JPH0242431U - - Google Patents
Info
- Publication number
- JPH0242431U JPH0242431U JP12242388U JP12242388U JPH0242431U JP H0242431 U JPH0242431 U JP H0242431U JP 12242388 U JP12242388 U JP 12242388U JP 12242388 U JP12242388 U JP 12242388U JP H0242431 U JPH0242431 U JP H0242431U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sealing
- cavity
- lead
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
- 238000007789 sealing Methods 0.000 claims 4
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第1図は本考案の実施例1を示す平面図、第2
図は同断面図、第3図は従来例を示す平面図、第
4図は本考案において個別に分離したフラツトパ
ツケージICを示す平面図、第5図は従来構造に
おいて個別に分離したフラツトパツケージICを
示す平面図、第6図は本考案の実施例2を示す平
面図、第7図は同断面図である。
1……2連リードフレーム、2a,2b……メ
インランナ、3……サブランナ、4……キヤビテ
イ、5……リード端子。
Figure 1 is a plan view showing the first embodiment of the present invention;
3 is a plan view showing a conventional example, FIG. 4 is a plan view showing individually separated flat package ICs in the present invention, and FIG. 5 is a plan view showing individually separated flat package ICs in the conventional structure. FIG. 6 is a plan view showing a package IC, FIG. 6 is a plan view showing a second embodiment of the present invention, and FIG. 7 is a sectional view thereof. 1...Double lead frame, 2a, 2b...Main runner, 3...Sub runner, 4...Cavity, 5...Lead terminal.
Claims (1)
ICチツプを樹脂封止するキヤビテイと、該IC
チツプに電気的に接続され、横方向に張り出させ
た複数のリード端子の各先端を受け入れ、各リー
ド端子の先端相互間を一連に樹脂封止する樹脂の
注入空間を形成したサブランナとを有することを
特徴とするIC用樹脂封止装置。 A resin molding mold includes a cavity for resin-sealing an IC chip mounted on a lead frame, and a cavity for resin-sealing the IC chip mounted on a lead frame.
It has a sub-runner which is electrically connected to the chip and has a resin injection space formed therein for receiving each tip of a plurality of lead terminals extending laterally and sealing the tips of each lead terminal with resin in a series. A resin sealing device for IC characterized by the following.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12242388U JPH0242431U (en) | 1988-09-19 | 1988-09-19 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12242388U JPH0242431U (en) | 1988-09-19 | 1988-09-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0242431U true JPH0242431U (en) | 1990-03-23 |
Family
ID=31370341
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12242388U Pending JPH0242431U (en) | 1988-09-19 | 1988-09-19 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0242431U (en) |
-
1988
- 1988-09-19 JP JP12242388U patent/JPH0242431U/ja active Pending