JPH06196831A - Manufacture of conductive pattern for aln substrate - Google Patents
Manufacture of conductive pattern for aln substrateInfo
- Publication number
- JPH06196831A JPH06196831A JP34413892A JP34413892A JPH06196831A JP H06196831 A JPH06196831 A JP H06196831A JP 34413892 A JP34413892 A JP 34413892A JP 34413892 A JP34413892 A JP 34413892A JP H06196831 A JPH06196831 A JP H06196831A
- Authority
- JP
- Japan
- Prior art keywords
- paste
- conductive pattern
- aln substrate
- layer
- fine powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子回路基板として利
用されるＡｌＮ（窒化アルミニウム）セラミックス基板
用導電パターンの製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a conductive pattern for an AlN (aluminum nitride) ceramic substrate used as an electronic circuit substrate.
【０００２】[0002]
【従来の技術】一般に、電子回路基板には高絶縁性、機
械的強度、他の電子素子を劣化させない、金属導体と容
易に接合体となる、熱伝導率が大きいなどの性質が要求
される。このような電子回路基板として、アルミナ、窒
化物セラミックスなどが知られている。2. Description of the Related Art Generally, an electronic circuit board is required to have properties such as high insulation, mechanical strength, deterioration of other electronic elements, easy joining with a metal conductor, and high thermal conductivity. . Alumina, nitride ceramics, and the like are known as such electronic circuit boards.
【０００３】近年、ＬＳＩなどの電子部品の高集積化・
高速化にともない、その放熱対策改善の要求が高まって
おり、電子回路基板材料として現在主流のアルミナより
も熱伝導率が７倍以上高く、放熱性に優れる窒化アルミ
ニウム（ＡｌＮ）セラミックスを用いた基板の開発が急
務となっている。In recent years, high integration of electronic parts such as LSI
Along with the increase in speed, there is an increasing demand for improved heat dissipation measures. A substrate using aluminum nitride (AlN) ceramics, which has a thermal conductivity 7 times higher than that of alumina, which is currently the mainstream as an electronic circuit board material, and has excellent heat dissipation. Development is urgent.
【０００４】ここで、電子回路基板としてセラミックス
を単体で用いると、トランジスター、ダイオード、Ｉ
Ｃ、ＬＳＩ等の電子部品を直接実装することができない
ので、セラミックス表面に金属化膜（導電パターン）を
形成して使用する。このセラミックス基板表面上への金
属化膜の形成には、銅（Ｃｕ）導電ペーストを１０〜３
０μｍ程度の厚みにスクリーン印刷し、乾燥させた後、
窒素雰囲気下で焼成するという方法がある。Here, when ceramics are used alone as an electronic circuit board, transistors, diodes, I
Since electronic components such as C and LSI cannot be directly mounted, a metallized film (conductive pattern) is formed on the ceramic surface before use. To form a metallized film on the surface of the ceramic substrate, a copper (Cu) conductive paste is used in an amount of 10 to 3
After screen printing to a thickness of about 0 μm and drying,
There is a method of firing in a nitrogen atmosphere.
【０００５】しかしながら、この方法で形成された金属
化膜はセラミックス基板との接着強度が不十分であり、
特に窒化アルミニウムに代表される窒化セラミックスで
はこの傾向が顕著であるため、前述の銅導電ペーストの
代わりに銅−チタン（Ｃｕ-Ｔｉ）導電ペースト等を用
いて金属化膜を形成し、接着強度を確保していた。However, the metallized film formed by this method has insufficient adhesive strength with the ceramic substrate,
Since this tendency is particularly remarkable in nitride ceramics typified by aluminum nitride, a metallized film is formed by using a copper-titanium (Cu-Ti) conductive paste or the like instead of the above-mentioned copper conductive paste to improve the adhesive strength. Had secured.
【０００６】[0006]
【発明が解決しようとする課題】銅は電気抵抗が最も小
さい金属の中のひとつで、コストも安価であるため、電
子回路基板の導電パターン形成には最適の金属である。
しかしながら、特に窒化セラミックスを電子回路基板材
料として用いた場合には、基板との接着強度が不十分で
あるという欠点を有している。この欠点は、５〜３０％
のチタンを添加し、導体組成を銅−チタン（Ｃｕ−Ｔ
ｉ）合金化することによりかなり改善することができ
る。しかし、その結果として比抵抗が増大し、しかも材
料コストも増大するという問題があった。Copper is one of the metals having the smallest electric resistance and is inexpensive, and is therefore the most suitable metal for forming a conductive pattern on an electronic circuit board.
However, in particular, when nitride ceramics is used as an electronic circuit board material, there is a drawback that the adhesive strength with the board is insufficient. This drawback is 5-30%
Of titanium is added, and the conductor composition is changed to copper-titanium (Cu-T
i) It can be considerably improved by alloying. However, as a result, there has been a problem that the specific resistance increases and the material cost also increases.
【０００７】そこで、本発明の技術的課題は、上記欠点
に鑑み、ＡｌＮ基板との間の充分な接着強度と、高い導
電性を有する金属化膜を形成することができるＡｌＮ基
板用導電パターンの製造方法を提供することである。Therefore, in view of the above-mentioned drawbacks, a technical problem of the present invention is to provide a conductive pattern for an AlN substrate capable of forming a metallized film having sufficient adhesive strength with the AlN substrate and high conductivity. It is to provide a manufacturing method.
【０００８】[0008]
【課題を解決するための手段】本発明によれば、銅微粉
末、チタン微粉末と結合剤を主成分とし、有機溶剤を分
散媒とする組成要素を、混練分散することにより、Ｃｕ
- Ｔｉペーストを調製し、銅微粉末と結合剤を主成分と
し有機溶剤を分散媒とする組成要素を混練分散すること
によりＣｕペーストを調製し、ＡｌＮ基板上に上記Ｃｕ
- ＴｉペーストからなるＣｕ- Ｔｉ層を形成し、そのＣ
ｕ- Ｔｉ層の上に上記Ｃｕペーストの層からなるＣｕ層
を形成することを特徴とするＡｌＮ基板用導電パターン
の製造方法が得られる。According to the present invention, a composition element containing copper fine powder, titanium fine powder, a binder as a main component, and an organic solvent as a dispersion medium is kneaded and dispersed to obtain Cu.
-A Ti paste is prepared, and a Cu paste is prepared by kneading and dispersing copper fine powder and a composition element having a binder as a main component and an organic solvent as a dispersion medium, and the Cu paste is formed on the AlN substrate.
-Cu-Ti layer consisting of Ti paste is formed and its C
A method of manufacturing a conductive pattern for an AlN substrate is obtained, which comprises forming a Cu layer made of the Cu paste layer on the u-Ti layer.
【０００９】[0009]
【作用】本発明は、ＡｌＮ基板表面上のＣｕ- Ｔｉ層に
より、基板と導電パターンとの接着強度を確保し、その
上にＣｕ層を設けることにより導電性を確保する。ま
た、本発明は、導電パターン全体としてのチタン量を減
少することができることから、コストの低減を図ること
ができる。According to the present invention, the adhesion strength between the substrate and the conductive pattern is secured by the Cu-Ti layer on the surface of the AlN substrate, and the conductivity is secured by providing the Cu layer thereon. Further, according to the present invention, the amount of titanium in the entire conductive pattern can be reduced, so that the cost can be reduced.
【００１０】[0010]
【実施例】以下、本発明に係るＡｌＮ基板用導電パター
ンの実施例を比較例と比較して詳細に説明する。EXAMPLES Examples of conductive patterns for an AlN substrate according to the present invention will be described in detail below in comparison with comparative examples.
【００１１】＜実施例＞ （１）ビヒクルの調製 結合剤（エチルセルロース） １５重量％ 溶剤（α−テルピネオール） ３５重量％ 溶剤（キシレン） ４５重量％ 分散剤（ステアリン酸） ５重量％ 上記組成を混合し、３０分間ホモジェナイザーを用いて
攪拌し、これをビヒクルとした。このビヒクルが、次の
（２）および（３）で用いられる。<Examples> (1) Preparation of vehicle Binder (ethyl cellulose) 15% by weight Solvent (α-terpineol) 35% by weight Solvent (xylene) 45% by weight Dispersant (stearic acid) 5% by weight Mixing the above composition Then, the mixture was stirred for 30 minutes using a homogenizer, and this was used as a vehicle. This vehicle is used in (2) and (3) below.
【００１２】（２）Ｃｕ- Ｔｉペーストの作製 銅微粉末（平均粒径０．５μｍ） ７０重量％ チタン微粉末（平均粒径１０μｍ） １５重量％ ビヒクル １５重量％ を加え、サンドミルにて５時間混練分散し、Ｃｕ- Ｔｉ
ペーストを得た。(2) Preparation of Cu-Ti paste Copper fine powder (average particle size 0.5 μm) 70% by weight Titanium fine powder (average particle size 10 μm) 15% by weight Vehicle 15% by weight was added to the mixture in a sand mill for 5 hours. Knead and disperse, Cu-Ti
I got a paste.
【００１３】（３）Ｃｕペーストの作製 銅微粉末（平均粒径０．５μｍ） ８５重量％ ビヒクル １５重量％ を加え、サンドミルにて５時間混練分散し、Ｃｕペース
トを得た。(3) Preparation of Cu Paste Fine copper powder (average particle size 0.5 μm) 85% by weight Vehicle 15% by weight was added and kneaded and dispersed in a sand mill for 5 hours to obtain a Cu paste.
【００１４】（４）ＡｌＮ基板上へのパターン印刷 ＡｌＮ基板表面上に、上記（２）のＣｕ- Ｔｉペースト
を１０μｍ程度の厚みに、２５０メッシュのスクリーン
を用いて印刷し乾燥させた後、上記（３）のＣｕペース
トを２０μｍ程度の厚さにスクリーン印刷して乾燥さ
せ、窒素雰囲気下で８００℃で焼成を行って、導体パタ
ーンを形成した。(4) Pattern Printing on AlN Substrate The Cu—Ti paste of (2) above is printed on the surface of the AlN substrate to a thickness of about 10 μm using a 250 mesh screen and dried, The Cu paste of (3) was screen-printed to a thickness of about 20 μm, dried, and fired at 800 ° C. in a nitrogen atmosphere to form a conductor pattern.
【００１５】＜比較例１＞上記（２）のＣｕ- Ｔｉペー
ストのみを用いて、ＡｌＮ基板上に３０μｍ程度の導体
パターンを形成した以外は、上記実施例と動揺にして試
料を作成した。<Comparative Example 1> A sample was prepared in the same manner as in the above-mentioned Example except that a conductor pattern of about 30 μm was formed on an AlN substrate using only the Cu—Ti paste of (2) above.
【００１６】＜比較例２＞上記（３）のＣｕペーストの
みを用いて、ＡｌＮ基板上に３０μｍ程度の導電パター
ンを形成した以外は、上記実施例と同様にして試料を作
成した。<Comparative Example 2> A sample was prepared in the same manner as in the above Example except that a conductive pattern of about 30 μm was formed on an AlN substrate using only the Cu paste of (3) above.
【００１７】＜評価＞これらの試料に関し、以下に述べ
る種々の評価を行った。<Evaluation> These samples were subjected to various evaluations described below.
【００１８】接着強度 ＡｌＮ基板上に、導電ペーストを２ｍｍ角にスクリーン
印刷し、乾燥させ、真空中で８００℃で焼き付けを行っ
て形成したメタライズ層に、半田によりＦｅ-Ｎｉ製の
ピンを垂直に立て、基板表面に対し垂直に引っ張ったと
きの引っ張り力を測定した。Adhesion Strength A conductive paste is screen-printed in a 2 mm square on an AlN substrate, dried, and baked at 800 ° C. in a vacuum to form a metallized layer. The pulling force when standing and pulling perpendicularly to the substrate surface was measured.
【００１９】導電性 実施例、比較例１、比較例２の試料の直流抵抗値を測定
して、その値を導電パターンの膜厚で補正し、比較例１
の数値を１００としたときの比率を求めた。Conductivity The DC resistance values of the samples of Examples, Comparative Examples 1 and 2 were measured, and the values were corrected by the film thickness of the conductive pattern.
The ratio when the numerical value of 100 was set to 100 was calculated.
【００２０】＜評価結果＞表１は、得られた測定結果の
判定基準を示す。表２は、判定基準に基づく試験試料の
評価結果である。<Evaluation Results> Table 1 shows the judgment criteria of the obtained measurement results. Table 2 shows the evaluation results of the test samples based on the criteria.
【００２１】[0021]
【表１】 [Table 1]
【００２２】[0022]
【表２】 [Table 2]
【００２３】接着強度については、その数値が大きい程
良く、導電性（直流抵抗の比で評価）は小さい程良い
が、ＡｌＮ基板の導電パターンとしては表１の○で表さ
れる範囲で実用的には充分である。As for the adhesive strength, the larger the numerical value is, the better the conductivity (evaluated by the ratio of direct current resistance) is, the better. However, the conductive pattern of the AlN substrate is practical within the range shown by ◯ in Table 1. Is enough for
【００２４】実施例は、ＡｌＮ基板との接着強度に於い
ては比較例１と遜色なく、また導電性に関しても比較例
１と比べて改善されており、実用上充分な値となってい
る。一方、比較例１は接着強度は充分であるが導電性は
最も悪い値となっており、比較例２は導電性は最も良い
が接着強度は実用に耐えないものとなっている。これは
実施例が、Ｃｕ- Ｔｉ層でＡｌＮ基板との接着強度を確
保し、Ｃｕ層で充分な導電性を得ているためと考えられ
る。The example is comparable to the comparative example 1 in the adhesive strength with the AlN substrate, and the conductivity is also improved as compared with the comparative example 1, which is a practically sufficient value. On the other hand, in Comparative Example 1, the adhesive strength is sufficient, but the electrical conductivity is the worst value. In Comparative Example 2, the electrical conductivity is the best, but the adhesive strength is not practical. This is considered to be because the example secures the adhesive strength with the AlN substrate with the Cu-Ti layer and obtains sufficient conductivity with the Cu layer.
【００２５】すなわち、本発明のＡｌＮ基板用導電パタ
ーンの製造方法を用いれば、ＡｌＮ基板と接着強度と導
電性という相反する要素を解決することができる。That is, the use of the method for producing a conductive pattern for an AlN substrate of the present invention can solve the conflicting elements of the adhesive strength and the conductivity with the AlN substrate.
【００２６】[0026]
【発明の効果】上述したように、本発明に係るＡｌＮ基
板用導電パターンの製造方法は、ＡｌＮ基板上にＣｕ-
Ｔｉペースト層を形成し、そのＣｕ- Ｔｉぺースト層の
上にＣｕペースト層を形成して導電パターンを形成する
から、その導電パターンは接着強度が確保され、導電性
も向上する。したがって、本発明によれば接着性および
導電性に優れた導電パターンを提供することができ、各
種電子部品の高集積化・高速化へ大きく寄与することが
できる。As described above, according to the method of manufacturing a conductive pattern for an AlN substrate according to the present invention, Cu-
Since the Ti paste layer is formed, and the Cu paste layer is formed on the Cu-Ti paste layer to form the conductive pattern, the conductive pattern has sufficient adhesive strength and improved conductivity. Therefore, according to the present invention, it is possible to provide a conductive pattern having excellent adhesiveness and conductivity, which can greatly contribute to high integration and high speed of various electronic components.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 岩田 伸一 茨城県つくば市大字花島新田字北原28番１ 株式会社トーキン内 (72)発明者 渡部 洋平 茨城県つくば市大字花島新田字北原28番１ 株式会社トーキン内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Shinichi Iwata 28-1 Kitahara, Shinden Hanajima, Ibaraki, Ibaraki Prefecture Tokin Co., Ltd. (72) Yohei Watanabe 28th Kitahara, Nitta, Hanashima, Tsukuba, Ibaraki Prefecture 1 Tokin Co., Ltd.
Claims (1)
分とし、有機溶剤を分散媒とする組成要素を、混練分散
することにより、Ｃｕ- Ｔｉペーストを調製し、銅微粉
末と結合剤を主成分とし有機溶剤を分散媒とする組成要
素を混練分散することによりＣｕペーストを調製し、Ａ
ｌＮ基板上に上記Ｃｕ- ＴｉペーストからなるＣｕ- Ｔ
ｉ層を形成し、そのＣｕ- Ｔｉ層の上に上記Ｃｕペース
トの層からなるＣｕ層を形成することを特徴とするＡｌ
Ｎ基板用導電パターンの製造方法。1. A Cu-Ti paste is prepared by kneading and dispersing a composition element containing copper fine powder, titanium fine powder and a binder as a main component, and an organic solvent as a dispersion medium, and bonding with the copper fine powder. A Cu paste is prepared by kneading and dispersing a composition element containing an agent as a main component and an organic solvent as a dispersion medium.
Cu-T consisting of the above Cu-Ti paste on the 1N substrate
An i layer is formed, and a Cu layer composed of the above Cu paste layer is formed on the Cu-Ti layer.
A method for manufacturing a conductive pattern for an N substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34413892A JPH06196831A (en) | 1992-12-24 | 1992-12-24 | Manufacture of conductive pattern for aln substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34413892A JPH06196831A (en) | 1992-12-24 | 1992-12-24 | Manufacture of conductive pattern for aln substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06196831A true JPH06196831A (en) | 1994-07-15 |
Family
ID=18366938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34413892A Pending JPH06196831A (en) | 1992-12-24 | 1992-12-24 | Manufacture of conductive pattern for aln substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06196831A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003069217A (en) * | 2001-08-22 | 2003-03-07 | Kyocera Corp | Method for manufacturing circuit board |
| WO2007088748A1 (en) * | 2006-01-31 | 2007-08-09 | Tokuyama Corporation | Process for producing metallized ceramic substrate, metallized ceramic substrate produced by the process, and package |
| JP2007201346A (en) * | 2006-01-30 | 2007-08-09 | Mitsuboshi Belting Ltd | Ceramics circuit board and its manufacturing method |
| JP2010109069A (en) * | 2008-10-29 | 2010-05-13 | Kyocera Corp | Wiring board and method for manufacturing the same |
| US20120015152A1 (en) * | 2009-03-30 | 2012-01-19 | Tokuyama Corporation | Process for producing metallized substrate, and metallized substrate |
| US20120321805A1 (en) * | 2010-03-02 | 2012-12-20 | Tokuyama Corporation | Production method of metallized substrate |
| JP2014532996A (en) * | 2011-11-03 | 2014-12-08 | セラムテック ゲゼルシャフト ミット ベシュレンクテル ハフツングＣｅｒａｍＴｅｃ ＧｍｂＨ | Circuit board made of AlN having a copper structure |
-
1992
- 1992-12-24 JP JP34413892A patent/JPH06196831A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003069217A (en) * | 2001-08-22 | 2003-03-07 | Kyocera Corp | Method for manufacturing circuit board |
| JP2007201346A (en) * | 2006-01-30 | 2007-08-09 | Mitsuboshi Belting Ltd | Ceramics circuit board and its manufacturing method |
| WO2007088748A1 (en) * | 2006-01-31 | 2007-08-09 | Tokuyama Corporation | Process for producing metallized ceramic substrate, metallized ceramic substrate produced by the process, and package |
| JP2007207914A (en) * | 2006-01-31 | 2007-08-16 | Tokuyama Corp | Method for manufacturing metallized ceramic substrate, metallized ceramic substrate manufactured thereby, and package |
| JP4699225B2 (en) * | 2006-01-31 | 2011-06-08 | 株式会社トクヤマ | Metallized ceramic substrate manufacturing method, metallized ceramic substrate manufactured by the method, and package |
| US8071187B2 (en) | 2006-01-31 | 2011-12-06 | Tokuyama Corporation | Method for fabricating metallized ceramics substrate, metallized ceramics substrate fabricated by the method, and package |
| JP2010109069A (en) * | 2008-10-29 | 2010-05-13 | Kyocera Corp | Wiring board and method for manufacturing the same |
| US20120015152A1 (en) * | 2009-03-30 | 2012-01-19 | Tokuyama Corporation | Process for producing metallized substrate, and metallized substrate |
| US9301390B2 (en) | 2009-03-30 | 2016-03-29 | Tokuyama Corporation | Process for producing metallized substrate, and metallized substrate |
| US20120321805A1 (en) * | 2010-03-02 | 2012-12-20 | Tokuyama Corporation | Production method of metallized substrate |
| US9374893B2 (en) * | 2010-03-02 | 2016-06-21 | Tokuyama Corporation | Production method of metallized substrate |
| JP2014532996A (en) * | 2011-11-03 | 2014-12-08 | セラムテック ゲゼルシャフト ミット ベシュレンクテル ハフツングＣｅｒａｍＴｅｃ ＧｍｂＨ | Circuit board made of AlN having a copper structure |
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