JPH031532U - - Google Patents
Info
- Publication number
- JPH031532U JPH031532U JP6052689U JP6052689U JPH031532U JP H031532 U JPH031532 U JP H031532U JP 6052689 U JP6052689 U JP 6052689U JP 6052689 U JP6052689 U JP 6052689U JP H031532 U JPH031532 U JP H031532U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- dry etching
- electrode
- light receiving
- receiving element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001514 detection method Methods 0.000 claims description 2
- 238000001312 dry etching Methods 0.000 claims 2
- 230000010355 oscillation Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
Landscapes
- ing And Chemical Polishing (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Drying Of Semiconductors (AREA)
Description
第1図は本考案の実施例1を示す縦断面図、第
2図は第1図の平面図、第3図は本考案の実施例
2を示す縦断面図、第4図は第3図の平面図、第
5図は従来の終点検出装置を示す縦断面図、第6
図a,bはウエハー近傍を示す縦断面図、第7図
a,bはレーザービーム反射強度の時間的変化を
示す図である。
1……ウエハー、2……カソード、3……アノ
ード、4……反応室、8……高周波電源、9……
マツチング回路、10……レーザービーム発生ユ
ニツト、11……ハーフミラー、12……入射用
受光素子、13……反射用受光素子、14a〜1
4e……モータ17……θアライメントステージ
、18……xyアライメントステージ、101…
…入射レーザービーム、102……反射レーザー
ビーム、103……ウエハー傾斜角、104……
ビーム入射角、105……ビーム反射角、106
……ウエハー直交線。
Fig. 1 is a longitudinal sectional view showing Embodiment 1 of the present invention, Fig. 2 is a plan view of Fig. 1, Fig. 3 is a longitudinal sectional view showing Embodiment 2 of the invention, and Fig. 4 is Fig. 3. 5 is a vertical sectional view showing a conventional end point detection device, and FIG.
Figures a and b are longitudinal cross-sectional views showing the vicinity of the wafer, and Figures a and b are diagrams showing temporal changes in laser beam reflection intensity. 1... Wafer, 2... Cathode, 3... Anode, 4... Reaction chamber, 8... High frequency power supply, 9...
Matching circuit, 10... Laser beam generation unit, 11... Half mirror, 12... Light receiving element for incidence, 13... Light receiving element for reflection, 14a-1
4e...Motor 17...θ alignment stage, 18...xy alignment stage, 101...
...Incoming laser beam, 102...Reflected laser beam, 103...Wafer tilt angle, 104...
Beam incident angle, 105...Beam reflection angle, 106
...Wafer orthogonal line.
Claims (1)
上に載置されたウエハーの被エツチング面に対し
鉛直方向の反応室外に設けられたレーザー発振ユ
ニツト及び受光素子と、 前記レーザービーム発生ユニツト及び発光素子
のウエハー表面に対する位置角度を変化させる機
構とを有することを特徴とするドライエツチング
用終点検出装置。[Claims for Utility Model Registration] A laser oscillation unit and a light receiving element provided outside a reaction chamber in a direction perpendicular to the surface to be etched of a wafer placed on one electrode of a counter-electrode type dry etching apparatus; 1. An end point detection device for dry etching, comprising a beam generating unit and a mechanism for changing the position angle of a light emitting element with respect to a wafer surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989060526U JP2522803Y2 (en) | 1989-05-25 | 1989-05-25 | End point detector for dry etching |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989060526U JP2522803Y2 (en) | 1989-05-25 | 1989-05-25 | End point detector for dry etching |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH031532U true JPH031532U (en) | 1991-01-09 |
JP2522803Y2 JP2522803Y2 (en) | 1997-01-16 |
Family
ID=31587965
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989060526U Expired - Lifetime JP2522803Y2 (en) | 1989-05-25 | 1989-05-25 | End point detector for dry etching |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2522803Y2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5274514U (en) * | 1975-12-01 | 1977-06-03 | ||
WO2009119650A1 (en) * | 2008-03-27 | 2009-10-01 | 日本電気株式会社 | Etching end point detecting pattern and method for etching |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5834309A (en) * | 1981-08-25 | 1983-02-28 | Nok Corp | Noncontacting type surface nature measuring method |
JPS61250520A (en) * | 1985-04-30 | 1986-11-07 | Hoya Corp | Liquid level meter |
JPS62203335A (en) * | 1986-03-03 | 1987-09-08 | Anelva Corp | Etching monitor apparatus |
-
1989
- 1989-05-25 JP JP1989060526U patent/JP2522803Y2/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5834309A (en) * | 1981-08-25 | 1983-02-28 | Nok Corp | Noncontacting type surface nature measuring method |
JPS61250520A (en) * | 1985-04-30 | 1986-11-07 | Hoya Corp | Liquid level meter |
JPS62203335A (en) * | 1986-03-03 | 1987-09-08 | Anelva Corp | Etching monitor apparatus |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5274514U (en) * | 1975-12-01 | 1977-06-03 | ||
WO2009119650A1 (en) * | 2008-03-27 | 2009-10-01 | 日本電気株式会社 | Etching end point detecting pattern and method for etching |
Also Published As
Publication number | Publication date |
---|---|
JP2522803Y2 (en) | 1997-01-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |