JPH0234463B2 - - Google Patents
Info
- Publication number
- JPH0234463B2 JPH0234463B2 JP57231126A JP23112682A JPH0234463B2 JP H0234463 B2 JPH0234463 B2 JP H0234463B2 JP 57231126 A JP57231126 A JP 57231126A JP 23112682 A JP23112682 A JP 23112682A JP H0234463 B2 JPH0234463 B2 JP H0234463B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- terminal
- terminals
- electrode
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000002131 composite material Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 description 14
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
- H01L2225/1029—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being a lead frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1041—Special adaptations for top connections of the lowermost container, e.g. redistribution layer, integral interposer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、電子部品を積み重ねて接続してなる
復合電子部品に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a composite electronic component formed by stacking and connecting electronic components.
従来例の構成とその問題点
近年、機器の小型化が要望され、電子部品を積
み重ねることが行なわれている。この積み重ねら
れた電子部品の接続について、その従来例を第１
図乃至第４図を用いて説明すれば、樹脂モールド
を外被とする電子部品１の外部端子２を引き出し
方向に対して直角に曲げ加工して接続端子２ａを
形成し、電子部品１周囲の接続端子２ａ内に、端
面電極４を有する他の電子部品３を嵌合して電子
部品１に積み重ね、接続端子２ａと端面電極４を
半田付けすることにより接続を行なつている。Conventional configuration and its problems In recent years, there has been a demand for miniaturization of devices, and electronic components have been stacked one on top of the other. Regarding the connection of stacked electronic components, the first example is the conventional example.
To explain with reference to FIGS. 4 to 4, the external terminal 2 of the electronic component 1 whose outer sheath is a resin mold is bent at right angles to the drawing direction to form the connecting terminal 2a, Another electronic component 3 having an end surface electrode 4 is fitted into the connection terminal 2a and stacked on the electronic component 1, and connection is made by soldering the connection terminal 2a and the end surface electrode 4.
従来のこのような接続においては、電子部品１
に電子部品３を組み合わせる際に、第３図に示す
如く接続端子２ａの少しの曲がりで電子部品３が
嵌合できない場合があり、組み合わせ作業の自動
化の妨げとする。また、嵌合できても電子部品３
の端面電極４が剥げたり接続端子２ａが破損する
恐れがある。この組み合わされた電子部品１，３
を印刷基板（図示せず）上に接着剤等で固定し、
半田槽で半田付けを行なうと、第２図に示す如く
接続端子２ａと端面電極４の間にはフイレツト５
が形成されているものの小さいため半田付け強度
が弱い。さらに、接続端子２ａ間が狭いために第
４図に示す如くシヨート６を生じ易い等多くの問
題点があつた。 In such a conventional connection, the electronic component 1
When assembling the electronic components 3, as shown in FIG. 3, there are cases where the electronic components 3 cannot be fitted due to a slight bend in the connecting terminal 2a, which hinders automation of the assembly work. In addition, even if the electronic components 3
There is a risk that the end face electrode 4 may peel off or the connecting terminal 2a may be damaged. These combined electronic components 1 and 3
is fixed on a printed circuit board (not shown) with adhesive, etc.
When soldering is performed in a solder bath, a fillet 5 is formed between the connection terminal 2a and the end electrode 4 as shown in FIG.
Although it is formed, the soldering strength is weak because it is small. Furthermore, since the distance between the connecting terminals 2a is narrow, there are many other problems, such as the tendency to cause shoots 6 as shown in FIG.
発明の目的
本発明は上記従来の欠点を解消するもので、電
子部品と電子部品の嵌合が容易で、半田付け強度
が大きく、しかも端子間のシヨートを防止するこ
とのできる複合電子部品を提供することを目的と
する。Purpose of the Invention The present invention solves the above-mentioned conventional drawbacks, and provides a composite electronic component in which electronic components can be easily fitted together, the soldering strength is high, and shorting between terminals can be prevented. The purpose is to
発明の構成
上記目的を達するため、本発明の複合電子部品
は、内部の電子回路を金属板により引き出して形
成した外部端子の必要数が引き出し方向と直角な
上方向に曲げ加工された接続端子および前記外部
端子の引き出し方向と直角な下方向に曲げ加工さ
れた取付端子を有し、樹脂モールドを外被とする
第１電子部品と、この第１電子部品の樹脂モール
ドのフラツト面に積み重ねられ、端面電極が前記
第１電子部品の接続端子に半田付けされた第２電
子部品とを備え、前記第１電子部品の曲げ加工さ
れた接続端子を外方へ傾斜するように形成すると
共に、前記第２電子部品の上面からみた前記端面
電極の突出高さに比し前記接続端子先端の突出高
さを高くなるように形成したものであり、これに
より、電子部品の、嵌合時には接続端子がガイド
になつて嵌合が容易となる。また、電子部品を組
み合わせた時の接続端子と端面電極の間の半田付
け体積が大きくなつて良好なフイレツトを生じ、
半田付け強度が増す。さらに、半田付け時に半田
の切れが良くなり、端子間のシヨートを防止する
ことができるものである。Structure of the Invention In order to achieve the above-mentioned object, the composite electronic component of the present invention has connection terminals in which the required number of external terminals formed by drawing out an internal electronic circuit using a metal plate are bent upward in a direction perpendicular to the drawing direction. a first electronic component having a mounting terminal bent downward in a direction perpendicular to the direction in which the external terminal is pulled out, and having a resin mold as an outer cover; stacked on a flat surface of the resin mold of the first electronic component; a second electronic component whose end face electrode is soldered to the connecting terminal of the first electronic component, the bent connecting terminal of the first electronic component is formed to be inclined outward; 2 The protruding height of the tip of the connecting terminal is formed to be higher than the protruding height of the end electrode when viewed from the top surface of the electronic component, so that the connecting terminal is guided when the electronic component is mated. This makes fitting easier. In addition, when electronic components are combined, the soldering volume between the connection terminal and the end electrode becomes larger, creating a good fillet.
Increases soldering strength. Furthermore, the solder can be easily cut during soldering, and shorts between the terminals can be prevented.
実施例の説明
以下、本発明の一実施例について、図面に基づ
いて説明する。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.
第５図乃至第８図は本発明の複合電子部品の一
実施例を示したものである。図において、１１は
内部に電子回路（図示せず）を有し、樹脂モール
ドで角板状に外被された電子部品、１２は前記電
子回路から金属板により樹脂モールドの周囲側面
外へ引き出され、電極リードとして形成された外
部端子、１３は各外部端子１２を幅方向に分割し
てその一方を引き出し方向に対して直角方向に曲
げ加工された接続端子で、直角位置よりも所定角
度（α）だけ電子部品１１外方へ傾斜している。
１４は外部端子１２の他方の分割片を前記接続端
子１３に対して反対方向に曲げてＬ字状に形成さ
れた取付端子、１５は電子部品１１同様、内部に
電子回路を有し、樹脂モールドで角板状に外被さ
れた電子部品で、その周囲側面には、内部の電子
回路に接続され前記電子部品１１の接続端子１３
と対応した端面電極１６が断面コの字状に形成さ
れている。なお、電子部品１１の周囲で互いに対
向する前記接続端子１３は、電子部品１５を電子
部品１１の樹脂モールドのフラツト面１１ａに積
み重ねた時、その内側に電子部品１５が嵌合可能
なようにその間隔を設定して前記の如く曲げ加工
されると共に、各々の接続端子１３の先端が、積
み重ねられた電子部品１５の上面１５ａよりも所
定量（ｘ）だけ高くなるように形成されている。 FIGS. 5 to 8 show an embodiment of the composite electronic component of the present invention. In the figure, numeral 11 has an electronic circuit (not shown) inside and is covered with a resin mold in the form of a rectangular plate, and numeral 12 is an electronic component drawn out from the electronic circuit by a metal plate to the outside of the peripheral side of the resin mold. , an external terminal formed as an electrode lead, and 13 a connecting terminal in which each external terminal 12 is divided in the width direction and one of the terminals is bent in a direction perpendicular to the drawing direction, and is bent at a predetermined angle (α ) the electronic component 11 is inclined outward.
14 is a mounting terminal formed into an L-shape by bending the other divided piece of the external terminal 12 in the opposite direction to the connecting terminal 13; 15, like the electronic component 11, has an electronic circuit inside and is molded with resin; The electronic component is covered with a rectangular plate shape, and the connecting terminal 13 of the electronic component 11 is connected to the internal electronic circuit on the surrounding side surface.
An end face electrode 16 corresponding to the above is formed with a U-shaped cross section. The connecting terminals 13 facing each other around the electronic component 11 are arranged so that when the electronic component 15 is stacked on the flat surface 11a of the resin mold of the electronic component 11, the electronic component 15 can be fitted inside the flat surface 11a. The connecting terminals 13 are bent as described above with the intervals set, and the tips of the respective connecting terminals 13 are formed to be higher than the upper surfaces 15a of the stacked electronic components 15 by a predetermined amount (x).
以上の構成において、接続端子１３を有する電
子部品１１のフラツト面１１ａに、端面電極１６
を有する電子部品１５を積み重ねる時、外方に傾
斜した接続端子１３が電子部品１５をガイドする
形となり、電子部品１５の接続端子１３内側への
嵌合が容易に成され、例え、接続端子１３が変形
して第７図に示す如く垂直状態となつても嵌合に
支障を来すことはない。従つて、嵌合時における
端面電極１６の剥れや、接続端子１３の破損を防
止することができる。また、電子部品１１と１５
を組み合わせて印刷基板に装着し、これを半田槽
にて半田付けする場合においても、接続端子１３
と端面電極１６の間の半田付け体積が大きいため
良好なフイレツトを生じ、半田付け強度が増す。
さらに、第６図に示す如く、電子部品１５の上面
１５ａから接続端子１３の先端までの寸法（ｘ）
を0.2mm以上とすることにより、噴流式半田槽に
て半田付けを行なう場合半田の切れが良くなり、
接続端子１３間のシヨートが生じにくくなる。 In the above configuration, the end surface electrode 16 is attached to the flat surface 11a of the electronic component 11 having the connection terminal 13.
When stacking the electronic components 15 having the connecting terminals 13, the outwardly inclined connecting terminals 13 guide the electronic components 15, and the electronic components 15 can be easily fitted inside the connecting terminals 13. Even if it is deformed into a vertical state as shown in FIG. 7, there will be no problem in fitting. Therefore, peeling of the end electrode 16 and damage to the connecting terminal 13 during fitting can be prevented. In addition, electronic components 11 and 15
Even when the terminals 13 are attached to a printed circuit board and soldered in a solder tank, the connecting terminals 13
Since the soldering volume between the electrode 16 and the end face electrode 16 is large, a good fillet is created and the soldering strength is increased.
Furthermore, as shown in FIG. 6, the dimension (x) from the top surface 15a of the electronic component 15 to the tip of the connection terminal 13
By setting it to 0.2 mm or more, the solder will cut better when soldering in a jet soldering tank.
Shorts between the connection terminals 13 are less likely to occur.
発明の効果
以上のように本発明によれば、接続端子を電子
部品に対して外方へ傾斜させたから、電子部品と
電子部品の嵌合が容易となると共に、組み合せ作
業を自動化することができ、しかも、接続端子と
端面電極の間の半田付け体積が大きくなるため、
半田付け強度を増すことができる。また、接続端
子の先端を積み重ねられた電子部品の端面電極よ
りも高くすることで、半田付け時の半田の切れが
良くなり、接続端子間のシヨートが発生しにくく
なるという効果が得られる。Effects of the Invention As described above, according to the present invention, since the connecting terminals are inclined outward with respect to the electronic components, it becomes easy to fit the electronic components together, and the assembly work can be automated. , Moreover, since the soldering volume between the connection terminal and the end electrode becomes large,
Soldering strength can be increased. Furthermore, by making the tips of the connection terminals higher than the end surface electrodes of the stacked electronic components, the solder cuts better during soldering, and shorts between the connection terminals are less likely to occur.
第１図Ａ，Ｂは従来例の平面図と断面図、第２
図は同要部の拡大断面図、第３図は同嵌合時の断
面図、第４図は同要部の斜視図、第５図Ａ，Ｂは
本発明の一実施例の平面図と断面図、第６図は同
要部の断面図、第７図は同嵌合時の断面図、第８
図は同要部の斜視図である。
１１……電子部品、１１ａ……フラツト面、１
２……外部端子、１３……接続端子、１４……取
付端子、１５……電子部品、１５ａ……上面、１
６……端面電極。
Figures 1A and B are a plan view and a sectional view of the conventional example, and Figure 2
The figure is an enlarged cross-sectional view of the essential parts, FIG. 3 is a cross-sectional view when the same is fitted, FIG. 4 is a perspective view of the essential parts, and FIGS. 5A and 5B are plan views of one embodiment of the present invention. 6 is a sectional view of the same essential parts, FIG. 7 is a sectional view of the same when mated, and FIG.
The figure is a perspective view of the main parts. 11...Electronic component, 11a...Flat surface, 1
2...External terminal, 13...Connection terminal, 14...Mounting terminal, 15...Electronic component, 15a...Top surface, 1
6... End electrode.
Claims (1)
成した外部端子の必要数が引き出し方向と直角な
上方向に曲げ加工された接続端子および前記外部
端子の引き出し方向と直角な下方向に曲げ加工さ
れた取付端子を有し、樹脂モールドを外被とする
第１電子部品と、この第１電子部品の樹脂モール
ドのフラツト面に積み重ねられ、端面電極が前記
第１電子部品の接続端子に半田付けされた第２電
子部品とを備え、前記第１電子部品の曲げ加工さ
れた接続端子を外方へ傾斜するように形成すると
共に、前記第２電子部品の上面からみた前記端面
電極の突出高さに比し前記接続端子先端の突出高
さを高くなるように形成した複合電子部品。1 The necessary number of external terminals formed by drawing out internal electronic circuits using a metal plate are connected terminals that are bent upward perpendicular to the drawing direction, and connection terminals that are bent downward perpendicular to the drawing direction of the external terminals. A first electronic component having a mounting terminal and having a resin mold as an outer cover, the first electronic component being stacked on a flat surface of the resin mold, and an end surface electrode being soldered to the connecting terminal of the first electronic component. a second electronic component, the bent connection terminal of the first electronic component is formed to be inclined outward, and the height is compared to the protruding height of the end electrode when viewed from the top surface of the second electronic component. and the composite electronic component is formed such that the protruding height of the tip of the connecting terminal is increased.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23112682A JPS59117147A (en) | 1982-12-23 | 1982-12-23 | Connecting terminal of electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23112682A JPS59117147A (en) | 1982-12-23 | 1982-12-23 | Connecting terminal of electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59117147A JPS59117147A (en) | 1984-07-06 |
| JPH0234463B2 true JPH0234463B2 (en) | 1990-08-03 |
Family
ID=16918687
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23112682A Granted JPS59117147A (en) | 1982-12-23 | 1982-12-23 | Connecting terminal of electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59117147A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59151445A (en) * | 1983-02-17 | 1984-08-29 | Rohm Co Ltd | Semiconductor device |
| US5138438A (en) * | 1987-06-24 | 1992-08-11 | Akita Electronics Co. Ltd. | Lead connections means for stacked tab packaged IC chips |
| KR100325290B1 (en) * | 1999-05-20 | 2002-02-21 | 김영환 | ultra high density integrated circuit BLP stack |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58142507A (en) * | 1982-02-19 | 1983-08-24 | Hitachi Metals Ltd | Manufacture of rare earth cobalt magnet |
-
1982
- 1982-12-23 JP JP23112682A patent/JPS59117147A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58142507A (en) * | 1982-02-19 | 1983-08-24 | Hitachi Metals Ltd | Manufacture of rare earth cobalt magnet |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59117147A (en) | 1984-07-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0234463B2 (en) | ||
| US5097389A (en) | Structure for fixing feedthrough capacitor in high-frequency device and manufacturing method of high-frequency device | |
| JP2585148Y2 (en) | Chip type electronic components | |
| JPH0338845Y2 (en) | ||
| JP3365426B2 (en) | Chip type electronic components | |
| JPH066027A (en) | Manufacturing method of circuit module | |
| JP5693387B2 (en) | connector | |
| JP2858252B2 (en) | Electrode structure of electronic components for surface mounting | |
| CN112470555B (en) | Electronic control device | |
| JP3853029B2 (en) | Electronic components | |
| JP2559104Y2 (en) | Surface mount connector | |
| JP3758002B2 (en) | Electronic components | |
| JPH0576029U (en) | Electronic parts | |
| JP3157975B2 (en) | Ladder type filter | |
| JPS6314470Y2 (en) | ||
| JPH054295Y2 (en) | ||
| JPH081585Y2 (en) | Surface mount connector | |
| JP4787718B2 (en) | Tab terminal | |
| JPH0440283Y2 (en) | ||
| JP2873101B2 (en) | Board connection device | |
| JP2001338841A (en) | Chip capacitor | |
| JP3367986B2 (en) | Manufacturing method of post contact for surface mount type connector | |
| JP2531060B2 (en) | Method for manufacturing printed wiring board | |
| JPH0113377Y2 (en) | ||
| JPH0430785Y2 (en) |