JPH03120608A - Thin-film magnetic head - Google Patents
Thin-film magnetic headInfo
- Publication number
- JPH03120608A JPH03120608A JP25899489A JP25899489A JPH03120608A JP H03120608 A JPH03120608 A JP H03120608A JP 25899489 A JP25899489 A JP 25899489A JP 25899489 A JP25899489 A JP 25899489A JP H03120608 A JPH03120608 A JP H03120608A
- Authority
- JP
- Japan
- Prior art keywords
- film
- protective film
- base film
- magnetic head
- ceramic structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010409 thin film Substances 0.000 title claims description 25
- 230000001681 protective effect Effects 0.000 claims abstract description 54
- 239000000919 ceramic Substances 0.000 claims abstract description 35
- 239000010408 film Substances 0.000 claims description 105
- 239000011347 resin Substances 0.000 abstract description 14
- 229920005989 resin Polymers 0.000 abstract description 14
- 238000005520 cutting process Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000004020 conductor Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229910052593 corundum Inorganic materials 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910001845 yogo sapphire Inorganic materials 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910000889 permalloy Inorganic materials 0.000 description 2
- 238000010420 art technique Methods 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、スライダの一端面に読み書き素子及び保護膜
を付着させた浮上型の薄膜磁気ヘッドに関し、読み書き
素子用の下地膜及び読み書き素子を覆う保護膜を、スラ
イダを構成するセラミック構造体の端縁よりは内側に形
成することにより、切断加工時の下地膜及び保護膜のク
ラック、欠は等を防止すると共に、保護膜上に塗布され
る外装樹脂の流出及び付着を阻止できるようにしたもの
である。[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to a floating type thin film magnetic head in which a read/write element and a protective film are attached to one end surface of a slider. By forming the covering protective film on the inner side of the edge of the ceramic structure that constitutes the slider, it is possible to prevent cracks, chips, etc. of the base film and protective film during cutting, and also prevent the coating from occurring on the protective film. This prevents the exterior resin from leaking out and adhering to the exterior resin.
〈従来の技術〉
浮上型薄膜磁気ヘッドは、磁気ディスクに対して相対的
に移動する時に空気の粘性によフて発生する動圧を利用
して、磁気ディスク面との間に微小な浮上量を発生させ
るようにしたものである。<Prior art> A floating thin-film magnetic head uses dynamic pressure generated by the viscosity of air when moving relative to a magnetic disk to create a small flying height between the head and the magnetic disk surface. It is designed to generate.
その一般的な構造は、第７図に示すように、スライダ１
の空気流出方向の端面に、読み書き素子２を付着させ、
読み書き素子２を保護膜３で覆った構造となっている。Its general structure is as shown in FIG.
A read/write element 2 is attached to the end face in the air outflow direction,
It has a structure in which a read/write element 2 is covered with a protective film 3.
スライダ１としては、磁気ディスクとの対向面側に間隔
をおいて突設したレール部１０２の表面に、浮上面１０
３を形成すると共に、浮上面１０３の空気流入方向の端
部に、テーパ面１０３ａを設けたいわゆるテーパ。The slider 1 has an air bearing surface 10 on the surface of a rail portion 102 that protrudes at intervals on the side facing the magnetic disk.
3 and a tapered surface 103a is provided at the end of the air bearing surface 103 in the air inflow direction.
フラット型のもの、テーパ面を持たないもの、更にはレ
ール部を持たないもの等、種々のタイプのものが提案さ
れている。Various types have been proposed, including flat types, those without a tapered surface, and even those without a rail portion.
スライダ１は、セラミック構造体１１の表面１１１上に
下地膜１２を有しており、読み書き素子２及び保護膜３
は下地膜１２の表面１２１の上に付着されている。下地
膜１２はその上に付着される読み書き素子２及び保護膜
３をセラミック構造体１１上に強固に付着させるため、
或いは、セラミック構造体１１がＡｌ２Ｏ３・Ｔｉｃ等
の導電性を有するセラミック材料で構成されているとき
は、読み書き素子２に対する電気絶縁性を確保する手段
として設けられるものである。下地膜１２を構成する材
料としては、ＡｈＯｓやＳｉｎ、等の電気絶縁セラミッ
クが知られている。下地ｇ１２はこれらのセラミック材
料を、セラミック構造体１１の端面１１１上にスパッタ
して形成するが一般的である。The slider 1 has a base film 12 on a surface 111 of a ceramic structure 11, and has a read/write element 2 and a protective film 3.
is attached on the surface 121 of the base film 12. The base film 12 is used to firmly adhere the read/write element 2 and the protective film 3 onto the ceramic structure 11.
Alternatively, when the ceramic structure 11 is made of a conductive ceramic material such as Al2O3.Tic, it is provided as a means to ensure electrical insulation with respect to the read/write element 2. Electrically insulating ceramics such as AhOs and Sin are known as materials constituting the base film 12. The base g12 is generally formed by sputtering these ceramic materials onto the end face 111 of the ceramic structure 11.
４は読み書き素子２のリード導体であり、保護［３の表
面に形成されている。4 is a lead conductor of the read/write element 2, which is formed on the surface of the protection [3].
読み書き素子２はＩＣ製造テクノロジと同様のプロセス
にしたがって形成された薄膜素子でなる。第８図は読み
書き素子２の付近の拡大断面図で、２１はパーマロイ等
でなる下部磁性膜、２２はＡｌ２Ｏ５・５１０２等で形
成された間隔膜、２３．２４はコイル導体、２５〜２７
はフォトレジスト等で形成された膜間絶縁膜、２８はパ
ーマロイ等でなる上部磁性膜である。下部磁性膜２１及
び上部磁性膜２８は間隔膜２２を介して対向する読み書
きポール部２１１及び２８１を有すると共に、ボール部
２１１及び２８１に連続するヨーク部２１２及び２８２
を有している。ヨーク部２１２及び２８１は、後方領域
で互いに結合されている。コイル導体２３．２４はヨー
ク部２１２及び２８２の後方領域に３ける結合部のまわ
りを渦巻状に回るように形成されている。The read/write element 2 is a thin film element formed according to a process similar to IC manufacturing technology. FIG. 8 is an enlarged sectional view of the vicinity of the read/write element 2, in which 21 is a lower magnetic film made of permalloy or the like, 22 is a spacing film made of Al2O5.5102, etc., 23.24 is a coil conductor, 25 to 27
28 is an interlayer insulating film made of photoresist or the like, and an upper magnetic film 28 is made of permalloy or the like. The lower magnetic film 21 and the upper magnetic film 28 have read/write pole parts 211 and 281 facing each other with the spacing film 22 in between, and yoke parts 212 and 282 that are continuous with the ball parts 211 and 281.
have. The yoke parts 212 and 281 are connected to each other in the rear region. The coil conductors 23, 24 are formed in a spiral manner around the joint in the rear region of the yoke parts 212 and 282.
保護膜３はＡｌ２Ｏ３または５ＩＯ２等のスパッタ膜と
して、読み書き素子２及び下地膜１２の表面１２１の全
面を覆うように形成されている。The protective film 3 is formed as a sputtered film of Al2O3, 5IO2, etc. so as to cover the entire surface 121 of the read/write element 2 and the base film 12.
〈発明が解決しようとする課題〉
しかしながら、上述した従来の薄膜磁気ヘッドには次の
ような問題点があった。<Problems to be Solved by the Invention> However, the conventional thin film magnetic head described above has the following problems.
（イ）磁気ディスク装置に装着して使用するに当り、第
９図に示すように、読み書き素子２のリード導体４にリ
ード線５を溶接６等の手段によって固着し、更にリード
線５を接続した部分の電気絶縁及び保護のため、浮上面
１０３側と対向する上面１０４側に寄せて、外装樹脂７
を塗布する。ところが、従来の薄膜磁気ヘッドでは、保
護膜３及び下地膜１２を、セラミック構造体１１の端面
１１１の略全面を覆うように形成してあり、セラミック
構造体１１の端縁と、下地膜１２及び保護ＰＩＡ３の端
縁が同一面上に位置するため、外装樹脂７が浮上面１０
３の反対側にある上面１０４に流出して付着し、外形寸
法が変化してしまうという問題点があった。これを除く
ために、上面１０４に付着した外装樹脂７１を拭き取る
作業が必要になり、製造能率が悪くなる。(b) When used in a magnetic disk device, as shown in FIG. 9, the lead wire 5 is fixed to the lead conductor 4 of the read/write element 2 by means such as welding 6, and then the lead wire 5 is connected. In order to electrically insulate and protect the exposed portion, the exterior resin 7
Apply. However, in the conventional thin film magnetic head, the protective film 3 and the base film 12 are formed to cover almost the entire surface of the end face 111 of the ceramic structure 11, and the protective film 3 and the base film 12 are Since the edges of the protective PIA 3 are located on the same plane, the exterior resin 7 is on the air bearing surface 10.
There was a problem in that the liquid flowed out and adhered to the upper surface 104 on the opposite side of 3, resulting in a change in external dimensions. In order to remove this, it is necessary to wipe off the exterior resin 71 adhering to the upper surface 104, which reduces manufacturing efficiency.
（ロ）保護膜３及び下地膜１２を、セラミック構造体１
１の端面ｉｔｔの略全面を覆うように形成しであるため
、切断加工時またはその後に、保護膜３及び下地膜室２
にクラックや欠けが発生し易く、信頼性の低下、歩留り
低下を招くという問題点があった。第１０図はこの種の
薄膜磁気ヘッドの製造工程を概略的に示す図である。ま
ず、第１０図（ａ）に示すように、セラミック構造体１
１の上に下地膜１２を付着させたウェハー上に、読み書
き素子２を有し保護膜３によって被覆されたベツドピー
ス群Ｈ８〜Ｈｎを形成しておき、これらのへッドビース
群Ｈ＋−）１ｎを切断位置（Ｘ ＋ Ｘ ＋）〜（Ｘ
ｎ Ｘｎ）で切断する。これにより、第１０図（ｂ）
に示すようなヘッドピース群Ｈ３〜）Ｉｎが切出される
。(b) The protective film 3 and the base film 12 are removed from the ceramic structure 1.
Since it is formed so as to cover almost the entire surface of the end surface itt of 1, the protective film 3 and the base film chamber 2 are removed during or after the cutting process.
There is a problem in that cracks and chips are likely to occur in the metal, resulting in lower reliability and lower yield. FIG. 10 is a diagram schematically showing the manufacturing process of this type of thin film magnetic head. First, as shown in FIG. 10(a), a ceramic structure 1
On a wafer on which a base film 12 is adhered on 1, bed piece groups H8 to Hn having read/write elements 2 and covered with a protective film 3 are formed, and these head piece groups H+-) 1n are cut. Position (X + X +) ~ (X
Cut at nXn). As a result, Fig. 10(b)
A head piece group H3~)In as shown in is cut out.
次に第１０図（Ｃ）に示すように、切出されたヘッドピ
ース群Ｈ１〜Ｈｎに対し、スライダとして必要な溝入れ
加工、研磨加工等を施した後、切断位置（Ｙ＋−Ｙ＋）
〜（Ｙｎ −Ｙｎ）で切断してヘッドピースを得る。Next, as shown in FIG. 10(C), the cut out head piece groups H1 to Hn are subjected to grooving, polishing, etc. necessary for the slider, and then cut at the cutting position (Y+-Y+).
~(Yn - Yn) to obtain a head piece.
ここで、第７図に説明したように、セラミック構造体１
１の端面１１１の略全面を覆うように、保護膜３及び下
地膜１２を形成した薄膜磁気ヘッドを効率良く得るため
、保護膜３及び下地膜１２はへッドビース群Ｈ１−”Ｈ
ｎにおいて連続するように形成しである。従って、切断
位置（Ｘｌ−Ｘ＋）〜（Ｘｎ Ｘｎ）及び（Ｙ＋
Ｙ、）〜（Ｙｎ−Ｙｎ）で切断した場合、第１１図に示
すように、セラミック構造体１１と保護膜３及び下地膜
１２とが、カッタ８によって同時に切断される。ところ
が、セラミック構造体１１がＡｌ２Ｏ３・Ｔｉｃ等でな
るのに対し、保護膜３及び下地膜１２は＾１２０３また
は５ｉｎ２等のスパッタ膜で形成されているため、同一
のカッタ８によって同時に切断した場合、保護膜３及び
下地膜１２にクラックや欠け３１が発生し、歩留りが低
下してしまうという問題点があった。Here, as explained in FIG. 7, the ceramic structure 1
In order to efficiently obtain a thin film magnetic head in which the protective film 3 and the base film 12 are formed so as to cover almost the entire surface of the end face 111 of the head bead group H1-"H, the protective film 3 and the base film 12 are
It is formed so as to be continuous in n. Therefore, the cutting positions (Xl-X+) to (Xn Xn) and (Y+
When cutting at Y, ) to (Yn-Yn), the ceramic structure 11, the protective film 3, and the base film 12 are cut at the same time by the cutter 8, as shown in FIG. However, while the ceramic structure 11 is made of Al2O3.Tic, etc., the protective film 3 and the base film 12 are formed of sputtered films such as ^1203 or 5in2, so if they are cut at the same time with the same cutter 8, There is a problem in that cracks and chips 31 occur in the protective film 3 and the base film 12, resulting in a decrease in yield.
クラックや欠け３１を防止しようとすれば、保護膜３及
び下地膜１２とセラミ、ツク構造体１！とを、その材質
に適した別々のカッタを用いて、別工程で行なわなけれ
ばならず、作業能率が低下する。In order to prevent cracks and chips 31, the protective film 3, base film 12, ceramic, and structure 1! This must be done in separate steps using separate cutters suitable for the material, which reduces work efficiency.
上述の問題点解決を目的とした先行技術として、特開昭
６４−４６２１６号公報、特開昭６２−７３４１１号公
報等に記載された技術がある。しかし、この先行技術で
は保護膜のクラック、欠けは防止できるものの、下地膜
のクラック、欠けを防止することができなかった。As prior art techniques aimed at solving the above-mentioned problems, there are techniques described in JP-A-64-46216, JP-A-62-73411, and the like. However, although this prior art can prevent cracks and chips in the protective film, it cannot prevent cracks and chips in the base film.
そこで、本発明の課題は、上述する問題点を解決し、切
断加工時の下地膜及び保護膜のクラック、欠は等を防止
すると共に、塗布される外装樹脂の流出及び付着を阻止
し得るようにした薄膜磁気ヘッドを提供することである
。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to solve the above-mentioned problems, to prevent cracks, chips, etc. of the base film and protective film during cutting, and to prevent leakage and adhesion of the exterior resin to be applied. It is an object of the present invention to provide a thin film magnetic head having the following characteristics.
く課題を解決するための手段〉
上述する課題解決のため、本発明は、スライダの一端面
に読み書き素子及びこの読み書き素子を覆う保護膜を付
着させた薄膜磁気ヘッドであって、
前記スライダは、セラミック構造体の上に付着された下
地膜を有しており、
前記読み書き素子及び前記保護膜は、前記下地膜の上に
付着されており、
前記下地膜及び前記保護膜は、少なくとも前記浮上面側
と対向する上面側において、前記セラミック構造体の端
縁との間に間隔が生じるように、前記セラミック構造体
の端縁よりは内側に形成されていること
を特徴とする。Means for Solving the Problems> In order to solve the above problems, the present invention provides a thin film magnetic head in which a read/write element and a protective film covering the read/write element are attached to one end surface of a slider, the slider comprising: a base film is deposited on the ceramic structure, the read/write element and the protective film are deposited on the base film, and the base film and the protective film cover at least the air bearing surface. It is characterized in that it is formed on the inner side of the edge of the ceramic structure so that a gap is created between the edge of the ceramic structure and the edge of the ceramic structure on the upper surface side facing the side.
く作用〉
下地膜及び保護膜は、少なくとも浮上面側と対向する上
面側において、セラミック構造体の＠縁との間に間隔が
生じるように、セラミック構造体の端縁よりは内側に形
成されているので、保護膜及び下地膜とセラミック構造
体の端縁との間に、前記間隔による段差部が発生し、こ
の段差部が保護膜表面に塗布される外装樹脂の流れ止め
どなり、スライダの上面に対する外装樹脂の流出及び付
着が防止される。Effect> The base film and the protective film are formed inside the edge of the ceramic structure so that there is a gap between them and the edge of the ceramic structure, at least on the upper surface side opposite to the air bearing surface side. As a result, a step is generated between the protective film and base film and the edge of the ceramic structure due to the above-described spacing, and this step prevents the flow of the exterior resin applied to the surface of the protective film and prevents the upper surface of the slider from flowing. This prevents the exterior resin from leaking out and adhering to the surface.
また、製造工程において、ウェハーからヘッドピース群
及びヘッドピースを切断して切出す場合、保護膜及び下
地膜を貫通してセラミック構造体の露出する凹溝を形成
しておぎ、この凹溝によりカッタに対する逃げ部を構成
し、保護膜及び下地膜にクラック、欠けが発生するのを
防止できる。In addition, in the manufacturing process, when cutting the head piece group and head pieces from the wafer, a groove is formed through the protective film and the base film to expose the ceramic structure, and this groove allows the cutter to be cut. This can prevent cracks and chips from occurring in the protective film and base film.
ヘッドピース化した後の取扱いにおいても、段差部が保
護膜及び下地膜に対す侭謹バリアとなり、外部部材との
接触による保護膜のクラック、欠けが防止できる。Even when handling the headpiece after it has been formed, the stepped portion acts as a barrier to the protective film and base film, and prevents the protective film from cracking or chipping due to contact with external members.
（実施例〉
第１図は本発明に係る浮上型薄膜磁気ヘッドの一実施例
を示す斜視図、第２図は同じ（空気流出端側から見た側
面図である。図において、第７図と同一の参照符号は同
一性ある構成部分を示している。この実施例では、保Ｊ
ｉ膜３及び下地膜１２は、少なくともスライダ１の浮上
面１ｏ・１と対向する上面１０３側において、読み書き
素子２及び保護膜３及び下地膜１２を付着させたセラミ
ック構造体１１の端面１１１の端縁（イ）よりは間隔Ｇ
、たけ内側に形成しである。従って、端面１１１の端縁
（イ）と保護膜３及び下地膜１２の端縁（ロ）との間に
は、間隔Ｇ、の段差部が形成される。実施例において、
段差部は、浮上面１０１のある面を除く各面１１４〜１
１６と、端面１１１との交叉稜角によって形成される端
縁（イ）と、保護膜３及び下地膜１２の端縁（ロ）との
間に連続して形成しである。(Embodiment) FIG. 1 is a perspective view showing an embodiment of a floating thin film magnetic head according to the present invention, and FIG. 2 is a side view of the same (as seen from the air outflow end side). The same reference numerals indicate identical components.In this example, the
The i-film 3 and the base film 12 are attached to the edge of the end face 111 of the ceramic structure 11 to which the read/write element 2, the protective film 3, and the base film 12 are attached, at least on the upper surface 103 side facing the air bearing surface 1o.1 of the slider 1. The interval G is better than the edge (A).
, formed on the inside. Therefore, a step portion with a distance G is formed between the edge (a) of the end surface 111 and the edge (b) of the protective film 3 and base film 12. In an example,
The stepped portion is formed on each surface 114 to 1 except for the surface where the air bearing surface 101 is located.
It is formed continuously between an edge (a) formed by the intersecting ridge angle of the protective film 3 and the end surface 111 and an edge (b) of the protective film 3 and the base film 12.
上述のように、保護膜３及び下地膜１２を、読み書き素
子２及びセラミック構造体１１の端面１１１の端縁（イ
）よりは間隔Ｇ１だけ内側に形成すると、第３図及び第
４図に拡大して示すように、間隔Ｇ、がリード線接続部
に塗布される外装樹脂７の流れ止めとなる。実施例では
、浮上面１０３のある面を除く各面１０４〜１０６及び
端面１１１の交叉稜角によって形成される端縁（イ）と
、保護膜３及び下地膜１２の端縁（ロ）との間に、間隔
Ｇ１を連続して形成しであるので、スライダ１の上面１
０４のみならず、側面１０５．１０６に対する外装樹脂
７の流出、付着が防止される。As described above, when the protective film 3 and the base film 12 are formed inside the edge (a) of the end surface 111 of the read/write element 2 and the ceramic structure 11 by the distance G1, the result is enlarged as shown in FIGS. 3 and 4. As shown, the gap G prevents the exterior resin 7 applied to the lead wire connection portion from flowing. In the embodiment, between the edge (a) formed by the intersecting ridge angles of each of the surfaces 104 to 106 except for the surface with the air bearing surface 103 and the end surface 111, and the edge (b) of the protective film 3 and the base film 12. Since the interval G1 is continuously formed, the upper surface 1 of the slider 1
This prevents the exterior resin 7 from flowing out or adhering not only to the side surfaces 105 and 106.
また、ウェハーからヘッドピース群及びヘッドピースを
切断して切出す場合、第５図に示すように、ヘッドピー
ス群Ｈ，ｘＨｎを隔てる凹溝９１及び各ヘッドピースを
隔てる凹溝９２を予め形成しておくことにより、カッタ
８の両側にカッタ逃げ部を生じさせ、保１ｉ１１ｉ３及
び下地膜１２のクラック、欠けを防止できる。凹溝９１
．９２は保護膜３及び下地膜１２を貫通してセラミック
構造体１１の端面１１１に到達するように形成しておく
。Furthermore, when cutting the head piece group and the head pieces from the wafer, as shown in FIG. By keeping the cutter 8 in place, cutter relief parts are formed on both sides of the cutter 8, and cracks and chipping of the retainer 1i11i3 and the base film 12 can be prevented. Groove 91
．． 92 is formed so as to penetrate through the protective film 3 and the base film 12 and reach the end surface 111 of the ceramic structure 11 .
ヘッドピース化した後の取扱いにおいても、間隔Ｇ、が
保護膜３及び下地膜１２に対する保護バリアとなり、外
部部材との接触による保護膜３及び下地膜１２のクラッ
ク、欠けが防止できる。Even in handling after the head piece is formed, the gap G acts as a protective barrier against the protective film 3 and the base film 12, and can prevent the protective film 3 and the base film 12 from cracking or chipping due to contact with external members.
上記実施例では、面内記録再生用薄膜磁気ヘッドを例に
とって説明したが、本発明は、垂直記録再生用薄膜磁気
ヘッドにも同様に適用できる。また、テーパ、フラット
型のものに限らず、テーバ面を持たないもの、更にはレ
ール部を持たないもの等、種々のタイプの薄膜磁気ヘッ
ドに広く適用できる。Although the above embodiments have been explained by taking as an example a thin film magnetic head for in-plane recording and reproducing, the present invention can be similarly applied to a thin film magnetic head for perpendicular recording and reproducing. Furthermore, it is widely applicable to various types of thin film magnetic heads, including not only tapered and flat types but also those without a tapered surface and those without a rail portion.
〈発明の効果〉
以上述べたように、本発明によれば、次のような効果が
得られる。<Effects of the Invention> As described above, according to the present invention, the following effects can be obtained.
（ａ）下地膜及び保護膜は、少なくとも浮上面側と対向
する上面側において、セラミック構造体の端縁との間に
間隔が生じるように、セラミック構造体の端縁よりは内
側に形成されているので、外装樹脂の流出及び付着がな
く、寸法精度及び浮上特性の安定した薄膜磁気ヘッドを
提供できる。(a) The base film and the protective film are formed inside the edge of the ceramic structure so that there is a gap between the base film and the edge of the ceramic structure, at least on the upper surface side opposite to the air bearing surface side. Therefore, it is possible to provide a thin film magnetic head with stable dimensional accuracy and flying characteristics without leakage or adhesion of the exterior resin.
（ｂ）ウェハーからヘッドピース群及びヘッドピースを
切断して切出す場合、保護膜及び下地膜のクラック及び
欠けを防止し、歩留りを向上させた薄膜磁気ヘッドを提
供できる。(b) When the head piece group and the head pieces are cut out from the wafer, cracking and chipping of the protective film and the underlying film can be prevented, and a thin film magnetic head with improved yield can be provided.
（Ｃ）外部との接触による保護膜及び下地膜のクラック
及び欠けを防止し得る薄膜磁気ヘッドを提供できる。(C) It is possible to provide a thin film magnetic head that can prevent cracks and chips in the protective film and underlayer due to contact with the outside.
第１図は本発明に係る浮上型薄膜磁気ヘッドの一実施例
を示す斜視図、第２″図は同じく空気流出端側から見た
側面図、第３図は同じく要部の拡大側面部分断面図、第
４図は同じく要部の拡・大平面部分断面図、第５図は本
発明に係る薄膜磁気ヘッドの製造工程の一部を示す斜視
図、第６図は同じく切断工程を示す図、第７図は従来の
薄膜磁気ヘッドの斜視図、第８図は読み書き素子付近の
拡大断面図、第９図は従来の問題点を示す図、第１０図
（ａ）〜（Ｃ）は従来の薄膜磁気ヘッドの製造工程を示
す図、第１１図は同じく製造工程における問題点を示す
図である。
１・・・スライダ ２・・・読み書き素子３・・・
保護膜
１１・・・セラミック構造体
１２・・・下地膜 Ｇｌ ・・・間隔３
１
図
第２ 図
とｉ
λ２
図
第
図
第
図
第
図
１
手
続
ネ甫
工Ｅ
書
平成 ２年 ３月 ６日
匡FIG. 1 is a perspective view showing an embodiment of the floating thin film magnetic head according to the present invention, FIG. 4 is an enlarged planar partial sectional view of the main part, FIG. 5 is a perspective view showing a part of the manufacturing process of the thin film magnetic head according to the present invention, and FIG. 6 is a view showing the cutting process. , FIG. 7 is a perspective view of a conventional thin-film magnetic head, FIG. 8 is an enlarged cross-sectional view of the vicinity of the read/write element, FIG. 9 is a diagram showing problems with the conventional method, and FIGS. 10 (a) to (C) are conventional FIG. 11 is a diagram showing the manufacturing process of the thin film magnetic head, and FIG. 11 is a diagram showing problems in the manufacturing process. 1...Slider 2...Read/write element 3...
Protective film 11...Ceramic structure 12...Underlying film Gl...Interval 3 1 Figure 2 Figure and i λ2 Figure Figure Figure Figure 1 Procedures E. March 6, 1990 Tadashi
Claims (2)
書き素子を覆う保護膜を付着させた薄膜磁気ヘッドであ
って、 前記スライダは、セラミック構造体と、このセラミック
構造体の上に付着された下地膜とを有しており、 前記読み書き素子及び前記保護膜は、前記下地膜の上に
付着されており、 前記下地膜及び前記保護膜は、少なくとも前記浮上面側
と対向する上面側において、前記セラミック構造体の端
縁との間に間隔が生じるように、前記セラミック構造体
の端縁よりは内側に形成されていること を特徴とする薄膜磁気ヘッド。(1) A thin film magnetic head in which a read/write element and a protective film covering the read/write element are attached to one end surface of a slider, and the slider includes a ceramic structure and a lower layer attached on the ceramic structure. a base film, the read/write element and the protective film are attached on the base film, and the base film and the protective film are attached to the base film at least on the upper surface side opposite to the air bearing surface side. 1. A thin film magnetic head, characterized in that the thin film magnetic head is formed inside an edge of the ceramic structure so that a gap is created between the edge and the edge of the ceramic structure.
ッド。(2) The thin film magnetic head according to claim 1, wherein the base film and the protective film are insulating films.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25899489A JPH03120608A (en) | 1989-10-04 | 1989-10-04 | Thin-film magnetic head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25899489A JPH03120608A (en) | 1989-10-04 | 1989-10-04 | Thin-film magnetic head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03120608A true JPH03120608A (en) | 1991-05-22 |
| JPH0557643B2 JPH0557643B2 (en) | 1993-08-24 |
Family
ID=17327877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25899489A Granted JPH03120608A (en) | 1989-10-04 | 1989-10-04 | Thin-film magnetic head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03120608A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5634259A (en) * | 1994-03-17 | 1997-06-03 | Fujitsu Limited | Method of manufacturing a magnetic head |
| US7142393B2 (en) | 1994-03-17 | 2006-11-28 | Fujitsu Limited | Magnetic head and magnetic disk apparatus |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6273411A (en) * | 1985-09-26 | 1987-04-04 | Seiko Epson Corp | Manufacture of magnetic head |
| JPS6446216A (en) * | 1987-08-14 | 1989-02-20 | Tdk Corp | Magnetic head |
-
1989
- 1989-10-04 JP JP25899489A patent/JPH03120608A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6273411A (en) * | 1985-09-26 | 1987-04-04 | Seiko Epson Corp | Manufacture of magnetic head |
| JPS6446216A (en) * | 1987-08-14 | 1989-02-20 | Tdk Corp | Magnetic head |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5634259A (en) * | 1994-03-17 | 1997-06-03 | Fujitsu Limited | Method of manufacturing a magnetic head |
| US7142393B2 (en) | 1994-03-17 | 2006-11-28 | Fujitsu Limited | Magnetic head and magnetic disk apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0557643B2 (en) | 1993-08-24 |
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