JPH0222533B2 - - Google Patents
Info
- Publication number
- JPH0222533B2 JPH0222533B2 JP61034229A JP3422986A JPH0222533B2 JP H0222533 B2 JPH0222533 B2 JP H0222533B2 JP 61034229 A JP61034229 A JP 61034229A JP 3422986 A JP3422986 A JP 3422986A JP H0222533 B2 JPH0222533 B2 JP H0222533B2
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- manual alignment
- center
- mark
- target
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 claims description 25
- 238000005516 engineering process Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
- H01L2223/54466—Located in a dummy or reference die
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61034229A JPS62193124A (ja) | 1986-02-19 | 1986-02-19 | パタ−ン位置合わせ方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61034229A JPS62193124A (ja) | 1986-02-19 | 1986-02-19 | パタ−ン位置合わせ方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62193124A JPS62193124A (ja) | 1987-08-25 |
JPH0222533B2 true JPH0222533B2 (zh) | 1990-05-18 |
Family
ID=12408315
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61034229A Granted JPS62193124A (ja) | 1986-02-19 | 1986-02-19 | パタ−ン位置合わせ方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62193124A (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR940000910B1 (ko) * | 1991-04-12 | 1994-02-04 | 금성일렉트론 주식회사 | 반도체 칩의 얼라인먼트 방법 및 레이저 리페이어용 타겟이 형성된 반도체 칩 |
-
1986
- 1986-02-19 JP JP61034229A patent/JPS62193124A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS62193124A (ja) | 1987-08-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |