JPH03109351U - - Google Patents
Info
- Publication number
- JPH03109351U JPH03109351U JP1623690U JP1623690U JPH03109351U JP H03109351 U JPH03109351 U JP H03109351U JP 1623690 U JP1623690 U JP 1623690U JP 1623690 U JP1623690 U JP 1623690U JP H03109351 U JPH03109351 U JP H03109351U
- Authority
- JP
- Japan
- Prior art keywords
- fitting groove
- integrated circuit
- circuit element
- bus line
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Pressure Sensors (AREA)
Description
第1図は本考案の実施例を示す図、第2図は第
1図のA方向矢視図である。 図において、1はシリコン基板、2はウエハス
ケール集積回路素子、3は嵌合溝、4はバスライ
ン、5はシリコンバツクパネルである。
1図のA方向矢視図である。 図において、1はシリコン基板、2はウエハス
ケール集積回路素子、3は嵌合溝、4はバスライ
ン、5はシリコンバツクパネルである。
Claims (1)
- シリコン基板1上にウエハスケール集積回路素
子2を支持、固定する嵌合溝3を平行に凹設する
とともに、該嵌合溝3に沿つてバスライン4を薄
膜工程により形成してなるシリコンバツクパネル
。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1623690U JPH03109351U (ja) | 1990-02-22 | 1990-02-22 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1623690U JPH03109351U (ja) | 1990-02-22 | 1990-02-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03109351U true JPH03109351U (ja) | 1991-11-11 |
Family
ID=31519516
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1623690U Pending JPH03109351U (ja) | 1990-02-22 | 1990-02-22 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03109351U (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008268651A (ja) * | 2007-04-23 | 2008-11-06 | Shiga Pref Gov | 立証札 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62293750A (ja) * | 1986-06-13 | 1987-12-21 | Nippon Telegr & Teleph Corp <Ntt> | 配線板およびその製造方法 |
-
1990
- 1990-02-22 JP JP1623690U patent/JPH03109351U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62293750A (ja) * | 1986-06-13 | 1987-12-21 | Nippon Telegr & Teleph Corp <Ntt> | 配線板およびその製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008268651A (ja) * | 2007-04-23 | 2008-11-06 | Shiga Pref Gov | 立証札 |
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