JPH0313768U - - Google Patents
Info
- Publication number
- JPH0313768U JPH0313768U JP7444189U JP7444189U JPH0313768U JP H0313768 U JPH0313768 U JP H0313768U JP 7444189 U JP7444189 U JP 7444189U JP 7444189 U JP7444189 U JP 7444189U JP H0313768 U JPH0313768 U JP H0313768U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- convex portion
- lead
- circuit board
- insertion type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000037431 insertion Effects 0.000 claims description 5
- 238000003780 insertion Methods 0.000 claims description 5
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
図−１および図−２は本考案の一実施例に係る
回路基板にリード挿入型電子部品を実装した状態
を示す断面図および斜視図、図−３はリード挿入
型電子部品の斜視図、図−４は従来の回路基板に
リード挿入型電子部品を実装した状態を示す斜視
図である。
１１……リード挿入型電子部品、１２……リー
ド、１４……配線パターン、１４ａ……パツド部
、１５……回路基板、１６……絶縁基板、１７…
…凸部。
Figures 1 and 2 are a sectional view and a perspective view showing a lead insertion type electronic component mounted on a circuit board according to an embodiment of the present invention, and Figure 3 is a perspective view and a perspective view of a lead insertion type electronic component. -4 is a perspective view showing a state in which a lead insertion type electronic component is mounted on a conventional circuit board. DESCRIPTION OF SYMBOLS 11... Lead insertion type electronic component, 12... Lead, 14... Wiring pattern, 14a... Pad portion, 15... Circuit board, 16... Insulating board, 17...
...Protrusion.
Claims (1)
ードの間に入る厚さの凸部を形成し、その凸部の
側面に上記リードが半田付けされる配線パターン
のパツド部を形成したことを特徴とする回路基板
。 A convex portion thick enough to fit between the leads of a lead insertion type electronic component is formed on the electronic component mounting surface, and a pad portion of a wiring pattern to which the lead is soldered is formed on the side surface of the convex portion. circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7444189U JPH0313768U (en) | 1989-06-27 | 1989-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7444189U JPH0313768U (en) | 1989-06-27 | 1989-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0313768U true JPH0313768U (en) | 1991-02-12 |
Family
ID=31614134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7444189U Pending JPH0313768U (en) | 1989-06-27 | 1989-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0313768U (en) |
-
1989
- 1989-06-27 JP JP7444189U patent/JPH0313768U/ja active Pending