JP2508981B2 - Multilayer printed wiring board and manufacturing method thereof - Google Patents
Multilayer printed wiring board and manufacturing method thereofInfo
- Publication number
- JP2508981B2 JP2508981B2 JP22628893A JP22628893A JP2508981B2 JP 2508981 B2 JP2508981 B2 JP 2508981B2 JP 22628893 A JP22628893 A JP 22628893A JP 22628893 A JP22628893 A JP 22628893A JP 2508981 B2 JP2508981 B2 JP 2508981B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- wiring board
- printed wiring
- different circular
- surface mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Description
【発明の詳細な説明】Detailed Description of the Invention
【０００１】[0001]
【産業上の利用分野】本発明は多層印刷配線板とその製
造方法に関し、特に表面実装用パッドの領域内に非貫通
スルーホールを有する多層印刷配線板とその製造方法に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer printed wiring board and a method of manufacturing the same, and more particularly to a multilayer printed wiring board having a non-penetrating through hole in the area of a surface mounting pad and a method of manufacturing the same.
【０００２】[0002]
【従来の技術】図４は従来の表面実装用パッド内に非貫
通スルーホールを設けた多層印刷配線板の一例の一部切
欠き斜視図である。2. Description of the Related Art FIG. 4 is a partially cutaway perspective view of an example of a conventional multilayer printed wiring board in which a non-penetrating through hole is provided in a surface mounting pad.
【０００３】図４に示すように、従来の表面実装用パッ
ド１９の領域内に非貫通スルーホール９を有する多層印
刷配線板２３は、絶縁体２２，スルーホール１６，表面
実装用パッド１９，凹部６７，非貫通スルーホール９，
表面回路１８，内部回路２０，電源・ＧＮＤ層２１等に
よって構成され、非貫通スルーホール９の形状はドリル
にて貫通穴が設けられ円形に形成されていた。As shown in FIG. 4, a multilayer printed wiring board 23 having a non-penetrating through hole 9 in the area of a conventional surface mounting pad 19 has an insulator 22, a through hole 16, a surface mounting pad 19, and a recess. 67, non-through through-hole 9,
The surface circuit 18, the internal circuit 20, the power supply / GND layer 21, etc. were formed, and the shape of the non-through hole 9 was circular with a through hole provided by a drill.
【０００４】図５（ａ）〜（ｉ）は従来の多層印刷配線
板の製造方法の一例を説明する工程順に示した断面図で
ある。従来の多層印刷配線板２３は、まず、図５（ａ）
に示すように、１８μｍの銅箔１を両面に有する０．１
ｍｍ厚のガラス繊維強化エポキシ基材を用いた積層板２
を用意する。次に、図５（ｂ）に示すように、積層板２
の表裏回路のスルーホール接続を行う部分と表面実装用
パッド１９を形成する部分にドリルを用いて円形の貫通
穴５３を形成する。次に、図５（ｃ）に示すように、貫
通穴５３の壁面を含む積層板２の全面に無電解銅めっき
を施した後電解銅めっきを施し厚み２０μｍの銅めっき
層４と円形のスルーホール５５を形成する。次に、図５
（ｄ）に示すように、多層印刷配線板２３の内部回路２
０となる側の積層板２の片側表面に印刷−エッチング法
により導電回路７を形成し両面印刷配線板８を得る。5 (a) to 5 (i) are cross-sectional views showing a sequence of steps for explaining an example of a conventional method for manufacturing a multilayer printed wiring board. The conventional multilayer printed wiring board 23 is first shown in FIG.
As shown in, 0.1 having a copper foil 1 of 18 μm on both sides
Laminated board 2 using mm-thick glass fiber reinforced epoxy substrate
To prepare. Next, as shown in FIG. 5B, the laminated plate 2
A circular through hole 53 is formed by using a drill in the portion where the through-hole connection of the front and back circuits and the portion where the surface mounting pad 19 is formed. Next, as shown in FIG. 5C, electroless copper plating is performed on the entire surface of the laminated plate 2 including the wall surface of the through hole 53 and then electrolytic copper plating is performed to form a copper plating layer 4 having a thickness of 20 μm and a circular through hole. The hole 55 is formed. Next, FIG.
As shown in (d), the internal circuit 2 of the multilayer printed wiring board 23 is
A conductive circuit 7 is formed on one surface of the laminated plate 2 on the side of 0 by a printing-etching method to obtain a double-sided printed wiring board 8.
【０００５】次に、図５（ｅ）に示すように、このよう
にして得られた２枚の両面印刷配線板８を予め準備して
おいた電源・ＧＮＤ用両面印刷配線板１０をプリプレグ
６を介して積層し加熱，圧着して積層体１１を形成す
る。このとき、積層体１１の表面にあふれ出たプリプレ
グ６の樹脂を除去し表面を平滑にし樹脂部６２を形成す
る。次に、図５（ｆ）に示すように、積層体１１をプラ
ズマエッチング装置によりガスプラズマ処理を行い樹脂
部６２の表面をエッチング除去し溝６３を形成する。次
に、図５（ｇ）に示すように、積層体１１に貫通穴１４
を設ける。次に、図５（ｈ）に示すように、貫通穴１４
の壁面と溝６３の底面を含む積層体１１の全面に無電解
銅めっきを施した後電解銅めっきを施し厚み３０μｍの
銅めっき層１５，凹部６７，非貫通スルーホール９，ス
ルーホール１６を形成する。次に、図５（ｉ）に示すよ
うに、印刷−エッチング法により積層体１１の表面の銅
層をエッチングし円形の表面実装用パッド６９，円形の
非貫通スルーホール９，スルーホール１６，表面回路１
８を形成し、内部回路２０，電源・ＧＮＤ層２１を含む
多層印刷配線板２３を得る。Next, as shown in FIG. 5 (e), the two-sided printed wiring board 8 thus obtained is preliminarily prepared with the two-sided printed wiring board 10 for power supply / GND prepared in advance. Then, the laminated body 11 is formed by laminating and heating and pressure bonding. At this time, the resin of the prepreg 6 overflowing on the surface of the laminated body 11 is removed to smooth the surface and form the resin portion 62. Next, as shown in FIG. 5F, the laminated body 11 is subjected to gas plasma treatment by a plasma etching apparatus to remove the surface of the resin portion 62 by etching to form a groove 63. Next, as shown in FIG. 5G, the through hole 14 is formed in the laminated body 11.
To provide. Next, as shown in FIG.
The entire surface of the laminated body 11 including the wall surface of No. 1 and the bottom surface of the groove 63 and then electrolytic copper plating to form a copper plating layer 15 having a thickness of 30 μm, a recess 67, a non-penetrating through hole 9 and a through hole 16. To do. Next, as shown in FIG. 5 (i), the copper layer on the surface of the laminate 11 is etched by a printing-etching method to form a circular surface mounting pad 69, a circular non-through hole 9, a through hole 16, and a surface. Circuit 1
8 is formed to obtain a multilayer printed wiring board 23 including an internal circuit 20 and a power supply / GND layer 21.
【０００６】このようにして得られた従来の多層印刷配
線板２３は、非貫通スルーホール９の形状が円形に形成
されるが、通常のテンティング工法でスルーホールを形
成するために図４に示す表面実装用パッド導体幅２４が
必要であるため非貫通スルーホール９の穴径は表面実装
用パッド１９から表面実装用パッド導体幅２５の２倍を
引いた値となり表面実装用パッド１９より大きく設定で
きないため、非貫通スルーホール９と表面実装用パッド
１９の接続面積が小さくなる。In the conventional multilayer printed wiring board 23 thus obtained, the non-penetrating through holes 9 are formed in a circular shape, but the through holes are formed by a normal tenting method as shown in FIG. Since the surface mounting pad conductor width 24 shown is necessary, the hole diameter of the non-penetrating through hole 9 is a value obtained by subtracting twice the surface mounting pad conductor width 25 from the surface mounting pad 19 and larger than the surface mounting pad 19. Since it cannot be set, the connection area between the non-through through hole 9 and the surface mounting pad 19 becomes small.
【０００７】一方、非貫通スルーホール９と表面実装用
パッド１９の接続面積を増やすため非貫通スルーホール
９の穴径を大きく設定すると、非貫通スルーホール９が
表面実装用パッド１９の端に接続しなくなり非貫通スル
ーホール９は形成できなくなる。On the other hand, if the diameter of the non-through through hole 9 is set large in order to increase the connection area between the non-through through hole 9 and the surface mounting pad 19, the non-through through hole 9 is connected to the end of the surface mounting pad 19. The non-through through hole 9 cannot be formed.
【０００８】このように従来の多層印刷配線板では、表
面実装用パッド１９と非貫通スルーホール９の接続強度
を強めることは困難であった。As described above, in the conventional multilayer printed wiring board, it was difficult to increase the connection strength between the surface mounting pad 19 and the non-penetrating through hole 9.
【０００９】[0009]
【発明が解決しようとする課題】上述した従来の多層印
刷配線板では、非貫通スルーホールと表面実装用パッド
の接続面積が小さく部品実装における熱ストレス又は機
械的ストレスに対し接続信頼性の保証が困難であるとい
う問題点があった。In the conventional multilayer printed wiring board described above, the connection area between the non-penetrating through hole and the surface mounting pad is small, and the connection reliability is guaranteed against thermal stress or mechanical stress during component mounting. There was a problem that it was difficult.
【００１０】本発明の目的は表面実装用パッドと非貫通
スルーホールの接続部の機械的強度が強く、信頼性の高
い多層印刷配線板とその製造方法を提供することにあ
る。An object of the present invention is to provide a multilayer printed wiring board having high mechanical strength at a connecting portion between a surface mounting pad and a non-penetrating through hole and having high reliability, and a manufacturing method thereof.
【００１１】[0011]
【課題を解決するための手段】本発明は、表面実装用パ
ッドの領域に非貫通スルーホールを有する多層印刷配線
板において、前記表面実装用パッドと、この表面実装用
パッドの領域内にこの表面実装用パッドの外周よりも小
さく表面実装部品のリードの外周よりも大きく形成され
た異円形非貫通スルーホールとを有し、前記表面実装用
パッドの前記異円形非貫通スルーホールと対応する表面
が凹状に形成されている。According to the present invention, there is provided a multilayer printed wiring board having a non-penetrating through hole in the surface mounting pad area, and the surface mounting pad and the surface mounting pad in the area. A different circular non-penetrating through hole formed smaller than the outer periphery of the mounting pad and larger than the outer periphery of the lead of the surface mounting component, and the surface corresponding to the different circular non penetrating through hole of the surface mounting pad is It is formed in a concave shape.
【００１２】本発明の多層印刷配線板の製造方法は、両
面に銅張りした積層板に異円形貫通穴を設ける工程と、
この積層板の前記異円形貫通穴の内壁を含む全面に銅め
っきを施し銅めっき層を被覆して異円形スルーホールを
形成する工程と、この積層板の片面のみ前記銅めっき層
及び銅張りの銅層部分を印刷−エッチング法にて導電回
路を形成し両面印刷配線板を形成する工程と、この両面
印刷配線板の前記導電回路を形成した面を内側にしてあ
らかじめ導電回路が形成された電源・ＧＮＤ用両面印刷
配線板と共に前記異円形スルーホールと対応する位置に
同一形状の異円形貫通穴が設けられたプリプレグを介し
て加熱，圧着して積層体を形成すると同時に、前記異円
形スルーホール内の前記プリプレグの樹脂を除去し充填
量をコントロールして溝を形成する工程と、この積層体
に貫通穴を設けこの貫通穴の内壁と前記溝を含む表面全
体に銅めっきを施し銅めっき層を被覆して異円形非貫通
スルーホールと貫通スルーホールを形成する工程と、前
記銅めっき層及び銅張りの銅層部分を印刷−エッチング
法にて表面実装用パッドと表面回路を形成する工程とを
含むことを特徴とする。The method for manufacturing a multilayer printed wiring board according to the present invention comprises the steps of forming different circular through holes in a copper-clad laminated board on both sides,
A step of forming a different circular through hole by performing copper plating on the entire surface of the laminated plate including the inner wall of the different circular through hole, and forming a different circular through hole on the laminated plate; A step of forming a conductive circuit by printing-etching a copper layer portion to form a double-sided printed wiring board, and a power source on which a conductive circuit is formed in advance with the surface on which the conductive circuit is formed of the double-sided printed wiring board facing inside. -The double-sided printed wiring board for GND is heated and pressure-bonded through a prepreg having a different circular through hole of the same shape at a position corresponding to the different circular through hole to form a laminated body, and at the same time, the different circular through hole. A step of removing the resin of the prepreg inside to form a groove by controlling the filling amount, and providing a through hole in this laminate, and performing copper plating on the inner wall of the through hole and the entire surface including the groove. Forming a surface mounting pad and a surface circuit by printing-etching the copper plating layer and the copper layer of the copper layer by coating the copper plating layer to form non-penetrating through holes and through holes And a step of performing.
【００１３】[0013]
【実施例】次に、本発明の実施例について図面を参照し
て説明する。Embodiments of the present invention will now be described with reference to the drawings.
【００１４】図１は本発明の一実施例の一部切欠き斜視
図である。図１に示すように、本発明の一実施例の多層
印刷配線板２３は、スルーホール１６，積層された絶縁
体２２，絶縁体２２間に配置された内部回路２０，電源
・ＧＮＤ層２１，異円形非貫通スルーホール５，凹部１
７を有する表面実装用パッド１９，表面回路１８等によ
って構成され、表面実装用パッド１９及び凹部１７は異
円形非貫通スルーホール５と同じ形状の異円形状で、凹
部１７の表面と側面及び表面実装用パッド１９の上面に
は銅めっき層１５が形成されている。FIG. 1 is a partially cutaway perspective view of an embodiment of the present invention. As shown in FIG. 1, a multilayer printed wiring board 23 according to an embodiment of the present invention includes a through hole 16, a laminated insulator 22, an internal circuit 20 arranged between the insulators 22, a power supply / GND layer 21, Different circular non-through hole 5, recess 1
The surface mounting pad 19 and the concave portion 17 have different circular shapes which are the same as the different circular non-through holes 5, and the surface, the side surface and the surface of the concave portion 17 are formed. A copper plating layer 15 is formed on the upper surface of the mounting pad 19.
【００１５】図２（ａ），（ｂ）は図１の多層印刷配線
板の製造に用いられる積層板及びプリプレグの一部切欠
き斜視図、図３（ａ）〜（ｉ）は本発明の多層印刷配線
板の製造方法の第１の実施例を説明する工程順に示した
断面図である。2 (a) and 2 (b) are partially cutaway perspective views of a laminate and a prepreg used for manufacturing the multilayer printed wiring board of FIG. 1, and FIGS. 3 (a) to 3 (i) show the present invention. It is sectional drawing shown in order of a process explaining 1st Example of the manufacturing method of a multilayer printed wiring board.
【００１６】本発明の多層印刷配線板の製造方法の第１
の実施例は、まず、図３（ａ）に示すように、１８μｍ
の銅箔１を両面に有する０．１ｍｍ厚のガラス繊維強化
エポキシ基材を用いた積層板２を用意する。次に、図３
（ｂ）に示すように、積層板２の表裏回路のスルーホー
ル接続を行う部分と表面実装用パッド１９を形成する部
分にドリルを用いて異円形貫通穴３を形成する。次に、
図３（ｃ）に示すように、異円形貫通穴３の壁面を含む
積層板２の全面に無電解銅めっきを施した後電解銅めっ
きを施し厚み２０μｍの銅めっき層４と異円形スルーホ
ール５を形成する。ここで、異円形に形成する理由は、
例えば長方形の場合、コーナ部と辺中央部の銅めっき層
４の厚みの均一性が懸念されることと、Ｎ／Ｃ穴あけ機
での形成が困難であるためである。次に、図３（ｄ）に
示すように、多層印刷配線板２３の内部回路２０となる
側の積層板２の片側表面に印刷−エッチング法により銅
電回路７を形成し両面印刷配線板８を得る。The first method of manufacturing a multilayer printed wiring board according to the present invention
First, as shown in FIG. 3A, the embodiment of
A laminated board 2 using a glass fiber reinforced epoxy base material having a thickness of 0.1 mm and having copper foils 1 on both sides thereof is prepared. Next, FIG.
As shown in (b), different circular through holes 3 are formed in a portion of the laminated plate 2 where front and back circuits are to be through-hole connected and a portion where the surface mounting pad 19 is to be formed, using a drill. next,
As shown in FIG. 3 (c), electroless copper plating is applied to the entire surface of the laminated plate 2 including the wall surface of the different circular through hole 3 and then electrolytic copper plating is performed to form a copper plating layer 4 having a thickness of 20 μm and a different circular through hole. 5 is formed. Here, the reason for forming the different circular shape is
This is because, for example, in the case of a rectangular shape, there is a concern that the thickness of the copper plating layer 4 at the corner portion and the center portion of the side may be uniform, and it is difficult to form the copper plating layer 4 by an N / C drilling machine. Next, as shown in FIG. 3D, a copper electric circuit 7 is formed by a printing-etching method on one surface of the laminated board 2 on the side to be the internal circuit 20 of the multilayer printed wiring board 23, and the double-sided printed wiring board 8 is formed. To get
【００１７】次に、図３（ｅ）に示すように、このよう
にして得られた２枚の両面印刷配線板８を予め準備して
おいた電源・ＧＮＤ用両面印刷配線板１０をプリプレグ
６を介して加熱，圧着し積層体１１を得る。このとき図
２（ａ），（ｂ）に示すように、プリプレグ６には、あ
らかじめ積層板２の異円形貫通穴３ａと同一位置に異円
形貫通穴３ｂを形成しておく。次に、図３（ｆ）に示す
ように、加熱，圧着すると外側に配置した両面印刷配線
板８の異円形スルーホール５の内部にはプリプレグ６の
エポキシ樹脂が所定の深さまで流入して充填される。こ
のとき異円形スルーホール５の内部のプリプレグ６のエ
ポキシ樹脂の深さを加熱温度１７０〜１８０℃，圧力３
０〜４０ｋｇ／ｃｍ2 ，時間１．０〜２．０ｈに設定
し、上述のプリプレグ６に形成した異円形貫通穴３ｂの
大きさ及びプリプレグ６の枚数を変えることによりコン
トロールする。Next, as shown in FIG. 3 (e), the two-sided printed wiring board 8 thus obtained is prepared in advance, and the two-sided printed wiring board 10 for power supply / GND is prepared by the prepreg 6. The laminated body 11 is obtained by heating and pressure bonding via. At this time, as shown in FIGS. 2A and 2B, different circular through holes 3b are formed in the prepreg 6 in advance at the same positions as the different circular through holes 3a of the laminated plate 2. Next, as shown in FIG. 3 (f), when heated and pressure-bonded, the epoxy resin of the prepreg 6 flows into and fills the inside of the different circular through hole 5 of the double-sided printed wiring board 8 arranged outside. To be done. At this time, the depth of the epoxy resin of the prepreg 6 inside the different circular through hole 5 is set to a heating temperature of 170 to 180 ° C. and a pressure of 3
The pressure is set to 0 to 40 kg / cm 2 and the time is set to 1.0 to 2.0 h, and control is performed by changing the size of the different circular through holes 3 b formed in the prepreg 6 and the number of prepregs 6.
【００１８】次に、図３（ｇ）に示すように、積層体１
１に貫通穴１４を設ける。次に、図３（ｈ）に示すよう
に、貫通穴１４の壁面と溝１３の底面を含む積層体１１
の全面に無電解銅めっきを施した後電解銅めっきを施し
厚み３０μｍの銅めっき層１５，凹部１７，異円形非貫
通スルーホール５，スルーホール１６を形成する。次
に、図３（ｉ）に示すように、印刷−エッチング法によ
り積層体１１の表面の銅層をエッチングし、異円形の表
面実装用パッド１９，異円形非貫通スルーホール５，ス
ルーホール１６，表面回路１８を形成し、内部回路２
０，電源・ＧＮＤ層２１を含む多層印刷配線板２３を得
る。Next, as shown in FIG. 3 (g), the laminated body 1
1 is provided with a through hole 14. Next, as shown in FIG. 3H, the laminated body 11 including the wall surface of the through hole 14 and the bottom surface of the groove 13 is formed.
Then, electroless copper plating is performed on the entire surface of the copper foil, and then electrolytic copper plating is performed to form a copper plating layer 15 having a thickness of 30 μm, a concave portion 17, a different circular non-through hole 5, and a through hole 16. Next, as shown in FIG. 3I, the copper layer on the surface of the laminated body 11 is etched by a printing-etching method to form a surface mount pad 19 of a different circular shape, a non-penetrating through hole of a different circular shape 5, and a through hole 16. , Forming the surface circuit 18 and forming the internal circuit 2
0, the multilayer printed wiring board 23 including the power supply / GND layer 21 is obtained.
【００１９】本発明の多層印刷配線板の製造方法の第２
の実施例は、図３（ｅ）に示す２枚の両面印刷配線板と
電源・ＧＮＤ用両面印刷配線板１０を積層一体化するプ
リプレグ６を溶融性の低い材質を使用し異円形スルーホ
ール５の内部に流入するプリプレグ６のエポキシ樹脂量
を抑制し溝１３を形成した以外は第１の実施例と同じで
あり、第１の実施例と同一形状の接続信頼性の高い表面
実装用パッドと異円形非貫通スルーホールを有する多層
印刷配線板を得る。Second Method of Manufacturing Multilayer Printed Wiring Board of the Present Invention
In the embodiment, the prepreg 6 for laminating and integrating the two double-sided printed wiring boards and the double-sided printed wiring board 10 for power supply / GND shown in FIG. Is the same as the first embodiment except that the amount of epoxy resin of the prepreg 6 flowing into the inside of the resin is suppressed and the groove 13 is formed, and a surface mounting pad having the same shape as that of the first embodiment and having high connection reliability. A multilayer printed wiring board having non-penetrating through holes of different circular shapes is obtained.
【００２０】[0020]
【発明の効果】以上説明したように本発明は、表面実装
用パッドの領域内に非貫通スルーホールを有する多層印
刷配線板において、表面実装用パッドと、この表面実装
用パッドの領域内にこの表面実装用パッドの外周よりも
小さく表面実装部品のリードの外周よりも大きく形成さ
れた異円形非貫通スルーホールとを設け、表面実装用パ
ッドの異円形非貫通スルーホールと対応する部分の表面
を凹状に形成することにより、表面実装部品のリードと
表面実装用パッドのはんだ接合を行う際に、良好なはん
だ付け性と機械的強度を有し、信頼性の高いはんだ接続
が得られるという効果がある。As described above, according to the present invention, in a multilayer printed wiring board having a non-penetrating through hole in the area of the surface mounting pad, the surface mounting pad and the surface mounting pad are provided in the area. Provide a different circular non-penetrating through hole that is smaller than the outer periphery of the surface mounting pad and larger than the outer periphery of the lead of the surface mounting component. By forming a concave shape, when soldering the leads of the surface mount component and the surface mount pad, it has good solderability and mechanical strength, and the effect that a highly reliable solder connection can be obtained is there.
【００２１】また、表面実装用パッドと非貫通スルーホ
ールの接続信頼性も高めることができるという効果もあ
る。There is also an effect that the connection reliability between the surface mounting pad and the non-through through hole can be improved.
【図１】本発明の一実施例の一部切欠き斜視図である。FIG. 1 is a partially cutaway perspective view of an embodiment of the present invention.
【図２】（ａ），（ｂ）は図１の多層印刷配線板の製造
に用いられる積層板及びプリプレグの一部切欠き斜視図
である。2 (a) and 2 (b) are partially cutaway perspective views of a laminate and a prepreg used for manufacturing the multilayer printed wiring board of FIG.
【図３】（ａ）〜（ｉ）は本発明の多層印刷配線板の製
造方法の第１の実施例を説明する工程順に示した断面図
である。3 (a) to 3 (i) are cross-sectional views showing the order of steps for explaining the first embodiment of the method for manufacturing a multilayer printed wiring board according to the present invention.
【図４】従来の表面実装用パッド内に非貫通スルーホー
ルを設けた多層印刷配線板の一例の一部切欠き斜視図で
ある。FIG. 4 is a partially cutaway perspective view of an example of a multilayer printed wiring board in which a non-through hole is provided in a conventional surface mounting pad.
【図５】（ａ）〜（ｉ）は従来の多層印刷配線板の製造
方法の一例を説明する工程順に示した断面図である。5 (a) to (i) are cross-sectional views showing the order of steps for explaining an example of a conventional method for manufacturing a multilayer printed wiring board.
１ 銅箔 ２ 積層板 ３，３ａ，３ｂ 異円形貫通穴 ４，１５ 銅めっき層 ５ 異円形スルーホール ６ プリプレグ ７ 導電回路 ８ 両面印刷配線板 ９ 非貫通スルーホール １０ 電源・ＧＮＤ用両面印刷配線板 １１ 積層体 １２，６２ 樹脂部 １３，６３ 溝 １４，５３ 貫通穴 １６，５５ スルーホール １７，６７ 凹部 １８ 表面回路 １９，６９ 表面実装用パッド ２０ 内部回路 ２１ 電源・ＧＮＤ層 ２２ 絶縁体 ２３ 多層印刷配線板 ２４ 表面実装用パッド導体幅 1 Copper Foil 2 Laminated Plate 3, 3a, 3b Different Circular Through Hole 4,15 Copper Plating Layer 5 Different Circular Through Hole 6 Prepreg 7 Conductive Circuit 8 Double Sided Printed Wiring Board 9 Non-Through Through Hole 10 Double Sided Printed Wiring Board for Power / GND 11 Laminated body 12,62 Resin part 13,63 Groove 14,53 Through hole 16,55 Through hole 17,67 Recessed portion 18 Surface circuit 19,69 Surface mounting pad 20 Internal circuit 21 Power supply / GND layer 22 Insulator 23 Multilayer printing Wiring board 24 Pad for surface mounting Conductor width
Claims (2)
ホールを有する多層印刷配線板において、前記表面実装
用パッドと、この表面実装用パッドの領域内にこの表面
実装用パッドの外周よりも小さく表面実装部品のリード
の外周よりも大きく形成された異円形非貫通スルーホー
ルとを有し、前記表面実装用パッドの前記異円形非貫通
スルーホールと対応する部分の表面が凹状に形成されて
いることを特長とする多層印刷配線板。1. A multilayer printed wiring board having a non-penetrating through hole in the area of a surface mounting pad, wherein the surface mounting pad is smaller than the outer circumference of the surface mounting pad in the area of the surface mounting pad. And a different circular non-penetrating through hole formed to be larger than the outer circumference of the lead of the surface mounting component, and a surface of a portion of the surface mounting pad corresponding to the different circular non penetrating through hole is formed in a concave shape. A multi-layer printed wiring board that features
を設ける工程と、この積層板の前記異円形貫通穴の内壁
を含む全面に銅めっきを施し銅めっき層を被覆して異円
形スルーホールを形成する工程と、この積層板の片面の
み前記銅めっき層及び銅張りの銅層部分を印刷−エッチ
ング法にて導電回路を形成し両面印刷配線板を形成する
工程と、この両面印刷配線板の前記導電回路を形成した
面を内側にしてあらかじめ導電回路が形成された電源・
ＧＮＤ用両面印刷配線板と共に前記異円形スルーホール
と対応する位置に同一形状の異円形貫通穴が設けられた
プリプレグを介して加熱，圧着して積層体を形成すると
同時に、前記異円形スルーホール内の前記プリプレグの
樹脂を除去し充填量をコントロールして溝を形成する工
程と、この積層体に貫通穴を設けこの貫通穴の内壁と前
記溝を含む表面全体に銅めっきを施し銅めっき層を被覆
して異円形非貫通スルーホールと貫通スルーホールを形
成する工程と、前記銅めっき層及び銅張りの銅層部分を
印刷−エッチング法にて表面実装用パッドと表面回路を
形成する工程とを含むことを特徴とする多層印刷配線板
の製造方法。2. A step of forming a different circular through hole in a laminated plate having copper clad on both sides, and copper plating is applied to the entire surface of the laminated plate, including the inner wall of the different circular through hole, and a copper plating layer is coated to form a different circular shape. forming a through hole, the one side of the laminate
Only the step of forming a conductive circuit by a printing-etching method on the copper plating layer and the copper layer portion coated with copper to form a double-sided printed wiring board, and the surface of the double-sided printed wiring board on which the conductive circuit is formed is set to the inside. Power supply with a conductive circuit formed in advance
A double-sided printed wiring board for GND and a prepreg provided with a different circular through hole of the same shape at a position corresponding to the different circular through hole are heated and pressure-bonded to form a laminated body, and at the same time, inside the different circular through hole. The step of removing the resin of the prepreg to form a groove by controlling the filling amount, and providing a through hole in this laminate, and performing copper plating on the entire surface including the inner wall of the through hole and the groove to form a copper plating layer. The step of covering and forming the different circular non-penetrating through holes and the penetrating through holes, and forming the surface mounting pad and the surface circuit by printing-etching the copper plating layer and the copper layer of the copper layer. The manufacturing method of the multilayer printed wiring board characterized by including the process of performing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22628893A JP2508981B2 (en) | 1993-09-13 | 1993-09-13 | Multilayer printed wiring board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22628893A JP2508981B2 (en) | 1993-09-13 | 1993-09-13 | Multilayer printed wiring board and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0786750A JPH0786750A (en) | 1995-03-31 |
| JP2508981B2 true JP2508981B2 (en) | 1996-06-19 |
Family
ID=16842869
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22628893A Expired - Fee Related JP2508981B2 (en) | 1993-09-13 | 1993-09-13 | Multilayer printed wiring board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2508981B2 (en) |
-
1993
- 1993-09-13 JP JP22628893A patent/JP2508981B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0786750A (en) | 1995-03-31 |
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| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19960227 |
|
| LAPS | Cancellation because of no payment of annual fees |