JPS6273411A - Manufacture of magnetic head - Google Patents

Manufacture of magnetic head

Info

Publication number
JPS6273411A
JPS6273411A JP21296185A JP21296185A JPS6273411A JP S6273411 A JPS6273411 A JP S6273411A JP 21296185 A JP21296185 A JP 21296185A JP 21296185 A JP21296185 A JP 21296185A JP S6273411 A JPS6273411 A JP S6273411A
Authority
JP
Japan
Prior art keywords
film
shape
head
passivation film
magnetic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21296185A
Other languages
Japanese (ja)
Inventor
Shinobu Kunida
国田　忍
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP21296185A priority Critical patent/JPS6273411A/en
Publication of JPS6273411A publication Critical patent/JPS6273411A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
    • G11B5/3103—Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing
    • G11B5/3106—Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing where the integrated or assembled structure comprises means for conditioning against physical detrimental influence, e.g. wear, contamination
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
    • G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
  • Magnetic Heads (AREA)

Abstract

PURPOSE:To prevent the damage to a magnetic head function part due to chipped passivation film or the chipping itself by decreasing a part exerted with a mechanical working force in the passivation film directly to the utmost at the working of the shape of the head. CONSTITUTION:A magnetic pole 2 and a coil part 3 is covered by the passivation film 8 to the part where a coil terminal part 4 is exposed. Further, an insulation film 7 is exposed only to a part where a head shape ridge film 14 is exfoliated. In this case,the boundary between the film 14 and the passivation film 8 is arranged as near as possible to the magnetic pole 2 and the mechanical processing force exerted to the passivation film 8 is limited to the grinding stage only for the final finish. Further, the head scheduled shape of the other part and the film 14 is decided by the working accuracy of the head shape.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はＩＣ技術を用い次薄膜磁気ヘッドの製造方法に
関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a thin film magnetic head using IC technology.

〔発明の概要〕[Summary of the invention]

本発明は、薄膜磁気ヘッドの製造過穆においてバシペー
シ冒ン膜形成後形状加工される予定の形状よりやや内側
まで少なくとも磁気ヘッド部の厚みと同等かそれ以上の
厚膜（以下、ヘッド形状縁取り膜と称する）を形成し、
バシベーシ璽ン膜形成後にパシペーシ言ン膜の表面を平
担に除去する際に、前記厚膜も除去することにより、後
の機械加工にて加エカｈｔ作用するのけ基板及び絶縁膜
の入となる几め、磁気ヘッドの形状加工時に起こる端部
カケ、またはパシベーシ１ン膜脱落などの予防に効果を
発揮するものである。The present invention provides a method for manufacturing a thin film magnetic head by forming a thick film (hereinafter referred to as a head shape edging film) that is at least equal to or thicker than the thickness of the magnetic head portion, up to the slightly inner side of the shape to be processed after the formation of the bathypaste film. ),
When removing the surface of the perforation film evenly after forming the perforation film, the thick film is also removed, thereby preventing the substrate and insulating film from being exposed to stress during later machining. This method is effective in preventing edge chipping or peeling off of the passivation film that occurs when shaping the magnetic head.

〔従来技術〕[Prior art]

年々、磁気記録装置の記録密度は増加し続け。 The recording density of magnetic recording devices continues to increase year by year.

これにともない磁気記録媒体の１トラック当りの記録幅
ｂ’−減少し、再生出力の低下ｈ％起こる。As a result, the recording width b' per track of the magnetic recording medium decreases, causing a reduction in reproduction output by h%.

この対策としては１例えば磁気へ−ｌドのコイル巻数を
増す方法が考えられるが、これはインダクタンスの増大
も招いてしまう。この九め１機械加工により形成されｔ
コアのコイル巻数を増し几場合、磁路長が長い几め共振
周波数が低下し、高周波の記録再生上望ましくない。As a countermeasure to this problem, for example, a method of increasing the number of turns of the magnetic lead coil may be considered, but this also results in an increase in inductance. This ninth part is formed by machining.
When the number of turns of the core coil is increased, the resonance frequency decreases due to the long magnetic path length, which is undesirable for recording and reproducing high frequencies.

このような点から、半導体製造技術の応用である薄膜磁
気へ・Ｉド〔例えば、特開昭５９−２５１７２２．６Ｏ
−４５９１４）ｂｔ最近注目されている。前記薄膜磁気
ヘッドはｍｓ部の微細化ｈｔ町咋であり、コイルの巻数
増加に適している。From this point of view, it is important to apply semiconductor manufacturing technology to thin film magnetism.
-45914) bt has been attracting attention recently. The thin-film magnetic head has a miniaturized HT section, and is suitable for increasing the number of turns of the coil.

〔発明ｈ；解決しようとする問題点及び目的〕しかし、
前述の薄膜磁気へリドにおいては、その製造上下記のよ
うな問題点を有する。第２図において、基板上に集積さ
れ比薄膜磁気へリドを示す。この図に示されているのは
、浮動形スライダと組入合せて用いる一般例であり、薄
膜磁気へ９ト集積後に破ＩＩ５の櫟に形状加工され、一
つの浮動形スライダに寸き二つの薄膜磁気ヘッドを有し
ている。以下、特に言及しない場合この例に沿って説明
する。薄膜磁気ヘッドの主要部Ｆ！第２図のように、磁
極２、コイル部３をコイルをリード線に接合するための
端子部４などであり、コイル部３には該コイルと絶縁膜
が集積されており、通例一枚の基板上に複数個の薄１１
ｉ１気ヘッドｈｔ形Ｉｌｉ！２される。[Invention h; Problem and purpose to be solved] However,
The above-mentioned thin film magnetic helide has the following problems in its manufacture. In FIG. 2, a thin film magnetic helide is shown integrated on a substrate. What is shown in this figure is a general example used in combination with a floating type slider, which is processed into a shape of a broken II5 square after being integrated into a thin film magnetic layer. It has a thin film magnetic head. The following description will be made using this example unless otherwise specified. Main part of thin film magnetic head F! As shown in Fig. 2, the magnetic pole 2 and the terminal part 4 for connecting the coil part 3 to the lead wire are included. Multiple thin layers 11 on the board
i1ki head HT type Ili! 2 will be given.

ところで、薄膜磁気ヘッド形成後、このままでは耐久上
実用に供さないため、コイル端子部４以外をパシベーシ
ョン膜にて覆う必要がある。このパシベーション模に関
連する機械加工上の問題点を第３図を加えて以下に説明
する。第３図は第２図にかけるＡ　−Ａ’部の断面図で
ある。基板１０が導電性を持つ場合その上に絶縁膜７　
ｈ”−形成され、その上に磁極２、コイル３８、コイル
間あるいけコイルと磁極あるいは磁極間の絶縁膜３ｂな
どが集積される。ま之、第３図中の６はコイル３αの一
部であり、第２図中のコイル端子部４に伸びている。基
板１０と絶縁ＩＩ７の境界部は通常何も異物は存在せず
、また基板１０上に積層されるのは最も早い段階である
。これだ対して、絶縁膜７とパシベーション膜８の境界
部には第３図に示されるように磁１ｉ２、コイル３α、
絶縁膜３ｂ、などの異物を多数含むこととなる。また、
絶縁膜７形成後、磁極２．コイル３α、絶縁膜３ｂ、コ
イル端子部などの積層に際して、各薄膜の形成および工
９チングが複雑に繰り返さｈるｔめ、パシベーション膜
８形成直前においては、絶縁膜７０表面が微視的ではあ
るが損傷を受けている。このためパシベーション膜８と
絶縁膜７の密着力はあまり太き（けない。ところで、ヘ
ッド集積過程の詳しい説明け、直接本発明とけ関わらな
い念め、ここでは省略する。By the way, after forming the thin film magnetic head, since it cannot be put to practical use in terms of durability as it is, it is necessary to cover the area other than the coil terminal portion 4 with a passivation film. Problems in machining related to this passivation pattern will be explained below with reference to FIG. 3. FIG. 3 is a sectional view taken along line A-A' in FIG. 2. If the substrate 10 is conductive, an insulating film 7 is provided thereon.
h"- is formed, and the magnetic pole 2, the coil 38, the coil between the coils and the insulating film 3b between the magnetic poles, etc. are integrated thereon. 6 in FIG. 3 is a part of the coil 3α. and extends to the coil terminal portion 4 in Fig. 2.No foreign matter is normally present at the boundary between the substrate 10 and the insulation II 7, and the layer is stacked on the substrate 10 at the earliest stage. On the other hand, at the boundary between the insulating film 7 and the passivation film 8, as shown in FIG.
This includes a large number of foreign substances such as the insulating film 3b. Also,
After forming the insulating film 7, the magnetic pole 2. When laminating the coil 3α, the insulating film 3b, the coil terminal portion, etc., the formation and processing of each thin film is repeated in a complicated manner, so immediately before the passivation film 8 is formed, the surface of the insulating film 70 is microscopic. is damaged. For this reason, the adhesion between the passivation film 8 and the insulating film 7 is not very strong. By the way, a detailed explanation of the head integration process is omitted here as it is not directly related to the present invention.

このようにして−基板上に磁気ヘリド機能部ｈ＝集積さ
れｔ後、第２図に示される破線５のように所要の形状に
切り、研削、研磨など機械加工が施される。これらの過
稈において、前述のような絶縁膜とパシベーション膜の
密着力の低下などを原因として、第４図１ｃおける欠け
９あるいけチッピングなどが生ずる。これらの欠け９な
どは、そのほとんどがパシベーション膜８において生じ
、絶縁膜７け損傷を受けないことが多い事実が調査の結
果判明した。ま之、機械加工力が第４図の矢印１１のよ
うに、パシベーション＋１ｉｌｓをＭ環１１！　７から
引き離す方向に加えられ几場合、欠け９などの増加を促
すことも多い。こうして発生し次欠け？あるいはチッピ
ング、は、磁気ヘッド実用に当り、長期使用において紡
記欠けを起因とし次磁気へリドの部分的な脱落ｈＬ起こ
らないという保証はない。After the magnetic helide function unit h=integrated on the substrate in this manner, it is cut into a desired shape as shown by the broken line 5 in FIG. 2, and subjected to mechanical processing such as grinding and polishing. In these overculms, the cracks 9 and chipping shown in FIG. 4, 1c, occur due to the decrease in adhesion between the insulating film and the passivation film as described above. As a result of investigation, it has been found that most of these chips 9 occur in the passivation film 8, and that the insulating film 7 is often not damaged. However, the machining force is M ring 11 with passivation + 1ils as shown by arrow 11 in Figure 4! If it is applied in a direction that separates it from 7, it often causes an increase in chipping 9, etc. This is how it occurs and the next one is missing? In practical use of a magnetic head, there is no guarantee that the magnetic helide will not partially fall off due to chipping during long-term use.

このため、前述の欠け、チッピングは薄膜磁気ヘッド機
械加工上の大きな問題点である。Therefore, the aforementioned chipping and chipping are major problems in machining thin film magnetic heads.

そこで本発明はこのような問題点を解決するもので、そ
の目的とするところは欠けあるいはチッピングの発生し
忙〈い薄膜磁気ヘッドの製造方法を提供するところにあ
る。SUMMARY OF THE INVENTION The present invention is intended to solve these problems, and its purpose is to provide a method for manufacturing a thin film magnetic head that is prone to chipping or chipping.

〔問題点を解決するための手段〕[Means for solving problems]

本発明の磁気ヘッドの製造方法は、磁気ヘッド素子部を
積層後バシベーシヲン膜形成以前に、後尾形状加工され
る所定の形状よりやや内側まで、また最終的なバシペー
シジン膜の厚みと同等かそれよりも厚い膜を形成するこ
とを性徴とする。The manufacturing method of the magnetic head of the present invention is such that after laminating the magnetic head element portion and before forming the basibase film, the magnetic head element portion is laminated to a point slightly inside the predetermined shape to be processed into the trailing shape, and the thickness is equal to or thicker than the final basibase film. The sexual characteristic is the formation of a thick membrane.

〔作用〕[Effect]

本発明の上記の構成によれば、磁気へづドの形状加工の
際忙機械加工カが直接パシベーション膜に作用する部分
を記録媒体対向面だけに限定することＫより、パシベー
ション膜の欠けやそれに起因する磁気へヴド部の損傷な
どを最少限に抑制できるものである。According to the above structure of the present invention, since the part where the machining force directly acts on the passivation film when processing the shape of the magnetic head is limited to only the surface facing the recording medium, chipping of the passivation film can be avoided. This allows damage to the magnetic heave portion caused by this to be minimized.

〔実施例〕〔Example〕

第１図は本発明の実施例における形状加工後の磁気ヘッ
ドの斜視図であって、浮動形スライダに磁気ヘッド部を
二個枳有する構造の一例である。FIG. 1 is a perspective view of a magnetic head after shape processing according to an embodiment of the present invention, and is an example of a structure in which two magnetic head sections are mounted on a floating slider.

図中では、パシベーション膜８彫成以前にヘッド形状縁
取り膜を形成し九ことに起因する前記パシベーション膜
の欠落ｈｔスライダ１の形状よりやや小さく、記録媒体
対向面を除いて生ずる。In the figure, the passivation film is slightly smaller than the shape of the ht slider 1 due to the fact that a head-shape edging film is formed before the passivation film 8 is carved, and occurs except on the surface facing the recording medium.

さて、以下に第１図の磁気へヴドの製造方法について詳
細に説明する。几だし、磁気へ噌ド部（ＩｉＢ＠、コイ
ル部、コイル端子部など）の製造方法は本発明と直接関
連しないため省略する。ま友［スでは一個のスライダに
けき描いである。後の形状加工予定の縁どりを行なう厚
膜の形成をめっきにて行なう場合について述べる。まず
第５図のように、絶＃＠７及び磁極２などの表面に、め
クキ形成予定の材料（例えば、金、銅など）を導電化膜
１２として数千人蒸着にて付着させる。通常、密着力を
確保する几めにけｃｒを数百λ、めっき予定の材質を数
千χスパッタリングし念力り＝良いのであるが１本発明
ではめつきにて形成し几暎を後に容易に除去できるよう
にするため蒸着を用いている。そして、第６図に示すよ
うに、磁気ヘッドが後に形状加工される所定の形状１５
より小さくレヂストなどカバーｌ１１３を形成し、導電
化膜１２に電極を接続して、ヘッド形状縁取り膜１４を
めつきにて成長させる。この後、カバー膜１３を除去し
、余分な導電化膜１２を除去（例えば、逆スパ噌タリン
グなどを用いて）する。このとき、導電化膜１２の膜厚
が薄いほど除去は容易であるが前記導電化膜が薄すぎる
とヘッド形状縁取り噂１４の膜厚が基板上において、場
所により不均一となることがある。さて、第７図のよう
に基板全面にパシベーション膜８をスパッタリングにて
形成すると、図のようにパシベーション膜下の形状を反
映して、パシベーション嘆８の表面には凹凸が生イる。Now, the method for manufacturing the magnetic head shown in FIG. 1 will be explained in detail below. The method of manufacturing the cut-out and magnetically inserted parts (IiB@, coil part, coil terminal part, etc.) is not directly related to the present invention and will therefore be omitted. In Mayu, it is drawn on a single slider. A case will be described in which plating is used to form a thick film for edging that will be later processed into a shape. First, as shown in FIG. 5, a material (for example, gold, copper, etc.) on which a plating is to be formed is deposited as a conductive film 12 on the surfaces of the pole #7 and the magnetic pole 2 by several thousand evaporation processes. Normally, the material to be plated is sputtered with several hundred λ of CR to ensure adhesion, and several thousand χ of the material to be plated. Vapor deposition is used to enable removal. Then, as shown in FIG.
A cover l113 such as a smaller resist is formed, an electrode is connected to the conductive film 12, and a head-shaped edging film 14 is grown by plating. After that, the cover film 13 is removed, and the excess conductive film 12 is removed (for example, by using reverse sputtering or the like). At this time, the thinner the conductive film 12 is, the easier it is to remove, but if the conductive film is too thin, the thickness of the head shape edging layer 14 may become uneven depending on the location on the substrate. Now, when the passivation film 8 is formed by sputtering on the entire surface of the substrate as shown in FIG. 7, the surface of the passivation layer 8 becomes uneven, reflecting the shape under the passivation film as shown in the figure.

この平担化の几めと、やけりめつ六により産膜を形成し
たコイル端子部（ヘッド形状縁取り噂と異なり、こちら
は絶縁膜７などとの密着強度を確保できるように配慮し
である）の露出のｔめに、パシベーション膜８の表面に
研削・研磨加工を施す。このときの加工により、ヘッド
形状縁取り嘆１４及び導電化膜１２け絶縁＠７より容易
に剥離し、第８図のように絶縁膜７の一部ｈＺ露出する
。In addition to this method of flattening, the coil terminal part is coated with a film formed by Yakerimetsuroku (unlike the rumored head shape edging, this is designed to ensure adhesion strength with the insulating film 7, etc.) ), the surface of the passivation film 8 is ground and polished. By this processing, the head shape rim 14 and the conductive film 12 are easily peeled off from the insulation @7, and a part hZ of the insulation film 7 is exposed as shown in FIG.

この様子の平面図を筆９図に示す。コイル端子部４＾を
露出している以外は、磁ＷＬ２及びコイル部６などはパ
シベーション嘆８にて覆われている。A plan view of this situation is shown in Figure 9. The magnetic WL2, coil section 6, etc. are covered with a passivation layer 8, except for the exposed coil terminal section 4^.

＋：、た、へ・Ｉド形状縁取り模ｈ″−剥離した部分だ
け、絶縁膜７が露出している。このとき肝要であるのは
、記録媒体対向面については磁極の惺護の之め最終的な
形状としてパシベーション膜に機械加工力が加わるのを
避けｂ’−たいｈ−１前記記録媒体対向面ば通常研磨工
程により最終仕上げが為されることが多く、ヘッド形状
縁取り膜とパシベーション膜との境界をできるだけ磁極
近傍に配し、バシベーシ四ン膜に加わる機械加工力を最
終仕上げの研磨工程だけに限定し次男が望ましい。ま之
、その他の部分のヘッド予定形状とヘッド形状縁取り膜
との関係は、ヘッドの形状加工予定により決定されるべ
きである。+:, T, H, I-shaped border pattern h'' - The insulating film 7 is exposed only in the peeled part.At this time, it is important to protect the magnetic pole on the surface facing the recording medium. To avoid applying machining force to the passivation film in the final shape, b'-h-1 The surface facing the recording medium is usually finished by a polishing process, and the head shape edging film and passivation film are It is desirable to place the boundary as close to the magnetic pole as possible, and to limit the machining force applied to the base four film only to the final polishing process. The relationship should be determined by the head shape processing schedule.

このようにして、第９図のような基板上に集積され几磁
気ヘッドを第１図に示し定形状に機械加工しても、パシ
ベーシ１ン膜及び絶縁膜の欠けならびに欠けに起因する
磁気ヘッド機能部の損傷は皆無であり次。In this way, even if the magnetic head integrated on the substrate as shown in FIG. 9 is machined into the regular shape shown in FIG. There was no damage to the functional parts.

〔発明の効果〕〔Effect of the invention〕

以上述べ比ように本発明によれば、バシベーシ剪ン膜形
成後形状加工される予定の形状より内側まで、ま之最終
的なパシベーション膜の厚みと同等かそれよりも厚い膜
を形成し、パシベーション膜形成後に、前記バシペーシ
１ン膜の表面を平担に除去する際に前記厚膜も除去して
、ヘッド形状加工時に直接パシベーション膜に機械加工
力が作用する部分を極力減少することにより、前記パシ
ベーシ１ン膜の欠けあるいはその欠けに起因する磁気ヘ
ッド機能部の損傷を防止し、磁気へ噌ドの耐機械加工性
を飛躍的に向上させるという効果を有する。As described above, according to the present invention, after forming the passivation film, a film that is equal to or thicker than the final passivation film is formed to the inside of the shape to be processed, and the passivation film is After the film is formed, when the surface of the passivation film is removed flatly, the thick film is also removed to reduce as much as possible the portion where machining force directly acts on the passivation film during head shape processing. This has the effect of preventing chipping of the passivation film or damage to the magnetic head functional section due to the chipping, and dramatically improving the machining resistance of the magnetic head.

尚１本発明の実施例においては少なくとも二回以上の巻
数のコイルを持ち非磁残導電体基板上に集積された浮動
形磁気ヘッドについて説明し友が磁性体基板上に少なく
とも二回以上の巻数のコイルと片磁極を集積した磁気へ
ヴド、あるいは記録媒体接触形磁気ヘッド、あるいけ磁
気抵抗効果化磁気ヘッドなど、磁気ヘッドの構造の差お
よび記録再生形式の差によらず、磁気へヴドの一部が半
導体技術の応用にて集積され、パシベーシ１ン膜を持ち
、後に形状を機械加工される磁気ヘッド全てにおいて１
本発明が有効であることは言うまでもない。1. In the embodiment of the present invention, a floating magnetic head having a coil with at least two turns and integrated on a non-magnetic residual conductor substrate will be described. Regardless of the difference in the structure of the magnetic head or the difference in the recording/reproducing format, the magnetic head can be A part of the magnetic head is integrated using semiconductor technology, has a passivation film, and is later machined into a shape in all magnetic heads.
It goes without saying that the present invention is effective.

ま九、本発明の実施例においてはヘッド形状縁取り嗅と
称する厚膜の形成にめっきを用いｆｉ　６”−１その他
の形成方法やヘプト形状縁取り膜の面積が本爽施例と異
なる場合でも同等の効果を有する。9. In the embodiment of the present invention, plating is used to form a thick film called a head shape edging film. It has the effect of

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の製造方法を適用し九−実施例の磁気へ
ラドスライダの斜視図。 第２図は従来の基板上に集積され几磁気ヘッドの平面図
。 第３図け＊２図中Ａ　−Ａ’部の断面図。 第４図は従来の製造方法により損傷を受は几磁気へラド
スライダの斜視図。 第５図は磁気ヘッド製造工程を表わす断面図。 第６図は磁気ヘッド製造工程を表わすｌ！Ｆｌ而図。 面７図は磁気ヘッド製造工容を表わす断面図。 第８図は磁気へヴド製造工場を表わす断面図。 填９図は本発明の一実施例の基板上に集積された磁気ヘ
ッドの平面図。 １・・・・・・スライダ ２・・・・・・磁極 ３・・・・・・コイル部 ３α・・・・ｔ−コイル ３ｂ・・・・・・絶縁膜 ４・・・・・・コイル端子部 ５・・・・・・形状加工予定線 ６・・・・・・コイルとコイル端子部を結ぶ嘆７・・・
・・・絶縁膜 ８・・・・・・パシベーシ１ン膜 ９・・・・・・端部カケ １０・・・・・・基板 １１・・・・・・端部カケが発生し易い機械加工力の方
向 １２・・・・・・導電化膜 １３・・・・・・カバー膜 １４・・・・・・ヘッド形状縁取り稗 １５・・・・・・ヘッド形状加工予定線取　　上FIG. 1 is a perspective view of a magnetic RAD slider according to a ninth embodiment to which the manufacturing method of the present invention is applied. FIG. 2 is a plan view of a conventional magnetic head integrated on a substrate. Figure 3 *2 A sectional view taken along line A-A' in Figure 3. FIG. 4 is a perspective view of a magnetic RAD slider that has been damaged by the conventional manufacturing method. FIG. 5 is a cross-sectional view showing the magnetic head manufacturing process. Figure 6 shows the magnetic head manufacturing process. Fl diagram. Figure 7 is a sectional view showing the manufacturing process of the magnetic head. FIG. 8 is a sectional view showing the magnetic heave manufacturing factory. Figure 9 is a plan view of a magnetic head integrated on a substrate according to an embodiment of the present invention. 1... Slider 2... Magnetic pole 3... Coil portion 3α... T-coil 3b... Insulating film 4... Coil Terminal part 5... Shape processing planned line 6... Line 7 connecting the coil and coil terminal part...
... Insulating film 8 ... Passivation film 9 ... End chipping 10 ... Substrate 11 ... Machining that tends to cause end chipping Direction of force 12...Conductive film 13...Cover film 14...Head shape edging 15...Head shape machining plan line drawing Top

Claims (1)

【特許請求の範囲】 （ａ）基板上に磁極、コイル、コイル端子部、絶縁膜の
いずれかを積層し、さらにパシベーション膜にて覆う構
造であり、 （ｂ）前記パシベーション膜形成後に形状加工される予
定の形状より内側まで、また最終的な前記パシベーショ
ン膜の厚みと同等かそれ以上の厚い膜を形成した後、パ
シベーション膜を形成し、（ｃ）形状加工前あるいは形
状加工時に前記厚膜を除去することを特徴とする磁気ヘ
ッドの製造方法。[Claims] (a) A structure in which any one of a magnetic pole, a coil, a coil terminal portion, and an insulating film are laminated on a substrate, and further covered with a passivation film, and (b) the shape is processed after the passivation film is formed. (c) forming a passivation film to the inner side of the shape planned to be formed and having a thickness equal to or greater than the final thickness of the passivation film; (c) forming the thick film before or during shape processing; A method of manufacturing a magnetic head characterized by removing the magnetic head.
JP21296185A 1985-09-26 1985-09-26 Manufacture of magnetic head Pending JPS6273411A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21296185A JPS6273411A (en) 1985-09-26 1985-09-26 Manufacture of magnetic head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21296185A JPS6273411A (en) 1985-09-26 1985-09-26 Manufacture of magnetic head

Publications (1)

Publication Number Publication Date
JPS6273411A true JPS6273411A (en) 1987-04-04

Family

ID=16631157

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21296185A Pending JPS6273411A (en) 1985-09-26 1985-09-26 Manufacture of magnetic head

Country Status (1)

Country Link
JP (1) JPS6273411A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0359811A (en) * 1989-07-28 1991-03-14 Hitachi Ltd Thin-film magnetic head and production thereof
JPH03120608A (en) * 1989-10-04 1991-05-22 Tdk Corp Thin-film magnetic head
US8411535B1 (en) 2011-11-30 2013-04-02 HGST Netherlands B.V. Electrical connection for a laser diode in a tar head
US8631561B2 (en) 2011-11-30 2014-01-21 HGST Netherlands B.V. Method for electrically connecting an energy source to a head of a disk drive

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0359811A (en) * 1989-07-28 1991-03-14 Hitachi Ltd Thin-film magnetic head and production thereof
JPH03120608A (en) * 1989-10-04 1991-05-22 Tdk Corp Thin-film magnetic head
JPH0557643B2 (en) * 1989-10-04 1993-08-24 Tdk Electronics Co Ltd
US8411535B1 (en) 2011-11-30 2013-04-02 HGST Netherlands B.V. Electrical connection for a laser diode in a tar head
US8631561B2 (en) 2011-11-30 2014-01-21 HGST Netherlands B.V. Method for electrically connecting an energy source to a head of a disk drive

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