JPH0267507A - Connector for optical fiber - Google Patents

Connector for optical fiber

Info

Publication number
JPH0267507A
JPH0267507A JP21923888A JP21923888A JPH0267507A JP H0267507 A JPH0267507 A JP H0267507A JP 21923888 A JP21923888 A JP 21923888A JP 21923888 A JP21923888 A JP 21923888A JP H0267507 A JPH0267507 A JP H0267507A
Authority
JP
Japan
Prior art keywords
connector
guide pin
organic film
fixing member
optical fiber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21923888A
Other languages
Japanese (ja)
Inventor
Hiroyuki Fujikawa
裕之 藤川
Makoto Kawase
誠 川瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP21923888A priority Critical patent/JPH0267507A/en
Publication of JPH0267507A publication Critical patent/JPH0267507A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To increase the rupture strength and improve the durability of the title connector by forming an organic film on the surface of a guide pin fixing member. CONSTITUTION:This connector 2 is fitted to the optical fuber 1, after the end face 1b to be connected of an optical fiber 1 is exposed. The connector has a rectangular guide pin fixing member 3 provided with two V grooves 3b formed in the upper surface along the connecting direction. A organic film 3a is formed on the upper surface of the member 3 as a buffer layer by an electrolytic leaving method. Therefore, when external force is applied to the member 3 coated with the organic film 3a, the organic film 3a acts as a buffer layer and absorbs the shock. Thus the occurrence of cracks can be prevented and the durability of the connector can be improved.

Description

【発明の詳細な説明】 〈産業上の利用分野〉 本発明は光ファイバ同士の接続に用いるコネクタに係わ
り、より詳しくは耐久性に優れた光ファイバ用コネクタ
に関する。
DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a connector used for connecting optical fibers, and more particularly to an optical fiber connector with excellent durability.

〈従来の技術〉 光ファイバ同士の接続法として、着脱が可能で、接続作
業が簡単なコネクタによる接続法がある。
<Prior Art> As a method of connecting optical fibers, there is a method of connecting optical fibers using a connector that is detachable and easy to connect.

このコネクタによる接続法の一つに、ガイドピンをガイ
ドピン固定部材にて一方のコネクタに挾み込んで固定し
、該ガイドピンを他方のコネクタに設けられたガイド孔
に嵌入させることにより、コネクタ同士の接続を行う接
続法がある。
One of the connection methods using this connector is to insert and fix a guide pin into one connector using a guide pin fixing member, and then insert the guide pin into a guide hole provided in the other connector. There is a subjunctive method that connects them.

従来、ガイドピン固定部材は、金属材料を精密切削加工
して作製したものが主流を占めていた。
Conventionally, guide pin fixing members have been mainly manufactured by precision cutting metal materials.

しかし、ガイドピン固定部材はミクロン単位の寸法精度
で精密加工する必要があるにもががゎらず、金属材料で
は加工誤差によってコアの軸ずれ、角度ずれ等が生じ、
接続部における光伝送損失(以下、「接続損失」という
)が多いものが作製される場合があった。
However, the guide pin fixing member needs to be precisely machined with dimensional accuracy in the micron level, and with metal materials, machining errors can cause core axis misalignment, angular misalignment, etc.
In some cases, a device with a large optical transmission loss (hereinafter referred to as "connection loss") at the connection portion was manufactured.

そこで、近年、加工精度を向上させるため、金属材料に
代わるものとして精密加工に好適なシリコン等のセラミ
ックがガイドピン固定部材の材料として実用化されてい
る。
Therefore, in recent years, in order to improve machining accuracy, ceramics such as silicon, which are suitable for precision machining, have been put into practical use as materials for guide pin fixing members in place of metal materials.

〈発明が解決しようとする課題〉 しかしながら、上記従来の光ファイバ用コネク夕には、
ガイドピン固定部材の素材として用いるセラミックが脆
くて強度が充分でなく、接続の際、ガイドピンを介して
加えられる外力により簡単にひび割れしたり、表面にク
ラックが生じたりするため、耐久性が良くないと共に、
これらひび割れ等によりコア軸のずれ等が生じ、損失の
少ない光伝送を行うことができないという問題があった
<Problem to be solved by the invention> However, the conventional optical fiber connector described above has the following problems:
The ceramic used as the material for the guide pin fixing member is brittle and does not have sufficient strength, and when connected, it easily cracks or cracks occur on the surface due to external force applied through the guide pin. With no,
There is a problem in that these cracks cause misalignment of the core axis, making it impossible to perform optical transmission with little loss.

本発明は、上記問題を解決するためになされたものであ
って、その目的とするところは、加工精度を向上させる
ためにセラミック等の精密加工に適した部材にて作製さ
れたガイドビン固定部材の脆さに起因するひび割れ及び
クラックが生じることのないコネクタを提供することに
ある。
The present invention has been made in order to solve the above-mentioned problems, and its purpose is to provide a guide bin fixing member made of a material suitable for precision machining, such as ceramic, in order to improve machining accuracy. An object of the present invention is to provide a connector that is free from cracks and cracks caused by the fragility of the connector.

く課題を解決するための手段〉 上記目的を達成するべくなされた本発明に係る光ファイ
バ用コネクタは、少なくとも前記ガイドビン固定部材の
ガイドピンが当接する面に、軟質の有機膜が形成されて
いることを特徴とする。
Means for Solving the Problems> The optical fiber connector according to the present invention, which has been made to achieve the above object, has a soft organic film formed at least on the surface of the guide bin fixing member that the guide pin contacts. It is characterized by the presence of

上記有機膜の素材としては、ポリエチレン、ポリテトラ
フルオロエチレン、ポリイミド、ポリフ二二しンサルフ
ァイドが例示されるが、軟質膜を形成し得るものであれ
ば特に限定されない。
Examples of the material for the organic film include polyethylene, polytetrafluoroethylene, polyimide, and polyphenylene sulfide, but the material is not particularly limited as long as it can form a soft film.

上記有機膜の膜厚は1〜50μ−程度が好ましい。The thickness of the organic film is preferably about 1 to 50 μm.

これは、膜厚が1μm未満であると、有機膜の緩衝層と
しての効果を充分期待できなくなるからであり、50μ
mを越えると、軸ずれ等が大きくなり接続損失が多くな
るからである。
This is because if the film thickness is less than 1 μm, the effect of the organic film as a buffer layer cannot be expected to be sufficient;
This is because if it exceeds m, axis misalignment, etc. will become large and connection loss will increase.

上記有機膜を形成する好適な手段としては、電界脱離法
を例示することができる。塗布法によることも可能では
あるが、ピンホールの少ない高品質の膜を形成し得る点
で電界脱離法が好ましい。
An example of a suitable means for forming the organic film is an electric field desorption method. Although it is possible to use a coating method, the electric field desorption method is preferable because it can form a high-quality film with few pinholes.

電界脱離法は、先端の尖鋭部に有機物を塗布した加熱に
耐え得る針金、カミソリ等を一方の電極として配すると
共に、対向電極を空間を隔てて配し、これら両電極間に
高電圧を印加して108V/(至)程度以上の強い電界
を発生させ、徐々に昇温し、発生した電界の吸引力によ
り、加熱溶融した有機物をいわゆる分子イオン又は帯電
粒子として溶融相から気相に飛散させ、この飛散物を上
記電界の作用によりガイドビン固定部材の表面に運び、
そこに膜を析出形成する方法である。
In the electric field desorption method, a wire, razor, etc. that can withstand heating and whose sharp tip is coated with an organic substance is placed as one electrode, an opposing electrode is placed with a space between them, and a high voltage is applied between these two electrodes. A strong electric field of about 108 V/(max) is applied, the temperature is gradually raised, and the attractive force of the generated electric field causes the heated and melted organic matter to scatter from the molten phase to the gas phase as so-called molecular ions or charged particles. The scattered objects are carried to the surface of the guide bin fixing member by the action of the electric field,
This method involves depositing and forming a film there.

上記飛散物には、極微細なジェット状の帯電した液滴と
して飛散するものと、分子状のいわゆる分子イオンとし
て飛散するものとがあり、電界脱離法は両爪散物を共に
シリコン等のガイドビン固定部材に導いて膜形成をなす
ので、膜形成効率の高い方法であると言える。
The above-mentioned scattered particles include those that scatter as ultrafine jet-shaped charged droplets and those that scatter as molecular ions, and the electric field desorption method can remove both types of scattered particles such as silicon. Since the film is formed by guiding it to the guide bin fixing member, it can be said that it is a method with high film formation efficiency.

く作用〉 本発明に係る光ファイバ用コネクタの有機膜で被覆され
ているガイドビン固定部材にガイドピンを介して外力が
作用すると、有機膜が緩衝層として衝撃を吸収し、これ
によりコネクタのひび割れ、クラック等の亀裂の発生が
阻止される。
Effect> When an external force acts on the guide bin fixing member covered with the organic film of the optical fiber connector according to the present invention via the guide pin, the organic film absorbs the impact as a buffer layer, thereby preventing cracks in the connector. , the occurrence of cracks such as cracks is prevented.

〈実施例〉 以下、本発明の実施例について添付図面を参照にして詳
細に説明する。
<Examples> Hereinafter, examples of the present invention will be described in detail with reference to the accompanying drawings.

第1図は本発明に係る光ファイバ用コネクタ(2)を示
し、図において(1)は光ファイバであり、該光ファイ
バ(1)には、光ファイバ(1)の接続すべき端面(l
b)を露出させてコネクタ(2)が取り付けられている
。コネクタ(2)は、第2図に示すように、接続方向に
延びる2つのV溝(3b) (3b)が上面に形成され
た直方体状のガイドビン固定部材(3)を有している。
FIG. 1 shows an optical fiber connector (2) according to the present invention. In the figure, (1) is an optical fiber, and the optical fiber (1) has an end face (l) to be connected to the optical fiber (1).
Connector (2) is attached with b) exposed. As shown in FIG. 2, the connector (2) has a rectangular parallelepiped-shaped guide bin fixing member (3) having two V-grooves (3b) (3b) extending in the connection direction formed on its upper surface.

各々のV溝(3b)には、該V溝(3b)とコネクタ(
2の外枠を内側に囲巻して形成した弾性部(2a) (
2a)とによってコネクタ(2)に固定支持される棒状
のガイドピン(4)が挿入されている。このガイドピン
(4)を接続すべき他方の光ファイバのコネクタ(図示
せず)に形成されたガイド孔に嵌入させて光ファイバの
端面同士を衝合させることによりオプティカル接続がな
されるのである。なお、光ファイバ(1)のコネクタ(
2)内の位置決めは、弾性部(2a) (2a)により
挾持される着脱可能な直方体状の押圧部材(5)と、ガ
イドビン固定部材(3)とによりなされる。
Each V groove (3b) is connected to the V groove (3b) and the connector (
An elastic part (2a) formed by wrapping the outer frame of No. 2 inward (
A rod-shaped guide pin (4) fixedly supported by the connector (2) by the connector (2a) is inserted. An optical connection is made by fitting this guide pin (4) into a guide hole formed in a connector (not shown) of the other optical fiber to be connected and bringing the end surfaces of the optical fibers into abutment. In addition, the connector (
Positioning within 2) is performed by a removable rectangular parallelepiped pressing member (5) held by the elastic portion (2a) (2a) and a guide bin fixing member (3).

上記ガイドビン固定部材(3)の上面には、第3図に示
すように緩衝層としての有機膜(3a)が電界脱離法を
用いて形成されている。
As shown in FIG. 3, an organic film (3a) as a buffer layer is formed on the upper surface of the guide bin fixing member (3) using an electric field desorption method.

上記有機膜(3a)は、有機物として、ポリエチレン(
実施例1)、ポリイミド(実施例2)又はポリテトラフ
ルオロエチレン(実施例3)を多孔質金属であるニッケ
ルを素材とする発泡金属(商品名「セルメット」、住友
電気工業社製)の空孔部に保持させた後、これを加熱し
て有機物を溶融させる一方、この多孔質金属と空間を隔
てて配したメツシュ状の対向電極との間に20K Vの
電圧を15分間印加することによりに膜厚2μ厘に形成
したものである。
The organic film (3a) contains polyethylene (
Example 1), polyimide (Example 2) or polytetrafluoroethylene (Example 3) were used as pores in a foamed metal (trade name "Celmet", manufactured by Sumitomo Electric Industries, Ltd.) made of nickel, which is a porous metal. After holding the porous metal in place, the organic matter is melted by heating it, while applying a voltage of 20 KV for 15 minutes between the porous metal and a mesh-like counter electrode placed across a space. The film was formed to have a thickness of 2 μm.

上記実施例1〜3において作成したコネクタ(2)のガ
イドピン(4) (4)の先端にそれらを外側、すなわ
ちへの字状におし拡げる方向に外力を加えた場合のコネ
クタ(2)の破壊強度を表に示す。なお、有機膜を形成
しなかったコネクタ(2)の破壊強度を、比較例として
併記している。
Connector (2) when an external force is applied to the tips of the guide pins (4) (4) of the connectors (2) created in Examples 1 to 3 above in the direction of expanding them outward, that is, in a curved shape. The table shows the breaking strength of Note that the breaking strength of the connector (2) on which no organic film was formed is also shown as a comparative example.

(以下、余白) 上記表より明らかなようにガイドピン固定部材に有機膜
が形成された本発明に係る光ファイバ用コネクタ(実施
例1〜3)は、有機膜が形成されていない従来の光ファ
イバ用コネクタ(比較例)に比べて破壊強度が倍程度大
きい。
(Hereinafter, blank space) As is clear from the above table, the optical fiber connectors (Examples 1 to 3) according to the present invention in which an organic film is formed on the guide pin fixing member are different from the conventional optical fiber connectors in which an organic film is not formed. The breaking strength is approximately twice as high as that of the fiber connector (comparative example).

なお、上記実施例ではコネクタ同士を直接接続する方式
のコネクタについて説明したが、本発明はかかる構造の
ものに限られず、例えば中間接続具を介してコネクタ同
士を接続する構造のコネクタであってもよい。
Although the above embodiment describes a connector that connects the connectors directly to each other, the present invention is not limited to such a structure. good.

また、■構成のガイドビン固定部材を備えるコネクタに
ついて説明したが、■溝は楔効果によりガイドピンの滑
動を防止するためであるから、滑動を防止し得る構造の
ガイドピン固定部材を備えるものであれば、本発明は、
かかる形状のガイドピン固定部材を備えるコネクタに限
定されるものではない。
In addition, although we have described a connector equipped with a guide pin fixing member having the structure (■), since the groove is used to prevent the guide pin from sliding due to the wedge effect, it is not a connector that is equipped with a guide pin fixing member having a structure that can prevent sliding. If so, the present invention
The connector is not limited to a guide pin fixing member having such a shape.

〈発明の効果〉 本発明に係る光ファイバ用コネクタは、ガイドビン固定
部材に有機膜が形成されているので、破壊強度が大きく
耐久性に優れる等、本発明は優れた特有の効果を奏する
<Effects of the Invention> Since the optical fiber connector according to the present invention has an organic film formed on the guide bin fixing member, the present invention has excellent unique effects such as high breaking strength and excellent durability.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明に係る光ファイバ用コネクタの一実施例
を示す斜視図、第2図は■溝を有するガイドビン固定部
材の斜視図、第3図は有機膜が形成されたガイドピン固
定部材の断面図である。 (1)・・・光ファイバ、(2)・・・コネクタ、(2
a)・・・弾性部、(3)・・・ガイドピン固定部材、
(3a)・・・有機膜、(4)・・・ガイドピン、(5
)・・・抑圧部材。
Fig. 1 is a perspective view showing an embodiment of the optical fiber connector according to the present invention, Fig. 2 is a perspective view of a guide pin fixing member having a groove, and Fig. 3 is a guide pin fixing member formed with an organic film. It is a sectional view of a member. (1)...Optical fiber, (2)...Connector, (2
a)...Elastic part, (3)...Guide pin fixing member,
(3a)...Organic film, (4)...Guide pin, (5
)...Suppression member.

Claims (1)

【特許請求の範囲】 1、コネクタ同士の接続を案内するガイ ドピンと、該ガイドピンをコネクタ外枠 との間で挾み込んで固定する脆性のガイ ドピン固定部材とを備える光ファイバ用 コネクタにおいて、 少なくとも前記ガイドピン固定部材の ガイドピンが当接する面に、軟質の有機 膜が形成されていることを特徴とする光 ファイバ用コネクタ。[Claims] 1. Guide to guide the connection between connectors and the guide pin to the outer frame of the connector. A brittle guy that is inserted between the For optical fiber with doping fixing member In the connector, At least the guide pin fixing member There is a soft organic material on the surface that the guide pin contacts. Light characterized by the formation of a film Fiber connector.
JP21923888A 1988-09-01 1988-09-01 Connector for optical fiber Pending JPH0267507A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21923888A JPH0267507A (en) 1988-09-01 1988-09-01 Connector for optical fiber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21923888A JPH0267507A (en) 1988-09-01 1988-09-01 Connector for optical fiber

Publications (1)

Publication Number Publication Date
JPH0267507A true JPH0267507A (en) 1990-03-07

Family

ID=16732379

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21923888A Pending JPH0267507A (en) 1988-09-01 1988-09-01 Connector for optical fiber

Country Status (1)

Country Link
JP (1) JPH0267507A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6254280B1 (en) * 1995-02-21 2001-07-03 Agere Systems Optoelectronics Guardian Corp. Substrate based array connector

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6254280B1 (en) * 1995-02-21 2001-07-03 Agere Systems Optoelectronics Guardian Corp. Substrate based array connector

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