply blocks are in surface contact.
熱供給ブロツクの先端には、熱電対１３が取り
付けられており、この熱電対１３の出力はコント
ローラー（図示せず）を介してヒーター１０の入
力電力を制御し熱供給ブロツク１２の先端温度を
常に設定温度に保持する構造になつている。 A thermocouple 13 is attached to the tip of the heat supply block, and the output of this thermocouple 13 controls the input power of the heater 10 via a controller (not shown) to constantly maintain the temperature at the tip of the heat supply block 12. It is structured to maintain the set temperature.
このような構成において、第２図ではんだ付け
動作の説明を行なう。 In such a configuration, the soldering operation will be explained with reference to FIG.
ａ図ははんだ付け直前の状態を示しており、ヒ
ーター１０は加熱され、その熱は加熱ブロツク１
１を介し熱供給ブロツク１２を設定温度に保つて
いる。熱供給ブロツク１２の端面より離れた位置
にチツプ保持体８及び加熱チツプ７が配置されて
いる。加熱チツプ７の端面下方に、端面から離れ
て、基板端子２上にはんだ３、フラツクス４が供
給され、その上に部品端子６が配置されている。
ｂ図は第一の工程で加熱チツプ７を下降させ部品
端子６上に加熱チツプ下端面を押し付ける。ｃ図
は第二の工程で熱供給ブロツク１２を下降させチ
ツプ保持体８の上端に熱供給ブロツク１２の下端
を押し付ける。この状態で熱供給ブロツク１２及
び加熱ブロツク１１ならびにヒーター１２からの
熱は、チツプ保持体８及び加熱チツプ７を通過し
て接続部に流れ込み、はんだ３を溶融させ、基板
端子２と部品端子６をはんだで接続する。 Figure a shows the state immediately before soldering, in which the heater 10 is heated and the heat is transferred to the heating block 1.
1 to maintain the heat supply block 12 at a set temperature. A chip holder 8 and a heating chip 7 are arranged at a position away from the end face of the heat supply block 12. Solder 3 and flux 4 are supplied onto the substrate terminal 2 below the end surface of the heating chip 7 and away from the end surface, and component terminals 6 are arranged thereon.
In Figure b, in the first step, the heating chip 7 is lowered and the lower end surface of the heating chip is pressed onto the component terminal 6. In the second step shown in Figure c, the heat supply block 12 is lowered and the lower end of the heat supply block 12 is pressed against the upper end of the chip holder 8. In this state, the heat from the heat supply block 12, heating block 11, and heater 12 passes through the chip holder 8 and heating chip 7, flows into the connection part, melts the solder 3, and connects the board terminal 2 and component terminal 6. Connect with solder.
本実施例では、ダイヤモンドチツプ先端径1.0
ミリメートル部品径0.4ミリメートル、基板は1.0
ミリメートル厚さの銅張り樹脂積層板上に３ミリ
メートル×４ミリメートルの銅パターンを有する
ものを使用し、錫60パーセント残り鉛のフラツク
ス入ペーストはんだを用いて熱供給ブロツク温度
300℃に設定した場合、２〜３秒ではんだ付けが
完了することを確認した。ｃ図に示す状態で一定
時間保つた後、ｄ図に示す第三の工程に移る。ｄ
図において加熱チツプは接続個所を押さえた状態
で、熱供給ブロツク１２のみ上方に引き上げる。
この状態で加熱チツプ７及びはんだ接続部への熱
供給は停止され、接続部は基板１の板厚方向及び
廻りの空気中への熱放散により急激に温度がさが
り、接続部のはんだ３は凝固する。はんだ凝固後
に加熱チツプ７を上方に持ち上げこれではんだ付
けが完了する。 In this example, the diamond tip tip diameter is 1.0.
mm part diameter 0.4mm, board 1.0
Using a 3mm x 4mm copper pattern on a millimeter-thick copper-clad resin laminate, the heat supply block temperature was set using a flux-cored paste solder with 60% tin and the rest lead.
It was confirmed that soldering was completed in 2 to 3 seconds when the temperature was set to 300°C. After maintaining the state shown in Figure c for a certain period of time, proceed to the third step shown in Figure d. d
In the figure, only the heat supply block 12 is pulled up while the heating chip is holding down the connection point.
In this state, the heat supply to the heating chip 7 and the solder joint is stopped, and the temperature of the joint rapidly decreases due to heat dissipation in the thickness direction of the board 1 and into the surrounding air, and the solder 3 at the joint solidifies. do. After the solder has solidified, the heating chip 7 is lifted upwards to complete the soldering.
第３図は本発明になる他の実施例を示す断面図
で断熱ブロツク９内に気体を通す穴１４及び１
４′を設けたものである。他の符号は図１及び図
２と同じ内容を示している。 FIG. 3 is a sectional view showing another embodiment of the present invention.
4' is provided. Other symbols indicate the same contents as in FIGS. 1 and 2.
第３図に示す構造にすることにより、第２図ｄ
で説明した、はんだ付け後の接続部の冷却に対し
第３図に示す孔１４及び１４′を通しＡ方向に冷
却された気体を吹きつけ加熱チツプ７、および接
続部を急速に冷却するとともに部品５にも同時に
吹きつけることにより、耐熱性の悪い部品の熱に
よるダメージを防止する。 By making the structure shown in Fig. 3, Fig. 2 d
In order to cool the joints after soldering as explained in 1.3, cooled gas is blown in the direction A through the holes 14 and 14' shown in FIG. By spraying 5 at the same time, heat damage to parts with poor heat resistance can be prevented.
以上述べたように本発明によれば、加熱前の加
熱チツプにて接続部の部品リード線を挿え、はん
だを溶融させる時間のみ熱供給をする構造である
ため、部品本体への熱影響を非常に小さくでき
る。 As described above, according to the present invention, the component lead wire of the connection part is inserted in the heating chip before heating, and heat is supplied only during the time to melt the solder, so the thermal influence on the component body is reduced. Can be made very small.
また、はんだ付け後、部品リード線を加熱チツ
プで押えた状態で冷却するため位置ずれ、部品リ
ード線の浮上り等の不良を防止することができ、
さらにチツプ形状を小さくすることにより従来方
法では不可能であつた小型部品にも適用できる。
また、加熱チツプ先端は熱伝導が良好で、はんだ
及びフラツクス等の付着が少ないダイヤモンドを
使用しているため、長時間の連続作業が可能であ
り、はんだ付けの自動化が容易にできる。 In addition, after soldering, the component lead wires are cooled while being held down by the heating chip, which prevents defects such as misalignment and floating of the component lead wires.
Furthermore, by reducing the size of the chip, it can be applied to small parts that were not possible using conventional methods.
In addition, the tip of the heating chip uses diamond, which has good thermal conductivity and has little adhesion of solder and flux, so it can be used continuously for long periods of time, and soldering can be easily automated.
さらに、はんだ付け後の部品への冷気吹き付け
により、耐熱性の悪い部品の自動はんだ付け作業
が可能である。 Furthermore, by blowing cold air onto the parts after soldering, it is possible to automatically solder parts with poor heat resistance.
第１図は本発明になるはんだ付け方法及び装置
の一実施例を示す断面図、第２図は本発明による
はんだ付け動作を説明するための断面図、第３図
は本発明になるはんだ付け方法及び装置の他の実
施例を示す断面図である。
１…基板、２…基板端子、３…はんだ、５…部
品、６…部品端子、７…加熱チツプ、１１…加熱
ブロツク、１２…熱供給ブロツク。
FIG. 1 is a cross-sectional view showing an embodiment of the soldering method and apparatus according to the present invention, FIG. 2 is a cross-sectional view for explaining the soldering operation according to the present invention, and FIG. FIG. 6 is a cross-sectional view of another embodiment of the method and apparatus. DESCRIPTION OF SYMBOLS 1... Board, 2... Board terminal, 3... Solder, 5... Component, 6... Component terminal, 7... Heating chip, 11... Heating block, 12... Heat supply block.
Claims (1)
低融点金属で接続する方法において、ダイヤモン
ドからなる加熱チツプと、この加熱チツプの一端
に押し付けることにより加熱チツプに熱供給を行
なう加熱ブロツクを、低融点はんだとフラツクス
を供給した基板端子と電子部品端子を位置合わせ
した位置に配置しこの両端子に加熱チツプを押し
付け、次いで加熱ブロツクを加熱チツプに押し付
け、一定時間経過後にブロツクを加熱チツプから
離し、さらに一定時間経過後加熱チツプを該端子
から離すことを特徴とする、はんだ付け方法。 ２ 部品接続用の端子を有する基板に電子部品を
低融点金属で接続する方法において、ダイヤモン
ドからなる加熱チツプと、この加熱チツプの一端
に押し付けることにより加熱チツプに熱供給を行
なう加熱ブロツクを、低融点はんだとフラツクス
を供給した基板端子と電子部品端子を位置合わせ
した位置に配置しこの両端子に加熱チツプを押し
付け、次いで加熱ブロツクを加熱チツプに押し付
け、一定時間経過後に加熱ブロツクを加熱チツプ
から離し、加熱チツプ、上記両端子、部品に気体
を吹きつけ、さらに一定時間経過後加熱チツプを
該端子から離すことを特徴とするはんだ付け方
法。 ３ ダイヤモンドからなる加熱チツプを、チツプ
保持体及び断熱体によつて保持する機構と、この
加熱チツプの一端に押しつけることにより加熱チ
ツプに熱供給を行ない、離脱することによつて熱
供給を停止する加熱ブロツクと、この加熱チツプ
を含む機構を上下に移動させる機構と、この加熱
ブロツクを前記加熱チツプと独立に上下に移動さ
せる機構とを有することを特徴とするはんだ付け
装置。 ４ ダイヤモンドからなる加熱チツプを、チツプ
保持体及び断熱体によつて保持する機構と、該加
熱チツプの一端に押し付けることにより加熱チツ
プに熱供給を行ない、離脱することによつて熱供
給を停止する加熱ブロツクと、該加熱チツプを含
む機構を上下に移動させる機構と該加熱ブロツク
を該加熱チツプと独立に上下に移動させる機構
と、加熱チツプ、はんだ付けされた位置、部品を
冷却する機構とを有することを特徴とするはんだ
付け装置。[Claims] 1. A method of connecting electronic components to a board having terminals for connecting components using a low-melting point metal, which includes a heating chip made of diamond and heat supplied to the heating chip by pressing the heating chip against one end of the heating chip. Place the heating block at a position where the board terminals to which low-melting point solder and flux have been supplied and the electronic component terminals are aligned, press the heating chip against both terminals, then press the heating block against the heating chip, and after a certain period of time have passed the block. A soldering method characterized by separating the terminal from the heated chip, and further separating the heated chip from the terminal after a certain period of time has elapsed. 2. In a method of connecting electronic components to a board having terminals for connecting components using a low-melting point metal, a heating chip made of diamond and a heating block that supplies heat to the heating chip by pressing it against one end of the heating chip are used. Place the board terminals to which melting point solder and flux have been supplied and the electronic component terminals in aligned positions, press the heating chip against both terminals, then press the heating block against the heating chip, and after a certain period of time, remove the heating block from the heating chip. . A soldering method characterized by blowing gas onto the heated chip, the above-mentioned terminals, and the components, and then separating the heated chip from the terminals after a certain period of time has elapsed. 3. A mechanism for holding a heating chip made of diamond by a chip holder and a heat insulator, and supplying heat to the heating chip by pressing it against one end of the heating chip, and stopping the heat supply by removing it. A soldering apparatus comprising a heating block, a mechanism for vertically moving a mechanism including the heating chip, and a mechanism for vertically moving the heating block independently of the heating chip. 4. A mechanism for holding a heating chip made of diamond by a chip holder and a heat insulator, supplying heat to the heating chip by pressing it against one end of the heating chip, and stopping the heat supply by removing it. A heating block, a mechanism for vertically moving a mechanism including the heating chip, a mechanism for vertically moving the heating block independently of the heating chip, and a mechanism for cooling the heating chip, soldered positions, and components. A soldering device comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17304481A JPS5877769A (en) | 1981-10-30 | 1981-10-30 | Method and device for soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17304481A JPS5877769A (en) | 1981-10-30 | 1981-10-30 | Method and device for soldering |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5877769A JPS5877769A (en) | 1983-05-11 |
| JPS6348625B2 true JPS6348625B2 (en) | 1988-09-29 |
Family
ID=15953159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17304481A Granted JPS5877769A (en) | 1981-10-30 | 1981-10-30 | Method and device for soldering |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5877769A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61119374A (en) * | 1984-11-16 | 1986-06-06 | Toshiba Corp | Soldering device |
| JPH0489175A (en) * | 1990-08-01 | 1992-03-23 | Nippondenso Co Ltd | Soldering iron |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5653581Y2 (en) * | 1978-08-29 | 1981-12-14 |
-
1981
- 1981-10-30 JP JP17304481A patent/JPS5877769A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5877769A (en) | 1983-05-11 |
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