JPH03138807A - Conductor paste - Google Patents
Conductor pasteInfo
- Publication number
- JPH03138807A JPH03138807A JP1276429A JP27642989A JPH03138807A JP H03138807 A JPH03138807 A JP H03138807A JP 1276429 A JP1276429 A JP 1276429A JP 27642989 A JP27642989 A JP 27642989A JP H03138807 A JPH03138807 A JP H03138807A
- Authority
- JP
- Japan
- Prior art keywords
- paste
- oil
- cavity
- added
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 title claims description 12
- 239000004215 Carbon black (E152) Substances 0.000 claims abstract description 8
- 229930195733 hydrocarbon Natural products 0.000 claims abstract description 8
- 150000002430 hydrocarbons Chemical class 0.000 claims abstract description 8
- 239000000843 powder Substances 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 6
- 239000007788 liquid Substances 0.000 claims abstract description 4
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000003921 oil Substances 0.000 abstract description 15
- 230000000694 effects Effects 0.000 abstract description 5
- 239000001856 Ethyl cellulose Substances 0.000 abstract description 3
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 abstract description 3
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 abstract description 3
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 abstract description 3
- 229920001249 ethyl cellulose Polymers 0.000 abstract description 3
- 235000019325 ethyl cellulose Nutrition 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 abstract description 3
- 229940116411 terpineol Drugs 0.000 abstract description 3
- 230000000740 bleeding effect Effects 0.000 abstract description 2
- 239000010729 system oil Substances 0.000 abstract 1
- 239000011230 binding agent Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229940057995 liquid paraffin Drugs 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000002411 thermogravimetry Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
イ０発明の目的
［産業上の利用分野コ
本発明は、セラミック配線基板のグリーンシート上の配
線用導体ペーストの改良に関する。DETAILED DESCRIPTION OF THE INVENTION OBJECTS OF THE INVENTION [Industrial Field of Application] The present invention relates to improvements in conductor paste for wiring on green sheets of ceramic wiring boards.
［従来の技術］
多層配線基板では、セラミックスグリーンシート上に、
タングステンおよびさらに必要によりモリブデンを加え
、これにバインダーおよび溶剤からなるビヒクルを添加
した導体ペーストを印刷し、ファインパターンを形成す
る。従来このパターンは乾燥時に、第２図のに示すよう
にその頂上部に凹みが発生する。これを顕微鏡（約２０
倍）で観察すると、ファインラインパターン上に、条が
確認比ている場合、ワイヤボンドをした際に、凹みの部
分が数μｍの空隙となり接着さ九ず密着の信頼性が損わ
れる。また、凹みを残したままグリーンシートを積み重
ねる（積層）と、焼成後、凹み部分が繋がった空孔とな
り、セラミックス基板の信頼性が低下する問題があった
。このため頂上部の凹み深さを、第２図のｄで１μｍ以
下が好ましいとされている。第２図の例では、下辺幅す
は、約１５０〜２００μｍ、高さＣは、２０〜３０μｍ
である。[Conventional technology] In a multilayer wiring board, on a ceramic green sheet,
A fine pattern is formed by printing a conductive paste to which tungsten and, if necessary, molybdenum are added and a vehicle consisting of a binder and a solvent is added thereto. Conventionally, when this pattern dries, a depression occurs at the top of the pattern as shown in FIG. Microscope (approximately 20
When observed with a magnification of 2.5 times, it was found that when wire bonding is performed on a fine line pattern, the concave portion becomes a gap of several micrometers and the reliability of adhesion is impaired. Furthermore, if green sheets are stacked (laminated) with recesses left, the recesses become connected voids after firing, resulting in a problem of lowering the reliability of the ceramic substrate. For this reason, it is said that the depth of the recess at the top is preferably 1 μm or less as indicated by d in FIG. In the example shown in Fig. 2, the width of the lower side is approximately 150 to 200 μm, and the height C is approximately 20 to 30 μm.
It is.
従来この頂上部の凹みは、ローラーでこするとか、印刷
された導体をプレスで押さえたりして第１図に示す凹み
のない状態に近づけてその解消に努めていたが完全に条
は消えず、またその工数に手間取っていた。Conventionally, efforts have been made to eliminate the dents at the top by rubbing the conductor with a roller or pressing the printed conductor with a press to bring it closer to the dent-free state shown in Figure 1, but the streaks have not disappeared completely. , and the man-hours involved were time-consuming.
［発明が解決しようとする課題］
本発明は、以上述べた、導体ペーストが乾燥する際に発
生する凹みにより起こる筋の発生しない導体ペーストを
得て信頼性の高い多層配線基板を得ることにある。[Problems to be Solved by the Invention] The present invention is directed to obtaining a highly reliable multilayer wiring board by obtaining a conductive paste that does not have streaks caused by dents that occur when the conductive paste dries, as described above. .
口８発明の構成
［課題を解決するための手段］
本発明の要旨は、 金属粉末とビヒクルよりなるペース
ト１００重ｆｆｉ％に、Ｃｎ１Ｉ２．．２（ｎ＞１３）
からなる液状炭化水素系オイルを１〜６重量％添加した
ことを特徴とする導体ペーストである。Structure of the Invention [Means for Solving the Problems] The gist of the present invention is to add Cn1I2. ．． 2 (n>13)
This is a conductor paste characterized by adding 1 to 6% by weight of a liquid hydrocarbon oil consisting of:
本発明で、金属粉末は、導体であれはよい。In the present invention, the metal powder may be any conductor.
般には、＼Ｖ、Ｍｏ、Ｍｎ及びその合金等が使用されて
いる。Generally, \V, Mo, Mn and their alloys are used.
ビヒクルは従来用いられているバインダーと溶剤をいう
。Vehicle refers to conventionally used binders and solvents.
［作用コ
本発明の特徴をなす炭化水素系オイルは、ペーストに添
加するためには液状であることが必要であり、ＣｎＨ２
ｎ＋２のｎ数が２０以上の場合固体状のものが多く、３
０以上を超えると殆ど固体となる。またｎ数が１３以上
としたのは、導体印刷後の乾燥温度である通常の８０〜
１２０°Ｃて乾燥するには１３０℃の弓火温度にする必
要があり、満足するには１１数が１３以上となる。[Function] The hydrocarbon oil that characterizes the present invention needs to be in liquid form in order to be added to the paste, and CnH2
When the number n of n+2 is 20 or more, it is often solid, and 3
When it exceeds 0 or more, it becomes almost solid. In addition, the reason why the number n is 13 or more is because the drying temperature after conductor printing is 80~
In order to dry at 120°C, it is necessary to set the fire temperature to 130°C, and the number 11 must be 13 or higher to be satisfied.
市販品の炭化水素系オイル（以下単にオイルという）は
、粘度で品番を表すことが多く、＃４０．６０゜８０、
１５０，２６０．３５０等が存在し、不純・物のないも
のが比較的安価に人手しやすい。総称して流動パラフィ
ンと呼ばれている。さらに、本発明のビヒクル中には、
高分子やワックス等を加え変性したものも含み、これら
の添加で接着強度も改善される。Commercially available hydrocarbon oils (hereinafter simply referred to as oils) are often indicated by their viscosity, such as #40.60゜80, #40.60゜80,
There are 150, 260, 350, etc., and those without impurities are relatively cheap and easy to handle. Collectively, they are called liquid paraffin. Additionally, in the vehicle of the invention,
It also includes those modified by adding polymers, wax, etc., and the addition of these improves adhesive strength.
オイル添加量をペースト１００重量χ（以下重量％を２
という）に対して１〜６χに限定したのは、■γ未溝で
は、その凹み減少効果がなく、６χより多いとオイルに
よるにじみが発生し、シャープなファインラインが得ら
れないためである。The amount of oil added is 100% by weight of the paste (hereinafter weight% is 2)
The reason why the range is limited to 1 to 6χ is that a groove without γ has no effect of reducing the dent, and if it is more than 6χ, oil bleeds and a sharp fine line cannot be obtained.
ペーストは、既述したように、金属粉末は、通常Ｗまた
は、Ｗ／Ｍｏの混合物からなり、粒度に特別の制限はな
いが、スクリーン印刷では、０．８〜３μｍの平均粒径
が適している。ビヒクルのバインダーと溶剤も一般的に
使用されているものでよい。即ちバインダーとしては、
エチルセルロース、ブチラール樹脂、アクリル樹脂等、
溶剤はテルピネオール、ブチルカルピトールアセテート
（ＢＣＡ）等が通常使用されている。As mentioned above, the metal powder in the paste is usually made of W or a mixture of W/Mo, and there is no particular restriction on the particle size, but for screen printing, an average particle size of 0.8 to 3 μm is suitable. There is. The vehicle binder and solvent may also be those commonly used. In other words, as a binder,
Ethyl cellulose, butyral resin, acrylic resin, etc.
As the solvent, terpineol, butylcarpitol acetate (BCA), etc. are usually used.
オイルの添加時期は、金属粉末、とビヒクルを混合する
時に添加しても、ペーストになってからに添加しても効
果に変りはない。There is no difference in the effect whether the oil is added when the metal powder and vehicle are mixed or after it has been made into a paste.
本発明の、添加剤のオイルを従来の導体ペーストに添加
した場合と添加しない場合につき、熱重量分析を行って
、加熱温度と時間による熱重量変化率を測定した結果を
、第３図に示す。第３図より本発明の導体の重量変化率
は、オイル添加しない場合の約２２分後の１８６．８℃
で８８．１％に比較し、２２分後２８６．５°Ｃで９２
．６：Ｅと小さい。このことからペーストにオイル添加
することにより、乾燥しにくく、急激な乾燥による凹み
が少なくなるものと考えられる。Figure 3 shows the results of thermogravimetric analysis and measurement of the thermogravimetric change rate depending on heating temperature and time when the additive oil of the present invention was added to the conventional conductor paste and when it was not added. . From Figure 3, the rate of weight change of the conductor of the present invention is 186.8°C after about 22 minutes when no oil is added.
92 at 286.5°C after 22 minutes.
．． 6: E and small. From this, it is thought that by adding oil to the paste, it is difficult to dry and the dents caused by rapid drying are reduced.
［実施例コ
［実施例１コ
平均粒径１μｍのＷ粉末と予めテルピネオールに溶かし
たエチルセルロースを粘度が２０００ボイスになるよう
に配合し、３本ローラでペースト化した。[Example 1] W powder having an average particle size of 1 μm and ethyl cellulose previously dissolved in terpineol were blended to have a viscosity of 2000 voices, and the mixture was made into a paste using three rollers.
このペーストに平均ｎ数が２５の炭化水素オイルを添加
して、線幅が、２００μｍのファインラインをスクリー
ン印刷した。その結果を、第１表に示す。A hydrocarbon oil having an average n number of 25 was added to this paste to screen print a fine line with a line width of 200 μm. The results are shown in Table 1.
また乾燥時の導体ペーストの断面形状を第１図に示す。Furthermore, the cross-sectional shape of the conductive paste when dried is shown in FIG.
図の上辺の幅ａと下辺幅すの比（ａ／ｂ）は、約０．８
であった。The ratio (a/b) of the width of the upper side of the figure to the width of the lower side is approximately 0.8
Met.
第１表 炭化水素オイル１〜６ｚの添加で効果が認められた。Table 1 Effects were observed with the addition of hydrocarbon oils 1 to 6z.
［実施例２コ
平均粒径がいずれも１．８〜２．３μｍのＷ８０％とＭ
０２０％を金属粉末とし、アクリルをＢＣＡで溶かした
市販の溶液を、三本ローラーで混合し、同時に平均ｎ数
が２０のものを添加して、線幅３００μｍのライン印刷
を行った。凹み、にじみに関しては、第１表と同様であ
ったが実施例１と比へ導体とグリーンシートの接着強度
は１／２であった。[Example 2] W80% and M with average particle diameters of 1.8 to 2.3 μm
A commercially available solution containing 020% metal powder and acrylic dissolved in BCA was mixed using three rollers, and at the same time, a solution having an average n number of 20 was added to perform line printing with a line width of 300 μm. Regarding dents and bleeding, the results were the same as those shown in Table 1, but the adhesive strength between the conductor and the green sheet was 1/2 that of Example 1.
ハ１発明の効果
本発明は、従来多層配線基板の回路形成の導体ペースト
を印刷乾燥する際に発生ずるファインパターンの凹みの
発生を防止し、信頼性の高い多層配線基板を得ることが
できる。C1 Effects of the Invention The present invention can prevent the occurrence of dents in fine patterns that occur when printing and drying conductive paste for forming circuits on conventional multilayer wiring boards, and can provide highly reliable multilayer wiring boards.
第１図は、本発明の導体ペーストの断面図の１例である
。第２図は、従来のペーストの断面図である。第３図は
、本発明および従来の導体ペーストの加熱温度、経過時
間当りの熱重量変化率を示す。FIG. 1 is an example of a cross-sectional view of the conductive paste of the present invention. FIG. 2 is a cross-sectional view of a conventional paste. FIG. 3 shows the heating temperature and thermogravimetric change rate per elapsed time of the present invention and the conventional conductor paste.
Claims (1)
よりなるペースト１００重量％に、ＣｎＨ＿２＿ｎ＿＋
＿２（ｎ＞１３）からなる液状炭化水素系オイルを１〜
６重量％添加したことを特徴とする導体ペースト。1. In a ceramic wiring board, CnH_2_n_+ is added to 100% by weight paste consisting of metal powder and vehicle.
Liquid hydrocarbon oil consisting of _2 (n>13)
A conductor paste characterized by containing 6% by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1276429A JPH03138807A (en) | 1989-10-24 | 1989-10-24 | Conductor paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1276429A JPH03138807A (en) | 1989-10-24 | 1989-10-24 | Conductor paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03138807A true JPH03138807A (en) | 1991-06-13 |
Family
ID=17569290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1276429A Pending JPH03138807A (en) | 1989-10-24 | 1989-10-24 | Conductor paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03138807A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07147469A (en) * | 1993-11-24 | 1995-06-06 | Sumitomo Kinzoku Ceramics:Kk | Conductor paste |
| CN109294468A (en) * | 2018-09-04 | 2019-02-01 | 东莞泰博世实业投资有限公司 | A kind of one-way viewable advertisement film and preparation method thereof |
-
1989
- 1989-10-24 JP JP1276429A patent/JPH03138807A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07147469A (en) * | 1993-11-24 | 1995-06-06 | Sumitomo Kinzoku Ceramics:Kk | Conductor paste |
| CN109294468A (en) * | 2018-09-04 | 2019-02-01 | 东莞泰博世实业投资有限公司 | A kind of one-way viewable advertisement film and preparation method thereof |
| CN109294468B (en) * | 2018-09-04 | 2021-02-23 | 东莞泰博世实业投资有限公司 | One-way visual advertising film and preparation method thereof |
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