JPH025944Y2 - - Google Patents
Info
- Publication number
- JPH025944Y2 JPH025944Y2 JP1983112437U JP11243783U JPH025944Y2 JP H025944 Y2 JPH025944 Y2 JP H025944Y2 JP 1983112437 U JP1983112437 U JP 1983112437U JP 11243783 U JP11243783 U JP 11243783U JP H025944 Y2 JPH025944 Y2 JP H025944Y2
- Authority
- JP
- Japan
- Prior art keywords
- glass cloth
- phosphonium salt
- epoxy resin
- laminate
- aromatic amine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011521 glass Substances 0.000 claims description 17
- 239000004744 fabric Substances 0.000 claims description 16
- 239000003822 epoxy resin Substances 0.000 claims description 14
- 229920000647 polyepoxide Polymers 0.000 claims description 14
- 150000004714 phosphonium salts Chemical group 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 239000004593 Epoxy Substances 0.000 claims description 9
- 150000004982 aromatic amines Chemical class 0.000 claims description 7
- 150000001875 compounds Chemical class 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 239000011888 foil Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000003607 modifier Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical class [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000004848 polyfunctional curative Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Description
【考案の詳細な説明】
産業上の利用分野
本考案は、配線用基材として、適度な可撓性を
有する金属箔−ガラス布基材エポキシ樹脂積層板
に関する。[Detailed Description of the Invention] Industrial Application Field The present invention relates to a metal foil-glass cloth base epoxy resin laminate having appropriate flexibility as a wiring base material.
従来例の構成とその問題点
従来のガラス布基材エポキシ樹脂板は、その結
着材のエポキシ樹脂が、主に、酸無水物系硬化剤
配合の樹脂あるいはノボラツク型樹脂硬化剤配合
の樹脂で形成されており、強い剛性を有する反
面、例えば、はんだ材のリフロー過程のような
200℃をこえる高温処理に対して、ガラスと樹脂
との接着部分に剥離が生じるという問題があつ
た。Structure of conventional examples and their problems In conventional glass cloth-based epoxy resin plates, the epoxy resin as a binder is mainly a resin containing an acid anhydride hardener or a resin containing a novolak type resin hardener. Although it has strong rigidity,
When subjected to high-temperature treatment exceeding 200°C, there was a problem in which peeling occurred at the bonded area between the glass and the resin.
考案の目的
本考案は、従来のガラス布基材エポキシ樹脂積
層板にみられた問題点を解消するものであり、適
度な可撓性とともに、耐熱性、耐湿性のすぐれた
金属箔−ガラス布基材エポキシ樹脂積層板を提供
すものである。Purpose of the invention This invention solves the problems observed in conventional glass cloth-based epoxy resin laminates. The present invention provides a base epoxy resin laminate.
考案の構成
本考案は、要約すると、ガラス布基材に、エポ
キシ成分、芳香族アミンアダクト化合物および第
四フオスフオニウム塩もしくは第五フオスフオニ
ウム塩を含む樹脂を用いて金属箔を張り合わせた
ガラス布基材エポキシ樹脂積層板であり、これに
より、ガラス布基材エポキシ樹脂積層板の剛性を
緩和し、かつ、耐熱性、耐湿性のよいガラス布基
材エポキシ樹脂積層板を得ることができる。Structure of the invention In summary, the present invention consists of a glass cloth base epoxy laminated with a metal foil using a resin containing an epoxy component, an aromatic amine adduct compound, and a quaternary phosphonium salt or a fifth phosphonium salt. This is a resin laminate, thereby making it possible to reduce the rigidity of the glass cloth-based epoxy resin laminate and to obtain a glass cloth-based epoxy resin laminate having good heat resistance and moisture resistance.
実施例の説明
図面は本考案実施例積層板の断面図であり、銅
箔１とガラス布基材エポキシ樹脂積層板２との張
り合せ構体である。ガラス布基材エポキシ樹脂積
層板２は、ガラス布にエポキシ樹脂を含浸させ、
これを、通常、複数枚積層したものであり、その
エポキシ樹脂の配合成分として、エポキシ成分、
芳香族アミンアダクト化合物および第四フオスフ
オニウム塩を含むものである。エポキシ成分は、
平均分子量300〜500で、なるべく、中心分布の高
密度なものを用い、これに、ほぼ等量の芳香族ア
ミンアダクト化合物を硬化剤として配合する。ま
た、硬化調整剤として、第四フオスフオニウム塩
もしくは第五フオスフオニウム塩を、前記エポキ
シ成分と芳香族アミンアダクト化合物との配合物
に対して、0.2重量％程度添加する。そして、前
記樹脂組成物をガラス布に含浸させ、厚さ40〜
60μmの単層を形成し、脱泡処理後、100℃、１時
間の熱処理を施し、半硬化（Ｂステージ）状態に
する。そして、基材として所望の厚みになるよう
に、前記ガラス布単層を復数枚に積層するととも
に、最表部に銅箔１を張り合わせたのち、140℃
以上の硬化過程で、成型、接着を行なう。なお、
銅箔１は積層板２の両面に接着することも可能で
ある。DESCRIPTION OF THE EMBODIMENTS The drawing is a sectional view of a laminate according to an embodiment of the present invention, which is a laminated structure of a copper foil 1 and a glass cloth base epoxy resin laminate 2. The glass cloth base epoxy resin laminate 2 is made by impregnating glass cloth with epoxy resin,
This is usually made by laminating multiple sheets, and the epoxy resin composition includes epoxy components,
It contains an aromatic amine adduct compound and a quaternary phosphionium salt. The epoxy component is
A material with an average molecular weight of 300 to 500 and a high density central distribution is preferably used, and approximately the same amount of an aromatic amine adduct compound is blended therein as a curing agent. Further, as a curing regulator, about 0.2% by weight of a quaternary phosphonium salt or a fifth phosphonium salt is added to the mixture of the epoxy component and the aromatic amine adduct compound. Then, a glass cloth is impregnated with the resin composition to a thickness of 40~40 mm.
A single layer of 60 μm is formed, and after degassing treatment, heat treatment is performed at 100°C for 1 hour to bring it to a semi-cured (B stage) state. Then, the single layer of glass cloth was laminated several times so as to have the desired thickness as a base material, and the copper foil 1 was pasted on the outermost part, and then heated to 140°C.
Molding and adhesion are performed during the above curing process. In addition,
The copper foil 1 can also be bonded to both sides of the laminate 2.
なお、エポキシ成分、芳香族アミンアダクト化
合物および第四フオスフオニウム塩もしくは第五
フオスフオニウム塩を含む樹脂は、完全硬化後の
軟化温度が150℃以上であり、250℃〜300℃の熱
処理に対しても十分な耐性があり、また、ガラス
布の熱膨張に対しても、その伸縮性によつて十分
に対応し、ガラス繊維体と樹脂との剥離が、ほと
んど起こらない。 In addition, resins containing an epoxy component, an aromatic amine adduct compound, and a quaternary phosphonium salt or a fifth phosphonium salt have a softening temperature of 150°C or higher after complete curing, and are suitable for heat treatment at 250°C to 300°C. Furthermore, its elasticity sufficiently copes with the thermal expansion of the glass cloth, and peeling between the glass fiber body and the resin hardly occurs.
考案の効果
本考案によれば、エポキシ成分、芳香族アミン
アダクト化合物および第四フオスフオニウム塩も
しくは第五フオスフオニウム塩を含む樹脂が適度
の可撓性を有しているから、これを結着材に用い
たガラス布基材エポキシ樹脂積層板も可撓性を付
与することが可能であり、とくに、伸び率の大き
い銅箔と張り合わせて、適度な可撓性をそなえた
配線用基材を得ることができる。Effects of the invention According to the invention, since the resin containing the epoxy component, aromatic amine adduct compound, and quaternary phosphonium salt or fifth phosphonium salt has appropriate flexibility, it can be used as a binder. It is also possible to impart flexibility to glass cloth-based epoxy resin laminates, and in particular, it is possible to obtain wiring substrates with appropriate flexibility by laminating them with copper foil, which has a high elongation rate. can.
図面は本考案実施例積層板の断面図である。
１……銅箔、２……ガラス布基材エポキシ樹脂
積層板。
The drawing is a sectional view of a laminate according to an embodiment of the present invention. 1...Copper foil, 2...Glass cloth base epoxy resin laminate.
Claims (1)
とほぼ等量の芳香族アミンアダクト化合物および
硬化調整剤として第四フオスフオニウム塩もしく
は第五フオスフオニウム塩を含む樹脂を含浸させ
たガラス布基材に、金属箔を張り合わせたことを
特徴とするガラス布基材エポキシ樹脂積層板。 A metal foil is laminated onto a glass cloth substrate impregnated with a resin containing an epoxy component, an aromatic amine adduct compound as a curing agent in an amount almost equal to the epoxy component, and a quaternary phosphonium salt or a fifth phosphonium salt as a curing modifier. A glass cloth-based epoxy resin laminate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11243783U JPS6019431U (en) | 1983-07-19 | 1983-07-19 | Glass cloth base epoxy resin laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11243783U JPS6019431U (en) | 1983-07-19 | 1983-07-19 | Glass cloth base epoxy resin laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6019431U JPS6019431U (en) | 1985-02-09 |
| JPH025944Y2 true JPH025944Y2 (en) | 1990-02-14 |
Family
ID=30260653
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11243783U Granted JPS6019431U (en) | 1983-07-19 | 1983-07-19 | Glass cloth base epoxy resin laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6019431U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49107079A (en) * | 1973-02-13 | 1974-10-11 | ||
| JPS5831746A (en) * | 1981-08-19 | 1983-02-24 | 東芝ケミカル株式会社 | Copper lined laminated board |
-
1983
- 1983-07-19 JP JP11243783U patent/JPS6019431U/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49107079A (en) * | 1973-02-13 | 1974-10-11 | ||
| JPS5831746A (en) * | 1981-08-19 | 1983-02-24 | 東芝ケミカル株式会社 | Copper lined laminated board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6019431U (en) | 1985-02-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0434013B1 (en) | Epoxy resin-impregnated glass cloth sheet having adhesive layer | |
| JPH025944Y2 (en) | ||
| JPS6021220A (en) | Manufacture of chemical plating laminated sheet | |
| JPH0133513B2 (en) | ||
| JPS589756B2 (en) | Method for manufacturing coating sheet and copper clad laminate | |
| CN100497475C (en) | Halogen-free resin composition and its uses in adhesive sheet and copper-cladded plate | |
| JPS61138680A (en) | Adhesive and substrate for flexible printed circuit | |
| JPH05116249A (en) | Manufacture of laminated board | |
| JPH08283436A (en) | Prepreg and copper-clad laminate board | |
| JPH07112506A (en) | Preparation of metal foil-clad laminated sheet | |
| JPS607792A (en) | Heat resistant insulating substrate and method of producing same | |
| JPS6026706B2 (en) | Epoxy resin copper clad laminate | |
| JPS60127348A (en) | Epoxy resin composition and electrical laminated board | |
| JPS62116682A (en) | Metal foil adhesive for laminate | |
| JPS60127148A (en) | Laminated board | |
| JPS6143550A (en) | Adhesive for metal lined laminated board | |
| JPS6049212B2 (en) | Manufacturing method of epoxy resin bonding sheet | |
| JPS63265486A (en) | Printed circuit board | |
| JPS6336622B2 (en) | ||
| JPS587460B2 (en) | Method for manufacturing coated composite sheets and copper-clad laminates | |
| JPS58127670A (en) | Production of table tennis racket base plate | |
| JPH024887A (en) | Adhesive composition | |
| JPS5989145A (en) | Manufacture of laminated board | |
| JPH02308595A (en) | Epoxy resin multilayer copper coated laminated board | |
| JPS63290737A (en) | Laminated sheet for electricity |