JPH02304808A - Insulated wire - Google Patents
Insulated wireInfo
- Publication number
- JPH02304808A JPH02304808A JP1125396A JP12539689A JPH02304808A JP H02304808 A JPH02304808 A JP H02304808A JP 1125396 A JP1125396 A JP 1125396A JP 12539689 A JP12539689 A JP 12539689A JP H02304808 A JPH02304808 A JP H02304808A
- Authority
- JP
- Japan
- Prior art keywords
- insulated wire
- molecular weight
- imide resin
- polyamido
- pts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims abstract description 25
- 239000011347 resin Substances 0.000 claims abstract description 25
- 229920001228 polyisocyanate Polymers 0.000 claims abstract description 23
- 239000005056 polyisocyanate Substances 0.000 claims abstract description 23
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 claims abstract description 17
- 150000001875 compounds Chemical class 0.000 claims abstract description 11
- 239000011248 coating agent Substances 0.000 claims abstract description 7
- 238000000576 coating method Methods 0.000 claims abstract description 7
- 239000004020 conductor Substances 0.000 claims abstract description 6
- 230000000087 stabilizing effect Effects 0.000 claims abstract 4
- 239000004962 Polyamide-imide Substances 0.000 claims description 25
- 229920002312 polyamide-imide Polymers 0.000 claims description 25
- 239000003973 paint Substances 0.000 claims description 13
- -1 aromatic tricarboxylic acid Chemical class 0.000 claims description 9
- 229920005862 polyol Polymers 0.000 claims description 6
- 150000003077 polyols Chemical class 0.000 claims description 6
- 239000002981 blocking agent Substances 0.000 claims description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 4
- 239000006260 foam Substances 0.000 abstract 1
- 238000012423 maintenance Methods 0.000 abstract 1
- 238000002156 mixing Methods 0.000 abstract 1
- 229920002635 polyurethane Polymers 0.000 description 7
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 5
- 150000008064 anhydrides Chemical class 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 239000004814 polyurethane Substances 0.000 description 4
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical compound CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 150000004985 diamines Chemical class 0.000 description 3
- 125000005442 diisocyanate group Chemical group 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- AGGKEGLBGGJEBZ-UHFFFAOYSA-N tetramethylenedisulfotetramine Chemical compound C1N(S2(=O)=O)CN3S(=O)(=O)N1CN2C3 AGGKEGLBGGJEBZ-UHFFFAOYSA-N 0.000 description 3
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 3
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- MHABMANUFPZXEB-UHFFFAOYSA-N O-demethyl-aloesaponarin I Natural products O=C1C2=CC=CC(O)=C2C(=O)C2=C1C=C(O)C(C(O)=O)=C2C MHABMANUFPZXEB-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- LQNUZADURLCDLV-UHFFFAOYSA-N nitrobenzene Chemical compound [O-][N+](=O)C1=CC=CC=C1 LQNUZADURLCDLV-UHFFFAOYSA-N 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- 150000003628 tricarboxylic acids Chemical class 0.000 description 2
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 1
- HNNQYHFROJDYHQ-UHFFFAOYSA-N 3-(4-ethylcyclohexyl)propanoic acid 3-(3-ethylcyclopentyl)propanoic acid Chemical compound CCC1CCC(CCC(O)=O)C1.CCC1CCC(CCC(O)=O)CC1 HNNQYHFROJDYHQ-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- OIFBSDVPJOWBCH-UHFFFAOYSA-N Diethyl carbonate Chemical compound CCOC(=O)OCC OIFBSDVPJOWBCH-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- VYGUBTIWNBFFMQ-UHFFFAOYSA-N [N+](#[C-])N1C(=O)NC=2NC(=O)NC2C1=O Chemical group [N+](#[C-])N1C(=O)NC=2NC(=O)NC2C1=O VYGUBTIWNBFFMQ-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- PWAXUOGZOSVGBO-UHFFFAOYSA-N adipoyl chloride Chemical compound ClC(=O)CCCCC(Cl)=O PWAXUOGZOSVGBO-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- FDQSRULYDNDXQB-UHFFFAOYSA-N benzene-1,3-dicarbonyl chloride Chemical compound ClC(=O)C1=CC=CC(C(Cl)=O)=C1 FDQSRULYDNDXQB-UHFFFAOYSA-N 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 150000001896 cresols Chemical class 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 description 1
- 229940091173 hydantoin Drugs 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- LXEJRKJRKIFVNY-UHFFFAOYSA-N terephthaloyl chloride Chemical compound ClC(=O)C1=CC=C(C(Cl)=O)C=C1 LXEJRKJRKIFVNY-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Paints Or Removers (AREA)
- Organic Insulating Materials (AREA)
- Insulated Conductors (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は半田付性に優れかつ耐熱性の良好な絶縁電線に
関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an insulated wire with excellent solderability and good heat resistance.
（従来の技術とその問題点）
ポリウレタン絶縁電線は絶縁皮膜をはくすする事なく、
そのまま半田付けが出来るため、電子機器用巻線として
広く使用されている。(Conventional technology and its problems) Polyurethane insulated wire can be used without removing the insulation film.
Since it can be soldered as is, it is widely used as winding wire for electronic devices.
最近、機器の小型化高性能化が進み、機器の使用雰囲気
温度が上昇し、使用部品の耐熱性向上が要求されはじめ
ている。Recently, equipment has become smaller and more sophisticated, the ambient temperature in which the equipment is used has increased, and there has been a demand for improved heat resistance of the parts used.
従って従来のポリウレタン絶縁電線では耐熱性の要求を
満足出来なくなる用途も現われ、一部ポリエステル絶縁
電線やエステルイミド絶縁電線が使用されはじめている
。Therefore, there are some applications in which conventional polyurethane insulated wires cannot satisfy the heat resistance requirements, and polyester insulated wires and esterimide insulated wires have begun to be used in some cases.
上記のポリエステル、エステルイミド絶縁電線を使用す
ると耐熱性は満足するものの、半田付けが出来ないとい
う問題点があり、ユーザーにおいては耐熱性を優先する
か、端末処理の容易さを優先するか選択に悩んでおり、
耐熱性、半田付性の両方を合せもつ絶縁電線が強く要求
されている。Although heat resistance is satisfactory when using polyester or esterimide insulated wires mentioned above, there is a problem that soldering is not possible, and the user has to choose whether to prioritize heat resistance or ease of terminal processing. I'm worried,
There is a strong demand for insulated wires that have both heat resistance and solderability.
本発明者は、上記問題点について鋭意検討した結果、ポ
リアミドイミド樹脂に特定の安定化ポリイソシアネート
を適量配合した絶縁塗料を導体上に塗布・焼付する事に
よりポリアミドイミド樹脂の優れた耐熱性を保持しなが
ら、半田付の可能な絶縁電線を得る事に成功した。As a result of intensive study on the above-mentioned problems, the present inventor maintained the excellent heat resistance of polyamide-imide resin by applying and baking an insulating paint containing polyamide-imide resin and an appropriate amount of a specific stabilized polyisocyanate onto the conductor. However, we succeeded in obtaining an insulated wire that can be soldered.
（特願昭６３−２５１５５８）
本発明者は上記の技術についてさらに詳細に検討した結
果所定の分子量、構造をもつポリアミドイミドを使用す
ると特に効果のある事がわかり、本発明に到達した。(Japanese Patent Application No. 63-251558) As a result of further detailed study of the above-mentioned technique, the present inventor found that the use of polyamideimide having a predetermined molecular weight and structure is particularly effective, and thus arrived at the present invention.
（発明の構成）
本発明は分子量が還元比粘度で０．１〜１．０であるポ
リアミドイミド樹脂１００重量部に対しジフェニルメタ
ンジイソシアネートより得られた安定化ポリイソシアネ
ート化合物を７５重量部〜４００重量部加えた絶縁塗料
を導体上に塗布・焼付した事を特徴とする絶縁電線であ
る。(Structure of the Invention) The present invention uses 75 parts by weight to 400 parts by weight of a stabilized polyisocyanate compound obtained from diphenylmethane diisocyanate to 100 parts by weight of a polyamideimide resin having a molecular weight of 0.1 to 1.0 in reduced specific viscosity. This insulated wire is characterized by having an added insulating paint applied and baked onto the conductor.
本発明にふ・いて、ポリアミドイミド樹脂とは分子中に
アミド結合とイミド結合をもつもので具体的な製法の例
としては次の二つがある。According to the present invention, polyamide-imide resin has an amide bond and an imide bond in its molecule, and there are two specific examples of manufacturing methods as follows.
一つの方法は少なくとも一種のトリカルボン酸無水物の
酸クロライドと少なくとも一種のジアミンとを反応させ
るものである。又、上記トリカルボン酸無水物の酸クロ
ライドの一部を少くとも一種のジカルボン酸ジクロライ
ド或は少くとも、一種のテトラカルボン酸二無水物、或
は少くとも一種のジカルボン酸ジクロライドと少くとも
一種のテトラカルボン酸二無水物でおきかえてもよい。One method involves reacting at least one acid chloride of tricarboxylic acid anhydride with at least one diamine. Further, a part of the acid chloride of the tricarboxylic anhydride may be replaced with at least one dicarboxylic dichloride, at least one tetracarboxylic dianhydride, or at least one dicarboxylic dichloride and at least one tetracarboxylic dianhydride. It may be replaced with carboxylic dianhydride.
又、上記ジアミンの一部を少くとも一種のトリアミン、
或いは少なくとも一種のテトラミン、或いは少なくとも
一種のトリアミンと少なくとも一種のテトラミンでおき
かえてもよい。Further, a part of the above diamine may be replaced with at least one kind of triamine,
Alternatively, at least one type of tetramine may be replaced with at least one triamine and at least one type of tetramine.
トリカルボン酸無水物の酸クロライドの例としては、ト
リメリット酸無水物の４−酸クロライド等がある。Examples of the acid chloride of tricarboxylic anhydride include 4-acid chloride of trimellitic anhydride.
ジカルボン酸ジクロライドの例としては、テレフタル酸
ジクロライド、イソフタル酸ジクロライド、アジピン酸
ジクロライド等がある。Examples of dicarboxylic acid dichloride include terephthalic acid dichloride, isophthalic acid dichloride, adipic acid dichloride, and the like.
ジアミンの例としては、４．４’−ジアミノジフェニル
メタン、４．４’−ジアミノジフェニルエーテルｍ−フ
ェニレンジアミン等がある。トリアミンの例トシては、
８．４．４’ −）リアミノジフェニルエーテル等があ
る。テトラミンの例としては、３．３′。Examples of diamines include 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl ether m-phenylenediamine, and the like. An example of triamine is
8.4.4'-)riaminodiphenyl ether and the like. An example of tetramine is 3.3'.
４．４′ −テトラアミノジフェニルエーテル等がある
。4.4'-tetraaminodiphenyl ether and the like.
代表的な製法のもう一つの例としては、少なくとも一種
のトリカルボン酸無水物と少なくとも一種のジイソシア
ネートとを反応させるものがある。Another example of a typical manufacturing method involves reacting at least one tricarboxylic acid anhydride with at least one diisocyanate.
又、上記トリカルボン酸無水物の一部を少くとも一種の
ジカルボン酸、或は少くとも一種のテトラカルボン酸二
無水物、或は少くとも一種のジカルボン酸と少くとも一
種のテトラカルボン酸二無水物でおきかえてもよい。Further, a part of the above tricarboxylic anhydride may be at least one dicarboxylic acid, or at least one tetracarboxylic dianhydride, or at least one dicarboxylic acid and at least one tetracarboxylic dianhydride. You can replace it with
又、上記ジイソシアネートの一部を少くとも一種の３価
又はそれ以上のポリイソシアネートでおきかえてもよい
。Further, a part of the above diisocyanate may be replaced with at least one type of trivalent or higher polyisocyanate.
トリカルボン酸無水物の例としては、トリメリット酸無
水物等がある。Examples of tricarboxylic anhydrides include trimellitic anhydride.
ジカルボン酸の例としては、イソフタル酸、テレフタル
酸、アジピン酸等がある。Examples of dicarboxylic acids include isophthalic acid, terephthalic acid, adipic acid, and the like.
テトラカルボン酸二無水物の例としては、ピロメリット
酸二無水物、ベンゾフェノンテトラカルボン酸二無水物
等がある。ジイソシアネートの例トシては、ジフェニル
メタン−４，４′−ジイソシアネート、ジフェニルエー
テル−４，ず−ジイソシアネート、トリレンジイソシア
ネート、キシリレンジイソシアネート、ヘキサメチレン
ジイソシアネート等がある。Examples of tetracarboxylic dianhydride include pyromellitic dianhydride, benzophenone tetracarboxylic dianhydride, and the like. Examples of diisocyanates include diphenylmethane-4,4'-diisocyanate, diphenyl ether-4,z-diisocyanate, tolylene diisocyanate, xylylene diisocyanate, hexamethylene diisocyanate, and the like.
ポリイソシアネートの例としては、ポリメチレンポリフ
ェニレンポリイソシアネート等がある。Examples of polyisocyanates include polymethylene polyphenylene polyisocyanate.
中でも芳香族トリカルボン酸無水物又はその誘導体と芳
香族ジイソシアネートの反応より得られるポリアミドイ
ミド樹脂を用いるとポリアミドイミド樹脂の特徴である
耐熱性がより発揮出来好ましい０
本発明においては、分子量が還元比粘度で０．１〜１．
０であるポリアミドイミド樹脂を使用する必要がある。Among these, it is preferable to use a polyamide-imide resin obtained by reacting an aromatic tricarboxylic acid anhydride or its derivative with an aromatic diisocyanate because it can better exhibit the heat resistance characteristic of polyamide-imide resins. In the present invention, the molecular weight is determined by the reduced specific viscosity 0.1 to 1.
It is necessary to use a polyamideimide resin having a
分子量が還元比粘度で０．１以下であると得られる絶縁
電線の可どう性が乏しく、逆に１．０以上であると絶縁
電線の作成時皮膜に多数の発泡を生じ生産性が悪い。又
、還元比粘度が０．２〜０．５であるポリアミドイミド
樹脂を使用すると得られた絶縁電線の特性が良好で絶縁
電線製造時の作業性もよく、好ましい。If the molecular weight is less than 0.1 in terms of reduced specific viscosity, the obtained insulated wire will have poor flexibility, and if it is more than 1.0, a large number of bubbles will occur in the film during the production of the insulated wire, resulting in poor productivity. Further, it is preferable to use a polyamideimide resin having a reduced specific viscosity of 0.2 to 0.5 because the properties of the resulting insulated wire are good and the workability during production of the insulated wire is also good.
特に還元比粘度が０，３のものが、上記特性、作業性の
最もよい点である。In particular, those having a reduced specific viscosity of 0.3 have the best properties and workability.
本発明に示した還元比粘度は、溶剤にＤＭＡＣ又はＮＭ
２ Ｐを用いポリアミドイミド樹脂の濃度を溶剤１００
ｍ１に対し０．５ｇとした時の温度３０°Ｃでの測定値
で示した。The reduced specific viscosity shown in the present invention is based on DMAC or NM in the solvent.
2 Using P, the concentration of polyamideimide resin was adjusted to 100% as a solvent.
It is shown as a measured value at a temperature of 30°C when the weight is 0.5g per m1.
ジフェニルメタンジイソシアネートより得られた安定化
ポリイソシアネートとはジフェニルメタンジイソシアネ
ート単独、又は、ジフェニルメタンジイソシアネートと
ポリオール、ポリアミン、ポリカルボン酸等と反応させ
る事により得られたポリイソシアネートのイソシアネー
ト基をフェノール類、アルコール類、カブロラククム類
等の公知のブロック剤でブロックした化合物であればい
かなるものでも使用出来る。Stabilized polyisocyanate obtained from diphenylmethane diisocyanate is diphenylmethane diisocyanate alone, or polyisocyanate obtained by reacting diphenylmethane diisocyanate with polyols, polyamines, polycarboxylic acids, etc. The isocyanate groups are combined with phenols, alcohols, cabrolaccum, etc. Any compound blocked with a known blocking agent such as the following can be used.
具体的な例としては、ジフェニルメタンジイソシアネー
トとポリオールより得られたポリイソシアネートをフェ
ノール類でブロックした日本ポリウレタン社製コロネー
ト２５０８ 、ジフェニルメタンジイソシアネートをフ
ェノール類でブロックした日本ポリウレタン社製ミリオ
ネートＭＳ −５０゜等がある。Specific examples include Coronate 2508 manufactured by Nippon Polyurethane Co., Ltd., which is a polyisocyanate obtained from diphenylmethane diisocyanate and a polyol blocked with a phenol, and Millionate MS-50°, manufactured by Nippon Polyurethane Co., Ltd., which is a polyisocyanate obtained from diphenylmethane diisocyanate and a polyol blocked with a phenol. .
本発明では、ジフェニルメタンジイソシアネートより得
られる安定化ポリイソシアネート以外では効果を発揮し
ない。The present invention is not effective with stabilized polyisocyanates other than those obtained from diphenylmethane diisocyanate.
例えば、ポリオールとトリレンジイソシアネートより得
られた安定化ポリイソシアネートを用いると半田付性は
良好なものの、絶縁皮膜の可とう性が乏しいものしか得
られず、トリレンジイソシアネートの三量体より得られ
たイソシアヌル環を含む安定化ポリイソシアネートを用
いると絶縁皮膜の可とう性は良好なものの半田付が出来
ない。For example, when using a stabilized polyisocyanate obtained from a polyol and tolylene diisocyanate, the solderability is good, but the flexibility of the insulating film is poor; When a stabilized polyisocyanate containing an isocyanuric ring is used, the insulating film has good flexibility but cannot be soldered.
本発明においては、ポリアミドイミド樹脂１００重量部
に対しジフェニルメタンジイソシアネートより得られた
安定化ポリイソシアネート化合物を７５重量部〜４００
重量部加える必要がある。７５重量部以下であると得ら
れた絶縁電線が半田付出来なくなり、４００重量部以上
であると得られた絶縁電線の耐熱性向上が小さく、絶縁
皮膜の可とう性も低下する。In the present invention, 75 to 400 parts by weight of a stabilized polyisocyanate compound obtained from diphenylmethane diisocyanate is added to 100 parts by weight of the polyamide-imide resin.
It is necessary to add parts by weight. If it is less than 75 parts by weight, the obtained insulated wire will not be solderable, and if it is more than 400 parts by weight, the heat resistance of the obtained insulated wire will be little improved and the flexibility of the insulating film will also be reduced.
本発明の絶縁塗料に使用される溶剤としては、ポリアミ
ドイミド樹脂の溶剤として使用される、ＮＭ ２ Ｐ
、 ＤＭＡＣ、ＤＭＦ等とソルベントナフサ、トルエン
、キシレン等の稀釈剤の組み合せが好ましいが、通常の
焼付塗料において用いられるフェノール、クレゾール類
、セロソルブ、フェニルセロソルブ、メチルセロソルブ
、グリ１コソルブ、メチルセロソルブ、フェニルセロソ
ルブ、酢酸セロソルブ等のグリコールエーテル類、シク
ロヘキサノン、メチルエチルエトン、酢酸エチル、テト
ラヒドロフラン、ニトロベンゼン、ジオキサン、フルフ
ラール、スルホラン、ＤＭＳｏｌ ピリジン、アニリン
、炭酸ジエチル、エタノール、メタノール、ブタノール
、シクロヘキサノール、等を使用するか一部加えてもよ
い。The solvent used in the insulating paint of the present invention is NM 2 P, which is used as a solvent for polyamideimide resin.
A combination of , DMAC, DMF, etc. and a diluent such as solvent naphtha, toluene, xylene, etc. is preferred, but phenol, cresols, cellosolve, phenyl cellosolve, methyl cellosolve, glycosolve, methyl cellosolve, phenyl, which are used in ordinary baking paints, are preferred. Glycol ethers such as cellosolve, cellosolve acetate, cyclohexanone, methylethyletone, ethyl acetate, tetrahydrofuran, nitrobenzene, dioxane, furfural, sulfolane, DMSol, pyridine, aniline, diethyl carbonate, ethanol, methanol, butanol, cyclohexanol, etc. are used. You may also add some.
本発明の絶縁塗料には必要に応じて、ナフテン酸や、オ
クテン酸の金属塩やアルキルアミン類、イミダゾール類
等のアミン類を硬化触媒として使用する事も出来る。If necessary, amines such as naphthenic acid, metal salts of octenoic acid, alkylamines, and imidazoles can be used as curing catalysts in the insulating coating of the present invention.
絶縁電線の製造時には、上記触媒を適当量加える方が製
造しやすく、耐熱性のよりよいものが得られるので好ま
しい。When manufacturing insulated wires, it is preferable to add an appropriate amount of the above-mentioned catalyst because manufacturing is easier and products with better heat resistance can be obtained.
本発明の絶縁塗料には、本発明の特徴を損わない程度ニ
ポリビニルホルマール、ポリアミド、ポリエステル、ポ
リウレタン、ポリエーテル、ポリスルホン、ポリエーテ
ルスルホン、ポリエーテルイミド等の熱可塑性樹脂、メ
ラミン樹脂、フェノール樹脂、ポリエステル、ポリウレ
タン、ポリエステルイミド、ポリアミドイミド、ポリエ
ステルアミドイミド、ポリイミド、ヒダントイン等の熱
硬化性樹脂、フィラー、顔料、染料、界面活性剤、潤滑
剤、酸化防止剤、等を加える事も可能である。The insulating paint of the present invention includes thermoplastic resins such as polyvinyl formal, polyamide, polyester, polyurethane, polyether, polysulfone, polyether sulfone, and polyetherimide, melamine resin, and phenol resin, to an extent that does not impair the characteristics of the present invention. It is also possible to add thermosetting resins such as polyester, polyurethane, polyesterimide, polyamideimide, polyesteramideimide, polyimide, hydantoin, fillers, pigments, dyes, surfactants, lubricants, antioxidants, etc. .
以下の実施例において本発明の詳細な説明するが本発明
はこれら実施例に限定されるものではない。The present invention will be explained in detail in the following examples, but the present invention is not limited to these examples.
以下の参考例で比較例及び実施例に用いた絶縁塗料を示
す。The following reference examples show insulating paints used in comparative examples and examples.
（参考例１）（ポリアミドイミド絶縁塗料）トリメリッ
ト酸無水物１９２．１ｇ（１，０モル）とジフェニール
メタン−４，４′−ジイソシアネート２５０．３ｇ（１
，０モル）とを、Ｎ−メチル−２−とロリドン７７０ｇ
とソルベントナフサ（丸善石油化学製スワゾール＃１１
０００）３８０との混合溶剤中に加えて８０°Ｃで３時
間反応後、１６５°Ｃ迄６時間で昇温し、この温度で２
時間反応させポリアミドイミド絶縁塗料を得た。樹脂の
還元比粘度は０．５１ であった。(Reference Example 1) (Polyamide-imide insulation coating) 192.1 g (1.0 mol) of trimellitic anhydride and 250.3 g (1.0 mol) of diphenylmethane-4,4'-diisocyanate
,0 mol) and N-methyl-2- and 770 g of lolidon.
and solvent naphtha (Maruzen Petrochemical Swazol #11
000) 380 and reacted at 80°C for 3 hours, the temperature was raised to 165°C in 6 hours, and at this temperature 2
A polyamide-imide insulating paint was obtained by a time reaction. The reduced specific viscosity of the resin was 0.51.
（参考例２〜６）
参考例１と同様の原料を用い、反応温度、反応時間を変
える事により、樹脂の還元比粘度が０．０７（参考例２
）、０．１３’（参考例３）、０．３１（参考例４）、
０．８５（参考例５）、１．１５（参考例６）のポリア
ミドイミドを得た。(Reference Examples 2 to 6) By using the same raw materials as in Reference Example 1 and changing the reaction temperature and reaction time, the reduced specific viscosity of the resin was 0.07 (Reference Example 2
), 0.13' (Reference Example 3), 0.31 (Reference Example 4),
Polyamideimide having a weight of 0.85 (Reference Example 5) and 1.15 (Reference Example 6) was obtained.
（実施例１）
参考例１で作製したポリアミドイミド絶縁塗料の樹脂分
１００重量部に対してポリオールとジフェニルメタンジ
イソシアネートより得られた安定化ポリイソシアネート
である日本ポリウレタン社製コロネート２５０３（以下
コロネー） ２５０３と略す）を２００重量部触媒とし
て、ジブチルスズラウレートを１重量部加え、溶解混合
した絶縁塗料を０．３珊φの銅導体上に皮膜厚０．０２
０ｍｍとなるように塗布・焼付した。得られた絶縁電線
の特性を評価した結果を表１に示した。(Example 1) Coronate 2503 (hereinafter referred to as Coronet) 2503 manufactured by Nippon Polyurethane Co., Ltd., which is a stabilized polyisocyanate obtained from a polyol and diphenylmethane diisocyanate, was used for 100 parts by weight of the resin content of the polyamide-imide insulation paint prepared in Reference Example 1. 200 parts by weight of (abbreviated) as a catalyst, 1 part by weight of dibutyltin laurate, dissolved and mixed, and the insulating paint was coated on a 0.3mm diameter copper conductor with a film thickness of 0.02mm.
It was coated and baked to a thickness of 0 mm. Table 1 shows the results of evaluating the characteristics of the obtained insulated wire.
（比較例１）
ポリアミドイミド絶縁塗料を参考例２で作製したものと
した以外は実施例１と同様にして、絶縁電線を作製し、
特性を評価した。結果を表１に示した。(Comparative Example 1) An insulated wire was produced in the same manner as in Example 1 except that the polyamide-imide insulating paint was used as that produced in Reference Example 2,
Characteristics were evaluated. The results are shown in Table 1.
（実施例２〜４）
ポリアミドイミド絶縁塗料を参考例３（実施例２）、参
考例４（実施例３）、参考例５（実施例４）でそれぞれ
作成したものとした以外は実施例１と同様にして、絶縁
電線を作製し特性を評価した。結果を表１に示した。(Examples 2 to 4) Example 1 except that the polyamide-imide insulating paint was prepared in Reference Example 3 (Example 2), Reference Example 4 (Example 3), and Reference Example 5 (Example 4), respectively. Insulated wires were prepared and their characteristics were evaluated in the same manner as above. The results are shown in Table 1.
（比較例２）
ポリアミドイミド絶縁塗料を参考例６で作製したものと
した以外は実施例１と同様にして、絶縁電線の作製を試
みたところ発泡が多数発生し、断線し絶縁電線が得られ
なかった。(Comparative Example 2) When an attempt was made to produce an insulated wire in the same manner as in Example 1, except that the polyamide-imide insulating paint was used as the one produced in Reference Example 6, many bubbles occurred, the wire broke, and an insulated wire was not obtained. There wasn't.
（発明の効果）
以上説明したように本発明の分子量を規定したポリアミ
ドイミド樹脂を使用した絶縁電線は、外観、特性とも良
好であり、その工業的価値は大きい。(Effects of the Invention) As explained above, the insulated wire using the polyamide-imide resin of the present invention with a defined molecular weight has good appearance and properties, and has great industrial value.
Claims (6)
アミドイミド樹脂１００重量部に対しジフェニルメタン
ジイソシアネートより得られた安定化ポリイソシアネー
ト化合物を７５重量部〜４００重量部加えた絶縁塗料を
導体上に塗布・焼付した事を特徴とする絶縁電線。(1) An insulating paint prepared by adding 75 parts by weight to 400 parts by weight of a stabilized polyisocyanate compound obtained from diphenylmethane diisocyanate to 100 parts by weight of a polyamideimide resin having a molecular weight of 0.1 to 1.0 in reduced specific viscosity. An insulated wire characterized by coating and baking on the conductor.
．２〜０．５である請求項１記載の絶縁電線。(2) The molecular weight of polyamide-imide resin is 0 in terms of reduced specific viscosity.
．． The insulated wire according to claim 1, wherein the insulated wire has a molecular weight of 2 to 0.5.
．３である請求項１記載の絶縁電線。(3) The molecular weight of polyamide-imide resin is 0 in terms of reduced specific viscosity.
．． 3. The insulated wire according to claim 1.
水物又はその誘導体と芳香族ジイソシアネートの反応よ
り得られる化合物である請求項１記載の絶縁電線。(4) The insulated wire according to claim 1, wherein the polyamide-imide resin is a compound obtained by reacting an aromatic tricarboxylic acid anhydride or a derivative thereof with an aromatic diisocyanate.
安定化ポリイソシアネート化合物がジフェニルメタンジ
イソシアネートのイソシアネート基をブロック剤で安定
化したポリイソシアネート化合物である請求項１記載の
絶縁電線。(5) The insulated wire according to claim 1, wherein the stabilized polyisocyanate compound obtained from diphenylmethane diisocyanate is a polyisocyanate compound obtained by stabilizing the isocyanate groups of diphenylmethane diisocyanate with a blocking agent.
安定化ポリイソシアネート化合物がポリオールとジフェ
ニルメタンジイソシアネートより得られたポリイソシア
ネートをブロック剤で安定化した安定化ポリイソシアネ
ート化合物である請求項１記載の絶縁電線。(6) The insulated wire according to claim 1, wherein the stabilized polyisocyanate compound obtained from diphenylmethane diisocyanate is a stabilized polyisocyanate compound obtained by stabilizing the polyisocyanate obtained from a polyol and diphenylmethane diisocyanate with a blocking agent.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1125396A JP2683416B2 (en) | 1989-05-17 | 1989-05-17 | Insulated wire |
| EP89118324A EP0365877B1 (en) | 1988-10-04 | 1989-10-03 | Polyamideimide insulated wire |
| DE68920542T DE68920542T2 (en) | 1988-10-04 | 1989-10-03 | Wire insulated with polyamideimide. |
| KR1019890014235A KR920009847B1 (en) | 1985-05-17 | 1989-10-04 | Polyamideimide insulated wire |
| US07/895,455 US5219657A (en) | 1988-10-04 | 1992-06-08 | Polyamideimide insulated wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1125396A JP2683416B2 (en) | 1989-05-17 | 1989-05-17 | Insulated wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02304808A true JPH02304808A (en) | 1990-12-18 |
| JP2683416B2 JP2683416B2 (en) | 1997-11-26 |
Family
ID=14909103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1125396A Expired - Lifetime JP2683416B2 (en) | 1985-05-17 | 1989-05-17 | Insulated wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2683416B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05339523A (en) * | 1992-06-05 | 1993-12-21 | Hitachi Cable Ltd | Insulating varnish and insulated wire |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5023056A (en) * | 1973-07-04 | 1975-03-12 | ||
| JPS51150543A (en) * | 1975-06-20 | 1976-12-24 | Tokyo Tokushu Densen Toryo Kk | Polyurethane electrical insulating paint |
| JPS5624445A (en) * | 1979-08-04 | 1981-03-09 | Hitachi Chem Co Ltd | Polyamide-imide resin soluble in cresol-based solvent |
| JPS5968108A (en) * | 1982-10-08 | 1984-04-18 | 日立化成工業株式会社 | Insulated wire |
| JPS60124668A (en) * | 1983-12-09 | 1985-07-03 | Hitachi Cable Ltd | Insulated wire |
-
1989
- 1989-05-17 JP JP1125396A patent/JP2683416B2/en not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5023056A (en) * | 1973-07-04 | 1975-03-12 | ||
| JPS51150543A (en) * | 1975-06-20 | 1976-12-24 | Tokyo Tokushu Densen Toryo Kk | Polyurethane electrical insulating paint |
| JPS5624445A (en) * | 1979-08-04 | 1981-03-09 | Hitachi Chem Co Ltd | Polyamide-imide resin soluble in cresol-based solvent |
| JPS5968108A (en) * | 1982-10-08 | 1984-04-18 | 日立化成工業株式会社 | Insulated wire |
| JPS60124668A (en) * | 1983-12-09 | 1985-07-03 | Hitachi Cable Ltd | Insulated wire |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05339523A (en) * | 1992-06-05 | 1993-12-21 | Hitachi Cable Ltd | Insulating varnish and insulated wire |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2683416B2 (en) | 1997-11-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6099123A (en) | Use of polyamideimides as thermoplastics | |
| SG173327A1 (en) | Heat-resistant resin varnish, heat-resistant resin films, heat-resistant resin composites, and insulated wire | |
| US4505980A (en) | Insulated wire | |
| US5219657A (en) | Polyamideimide insulated wire | |
| US4069209A (en) | Imino acids and resins derived therefrom | |
| US4180612A (en) | Hydantoin-polyester coating compositions | |
| EP0751534A2 (en) | Insulated electric wire | |
| JP2008016266A (en) | Insulated wire | |
| JP2013033669A (en) | Multilayer insulated electric wire, electric coil using the same, and motor | |
| JPH02304808A (en) | Insulated wire | |
| JP2683417B2 (en) | Insulated wire | |
| CN109935392B (en) | Varnish for insulated wire, and motor | |
| JPH04212206A (en) | Insulating paint, solderable insulated wire, manufacture of the insulated wire, and flyback transformer using the insulated wire | |
| CA1318431C (en) | High temperature resistant fast soldering wire enamel | |
| JP2943209B2 (en) | Insulated wire | |
| US4548970A (en) | Polyamideimides prepared by reacting either lactams or polyamides with polyisocyanates and anhydrides using a lactam as an additive | |
| KR920009847B1 (en) | Polyamideimide insulated wire | |
| DE68920542T2 (en) | Wire insulated with polyamideimide. | |
| JPH03233812A (en) | Insulated cable | |
| JPH03233810A (en) | Insulated cable | |
| JP5712661B2 (en) | Polyamideimide resin insulating paint and insulated wire using the same | |
| JPH03233813A (en) | Insulated cable | |
| US4659622A (en) | Essentially linear polymer having a plurality of amide, imide and ester groups therein, a tinnable and solderable magnet wire, and a method of making the same | |
| JP3497525B2 (en) | Insulated wire | |
| US4997891A (en) | High temperature resistant fast soldering wire enamel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313532 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080808 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080808 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090808 Year of fee payment: 12 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090808 Year of fee payment: 12 |