JPS5831746A - Copper lined laminated board - Google Patents
Copper lined laminated boardInfo
- Publication number
- JPS5831746A JPS5831746A JP12959081A JP12959081A JPS5831746A JP S5831746 A JPS5831746 A JP S5831746A JP 12959081 A JP12959081 A JP 12959081A JP 12959081 A JP12959081 A JP 12959081A JP S5831746 A JPS5831746 A JP S5831746A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy
- epoxy resin
- parts
- paper
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は、耐熱性、耐2−ズリンダ性、耐溶剤性等に優
れ、しかも加工性および難燃性の良好な銅張積層1[に
関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a copper-clad laminate 1 which is excellent in heat resistance, 2-zlinda resistance, solvent resistance, etc., and also has good workability and flame retardancy.
エポキシ樹脂銅張積層板やフェノール樹脂鋼張積層1[
ハ、各種童業K11l!が多く、41に最近は。Epoxy resin copper clad laminate or phenolic resin steel clad laminate 1 [
Ha, various child work K11l! There are a lot of them, and these days it's 41.
宇宙機器、大部、中蓋、小濡のコンビ島−一、マイクロ
ツンピ暴−一、無線応用機器、工業針測機器、[療用機
器等への需要が拡大しつつある。Demand is increasing for space equipment, large parts, middle lids, small wet combination islands, micro tsunpi parts, wireless application equipment, industrial needle measuring equipment, medical equipment, etc.
これらの中でも紙を基材として使用する紙−エポ中り鋼
張積層1[KsIPvkては、孔あけ加工の際。Among these, paper-Epo steel clad laminate 1 [KsIPvk] uses paper as a base material during drilling.
ドリル穿孔と共に設備経費が安くζスの少な一打抜加工
の方法が用−られて−るが、樹脂の硬化状態が良すぎる
場合には、この方法では、かなり高温で打ち抜かなけれ
ばならず1作業性が悪iばかりでなく、その際、板の反
りや寸法収縮による精度の低下をまねくと一5問題があ
った。In addition to drilling, a method of punching is used, which has low equipment costs and requires little space, but if the resin is too hardened, this method requires punching at a fairly high temperature. In addition to poor workability, there were other problems such as a decrease in accuracy due to warpage and dimensional shrinkage of the plate.
また、この紙−エポキシ積層板は、NRMムグレードが
PR−3(Ill燃性の紙−エポキシ積層1りであるた
め、充分な難燃性を有することが要求されて−た。Furthermore, this paper-epoxy laminate was required to have sufficient flame retardancy because the NRM grade was PR-3 (Ill flammable paper-epoxy laminate).
本発明はこれらの問題を解決するため虻なされえもので
、エポキシ樹脂100重量部に対して10〜50重量部
のエポ命シ系町■剤と硬化剤、およびその他の添加剤を
配合したエポキシ樹真組成物を、基材に含浸させてなる
プリプレグな、所要枚数積層し、その片面又は両IIK
鋼箔な重ねて加熱加圧により一体に成形して成ることを
特徴とする銅張積層板に関する。The present invention has been made to solve these problems, and is an epoxy resin containing 10 to 50 parts by weight of an epoxy adhesive, a curing agent, and other additives to 100 parts by weight of an epoxy resin. A prepreg made by impregnating a base material with a tree resin composition, laminated in the required number of sheets, and laminated on one or both sides of the prepreg.
The present invention relates to a copper-clad laminate characterized in that it is formed integrally by stacking steel foils and heating and pressurizing them.
本2発明におけるエポキシ樹脂としては、ビスフェノー
ル人のグリシジルエーテル、ノボラックのグリシジルエ
ーテルのようなグリシジル系エポキシ樹脂の他、非グリ
シジル系エポキシ樹脂も用いることができるが、基材へ
の含浸性や特性の点から、これらのうちエポキシ当量が
200〜1000程度のものを用いるのが望ましめ、ま
え、これらのエポキシ樹脂の一部或iは全部をハロゲン
化ビスフェノール型エポキシ樹脂、ハロゲン化ノボツツ
ク型エポキシ樹脂のようなハロゲン化エポキシ樹脂に置
き換えて、S燃性な付与することもできる。As the epoxy resin in the present invention, in addition to glycidyl-based epoxy resins such as bisphenol glycidyl ether and novolac glycidyl ether, non-glycidyl-based epoxy resins can also be used; From this point of view, it is desirable to use epoxy resins with an epoxy equivalent of about 200 to 1,000, and first, some or all of these epoxy resins are mixed with halogenated bisphenol type epoxy resins or halogenated Novottsk type epoxy resins. It is also possible to provide S flammability by replacing it with a halogenated epoxy resin such as epoxy resin.
本発明におけるエポキシ系町−剤としては、エポキシ化
植物油、エボキV化グイi−酸の↓うな。The epoxy-based agent in the present invention includes epoxidized vegetable oil, epoxidized vegetable oil, and epoxidized acid.
天然油脂の不飽和結合をエポキシ化した不飽和脂肪酸系
のものや、エポキシ化ポリブタジェンのような合成樹脂
系のものがあり、Vhずれも液体もしくは粘稠な流動体
である。There are those based on unsaturated fatty acids obtained by epoxidizing the unsaturated bonds of natural oils and fats, and those based on synthetic resins such as epoxidized polybutadiene, and Vh deviations are also liquids or viscous fluids.
これらのエポキシ系の可塑剤は、エポキシ基を分子内に
有して−るため、ベースのエポキシ樹脂トの相溶性がよ
く、硬化の際、容易にベースと一体となり、硬化阻害や
特性の低下が起こらな−という利点がある。These epoxy plasticizers have epoxy groups in their molecules, so they have good compatibility with the base epoxy resin and easily integrate with the base during curing, preventing curing inhibition and property deterioration. This has the advantage that it does not occur.
而して、エポキシ系可塑剤は、ベースのエポキシ樹脂と
できるだけエポキシ当量が近いものを用いるのが好まし
く、ベース100重量部に対して。Therefore, it is preferable to use an epoxy plasticizer having an epoxy equivalent as close as possible to that of the base epoxy resin, based on 100 parts by weight of the base.
10〜50重量部配合するのが望ましい。It is desirable to blend 10 to 50 parts by weight.
エポキシ系可塑剤の配合量が10重量部未満では、充分
な可塑効果が得られず、反対に50重量部を越えた場合
には、ベース樹脂の硬化が阻害されるばかりでなく、積
層板の特性が低下して実用に不適当なものとなる。If the amount of the epoxy plasticizer is less than 10 parts by weight, a sufficient plasticizing effect will not be obtained, while if it exceeds 50 parts by weight, not only will the curing of the base resin be inhibited, but the laminate will The properties deteriorate, making it unsuitable for practical use.
また、本発明においては、これらのエポキシ系可塑剤と
共に、トリフェニル7オスフエートやタレジルジフェニ
ルフォスフェート、トリクレジル7オスフエートのよ5
なリン酸エステル類を、す7分で5重量%程度併用し、
加工性をさらに改善することも可能である。In addition, in the present invention, in addition to these epoxy plasticizers, 5-benzene such as triphenyl 7 phosphate, talesyl diphenyl phosphate, and tricresyl 7 phosphate are used.
Using about 5% by weight of phosphoric acid esters in 7 minutes,
It is also possible to further improve the processability.
これらのリン酸エステルlIIは、エポキシ系可塑剤の
可塑効果を補うばかりでなく、難燃性を付与する役割を
果たす本のである。These phosphoric acid esters III not only supplement the plasticizing effect of the epoxy plasticizer, but also play a role in imparting flame retardancy.
本発明(おける硬化剤としては、一般にエポキシ樹脂用
硬化剤として用いられているものは、全て使用すること
ができ、例えば、無水フタル酸、デトラヒドロ無水フタ
ル酸、ヘキサヒドロ無水フタル酸、ピロメリット酸無水
物、無水iレイン酸、テトラクロル無水フタル酸、テト
ラブロム無水フタル酸、無水ヘット酸(ヘキサクロルエ
ンドメチレンテトラハイドロ7タル酸無水暢)のような
酸無水物や、ジシアンジアミド、ジエチレントリアミン
、トリエチレンテトランン、メタフェニレンジアミン、
シアミノジフェニルメタン、シアさノシフェニルスル7
オン、イミダゾールのようなアミン類を使用することが
できる。これらのうち、特にテトラクロン無水フタル酸
、テトラブロム無水フタル酸、無水ヘット酸のようなハ
ロゲン系の酸無水物を用いた場合には、離燃性の高−組
成物が得られるとリラ利点がある。As the curing agent in the present invention, any curing agent that is generally used as a curing agent for epoxy resins can be used. For example, phthalic anhydride, detrahydrophthalic anhydride, hexahydrophthalic anhydride, pyromellitic anhydride, etc. Acid anhydrides such as oleic anhydride, tetrachlorophthalic anhydride, tetrabromophthalic anhydride, hetacetic anhydride (hexachlorendomethylenetetrahydroheptalic anhydride), dicyandiamide, diethylenetriamine, triethylenetetramine, metaphenylenediamine,
Cyaminodiphenylmethane, cyanocyphenylsul 7
Amines such as ion, imidazole, etc. can be used. Among these, when using halogen-based acid anhydrides such as tetraclone phthalic anhydride, tetrabromo phthalic anhydride, and het acid anhydride, there is an advantage that a composition with high flammability can be obtained. .
これらの硬化剤の配合量は、ベースのエポキシ樹脂およ
びエポキシ系可塑剤のエポキシ量を加えた全量に対し、
0.8〜1.2当量とするのが望ましい。The blending amount of these curing agents is based on the total amount including the base epoxy resin and the epoxy amount of the epoxy plasticizer.
The amount is preferably 0.8 to 1.2 equivalents.
硬化剤の配合量が、0.8当量未満では、エポキシ樹脂
等が未反応で残り1反対に1.2当量を越える場合には
、硬化剤が未反応で残るため、この範囲外ではかえって
耐熱性や耐溶剤性が低下してしまうので好ましくなφ。If the amount of the curing agent is less than 0.8 equivalent, the epoxy resin etc. will remain unreacted.On the other hand, if it exceeds 1.2 equivalent, the curing agent will remain unreacted. φ is not preferable because it lowers the properties and solvent resistance.
本発明におけるエポキシ樹脂組成−(は、以上の配合成
分の他に、公知の希釈剤、充填剤、顔料、離燃剤等の添
加剤を必JI!に応じて適宜添加することもできる。In addition to the above-mentioned ingredients, known additives such as diluents, fillers, pigments, and flame retardants may be added as necessary to the epoxy resin composition of the present invention.
この中で、離燃剤としては、q#にテトラプロモビスフ
ェノールムやハロゲン化ジフェニルエーテル類の使用が
好ましい。添加量は、他の配合成分の種類<ttb燃性
の度合)と配合量により異なるが、ハロゲン分で3〜1
5重量%添加するのが望ましVh。Among these, as the flame release agent, it is preferable to use tetrapromobisphenol or halogenated diphenyl ethers for q#. The amount added varies depending on the type of other ingredients <ttb degree of flammability) and the amount added, but the halogen content is 3 to 1.
It is desirable to add 5% by weight of Vh.
本発明の基材としては1紙、ガラス繊維布のV)ずれを
も使用することができるが1価格の低摩さと打抜加工の
容易さの点から、クラフト紙、コプトンリンター紙、ク
ラフト−コツトンリンター混抄紙等の紙基材を用いるの
が好ましい。As the base material of the present invention, it is possible to use paper or glass fiber cloth, but from the viewpoint of low cost, low abrasion and ease of punching, kraft paper, Copton linter paper, kraft paper, etc. It is preferable to use a paper base material such as paper mixed with cotton linters.
また、二酸化アンチモン、水酸化アルミニウムのよ5な
難燃助剤をこれらの紙にすきこんだものを使用すること
もできる。It is also possible to use these papers in which flame retardant aids such as antimony dioxide and aluminum hydroxide are injected.
本発明の銅張積層板を製造するには、先ず前述のエポキ
シ樹脂組成物を、常法により上記紙基材等に含浸し乾燥
させてプリプレグ8枚する。このとき、エポキシ樹脂の
紙への含浸性を増すために、予め、低分子量のフェノー
ル樹脂、メラミンフェノール樹脂、グアナミンフェノー
ル樹脂等の下塗り樹脂を1紙基材に塗布含浸させておく
こともできる。この場合には、電気特性、耐熱性等の特
性の一段E改良された積層板が得られる。To manufacture the copper-clad laminate of the present invention, first, the above-mentioned epoxy resin composition is impregnated into the above-mentioned paper base material etc. by a conventional method and dried to form 8 sheets of prepreg. At this time, in order to increase the impregnability of the epoxy resin into the paper, an undercoat resin such as a low molecular weight phenol resin, melamine phenol resin, or guanamine phenol resin may be applied and impregnated onto the paper base material in advance. In this case, a laminate with improved electrical properties, heat resistance, etc., can be obtained.
次に、このプリプレグを、所要枚数積層し、その片面酸
%(hは両面に銅箔を重ねて、ホットプレスにより加熱
加圧し、一体に成形することにより銅張積層板が製造さ
れる。Next, a required number of prepregs are laminated, copper foil is stacked on both sides (h is copper foil), and a copper clad laminate is manufactured by heating and pressing with a hot press and molding into one piece.
このようにして得られる本発明の銅張積層板は、耐熱性
、耐ミーズリング性、耐薬品性の他、打抜加工性におい
ても優れて−る。The copper-clad laminate of the present invention thus obtained has excellent heat resistance, measling resistance, chemical resistance, and punching workability.
次に実施例について記載する。Next, examples will be described.
実施例1〜5
第1表の配合成分を同表の割合で混合し、これニア上ト
ン10容量部とジメチルホルムアンド6容量部とを加え
て透明、均一なエポキシ樹脂ワニスを調製した。これら
のフェスをエポキシシラン処理した厚さ10ミルスのク
ラフト紙に含浸塗布し、150℃で5分間乾燥させて樹
脂分40%のプリプレグを得た。このプリプレグ8枚を
重ねた両面に厚さ55mの銅箔な重ね、150℃で10
0分間100 kg/am の加熱加圧下で一体に成
形し、1[厚1.6mm の銅張積層板を得た。Examples 1 to 5 The components shown in Table 1 were mixed in the proportions shown in the same table, and 10 parts by volume of near-tonne and 6 parts by volume of dimethylformand were added to prepare a transparent and uniform epoxy resin varnish. These fabrics were impregnated and coated on 10 mils thick kraft paper treated with epoxy silane, and dried at 150° C. for 5 minutes to obtain a prepreg with a resin content of 40%. Layer 55m thick copper foil on both sides of the 8 sheets of prepreg and heat for 10 minutes at 150℃.
They were integrally molded under heat and pressure of 100 kg/am for 0 minutes to obtain a copper-clad laminate having a thickness of 1.6 mm.
次に、実施例1〜実施例5ならびに比較例で得九鋼張積
層板の特性にりiでの試験を行なった。Next, tests were conducted on the characteristics of the steel-clad laminates in Examples 1 to 5 and Comparative Examples.
試験結果を第2表に示す。The test results are shown in Table 2.
(以下、余白)
第 1 表
(表中の数値は−ずれも重量部を示す。)エピコート1
001.1045 : vhずれもシェル社製エポキシ
樹脂の商品名
(以下余白)
第 2 表
[(Hereinafter, blank space) Table 1 (Numbers in the table indicate parts by weight.) Epicote 1
Table 2 [
Claims (1)
部のエポ・キシ系可塑剤%および硬化剤を配合したエポ
命シ樹脂組成物を、基材に含浸させてなるプリプレグを
、所要枚数積層し、その表面に鋼塾、 箔を重ねて加野加圧により一体に成形して成ることを譬
黴とする鋼張積層板。 2、基材が紙であることを特徴とする特許請求の範囲第
1項記載の鋼張積層板。[Claims] 1. A base material is impregnated with an epoxy resin composition containing 10 to 50 parts by weight of an epoxy plasticizer and a curing agent per 100 parts by weight of an epoxy resin. Steel clad laminates are made by laminating the required number of prepreg sheets, overlaying steel sheets and foil on the surface, and molding them into one piece using Kano pressure. 2. The steel clad laminate according to claim 1, wherein the base material is paper.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12959081A JPS5831746A (en) | 1981-08-19 | 1981-08-19 | Copper lined laminated board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12959081A JPS5831746A (en) | 1981-08-19 | 1981-08-19 | Copper lined laminated board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5831746A true JPS5831746A (en) | 1983-02-24 |
JPH0113420B2 JPH0113420B2 (en) | 1989-03-06 |
Family
ID=15013200
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12959081A Granted JPS5831746A (en) | 1981-08-19 | 1981-08-19 | Copper lined laminated board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5831746A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6019431U (en) * | 1983-07-19 | 1985-02-09 | 松下電器産業株式会社 | Glass cloth base epoxy resin laminate |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4252353A (en) * | 1979-04-26 | 1981-02-24 | Ferrofluidics Corporation | Self-activating ferrofluid seals |
-
1981
- 1981-08-19 JP JP12959081A patent/JPS5831746A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6019431U (en) * | 1983-07-19 | 1985-02-09 | 松下電器産業株式会社 | Glass cloth base epoxy resin laminate |
JPH025944Y2 (en) * | 1983-07-19 | 1990-02-14 |
Also Published As
Publication number | Publication date |
---|---|
JPH0113420B2 (en) | 1989-03-06 |
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