JPH0224555U - - Google Patents

Info

Publication number
JPH0224555U
JPH0224555U JP1988102040U JP10204088U JPH0224555U JP H0224555 U JPH0224555 U JP H0224555U JP 1988102040 U JP1988102040 U JP 1988102040U JP 10204088 U JP10204088 U JP 10204088U JP H0224555 U JPH0224555 U JP H0224555U
Authority
JP
Japan
Prior art keywords
leadless electronic
electronic component
resin
bent
resin molded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988102040U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988102040U priority Critical patent/JPH0224555U/ja
Publication of JPH0224555U publication Critical patent/JPH0224555U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L24/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/4005—Shape
    • H01L2224/4009—Loop shape
    • H01L2224/40095—Kinked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Description

【図面の簡単な説明】
第１図は、この考案の一実施例であるリードレ
ス電子部品を示し、同図ａは、その水平断面図、
同図ｂは、その中央断面図、同図ｃは、その側面
図、第２図は、この考案の他の実施例であるリー
ドレス電子部品を示し、同図ａは、その部分外観
図、同図ｂは、その部分平面図、第３図は、上記
リードレス電子部品に使用するリードフレームを
示し、同図ａは、その一部切欠平面図、同図ｂは
、その拡大側面図、同図ｃは、同じくその拡大平
面図、第４図は、上記リードレス電子部品に使用
する内部リードを示し、同図ａは、その一部切欠
平面図、同図ｂは、その側面図、第５図は、従来
のリードレス電子部品を示し、同図ａは、その中
央断面図、同図ｂは、その平面図、第６図ａ，ｂ
，ｃは、リードレス電子部品のリードの折り曲げ
加工手順を示す工程図である。 ３……チツプ、１０……リードフレーム、１１
……連結部、１２……リード、１３……チツプ搭
載部、１４……テーパ部、１５……つば部、１６
……狭幅部、１７……広幅部、２０……内部リー
ド、３１……樹脂モールド部、３２……切欠部。

Claims (1)

  1. 【実用新案登録請求の範囲】 １ 板状の１対のリードに固着されたチツプが樹
    脂封止された樹脂モールド部を有し、この樹脂モ
    ールド部から導出される前記１対のリードの一端
    が当該樹脂モールド部の外周を抱き込むように折
    り曲げられたリードレス電子部品において、前記
    リードが樹脂モールド部を抱き込むように折り曲
    が加工される際の外力が前記樹脂モールド部内に
    封止されたチツプに伝達されないように、前記１
    対のリードにストツパ部を設けたことを特徴とす
    るリードレス電子部品。 ２ 前記ストツパ部は、前記樹脂モールド部内に
    位置するリード部分に形成したテーパ部であるこ
    とを特徴とする実用新案登録請求の範囲第１項記
    載のリードレス電子部品。 ３ 前記ストツパ部は、前記樹脂モールド部内に
    位置するリード部分に形成したつば部であること
    を特徴とする実用新案登録請求の範囲第１項記載
    のリードレス電子部品。 ４ 前記ストツパ部は、前記樹脂モールド部から
    導出され、かつ、折り曲げ加工される部分を他の
    リードの幅に比較して幅の狭い狭幅部に形成した
    ことを特徴とする実用新案登録請求の範囲第１項
    記載のリードレス電子部品。 ５ 前記ストツパ部は、前記樹脂モールド部から
    導出され、かつ、折り曲げ加工される部分にかか
    るようにリードの一部に切欠部を設けたことを特
    徴とする実用新案登録請求の範囲第１項記載のリ
    ードレス電子部品。
JP1988102040U 1988-08-04 1988-08-04 Pending JPH0224555U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988102040U JPH0224555U (ja) 1988-08-04 1988-08-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988102040U JPH0224555U (ja) 1988-08-04 1988-08-04

Publications (1)

Publication Number Publication Date
JPH0224555U true JPH0224555U (ja) 1990-02-19

Family

ID=31331580

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988102040U Pending JPH0224555U (ja) 1988-08-04 1988-08-04

Country Status (1)

Country Link
JP (1) JPH0224555U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011249395A (ja) * 2010-05-24 2011-12-08 Mitsubishi Electric Corp 半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60161646A (ja) * 1984-02-01 1985-08-23 Hitachi Ltd 半導体装置用リ−ドフレ−ム
JPS61236144A (ja) * 1985-04-12 1986-10-21 Hitachi Ltd レジンモ−ルド型半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60161646A (ja) * 1984-02-01 1985-08-23 Hitachi Ltd 半導体装置用リ−ドフレ−ム
JPS61236144A (ja) * 1985-04-12 1986-10-21 Hitachi Ltd レジンモ−ルド型半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011249395A (ja) * 2010-05-24 2011-12-08 Mitsubishi Electric Corp 半導体装置

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