JPH022832U - - Google Patents

Info

Publication number
JPH022832U
JPH022832U JP7970388U JP7970388U JPH022832U JP H022832 U JPH022832 U JP H022832U JP 7970388 U JP7970388 U JP 7970388U JP 7970388 U JP7970388 U JP 7970388U JP H022832 U JPH022832 U JP H022832U
Authority
JP
Japan
Prior art keywords
processing
semiconductor substrate
processing tank
uniform
fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7970388U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7970388U priority Critical patent/JPH022832U/ja
Publication of JPH022832U publication Critical patent/JPH022832U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Weting (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例の配管図、第２図は
本考案の実施例２の配管図、第３図は従来の配管
図である。 １，１２……処理槽、２……ドレン口、３……
バツフア槽、４……貯液用バルブ、５，１３，１
７……送液ポンプ、６……ノズル、７……蓋、８
……キヤリア、９，１１，１５……処理液供給バ
ルブ、１０，１４，１８……フイルター、１６…
…外槽、１９……内槽。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体基板を浸漬処理するための処理槽に於い
    て、半導体基板処理中の処理槽内の流体の流れを
    均一かつ上方から下方にすることを特徴とする半
    導体基板浸漬処理装置。
JP7970388U 1988-06-15 1988-06-15 Pending JPH022832U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7970388U JPH022832U (ja) 1988-06-15 1988-06-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7970388U JPH022832U (ja) 1988-06-15 1988-06-15

Publications (1)

Publication Number Publication Date
JPH022832U true JPH022832U (ja) 1990-01-10

Family

ID=31304560

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7970388U Pending JPH022832U (ja) 1988-06-15 1988-06-15

Country Status (1)

Country Link
JP (1) JPH022832U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6366106U (ja) * 1986-10-16 1988-05-02
JP2012142419A (ja) * 2010-12-28 2012-07-26 Mitsubishi Electric Corp ウェットエッチング装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6366106U (ja) * 1986-10-16 1988-05-02
JP2012142419A (ja) * 2010-12-28 2012-07-26 Mitsubishi Electric Corp ウェットエッチング装置

Similar Documents

Publication Publication Date Title
JPH022832U (ja)
JPS6410073U (ja)
JPH01116435U (ja)
JPH0379424U (ja)
JPS63149521U (ja)
JPH0335U (ja)
JPH02117028U (ja)
JPH0246861U (ja)
JPS6083240U (ja) スピン現像機
JPS5840251U (ja) 塗布機
JPS5849245U (ja) 包埋装置
JPS5872166U (ja) 表面処理ライン槽のダムロ−ルシ−ル装置
JPH02147271U (ja)
JPS6043890U (ja) 蓄熱槽
JPS5923733U (ja) 表面処理槽
JPS61175955U (ja)
JPH01130527U (ja)
JPH0290845U (ja)
JPS61179742U (ja)
JPS62106964U (ja)
JPS63162528U (ja)
JPH0290846U (ja)
JPH02125333U (ja)
JPS59162489U (ja) 水タンク凍結防止装置
JPH0375530U (ja)