JPH0310761A - Cutter for semiconductor pellet - Google Patents
Cutter for semiconductor pelletInfo
- Publication number
- JPH0310761A JPH0310761A JP14640489A JP14640489A JPH0310761A JP H0310761 A JPH0310761 A JP H0310761A JP 14640489 A JP14640489 A JP 14640489A JP 14640489 A JP14640489 A JP 14640489A JP H0310761 A JPH0310761 A JP H0310761A
- Authority
- JP
- Japan
- Prior art keywords
- stage
- groove
- microscope
- grinding stone
- semiconductor pellet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 title claims abstract description 30
- 239000004065 semiconductor Substances 0.000 title claims abstract description 28
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 16
- 239000010432 diamond Substances 0.000 claims abstract description 16
- 230000002093 peripheral effect Effects 0.000 claims abstract description 3
- 239000011347 resin Substances 0.000 abstract description 10
- 229920005989 resin Polymers 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 4
- 239000004575 stone Substances 0.000 abstract 8
- 230000000007 visual effect Effects 0.000 abstract 2
- 238000005498 polishing Methods 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体ペレット用切削機に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a cutting machine for semiconductor pellets.
従来、半導体ペレットを切削して半導体ペレットに形成
された半導体素子の断面構造を観察するためには対象と
なる半導体ペレットを透明な硬い樹脂体に埋め込んで半
導体ペレットを保護し、樹脂体の外部から切削箇所の目
標が観察できる状態にして樹脂体を手の指あるいは治具
で固定してサンドペーパ及びアルミナ懸濁液を用いるパ
フ研磨法により半導体ペレットの端部から徐々に切削箇
所の目標に向って研磨すると云う方法が採用されていた
。Conventionally, in order to observe the cross-sectional structure of a semiconductor element formed in a semiconductor pellet by cutting a semiconductor pellet, the target semiconductor pellet is embedded in a transparent hard resin body to protect the semiconductor pellet, and the semiconductor pellet is protected from the outside of the resin body. With the target of the cutting location visible, the resin body is fixed with fingers or a jig, and the powder is gradually polished from the edge of the semiconductor pellet toward the target of the cutting location using a puff polishing method using sandpaper and alumina suspension. A method called polishing was used.
上記した従来の半導体ペレットの切削方法は、半導体ペ
レットを樹脂体に埋め込んでいるため、樹脂体への埋め
込みから樹脂硬化まで半日程の時間を要し、また切削箇
所の目標までサンドベーパやアルミナ懸濁液で徐々に研
磨して行かなければならないため、１個の半導体ペレッ
トの切削を完了するまでに８時間近くの工数を要してい
た。また、半導体ペレットが樹脂体内に埋め込まれてい
るため、切削箇所の目標の大きさが１０μｍ以下になる
と、厘微鏡の対物レンズと目標の距離を近ずけられない
ため顕微鏡の倍率を高くできず、樹指体の外から顕微鏡
を使用して目標を明確に観察することが困難となり、目
標とする半導体素子の正確な位置の観察が得にくいと云
う欠点があった。In the conventional semiconductor pellet cutting method described above, the semiconductor pellet is embedded in a resin body, so it takes half a day from embedding it in the resin body to resin hardening. Because polishing had to be done gradually with a liquid, it took nearly eight hours to complete the cutting of one semiconductor pellet. In addition, since the semiconductor pellet is embedded in the resin body, if the target size at the cutting point is less than 10 μm, the distance between the objective lens of the microscope and the target cannot be brought closer, so the magnification of the microscope cannot be increased. First, it is difficult to clearly observe the target from outside the resin using a microscope, and it is difficult to observe the exact position of the target semiconductor element.
本発明の半導体ペレット用切削機は、顕微鏡のステージ
に設けて該ステージを上下に貫通する溝と、前記溝の内
部に設けて周縁部が前記ステージの上面に突き出すこと
の可能な円板状の回転式のダイヤモンド砥石と、前記ダ
イヤモンド砥石を前記溝によって水平及び垂直に移動さ
せる手段とを有する。The cutting machine for semiconductor pellets of the present invention includes a groove provided on a stage of a microscope and penetrating the stage vertically, and a disk-shaped groove provided inside the groove so that a peripheral edge thereof can protrude above the top surface of the stage. It has a rotary diamond grindstone and means for moving the diamond grindstone horizontally and vertically through the groove.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図（ａ）、（ｂ）は本発明の一実施例の正面模式図
及び側面模式図である。FIGS. 1(a) and 1(b) are a schematic front view and a schematic side view of an embodiment of the present invention.
第１図（ａ）、（ｂ）に示すように、顕微鏡本体１の顕
微鏡の対物レンズの下に取付けられたステージ２の上下
の面を貫通して講３を設け、ステージ２の下側に制動ボ
ックス６に設けた軸にダイヤモンド砥石４が取付けられ
ている。As shown in FIGS. 1(a) and 1(b), a tube 3 is provided penetrating the upper and lower surfaces of the stage 2 attached below the objective lens of the microscope main body 1, and is attached to the lower side of the stage 2. A diamond grindstone 4 is attached to a shaft provided in a brake box 6.
第２図（ａ）、（ｂ）及び第３図は動作順に示した第１
図の部分平面図及びその側面図である。Figure 2 (a), (b) and Figure 3 are the first
FIG. 3 is a partial plan view and a side view thereof.
まず、第２図（ａ）、（ｂ）に示すように、半導体ペレ
ット７の切断箇所の目標１８がステージ２の溝３上に位
置するように半導体ペレット７を両面テープ等でステー
ジ２の上に張り付け、ステージ２を移動して切断箇所の
目標８を顕微鏡視野の中心に位置させる。次に、ステー
ジ２とダイヤモンド砥石４を溝３と平行方向に水平移動
し、制動ボックス６を操作してダイヤモンド砥石４を講
３と垂直方向に移動してダイヤモンド砥石４の刃先の中
心を顕微鏡視野の中心に合せ、制動ボックス６を操作し
て刃先の高さを半導体ペレット７の表面と裏面との中間
に設定する。First, as shown in FIGS. 2(a) and 2(b), the semiconductor pellet 7 is placed on the stage 2 using double-sided tape or the like so that the target 18 of the cutting point of the semiconductor pellet 7 is located on the groove 3 of the stage 2. and move the stage 2 to position the target 8 of the cutting location at the center of the microscope field of view. Next, the stage 2 and the diamond whetstone 4 are moved horizontally in a direction parallel to the groove 3, and the brake box 6 is operated to move the diamond whetstone 4 in a direction perpendicular to the stage 3, so that the center of the cutting edge of the diamond whetstone 4 can be seen under the microscope. , and operate the brake box 6 to set the height of the cutting edge to be midway between the front and back surfaces of the semiconductor pellet 7.
次に、第３図に示すようにダイヤモンド砥石４を回転さ
せ、ステージ２を溝３の平行方向に一定速度で水平移動
し、ダイヤモンド砥石４の刃先が半導体ペレット７の端
部に至るまで切削した所でダイヤモンド砥石４の回転を
停止する。Next, as shown in FIG. 3, the diamond grinding wheel 4 was rotated, and the stage 2 was moved horizontally at a constant speed in the direction parallel to the groove 3, until the cutting edge of the diamond grinding wheel 4 reached the end of the semiconductor pellet 7. At this point, the rotation of the diamond grindstone 4 is stopped.
このようにして、半導体ペレット７に切削目標の裏側に
切り込みを入れた状態とした後に半導体ペレット７をス
テージ２から取り外し平な面上に置いて切削目標の延長
上の前記切り込み部を先端の細い針のようなもので押す
と、前記の切り込みに沿って半導体ペレット７が割れ切
断を完了する。In this way, after the semiconductor pellet 7 has been cut on the back side of the cutting target, the semiconductor pellet 7 is removed from the stage 2 and placed on a flat surface, and the cut part on the extension of the cutting target is cut into a thin tip. When pressed with something like a needle, the semiconductor pellet 7 cracks along the cut and completes the cutting.
以上説明したように本発明は、半導体ペレットを樹脂に
埋め込むことなく切削が可能であるため、切削に要する
工数を従来の１／１０以下とすることができる他、半導
体ペレットの切断箇所目標を直接語微鏡で観察し、位置
合せできるため、目標に合わせた正確な切削が可能とな
る。As explained above, the present invention makes it possible to cut the semiconductor pellet without embedding it in resin, so the man-hours required for cutting can be reduced to 1/10 or less compared to the conventional method, and it is also possible to directly target the cutting point of the semiconductor pellet. Since it can be observed and aligned using a microscope, precise cutting can be performed according to the target.
及びその側面図である。and a side view thereof.
１・・・顕微鏡本体、２・・・ステージ、３・・・溝、
４・・・ダイヤモンド砥石、５・・・軸、６・・・制動
ボックス、７・・・半導体ペレット、８・・・切断箇所
目標。1...Microscope body, 2...Stage, 3...Groove,
4... Diamond grindstone, 5... Shaft, 6... Brake box, 7... Semiconductor pellet, 8... Cutting point target.
Claims (1)
溝と、前記溝の下部に設けて周縁部が前記ステージの上
面に突き出すことの可能な円板状の回転式のダイヤモン
ド砥石と、前記ダイヤモンド砥石を前記溝にそって水平
及び垂直に移動させる手段を有することを特徴とする半
導体ペレット用切削機。A groove provided on a stage of a microscope and passing through the stage vertically; a disc-shaped rotary diamond grindstone provided at the bottom of the groove so that a peripheral edge thereof can protrude above the top surface of the stage; and the diamond grindstone. A cutting machine for semiconductor pellets, comprising means for moving the pellet horizontally and vertically along the groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14640489A JPH0310761A (en) | 1989-06-07 | 1989-06-07 | Cutter for semiconductor pellet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14640489A JPH0310761A (en) | 1989-06-07 | 1989-06-07 | Cutter for semiconductor pellet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0310761A true JPH0310761A (en) | 1991-01-18 |
Family
ID=15406937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14640489A Pending JPH0310761A (en) | 1989-06-07 | 1989-06-07 | Cutter for semiconductor pellet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0310761A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04322442A (en) * | 1991-04-22 | 1992-11-12 | Sharp Corp | Inspecting apparatus for semiconductor device |
-
1989
- 1989-06-07 JP JP14640489A patent/JPH0310761A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04322442A (en) * | 1991-04-22 | 1992-11-12 | Sharp Corp | Inspecting apparatus for semiconductor device |
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