JPH03193342A - Manufacture of laminated sheet - Google Patents
Manufacture of laminated sheetInfo
- Publication number
- JPH03193342A JPH03193342A JP1331193A JP33119389A JPH03193342A JP H03193342 A JPH03193342 A JP H03193342A JP 1331193 A JP1331193 A JP 1331193A JP 33119389 A JP33119389 A JP 33119389A JP H03193342 A JPH03193342 A JP H03193342A
- Authority
- JP
- Japan
- Prior art keywords
- strength
- glass cloth
- tensile strength
- glass fiber
- improved
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 239000004744 fabric Substances 0.000 claims abstract description 15
- 239000011521 glass Substances 0.000 claims abstract description 14
- 239000003365 glass fiber Substances 0.000 claims abstract description 11
- 229920005989 resin Polymers 0.000 claims abstract description 6
- 239000011347 resin Substances 0.000 claims abstract description 6
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims abstract description 4
- 239000003822 epoxy resin Substances 0.000 abstract description 5
- 229920000647 polyepoxide Polymers 0.000 abstract description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract 1
- 238000005452 bending Methods 0.000 abstract 1
- 239000005007 epoxy-phenolic resin Substances 0.000 abstract 1
- 230000002349 favourable effect Effects 0.000 abstract 1
- 229920001568 phenolic resin Polymers 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 210000000936 intestine Anatomy 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Laminated Bodies (AREA)
- Moulding By Coating Moulds (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は従来の積層板に比べ、板厚０．６閤以下の薄い
ものにおいて、熱時の反りやたわみ性の改良された積層
板に関するものである。Detailed Description of the Invention [Industrial Application Field] The present invention relates to a laminate that is thinner than conventional laminates, with a thickness of 0.6 mm or less, and has improved warpage and flexibility when heated. It is something.
近年、プリント配線板は極めて広範囲の用途に使用され
ており、このプリント配線板を構成する積層板に対する
要求特性も益々多岐に渡っている。In recent years, printed wiring boards have been used in an extremely wide range of applications, and the characteristics required of the laminates constituting these printed wiring boards have become increasingly diverse.
こうした中で電子機器の小型軽量化に伴い、プリント配
線板の薄型化への要求が強まっている。Under these circumstances, as electronic devices become smaller and lighter, there is an increasing demand for thinner printed wiring boards.
しかしながら、リフローソルダーやソルダーレベラー時
に薄板のため反り、たわみが生じ、部品の実装精度が低
下するといった問題が発生している。However, due to the thin plate, warpage and deflection occur during reflow soldering and solder leveling, resulting in problems such as reduced component mounting accuracy.
本発明者は、板厚０．６−以下の薄板において熱時反り
及びたわみ性の優れている積層板を得んとして研究した
結果、基材として常温での引張強度が４５０ｋｇｆ／閣
寡以上であるガラス繊維を用いて作られた高強度ガラス
クロスを使用することにより、熱時の反り及びたわみを
抑えられるとの知見を得たものである。その目的とする
ところは熱時反り及びたわみ性に優れていて、通常のも
のと同等の電気的及び機械的体転性を有する積層板を提
供するにある。The present inventor conducted research to obtain a laminate with excellent heat warpage and flexibility in a thin plate with a thickness of 0.6 mm or less, and found that as a base material, the tensile strength at room temperature is 450 kgf/min or more. It was discovered that by using a high-strength glass cloth made from a certain type of glass fiber, warpage and deflection during heating can be suppressed. The purpose is to provide a laminate that is excellent in warpage and flexibility when heated and has electrical and mechanical rollability equivalent to that of ordinary laminates.
本発明は、常温での引張強度が４５０ ｋｇｆ／ｗｍ”
以上であるガラス繊維を用いて作られた高強度ガラスク
ロスに熱硬化性樹脂を含浸乾燥し、得られたプリプレグ
を積層成形して板厚０．６閣以下の積層板を得ることを
特徴とする積層板の製造方法である。The present invention has a tensile strength of 450 kgf/wm at room temperature.
The feature is that a high-strength glass cloth made using the above glass fiber is impregnated with a thermosetting resin and dried, and the obtained prepreg is laminated and molded to obtain a laminate with a thickness of 0.6 mm or less. This is a method for manufacturing a laminate.
高強度のガラス繊維を使用したガラスクロスを使用する
と、熱時の反り及びたわみが防止できる理由は、通常の
ガラス繊維に比べ引張強度が常温で約３６％、高温で約
４０％向上し、引張弾性率も約１６％向上しているため
特に熱時の剛性が大きいことによると考えられる。また
耐熱性に関して熱膨張係数が約４４％減少し、軟化点が
約１６％向上していることも挙げられる。The reason why glass cloth made from high-strength glass fibers can prevent warping and deflection when heated is that the tensile strength is approximately 36% higher at room temperature and approximately 40% higher at high temperatures compared to ordinary glass fibers. The elastic modulus was also improved by about 16%, which is thought to be due to the high rigidity especially when heated. Regarding heat resistance, the coefficient of thermal expansion is reduced by about 44%, and the softening point is improved by about 16%.
通常のガラスクロスに対して、本発明に使用するガラス
クロスを比較すると、ガラス繊維の常温での引張強度は
通常のガラスクロスが３００〜４００ ｋｇｆ／ｗｍ”
に対し、高強度ガラスクロスが４５０ ｋｇｆ／閣２以
上２以上（３７０℃）での引張強度は２００〜３００
ｋｇｆ／ｗｍ”に対し、３５０ ｋｇｆ／ｍ富以上、引
張り弾性率は７０００〜７５００ｋｇｆ／ｍ”に対し、
８３００ ｋｇｆ／ｍ”以上である。更に熱膨張係数は
約５． ＯＸ １０−’／”Ｃに対し、３．０×１０−
’／”Ｃ以下である。When comparing the glass cloth used in the present invention with ordinary glass cloth, the tensile strength of the glass fiber at room temperature is 300 to 400 kgf/wm.
On the other hand, high-strength glass cloth has a tensile strength of 200 to 300 at 450 kgf/kaku2 or above (370℃).
kgf/wm”, 350 kgf/m or more, tensile modulus is 7000-7500 kgf/m”,
8300 kgf/m" or more. Furthermore, the thermal expansion coefficient is approximately 5. OX 10-'/"C, 3.0 x 10-
'/''C or less.
熱硬化性樹脂としては、エポキシ樹脂、フェノール樹脂
などであるが、本発明においては高強度ガラスクロスの
特長を十分に発揮させるために、エポキシ樹脂が好まし
い。Examples of thermosetting resins include epoxy resins and phenol resins, and in the present invention, epoxy resins are preferred in order to fully exhibit the features of the high-strength glass cloth.
以下に本発明の内容を詳しく述べる為、実施例及び比較
例を記す。Examples and comparative examples will be described below to describe the content of the present invention in detail.
エポキシ樹脂（油化シェルエポキシ製エピコート１００
１）に対し、ジシアンジアミドを３部加え混合した０次
に、常温での引張強度が３５０ｋｇｆ ／ ｗｍ ”の
ガラス繊維を使用した厚さ１８０μｍ、重量２１０ ｇ
／ｉｆの通常のガラスクロス及び常温での引張強度が４
９０ｋｇｆ／閣”＃ＦＪ！：のガラス繊維を使用した高
強度ガラスクロスに積層成形後の厚さが１８０μｍにな
る様にそれぞれ前記フェスを塗布乾燥してプリプレグを
作製した。Epoxy resin (Epicoat 100 made by Yuka Shell Epoxy)
For 1), 3 parts of dicyandiamide was added and mixed, and glass fiber with a tensile strength of 350 kgf/wm at room temperature was used, the thickness was 180 μm, and the weight was 210 g.
/if normal glass cloth and tensile strength at room temperature is 4
A prepreg was prepared by applying the above-mentioned cloth to a high-strength glass cloth using glass fiber of 90 kgf/kaku "#FJ!" so that the thickness after lamination molding would be 180 μm and drying.
次に、これらのプリプレグを板厚０．６閣の場合は３枚
、０．４■の場合は２枚重ね、両表面に１８μｍの銅箔
をさらに重ねた後、加熱加圧してそれぞれ積層板を得た
。Next, three sheets of these prepregs are stacked in the case of a board thickness of 0.6cm, and two sheets are stacked in the case of 0.4cm, and after further overlapping 18μm copper foil on both surfaces, each laminate is made by heating and pressing. I got it.
これらの積層板について、次のようにして反り及びたわ
み性を測定した。Warpage and flexibility of these laminates were measured as follows.
得られた両面鋼張積層板を全面エツチングした後、１０
Ｘ５５腸の大きさに切断し、これを試験片とした。この
試験片を１５０℃で５分間乾燥した後、一端を２０■固
定し、もう一端から５−の位置に５０ｇの荷重をかけ、
そのたわみ量を測定した。その後荷重をかけたままの状
態で１４０℃２０分間加熱した後、再度たわみ量を測定
し、最初の測定値との差を熱時のたわみ量とした。After etching the entire surface of the obtained double-sided steel clad laminate,
It was cut into a size of X55 intestine and used as a test piece. After drying this test piece at 150°C for 5 minutes, one end was fixed at 20cm, and a load of 50g was applied from the other end to the 5- position.
The amount of deflection was measured. Thereafter, after heating at 140° C. for 20 minutes with the load still applied, the amount of deflection was measured again, and the difference from the first measured value was taken as the amount of deflection during heating.
その結果を第１表に示す。The results are shown in Table 1.
第１表より熱時のたわみ量は高強度ガラスクロスを使用
することにより０．６ｍｍ厚の積層板で５０％、０．４
■厚の積層板で３０％減少していることがわかる。From Table 1, the amount of deflection when heated is 50% for a 0.6 mm thick laminate by using high-strength glass cloth, and 0.4
■It can be seen that there is a 30% reduction in the thickness of the laminate.
本発明で得られる積層板は板厚０．６閣以下の薄い積層
板において、通常の積層板に比較して反り及びたわみ性
に優れているという特長を有している。The laminate obtained by the present invention is a thin laminate with a thickness of 0.6 mm or less, and has the advantage of being superior in warpage and flexibility compared to ordinary laminates.
従って、リフローソルダーやソルダーレベラー時におけ
る反りやたわみ量を減少させ部品の実装精度を向上させ
ることができ、更に通常の積層板ないしコンポジット材
と同等の加工が可能であることから、
工業的な熱時反り及びたわみ性に優れ
たプリント配線板の製造に最適である。Therefore, it is possible to reduce the amount of warpage and deflection during reflow soldering and solder leveling, and improve the mounting accuracy of parts.Furthermore, it is possible to process the same as ordinary laminates or composite materials, so it is possible to use industrial heat. Ideal for manufacturing printed wiring boards with excellent warpage and flexibility.
Claims (1)
であるガラス繊維を用いて作られた高強度ガラスクロス
に熱硬化性樹脂を含浸乾燥し、得られたプリプレグを積
層成形して板厚０．６ｍｍ以下の積層板を得ることを特
徴とする積層板の製造方法。(1) A high-strength glass cloth made using glass fiber with a tensile strength of 450 kgf/mm^2 or more at room temperature is impregnated with a thermosetting resin and dried, and the resulting prepreg is laminated and molded to determine the thickness of the plate. A method for manufacturing a laminate, characterized by obtaining a laminate with a thickness of 0.6 mm or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1331193A JPH03193342A (en) | 1989-12-22 | 1989-12-22 | Manufacture of laminated sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1331193A JPH03193342A (en) | 1989-12-22 | 1989-12-22 | Manufacture of laminated sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03193342A true JPH03193342A (en) | 1991-08-23 |
Family
ID=18240931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1331193A Pending JPH03193342A (en) | 1989-12-22 | 1989-12-22 | Manufacture of laminated sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03193342A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150043384A (en) | 2012-10-12 | 2015-04-22 | 쇼와 덴코 가부시키가이샤 | Composite carbon particle and lithium-ion secondary cell using same |
-
1989
- 1989-12-22 JP JP1331193A patent/JPH03193342A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150043384A (en) | 2012-10-12 | 2015-04-22 | 쇼와 덴코 가부시키가이샤 | Composite carbon particle and lithium-ion secondary cell using same |
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