JPH02200746A - Manufacture of copper alloy material for lead frame - Google Patents
Manufacture of copper alloy material for lead frameInfo
- Publication number
- JPH02200746A JPH02200746A JP1889689A JP1889689A JPH02200746A JP H02200746 A JPH02200746 A JP H02200746A JP 1889689 A JP1889689 A JP 1889689A JP 1889689 A JP1889689 A JP 1889689A JP H02200746 A JPH02200746 A JP H02200746A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- lead frame
- copper alloy
- intermediate annealing
- alloy material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000956 alloy Substances 0.000 title claims abstract description 47
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 238000000137 annealing Methods 0.000 claims abstract description 35
- 238000000034 method Methods 0.000 claims abstract description 16
- 238000005097 cold rolling Methods 0.000 claims abstract description 11
- 239000010949 copper Substances 0.000 claims abstract description 6
- 238000005098 hot rolling Methods 0.000 claims abstract description 5
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 abstract description 19
- 229910000679 solder Inorganic materials 0.000 abstract description 18
- 239000000463 material Substances 0.000 abstract description 16
- 229910052804 chromium Inorganic materials 0.000 abstract description 3
- 229910052718 tin Inorganic materials 0.000 abstract description 2
- 238000007747 plating Methods 0.000 description 14
- 229910017813 Cu—Cr Inorganic materials 0.000 description 9
- 239000011159 matrix material Substances 0.000 description 6
- 238000002474 experimental method Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000002244 precipitate Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 229910000799 K alloy Inorganic materials 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000004071 soot Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は半導体機器用リードフレーム材等に用いられる
銅合金の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for manufacturing a copper alloy used for lead frame materials for semiconductor devices and the like.
（従来の技術）
半導体機器のリードフレーム用材料において求められる
特性には種々あるが、そのうち最も基本的なものは強度
及び導電性である。近年鉄系、ニッケル系合金材に比べ
て導電性に優れている銅合金材に対する需要が高まって
きているが、なかでもＣｕ−Ｃｒ系及びＣｕ−Ｃｒ−Ｓ
ｎ系合金材は合金基質中における微細、なＣｒの析出相
の発現効果によって高い機械強度と、より優れた導電性
を得ることが可能であることから特に注［］されている
。(Prior Art) There are various properties required for materials for lead frames of semiconductor devices, the most basic of which are strength and conductivity. In recent years, there has been an increasing demand for copper alloy materials that have superior conductivity compared to iron-based and nickel-based alloy materials, and among them, Cu-Cr-based and Cu-Cr-S
Particular attention has been paid to n-based alloy materials because they can provide high mechanical strength and superior electrical conductivity due to the effect of developing fine Cr precipitate phases in the alloy matrix.
しかしながら、これらの系の銅合金は析出型合金である
ので、合金材の製造にあたって合金基質中にＣｒを固溶
させるための高温での熱処理及びその後Ｃｒを基質中に
析出させるための熱処理を施すことが必要となる。However, since these types of copper alloys are precipitation type alloys, in manufacturing the alloy materials, heat treatment at high temperatures is performed to form a solid solution of Cr in the alloy matrix, and then heat treatment is performed to precipitate Cr into the matrix. This is necessary.
従来これらの系の合金鋳塊より高強度銅合金材を得るに
は、約８００℃以上で行なわれる熱間圧延によってＣｒ
を基質中に固溶させ、その後、冷間圧延を行なう途中で
４００・〜４５０℃に３０分以上の中間焼鈍を施してＣ
ｒを基質中に析出させている。Conventionally, in order to obtain high-strength copper alloy materials from alloy ingots of these systems, Cr
is dissolved in the substrate, and then subjected to intermediate annealing at 400-450°C for 30 minutes or more during cold rolling.
r is precipitated into the substrate.
このようにして得らハた最終冷間圧延後の板または条は
引張強さ４５〜６０ｋｇ／’ｍａ、導電率６５−・８０
％ｌＡＣ３に及ぶ優れた特性を有するので、リードフレ
ーム材料としての適用も盛んに試みらり、−Ｃいる。The plate or strip thus obtained after final cold rolling has a tensile strength of 45 to 60 kg/'ma and an electrical conductivity of 65-80.
%lAC3, its application as a lead frame material has been actively attempted.
し力化ながら、このような方法で製造されな板または条
をリードフレーム材料として用いた場斤には、リード部
など６Ｊ施されためつき層の経時劣化が著しく、長時間
の使用によってはんだめっき層に亀裂を生じたり、剥離
を起こしたりするので所謂はんだめっき耐ぺ性が劣り、
実装後の信頼性に問題、があった。However, when plates or strips manufactured by this method are used as lead frame materials, the 6J damping layer on the lead parts etc. deteriorates significantly over time, and the solder plating deteriorates due to long-term use. The so-called solder plating resistance is poor because the layer may crack or peel.
There was a problem with reliability after implementation.
（発明が解決しようとする課題）
本発明はＣｕ−Ｃｒ系合金材及びＣ０−ＣＰＳｎ合金材
をリードフレーム材として利用するに際しての」−記の
問題点を解決し、これらの合金系のはんだめっき耐候性
を改善し１、て、リードフレーム材とし′Ｃの高い信頼
性を得ぜしめよ・）とするものである。(Problems to be Solved by the Invention) The present invention solves the problems described in "-" when using Cu-Cr alloy materials and C0-CPSn alloy materials as lead frame materials, and solves the problems described in "-" when using Cu-Cr alloy materials and C0-CPSn alloy materials as lead frame materials, and It is intended to improve weather resistance and achieve high reliability as a lead frame material.
（課題を解決するための干、段）
本発明者等は上記の目的を達成゛するためにＣｌＣｒ系
及びＣｕ −Ｃｒ −Ｓｎ系合金材の製造方法について
種々検討を加え／、コ結果、冷間圧延に際して途中で行
なわれる中間焼鈍の条件を所定の範囲に規定することに
より、はんだめっき耐候性が著しく改善されるという知
見を得て本発明を完成するに至ったものである。(Steps to Solve the Problems) In order to achieve the above object, the present inventors have conducted various studies on the manufacturing method of ClCr-based and Cu-Cr-Sn-based alloy materials, and as a result, The present invention was completed based on the finding that the weather resistance of solder plating can be significantly improved by regulating the conditions of intermediate annealing performed during rolling to a predetermined range.
即ち、本発明は０．０５−ヘ・１，０重置％のＣｒを含
み残部が実質的にＣｕからなる銅合金鋳塊、または０．
０５・へ、１．０重量％のＣｒ及び０．０１〜０．５重
量％のＳｎを含み残部が実質的にＣｕからなる銅合金鋳
塊に熱間圧延を施した後、冷間圧延と中間焼鈍とを繰返
し加えることによつζ板または条にするに際して、少な
くとも１１回の中間焼鈍は４７５〜５５０℃、１０分・
〜１６時間の条件Ｆで行なうことを特徴とするものであ
る。That is, the present invention provides a copper alloy ingot containing 0.05-1.0% Cr and the remainder substantially consisting of Cu, or a copper alloy ingot containing 0.05-1.0% Cr and the remainder substantially Cu.
To 05., after hot rolling a copper alloy ingot containing 1.0% by weight of Cr and 0.01 to 0.5% by weight of Sn, with the remainder substantially consisting of Cu, cold rolling was performed. When forming a ζ plate or strip by repeatedly applying intermediate annealing, at least 11 intermediate annealings are performed at 475 to 550°C for 10 minutes.
It is characterized by being carried out under condition F for ~16 hours.
（作用）
一般にこの種のＣｕ−Ｃｒ系合金材及びＣｕ−Ｃｒ−５
ｎ系合金材において高強度が得られるのは、主として加
工時の中間焼鈍に際して合金基質中に析出するＣｒの効
果によるものであることが知られている。(Function) Generally, this type of Cu-Cr alloy material and Cu-Cr-5
It is known that the high strength obtained in n-based alloy materials is mainly due to the effect of Cr precipitated in the alloy matrix during intermediate annealing during processing.
即ち、高温で熱間圧延された合金中にはＣ「が過飽和に
固溶しているが、これを冷間圧延するに際して途中で焼
鈍を加えると固溶されたＣ「が合金基質中に微細に分散
析出して５合金の強度及び導電率の向」ユに寄り−する
のである。In other words, in an alloy that has been hot-rolled at a high temperature, C' is supersaturated as a solid solution, but when annealing is added during cold rolling, the solid-soluted C' is finely dissolved in the alloy matrix. It disperses and precipitates in the alloy, thereby contributing to the strength and conductivity of the five alloys.
このＣｒの析出相の量、大きさ、分布などは中間焼鈍に
際し、ての諸条件によって異なるが、従来この系の合金
においては中間焼鈍の条件１投定は強度の向上を計るこ
とを主眼としてなされており、−般に４００・〜、４５
０°Ｃの温度において３０分以１−の加熱保持が行なわ
れている。The amount, size, distribution, etc. of this Cr precipitate phase vary depending on the various conditions during intermediate annealing, but conventionally in this type of alloy, intermediate annealing condition 1 was set with the main purpose of improving strength. - generally 400..., 45
Heating and holding is carried out for 30 minutes or more at a temperature of 0°C.
し力壮２ながら、本発明者等の行なった実装によれば上
記し７たような条件で焼鈍を施した合金材はＣｒの基質
中への析出が極めて微細に行なわれるので、強度上昇の
効果は顕著であるが、こｈをリードフレーム材に適用し
た場合には、はＸ７だめつき耐候性において著しく劣る
ものであることが確認された。However, according to the implementation carried out by the present inventors, the alloy material annealed under the above-mentioned conditions has extremely fine precipitation of Cr in the matrix, so it is difficult to increase the strength. Although the effect is remarkable, when this material was applied to a lead frame material, it was confirmed that the weather resistance due to X7 was significantly inferior.
そこで本発明者等は、本系合金利の加工時における中間
焼鈍条件のはんだめっき耐候性に及ぼリー影響につい゛
で更に詳細な検討を加えた結果、合金材のはんだめっき
耐候性は以下に示すように中間焼鈍条件、即ち中間焼鈍
に際しての材料の保持温度及び保持時間によって大きく
左右されることが明らかになった。Therefore, the inventors conducted a more detailed study on the influence of intermediate annealing conditions on the weathering resistance of solder plating during processing of this alloy material, and as a result, the weathering resistance of solder plating of the alloy material is as shown below. It has become clear that the intermediate annealing conditions are greatly influenced by the holding temperature and holding time of the material during intermediate annealing.
即ち、従来の方法のように４００・〜４５０℃の保持温
度において中間焼鈍を行なった場合には、焼鈍時間の如
何によらず材料のはんだめっき耐候性は著しく低い。こ
れに対して、保持温度をより高温の４７５〜５５０℃に
上げ、同温度範囲に１０分以」−の保持を行なった場合
には、その後の工程諸条件の如何によらず極めて優れた
はんだめっき耐候性を示すこと、また従来の中間焼鈍条
件によって得ちれた合金材に比して強度的にも殆ど低下
が認められず、仮に強度低下があっても実用」二問題の
ない程度であることが判かった。That is, when intermediate annealing is performed at a holding temperature of 400 to 450° C. as in the conventional method, the weather resistance of the solder plating of the material is extremely low regardless of the annealing time. On the other hand, when the holding temperature is raised to a higher temperature of 475 to 550°C and held in the same temperature range for 10 minutes or more, extremely excellent solder is obtained regardless of the subsequent process conditions. The plating shows good weather resistance, and there is almost no decrease in strength compared to alloy materials obtained by conventional intermediate annealing conditions, and even if there is a decrease in strength, it is still practical. I found out something.
しかして、保持温度の−Ｆ限が５５０℃を超えてさらに
高温度になると、Ｃｒの析出相が粗大化するために合金
材の強度が著しく低下してしまう。However, if the -F limit of the holding temperature exceeds 550° C. and becomes even higher, the Cr precipitate phase becomes coarser and the strength of the alloy material decreases significantly.
まな、焼鈍時間が１０分未ｉ：：にであるときははＸ２
だめ・、）き耐候性が十分に改善さｉｌない４． ・ツ
ノ、１６ｎ、ｑ間を越える焼鈍は経済的な理由１こより
好ましくない
即ち、木系合金材が高強度と優れたはんだめ−）き耐１
１又性を兼ね備えるためには中間焼鈍を−４−記した範
囲内で行なうことが必須の条件であるということが出来
る。However, if the annealing time is less than 10 minutes, then X2
4. Weather resistance has not been sufficiently improved.・Annealing exceeding 16n and q is not preferable for economical reasons.In other words, wood-based alloy materials have high strength and excellent solderability.
It can be said that in order to have monoprotic property, it is an essential condition that the intermediate annealing be performed within the range indicated by -4-.
本発明において上記し、た条件にＪ：る中間焼鈍は冷間
圧延中少なくとも１回行なえばよく、これによう”ζ合
金材に優れたはんだめっき耐候性を付与することが出来
るのである。従ってその後の中間焼鈍や冷間圧延率等は
、従来この柱合金系において板または条の質別に応じて
常法的に行なわれる条件に従って行なえばよい。ただし
、最終圧延終了後の板または条の強度維持の観点から本
発明の中間焼鈍を施した以降の中間焼鈍は、−に記温度
１・ｉ囲まノ；：はこれより低い温度範囲て°行なうこ
とが望ましい。In the present invention, the intermediate annealing under the conditions described above only needs to be performed at least once during cold rolling, and thus it is possible to impart excellent solder plating weather resistance to the ζ alloy material. The subsequent intermediate annealing, cold rolling rate, etc. may be carried out according to the conditions conventionally used in this column alloy system depending on the temper of the plate or strip.However, the strength of the plate or strip after the final rolling is From the viewpoint of maintenance, it is desirable that the intermediate annealing after the intermediate annealing of the present invention be carried out at a temperature lower than the temperature indicated by 1.i.
（実施例）
大気中で高周波銹尊溶解炉を用いて溶製し／こＣｕｃｒ
系及びＣｕ−Ｃｒ 〜−−Ｓｎ系の各銅合金鋳塊を厚さ
１５ｍまで熱間圧延しｆ、： ｔ＆ 、面削を施シ、°
〔厚さ１３剛としな。次いでこれを冷間圧延す゛るに際
し１、その途中においてで１回（１，２５ｍｍ）ソ）ま
たは２回（１，２５、厚及び０．３８ｍｍ厚）の中間焼
鈍を施し２て剋終厚０゜２霜■の合金板を得ｌｆ、焼鈍
は窒素雰囲気中で、４００−６００ ’Ｃの温度範囲に
おいて、５分乃至７１時間の各条件にて行な・すな。(Example) Cucr is melted using a high frequency melting furnace in the atmosphere.
The ingots of Cu-Cr and Sn-based copper alloys were hot-rolled to a thickness of 15 m, and then subjected to face milling.
[Thickness: 13mm. Next, when cold-rolling this, 1) intermediate annealing is performed once (1,25 mm) or twice (1,25 mm thick and 0.38 mm thick) in the middle of the cold rolling process, 2 to achieve a final thickness of 0°. An alloy plate of 2 frosts was obtained, and annealing was carried out in a nitrogen atmosphere at a temperature of 400-600'C for 5 minutes to 71 hours.
このようにし、て得られた０゜２５ｍｍＫ合金板Ｃη・
ｔ Ｌ、はんだめっき耐候性試験を以下の丁１１１１７
によりおこなった。In this way, the obtained 0゜25mm K alloy plate Cη・
tL, solder plating weather resistance test as below 11117
This was done by
各合金板に対し脱脂、洗浄、水洗、乾煤の油処理を行な
・）た後、ロジンフラックスを塗布し、２３０℃に保持
し々６０Ｓｎ７’４０Ｐｂはんだ浴中に５砂間浸漬して
はんだめっきを施した。、これら各試王１を大気中で１
５０℃に加熱保持された恒温槽中に挿入し、５００ 、
１０００．１５００時間の各時間保持しな。その後これ
らの芥試料について曲げ半径３ｖｎｎｓ９０°の曲げ試
験を行ない、曲げ部におけるはんなめっき層の１ｌｌｉ
ｆｌｌｕの有無ζこつい°Ｃ目視及び実体冑）微鏡を用
いた観察により判定した。After degreasing, cleaning, washing with water, and treating with dry soot and oil, each alloy plate is coated with rosin flux, kept at 230°C, and immersed in a 60Sn7'40Pb solder bath for 5 days to solder. Plated. , each of these trial kings 1 in the atmosphere
Insert into a constant temperature bath heated and maintained at 50°C,
Hold each hour for 1000.1500 hours. After that, a bending test with a bending radius of 3vnns and 90° was performed on these waste samples, and the solder plating layer at the bent part was 1lli
The presence or absence of fllu was determined by visual inspection and observation using a microscope.
また合金板の機械的性質及び導電率について、機械的性
質はＪＩＳ ５号試験片を用いた引張り試験によって、
また導電率は四端了法によっ°ζ求めた。Regarding the mechanical properties and electrical conductivity of the alloy plate, the mechanical properties were determined by a tensile test using a JIS No. 5 test piece.
In addition, the conductivity was determined by the four-point method.
下記する第１表にＣｕ−Ｃｒ系合金材についてそれぞれ
の合金組成、中間焼鈍条件を変えた試料によるＸ験結果
を、また下記する第２表にｃｏ−ｃｒ−ｓｎ系合金につ
いて同様にして得られた試験結果を示す。Table 1 below shows the results of X experiments for samples with different alloy compositions and intermediate annealing conditions for Cu-Cr alloy materials, and Table 2 below shows results obtained in the same way for co-cr-sn alloys. The following test results are shown below.
なお、表中には従来法による中間焼鈍を行なったもの及
び従来法とは異なるが本発明の中間焼鈍の範囲を逸脱し
７た条件て仲間焼鈍を行なったものについて試験した結
果を比較例として示しな。In addition, in the table, the results of tests on those subjected to intermediate annealing by the conventional method and those subjected to peer annealing under conditions different from the conventional method but outside the range of intermediate annealing of the present invention are shown as comparative examples. Show me.
先ずはんだめっき耐候性であるが、第１表及び第２表の
結果より判かるように、Ｃｕ−Ｃｒ系合金、Ｃｕ−Ｃｒ
−３ｎ系合金共に本発明の方法により得られた試料（
実験番号１〜７及び実験番号１４・−１９）においては
何ハの試料においてもはに、だめつき層の＆ＩＩ 離は
全く認、ぬられなかったのに対し”Ｃ１比較例合金試１
１（実験番号８〜１３及び２０・・〜２５）においては
中間焼鈍を６．００℃、１時間にて行なった試料（実験
番号１２及び２４）を除き、低温のｂｏｏ’ｃで保持し
たものにおいては剥離しないものがあるものの、総体的
に剥離し易いこと示されている。First, regarding the weather resistance of solder plating, as can be seen from the results in Tables 1 and 2, Cu-Cr alloy, Cu-Cr
-3n alloy samples obtained by the method of the present invention (
In Experiment Nos. 1 to 7 and Experiment Nos. 14 and 19), no peeling of the adhesive layer was observed in any of the samples, whereas no separation was observed in the C1 Comparative Example Alloy Sample 1.
1 (experiment numbers 8 to 13 and 20... to 25), except for the samples (experiment numbers 12 and 24) in which intermediate annealing was performed at 6.00 ° C. for 1 hour, and those held at low temperature boo'c. It has been shown that although there are some that do not peel off, they are generally easy to peel off.
また、機械的性質に−）いては本発明の方法による試料
は比較例に示された方法による試料に比べてほぼ同等の
値を示し、導電性は寧ろやや改善さノ′とていることが
判かる。In addition, in terms of mechanical properties (-), the samples produced by the method of the present invention showed almost the same values as the samples produced by the method shown in the comparative example, and the electrical conductivity was, if anything, slightly improved. I understand.
以上の結果より加工に際して、本発明の方法により中間
焼鈍を施したＣｕ−Ｃｒ系及びＣｕ−Ｃｒ−３ｎ系合金
材は本来この系の合金材の有する高強度、高導電率特性
を損なうことなくはんだめっき耐１１又性を著］、７く
向」ユさせることが出来るのでリードフレーム材若し７
くはこれと同様の性能が要求される導電材料等Ｊ＼の使
用６、−好適であることが判かる。The above results show that during processing, Cu-Cr and Cu-Cr-3n alloy materials subjected to intermediate annealing by the method of the present invention can be processed without impairing the high strength and high conductivity characteristics originally possessed by this alloy material. It has excellent resistance to solder plating and can be used in 7 directions, making it suitable for lead frame materials or 7
It can be seen that it is preferable to use conductive materials, etc., which require similar performance.
（発明の効果）
以上述べたように本発明の方法によれば半導体機器用リ
ードフレーム材とし、て要求される強度、導電率、はん
だめっき耐候性を十分に満足することの出来るＣＩＪ−
Ｃｒ系及びＣｕ−Ｃｒ−８ｎ系の銅合金材を得ることか
出来るの”Ｃ゛、リードフレーム材どしては勿論のこと
、各種リード線、その他のはんだめっきを伴う導電用材
利として高い信頼性をも−）で使用することが出来るの
でその］−業的１＋Ｉｆ値か高い。(Effects of the Invention) As described above, according to the method of the present invention, CIJ can be used as a lead frame material for semiconductor devices and fully satisfies the strength, conductivity, and weather resistance required for solder plating.
It is possible to obtain Cr-based and Cu-Cr-8n-based copper alloy materials, which are highly reliable as not only lead frame materials, but also various lead wires and other conductive materials with solder plating. Since it can also be used with -), its - commercial 1+If value is high.
特許出願人 住友金属鉱山株式会社Patent applicant: Sumitomo Metal Mining Co., Ltd.
Claims (2)
質的にＣｕからなる銅合金鋳塊を熱間圧延した後、冷間
圧延と中間焼鈍とを繰返し加えることによって板または
条を得るに際し、中間焼鈍の少くとも１回を４７５〜５
５０℃、１０分〜１６時間の条件下において行なうこと
を特徴とするリードフレーム用銅合金材の製造方法。(1) After hot rolling a copper alloy ingot containing 0.05 to 1.0% by weight of Cr and the remainder being substantially Cu, the plate or When obtaining a strip, at least one intermediate annealing is performed at 475 to 5
A method for manufacturing a copper alloy material for a lead frame, characterized in that the method is carried out at 50° C. for 10 minutes to 16 hours.
．５重量％のＳｎを含み、残部が実質的にＣｕからなる
銅合金鋳塊を熱間圧延した後、冷間圧延と中間焼鈍とを
繰返し加えることによって板または条を得るに際し、中
間焼鈍の少なくとも１回を４７５〜５５０℃、１０分〜
１６時間の条件下において行なうことを特徴とするリー
ドフレーム用銅合金材の製造方法。(2) 0.05-1.0% by weight of Cr and 0.01-0
．． When obtaining a plate or strip by repeatedly performing cold rolling and intermediate annealing after hot rolling a copper alloy ingot containing 5% by weight of Sn and the remainder substantially consisting of Cu, at least the intermediate annealing step is performed. 1 time at 475-550℃ for 10 minutes
A method for producing a copper alloy material for a lead frame, the method being carried out under conditions of 16 hours.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1889689A JPH02200746A (en) | 1989-01-27 | 1989-01-27 | Manufacture of copper alloy material for lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1889689A JPH02200746A (en) | 1989-01-27 | 1989-01-27 | Manufacture of copper alloy material for lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02200746A true JPH02200746A (en) | 1990-08-09 |
Family
ID=11984341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1889689A Pending JPH02200746A (en) | 1989-01-27 | 1989-01-27 | Manufacture of copper alloy material for lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02200746A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7909908B2 (en) | 2005-02-18 | 2011-03-22 | Dowa Electronics Materials Co., Ltd. | Method of improving the weatherability of copper powder |
-
1989
- 1989-01-27 JP JP1889689A patent/JPH02200746A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7909908B2 (en) | 2005-02-18 | 2011-03-22 | Dowa Electronics Materials Co., Ltd. | Method of improving the weatherability of copper powder |
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