JPH0221922U - - Google Patents
Info
- Publication number
- JPH0221922U JPH0221922U JP9940988U JP9940988U JPH0221922U JP H0221922 U JPH0221922 U JP H0221922U JP 9940988 U JP9940988 U JP 9940988U JP 9940988 U JP9940988 U JP 9940988U JP H0221922 U JPH0221922 U JP H0221922U
- Authority
- JP
- Japan
- Prior art keywords
- shape
- surface mount
- connection terminal
- mount component
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第1図〜第3図は本考案の端子部形状を説明す
るための平面図と斜視図、第4図は本考案と従来
品の半田上り特性を示す図、第5図は本考案と従
来品の半田付け強度の特性図、第6図は本考案品
の半田上がり不良率とl2/L2との関係を示す
図、第7図〜第10図は従来の端子部形状を説明
するための平面図、側面図、平面図である。
〔符号の説明〕、1……回路素子(振動素子)
、2……搭載基板、4……パターン、5……実装
基板、6……パツド、7……ハンダ、30……接
続端子部。
Figures 1 to 3 are a plan view and a perspective view for explaining the shape of the terminal portion of the present invention, Figure 4 is a diagram showing the solder rise characteristics of the present invention and the conventional product, and Figure 5 is the present invention and the conventional product. A characteristic diagram of the soldering strength of the product. Figure 6 is a diagram showing the relationship between the solder failure rate and l 2 /L 2 of the product of the present invention. Figures 7 to 10 explain the conventional terminal shape. These are a plan view, a side view, and a top view. [Explanation of symbols], 1...Circuit element (vibration element)
, 2... Mounting board, 4... Pattern, 5... Mounting board, 6... Pad, 7... Solder, 30... Connection terminal section.
Claims (1)
ターンと電気接続される表面実装部品で、該部品
は回路素子を実装した搭載基板を有し、該搭載基
板の側面には前記回路パターンと前記回路素子と
の電気接続用半田が流入する凹形状の接続端子部
が形成されている表面実装部品であつて、 前記端子部の凹形状が、開口部長さLが凹部深
さlより長い長穴形状となつていることを特徴と
した表面実装部品の接続端子部形状。 (2) 前記長穴形状は、開口部長さLと凹部深さ
lとの比l/Lが0.1〜0.7であることを特
徴とした実用新案登録請求の範囲第1項記載の表
面実装部品の接続端子部形状。[Claims for Utility Model Registration] (1) A surface mount component that is placed on a substrate surface and electrically connected to a circuit pattern on the substrate surface, the component having a mounting substrate on which circuit elements are mounted, A surface mount component, in which a concave connection terminal portion is formed on a side surface of the mounting board into which solder for electrical connection between the circuit pattern and the circuit element flows, and the concave shape of the terminal portion corresponds to the opening length. A connection terminal shape of a surface mount component, characterized in that the length L is an elongated hole shape that is longer than the recess depth l. (2) The elongated hole shape has a ratio l/L of opening length L to recess depth l of 0.1 to 0.7, as set forth in claim 1 of the utility model registration claim. Connection terminal shape of surface mount components.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9940988U JPH0221922U (en) | 1988-07-27 | 1988-07-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9940988U JPH0221922U (en) | 1988-07-27 | 1988-07-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0221922U true JPH0221922U (en) | 1990-02-14 |
Family
ID=31326541
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9940988U Pending JPH0221922U (en) | 1988-07-27 | 1988-07-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0221922U (en) |
-
1988
- 1988-07-27 JP JP9940988U patent/JPH0221922U/ja active Pending