JPH025614Y2 - - Google Patents
Info
- Publication number
- JPH025614Y2 JPH025614Y2 JP1984146699U JP14669984U JPH025614Y2 JP H025614 Y2 JPH025614 Y2 JP H025614Y2 JP 1984146699 U JP1984146699 U JP 1984146699U JP 14669984 U JP14669984 U JP 14669984U JP H025614 Y2 JPH025614 Y2 JP H025614Y2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- insulating layer
- cable
- heat
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 17
- 230000003014 reinforcing effect Effects 0.000 claims description 11
- 239000004033 plastic Substances 0.000 claims description 5
- 229920003023 plastic Polymers 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 39
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 229920003020 cross-linked polyethylene Polymers 0.000 description 1
- 239000004703 cross-linked polyethylene Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Cable Accessories (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は、導体接続部の補強絶縁層をモールド
してなるゴム、プラスチツク電力ケーブルの中間
接続部に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an intermediate connection portion of a rubber or plastic power cable formed by molding a reinforcing insulating layer at the conductor connection portion.
ゴム、プラスチツク絶縁ケーブルの接続部は、
接続すべき両ケーブル端の絶縁体を鉛筆削りし露
出させたケーブル導体をスリーブで圧縮接続した
後、該スリーブ上に未架橋の半導電性テープを巻
回し半架橋又は架橋状態にモールドし、その上に
金型をセツトし、金型内に架橋可能なEPゴムや
PE等を注入し加熱モールドして補強絶縁層を形
成していた。
Rubber and plastic insulated cable connections are
After sharpening the insulators at both cable ends to be connected and compressing and connecting the exposed cable conductors with a sleeve, uncrosslinked semiconductive tape is wound on the sleeve and molded into a semi-crosslinked or crosslinked state. A mold is set on top, and cross-linkable EP rubber is placed inside the mold.
A reinforcing insulating layer was formed by injecting PE or the like and heat molding.
前記の従来の接続方法では、スリーブ上にテー
プを巻回して設けた半導電層が半架橋状態の場合
金型内に注入された補強絶縁層のモールド時に半
導電層がフローし易く半導電層に突起や凹凸等の
いわゆる不整が生ずる。
In the above-mentioned conventional connection method, if the semi-conductive layer provided by winding tape on the sleeve is in a semi-crosslinked state, the semi-conductive layer tends to flow during molding of the reinforcing insulating layer injected into the mold. So-called irregularities such as protrusions and unevenness occur on the surface.
また、架橋状態にあつても樹脂注入時には高温
に保持されているため軟化しており注入樹脂の流
れにより半導電層の表層が削られカーボン粒子が
補強絶縁層に入り込む恐れがある等の問題点があ
つた。 In addition, even if the resin is in a crosslinked state, it is held at a high temperature during resin injection, so it softens, and the flow of the injected resin may scrape the surface layer of the semiconductive layer, causing problems such as the possibility that carbon particles may enter the reinforcing insulating layer. It was hot.
本考案は上記問題点を解消する目的でなされた
ものでケーブル導体接続スリーブ上に、内側から
半導電層、高誘電率層、絶縁層からなり、各層を
密着して一体化してなる３層熱収縮チユーブを包
被させ、その上にEPゴムやPE等のモールド補強
絶縁層を設けてなるゴム、プラスチツク絶縁ケー
ブルの接続部である。
The present invention was developed to solve the above problems, and consists of a semiconducting layer, a high dielectric constant layer, and an insulating layer from the inside on the cable conductor connection sleeve, and each layer is closely integrated into a three-layer heat sink. This is a connection part for rubber or plastic insulated cables, which is made by encasing a shrink tube and placing a molded reinforcing insulating layer of EP rubber or PE on top.
以下その一実施例を図面について説明する。 One embodiment will be described below with reference to the drawings.
第１図は本考案のケーブル接続部を示す。第２
図は第１図に示す本考案ケーブル接続部の導体接
続スリーブ上に包被された３層熱収縮チユーブ１
を示す説明図で、内側からカーボンを適量混入し
たエチレン−エチルアクリレート共重合体や、架
橋ポリエチレン、EPゴム、酢酸ビニルなどをベ
ースとしてなる半導電層１ａと、前記のベース樹
脂に酸化チタンやチタン酸バリウムなどの強誘電
物質またはカーボン粉末などを配合して、誘電率
を10〜60、抵抗率を105〜1014Ω−cmにした高誘電
率層１ｂと、前記のベース樹脂からなる絶縁層１
ｃとを互に密着して一体化してなる３層熱収縮チ
ユーブである。熱収縮チユーブの各層は架橋され
ていることが好ましい。 FIG. 1 shows the cable connection of the present invention. Second
The figure shows a three-layer heat shrink tube 1 wrapped on the conductor connection sleeve of the cable connection part of the present invention shown in Figure 1.
This is an explanatory diagram showing a semiconductive layer 1a based on ethylene-ethyl acrylate copolymer mixed with an appropriate amount of carbon from the inside, cross-linked polyethylene, EP rubber, vinyl acetate, etc., and a semiconductive layer 1a made of a base resin such as titanium oxide or titanium. A high dielectric constant layer 1b containing a ferroelectric substance such as barium oxide or carbon powder to have a dielectric constant of 10 to 60 and a resistivity of 10 5 to 10 14 Ω-cm, and an insulating layer made of the above-mentioned base resin. layer 1
This is a three-layer heat-shrinkable tube made by closely adhering and integrating c. Preferably, each layer of the heat shrink tube is crosslinked.
本考案は斯る構造の熱収縮チユーブ１を予め鉛
筆削りした接続すべき一方のケーブル端露出導体
２上に挿通しておいて両ケーブル導体２，２をス
リーブ３で圧縮接続した後ち、一方の導体側に寄
せておいた熱収縮チユーブ１をスリーブ３上に引
延して被せ外部から加熱収縮させて導体接続部の
遮へい層を形成する。 In the present invention, a heat-shrinkable tube 1 having such a structure is inserted into a pencil-sharpened exposed conductor 2 at one end of the cable to be connected, and after compressing and connecting both cable conductors 2 with a sleeve 3, one The heat-shrinkable tube 1 placed close to the conductor side is stretched over the sleeve 3, and is heated and shrunk from the outside to form a shielding layer for the conductor connection portion.
然る後第３図に示すように導体接続部上に二ツ
割金型６を被せ金型内に樹脂を圧入して補強絶縁
層４を形成し、その外周面に外部導電層５を設け
第１図に示すケーブル接続部を構成する。 Thereafter, as shown in FIG. 3, a two-split mold 6 is placed over the conductor connection portion, and resin is press-fitted into the mold to form a reinforcing insulating layer 4, and an external conductive layer 5 is provided on the outer peripheral surface of the reinforcing insulating layer 4. The cable connection section shown in FIG. 1 is constructed.
本考案は導体接続部上の遮へい層を、内側から
半導電層１ａ、高誘電率層１ｂ、絶縁層１ｃの３
層よりなる熱収縮チユーブ１を熱収縮させて形成
したものであるから、金型内に注入された補強絶
縁層のモールドの際に発生する導体接続部上遮へ
い層の不整はある程度防止できる。さらに、多少
の不整が生じたとしても高誘電率層１ｂによつて
電気的に緩和されるので電気的弱点とならない。
In the present invention, the shielding layer on the conductor connection part is divided into three layers from the inside: the semiconducting layer 1a, the high dielectric constant layer 1b, and the insulating layer 1c.
Since the heat-shrinkable tube 1 made of layers is formed by heat-shrinking, irregularities in the shielding layer above the conductor connection portion that occur during molding of the reinforcing insulating layer injected into the mold can be prevented to some extent. Furthermore, even if some irregularity occurs, it will not become an electrical weakness because it will be electrically relaxed by the high dielectric constant layer 1b.
また、金型内の注入樹脂の流れによつてカーボ
ン粒子が補強絶縁層に入り込むといつた問題は熱
収縮チユーブの絶縁層１ｃによつて解消できる。 Further, the problem of carbon particles entering the reinforcing insulating layer due to the flow of the injected resin in the mold can be solved by the insulating layer 1c of the heat-shrinkable tube.
これらの結果、耐電圧特性の優れた、信頼性の
高いケーブル接続部が得られるものである。 As a result, a highly reliable cable connection portion with excellent withstand voltage characteristics can be obtained.
第１図は本考案ケーブル接続部の一実施例を示
す説明図、第２図は本考案ケーブル接続部の導体
接続部遮へい層を形成する熱収縮チユーブを示す
説明図、第３図は接続部の補強絶縁層成形法の一
実施例を示す説明図である。
１……熱収縮チユーブ、２……ケーブル導体、
３……導体接続スリーブ、４……補強絶縁層。
Fig. 1 is an explanatory view showing one embodiment of the cable connection part of the present invention, Fig. 2 is an explanatory view showing a heat shrink tube forming a shielding layer for the conductor connection part of the cable connection part of the invention, and Fig. 3 is an explanatory view of the connection part. FIG. 2 is an explanatory diagram showing an example of a reinforcing insulating layer forming method. 1...Heat shrink tube, 2...Cable conductor,
3...Conductor connection sleeve, 4...Reinforcement insulating layer.
Claims (1)
設け、該導体遮へい層上に補強絶縁層を形成して
なるゴム、プラスチツク絶縁ケーブルの接続部に
おいて、前記導体遮へい層を、内側から半導電層
と高誘電率層と絶縁層とを密着して一体化してな
る熱収縮チユーブで形成してなることを特徴とす
るゴム、プラスチツク絶縁ケーブルの接続部。 At the connection part of a rubber or plastic insulated cable, a conductor shielding layer is provided on a cable conductor connection sleeve, and a reinforcing insulating layer is formed on the conductor shielding layer. A connection part for a rubber or plastic insulated cable, characterized in that it is formed from a heat-shrinkable tube made by closely integrating a heat-shrinkable layer and an insulating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984146699U JPH025614Y2 (en) | 1984-09-28 | 1984-09-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984146699U JPH025614Y2 (en) | 1984-09-28 | 1984-09-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6162525U JPS6162525U (en) | 1986-04-26 |
| JPH025614Y2 true JPH025614Y2 (en) | 1990-02-09 |
Family
ID=30704934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984146699U Expired JPH025614Y2 (en) | 1984-09-28 | 1984-09-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH025614Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5953631B2 (en) * | 1979-08-24 | 1984-12-26 | 株式会社日立製作所 | storage controller |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5953631U (en) * | 1982-09-30 | 1984-04-09 | 日東電工株式会社 | Heat-shrinkable tube with multilayer structure |
-
1984
- 1984-09-28 JP JP1984146699U patent/JPH025614Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5953631B2 (en) * | 1979-08-24 | 1984-12-26 | 株式会社日立製作所 | storage controller |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6162525U (en) | 1986-04-26 |
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