JPS63266054A - Manufacture of high-strength copper-base alloy - Google Patents
Manufacture of high-strength copper-base alloyInfo
- Publication number
- JPS63266054A JPS63266054A JP10140687A JP10140687A JPS63266054A JP S63266054 A JPS63266054 A JP S63266054A JP 10140687 A JP10140687 A JP 10140687A JP 10140687 A JP10140687 A JP 10140687A JP S63266054 A JPS63266054 A JP S63266054A
- Authority
- JP
- Japan
- Prior art keywords
- cold
- less
- strength
- grinding
- ingot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 15
- 239000000956 alloy Substances 0.000 title claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims abstract description 23
- 238000001816 cooling Methods 0.000 claims abstract description 19
- 238000000227 grinding Methods 0.000 claims abstract description 10
- 238000005482 strain hardening Methods 0.000 claims abstract description 8
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 7
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 6
- 239000010949 copper Substances 0.000 claims abstract description 5
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 5
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 4
- 238000002844 melting Methods 0.000 claims abstract description 4
- 230000008018 melting Effects 0.000 claims abstract description 4
- 239000012535 impurity Substances 0.000 claims abstract description 3
- 230000001590 oxidative effect Effects 0.000 claims description 16
- 229910052796 boron Inorganic materials 0.000 claims description 5
- 229910052787 antimony Inorganic materials 0.000 claims description 4
- 229910052745 lead Inorganic materials 0.000 claims description 4
- 229910052748 manganese Inorganic materials 0.000 claims description 4
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 4
- 229910052727 yttrium Inorganic materials 0.000 claims description 4
- 229910052785 arsenic Inorganic materials 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910052733 gallium Inorganic materials 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 229910052726 zirconium Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052797 bismuth Inorganic materials 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 229910052714 tellurium Inorganic materials 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 35
- 238000007747 plating Methods 0.000 abstract description 18
- 239000000203 mixture Substances 0.000 abstract description 7
- 238000004140 cleaning Methods 0.000 abstract description 4
- 229910052718 tin Inorganic materials 0.000 abstract description 3
- 229910052719 titanium Inorganic materials 0.000 abstract 2
- 238000000137 annealing Methods 0.000 description 13
- 238000005452 bending Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 8
- 238000005097 cold rolling Methods 0.000 description 6
- 238000012733 comparative method Methods 0.000 description 5
- 238000001953 recrystallisation Methods 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 229910000978 Pb alloy Inorganic materials 0.000 description 2
- 238000009749 continuous casting Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 239000010731 rolling oil Substances 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子・電気機器、特に電子部品のリード材、ス
イッチ・端子・コネクター等の配器材やばね材として多
く用いることができる高い強度と優れたメッキ性・半田
接合強度・耐食性・耐熱性等をもつ高力銅合金の製造法
に関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention has high strength and can be widely used as a lead material for electronic and electrical equipment, especially electronic components, and as a wiring material and spring material for switches, terminals, connectors, etc. This article relates to a method for producing a high-strength copper alloy that has excellent plating properties, solder joint strength, corrosion resistance, heat resistance, etc.
（従来の技術および発明が解決すべき問題点）電子機器
部品、例えばトランジスタ、ＩＣ。(Prior art and problems to be solved by the invention) Electronic equipment parts, such as transistors and ICs.
ＬＳｌ、ＶＬＳＩ、ダイオード等の半導体のリードフレ
ーム材、ヒートシンク材、電子部品のリード材、コネク
ター・スイッチ・リレー等の構成部品のばね材及び各種
端子材には多くの銅合金が利用されている。近年さらに
電子機器部品の小型化、高性能化、高密度化に伴ってよ
り高性能の合金が求められるようになり、特に最先端に
ある半導体は畠集積化が目覚しく、これに用いられるリ
ード材には高い強度が要求されている。Many copper alloys are used for lead frame materials for semiconductors such as LSI, VLSI, and diodes, heat sink materials, lead materials for electronic components, spring materials for component parts such as connectors, switches, and relays, and various terminal materials. In recent years, as electronic equipment parts have become smaller, more sophisticated, and more dense, there has been a demand for higher-performance alloys.In particular, cutting-edge semiconductors are becoming more integrated. requires high strength.
このような強度の優れた銅合金の代表的なものとしては
従来Ｃｕ−３ｎ−Ｐ系、Ｃｕ−Ｎｉ−８ｎ系及びｃｕ−
ｚｎ−ｐｂ系合金等があるが、これらの合金は製造工程
中に熱間加■が不可欠であるために、さらに加えて熱間
加工性が乏しいために次のような問題が発生しており品
質の低下とコストの上昇を（【１いている。Typical examples of copper alloys with excellent strength include Cu-3n-P, Cu-Ni-8n, and cu-Ni.
There are ZN-PB alloys, etc., but these alloys require hot working during the manufacturing process, and in addition, have poor hot workability, resulting in the following problems: Decrease in quality and increase in cost ([1])
（１）熱間圧延時及び熱間加工時に大気中での高温加熱
により材料表面に多層、多量の酸化スケールが発生し、
これを除去するために多大な研削が必要でおり、材料歩
留りが低下すると共に添加元素の内部酸化や圧延時の酸
化スケールの巻き込み等により内部欠陥を生じ、半田付
は性やメッキ密着性が低下する。(1) Multi-layered and large amounts of oxide scale are generated on the material surface due to high temperature heating in the atmosphere during hot rolling and hot processing.
A large amount of grinding is required to remove this, which lowers the material yield and causes internal defects due to internal oxidation of added elements and entrainment of oxide scale during rolling, resulting in decreased solderability and plating adhesion. do.
（２）大気加熱による再熱割れ及び熱間加工時の割れが
生じ、かつこれらの割れにより歩留りが低下し、従って
生産コストが増加する。(2) Reheat cracking due to atmospheric heating and cracking during hot working occur, and these cracks reduce yield and therefore increase production cost.
（３）熱間加工時に材料を高温に加熱するため多ωのエ
ネルギーを必要とし、かつそれに伴ない大きな設備投資
を必要とし生産コストか増加する。(3) In order to heat the material to a high temperature during hot processing, a large amount of energy is required, and a large equipment investment is required accordingly, which increases production costs.
〔問題点を解決するための手段）
本発明はこれに鑑み種々検討の結果、熱間加工工程を廃
止することにより上記問題点を解消した高力銅基台金の
製造法を開発したもので、’ｌｉｄ、旧〜５．Ｏｗｔ％
を含み、さらに２．２ｗｔ％以下のＳｎとそれぞれ２．
５ ｗｔ％以下のＮｉ、Ｚｎ。[Means for solving the problems] In view of this, and as a result of various studies, the present invention has developed a method for manufacturing a high-strength copper base metal that eliminates the above problems by eliminating the hot working process. , 'lid, old~5. Owt%
and 2.2 wt% or less of Sn, respectively.
5 wt% or less of Ni, Zn.
Ｍｎ、Ｃｏ、Ａ１とぞれぞれ０．５ｗｔ％以下のＭｇ、
Ａ’ｓ、Ｃａ、Ｖ、Ｙ、希土類元素、ｉｎ。Mn, Co, A1 and Mg of 0.5 wt% or less each,
A's, Ca, V, Y, rare earth elements, in.
Ｐｂ、Ｓｂ、Ｂ ｉ、Ｔｅ、Ａｇ、Ａｕ、Ｐ、Ｂ。Pb, Sb, B i, Te, Ag, Au, P, B.
Ｃｒ、Ｇａ、Ｚｒ、Ｇｅの１種又は２種以」ニを合計で
５、Ｏｗｔ％以下を含み、残部Ｃｕと不可避的不純物か
ら成る銅合金を連続鋳造し、該鋳塊の表面を研削した後
、２０〜９５％の加工率で冷間加工を行ない、しかる後
非酸化性雰囲気中にて３００〜９００℃で５秒〜２４時
間加熱シテｏ、０１〜５００℃／秒の冷却速度で冷却を
行なう工程の後、表面を溶解又は研削により清浄化し、
５〜９０％の加工率で冷間加工を行ない、しかる後非酸
化性雰囲気中にて２００〜６５０℃で５秒〜２４時間加
熱する工程を１回以上繰り返して行なうことを特徴とす
るものである。A copper alloy containing one or more of Cr, Ga, Zr, and Ge in a total of 5% or less by weight, with the remainder being Cu and unavoidable impurities was continuously cast, and the surface of the ingot was ground. After that, cold working is performed at a processing rate of 20 to 95%, and then heated at 300 to 900°C for 5 seconds to 24 hours in a non-oxidizing atmosphere, and cooled at a cooling rate of 01 to 500°C/second. After the process, the surface is cleaned by melting or grinding,
It is characterized by performing cold working at a processing rate of 5 to 90% and then heating it at 200 to 650°C for 5 seconds to 24 hours in a non-oxidizing atmosphere, which is repeated one or more times. be.
（作 用〕
本発明において合金組成を上記の如く限定したのは次の
理由による。(Function) The reason why the alloy composition is limited as described above in the present invention is as follows.
Ｔｉの含有量をｏ、 ｏｉ〜５．０ｗ１％と限定したの
は、Ｔｉの含有間がＯ，０１ｗｔ％未満では所望の強度
が１９られないからであり、Ｔｉの含有量が５．０ｗｔ
％を超える場合は高い強度は１ｑられるが冷間加工性や
曲げ成型性の低下が大きく半田付は性やメッキ密着性も
低下するからである。The reason why the Ti content is limited to 0.01 wt% is that the desired strength cannot be achieved if the Ti content is less than 0.01 wt%.
%, the high strength will be reduced by 1q, but the cold workability and bending formability will be greatly reduced, and the solderability and plating adhesion will also be reduced.
さらにＳｎ、Ｎ ｉ、Ｚｎ、Ｍｎ、ｃｏ、Ａ１゜ＭＬ
Ａｓ、ｃａ、ｖ、Ｙ、希土類元素、Ｉｎ。Furthermore, Sn, Ni, Zn, Mn, co, A1゜ML
As, ca, v, Y, rare earth element, In.
Ｐｂ、Ｓｂ、Ｂｉ、Ｔｅ、Ａｇ、Ａｕ、Ｐ、Ｂ。Pb, Sb, Bi, Te, Ag, Au, P, B.
Ｃｒ、Ｇａ、 Ｚｒ、 Ｇｅ （以下これらを副成分と
記す）において、２．２ｗｔ％以下のｓｎとそれぞれ２
．５ｗｔ％以下のＮ ｉ、Ｚｎ、Ｍｎ、Ｃｏ。In Cr, Ga, Zr, Ge (hereinafter referred to as subcomponents), sn of 2.2 wt% or less and 2
．． 5 wt% or less of Ni, Zn, Mn, Co.
Ａ１とそれぞれ０．５ｗｔ％以下のＭｇ、Ａｓ。A1 and 0.5 wt% or less of Mg and As, respectively.
（：、ａ、Ｖ、Ｙ、希土類元ｉ、Ｉｎ、Ｐｂ、Ｓｂ。(:, a, V, Y, rare earth element i, In, Pb, Sb.
ｓ ｉ、 Ｔｅ、 Ａｇ、 Ａｕ、ｐ、Ｂ、ｃｒ、ａａ
。s i, Te, Ag, Au, p, B, cr, aa
.
Ｚｒ、Ｑｅの１種又は２種以上を合計１５．０ｗｔ％以
下と限定したのは、これらを添加することにより電子部
品として良好な強度、半田イ」【プ性。The reason why one or more of Zr and Qe is limited to a total of 15.0 wt% or less is that by adding these, good strength and solderability can be achieved as an electronic component.
メッキ密着性及び優れた鋳造性を有するからであり、添
加量が合計で５．０ ｗｔ％を超えると鋳造性、半田付
は性及びメッキ密着性が劣るからである。This is because it has excellent plating adhesion and castability, and if the total amount added exceeds 5.0 wt%, castability, solderability, and plating adhesion will be poor.
次に上記組成の合金を連続ｖｉ造後後表面研削るのは、
鋳造時の欠陥や偏析を除去するためでおり、機械的ある
いは化学的な方法で表層を研削すれば良い。その後の冷
間加工の加工率を２０〜９５％と限定したのは２０％未
満では俊工程の熱処理時に再結晶を起こさせるのに不十
分であり、９５％を超えると材料組織の不均一性をｔＳ
＜ためである。Next, after continuous VI forming, the alloy with the above composition is subjected to surface grinding.
This is to remove defects and segregation during casting, and the surface layer can be ground by mechanical or chemical methods. The processing rate of the subsequent cold working was limited to 20-95% because if it is less than 20%, it is insufficient to cause recrystallization during heat treatment in the rapid process, and if it exceeds 95%, the material structure will be non-uniform. tS
＜For the sake of it.
引き続いての熱処理で加熱温度を３００〜９００℃と限
定したのは３００ ℃未満では材料の再結晶が不十分で
あり、９００°Ｃを超えると粗大な結晶粒を生じ特性を
劣化するからである。さらに加熱時間を５秒〜２４時間
と限定したのは５秒未満では再結晶を伴なう焼鈍の効果
がなく、２４時間を超える熱処理は生産性を低下させコ
スト高の要因となるからである。その後の冷却速度を０
、０１・〜５００℃／秒と限定したのは０．０１℃／秒
未満では冷却終了までの時間が長く、生産性が低下する
からであり、５００℃／秒を超えると冷却に伴なう材料
内部の温度差のため材料変形が生じるからである。また
以上の熱処理を非酸化性雰囲気で行なうのは材料の表面
及び内部の酸化を防止するためでおる。The heating temperature in the subsequent heat treatment was limited to 300 to 900°C because if it is less than 300°C, the recrystallization of the material is insufficient, and if it exceeds 900°C, coarse crystal grains will form and the properties will deteriorate. . Furthermore, the reason why the heating time was limited to 5 seconds to 24 hours is because if it is less than 5 seconds, the annealing effect accompanied by recrystallization will not be effective, and if the heat treatment exceeds 24 hours, it will reduce productivity and increase costs. . Then set the cooling rate to 0
, 01-500°C/sec is because if it is less than 0.01°C/sec, it will take a long time to finish cooling and productivity will decrease, and if it exceeds 500°C/sec, the cooling will be delayed. This is because material deformation occurs due to temperature differences inside the material. The reason why the above heat treatment is performed in a non-oxidizing atmosphere is to prevent oxidation on the surface and inside of the material.
次に表面を溶解又は研削により清浄化するのは製造工程
中の材料の酸化や冷間圧延時の圧延油の付着に伴なう熱
処理時の変色をそのまま放置して製品とすると半田付は
性やメッキ密着性に著しい低下を引き起こして信頼性を
大きく損なうのでこれらを防ぐためでり、酸やパフ等を
用い０，１〜５μｍ程度表面層を除去するのが望ましく
、５μｍを超えると表面が荒れることにより半田付（）
性及びメッキ密着性が低下してしまう。Next, the surface is cleaned by melting or grinding. If the discoloration during heat treatment due to oxidation of the material during the manufacturing process or adhesion of rolling oil during cold rolling is left as is, the soldering will be difficult. To prevent this, it is desirable to use acid or a puff to remove the surface layer of about 0.1 to 5 μm, and if it exceeds 5 μm, the surface will deteriorate. Soldering due to roughness ()
Otherwise, the properties and plating adhesion will deteriorate.
その俊の施す冷間加工を５〜９０％と限定したのは５％
未満では材料の平坦度や面相関が劣り、強度も小さいか
らであり、９０％を超えると材料組織の不均一性を招く
からである。さらに引き続いての熱処理が仕上げ加工後
の最終焼鈍である場合は該熱処理は材料の調質と内部歪
の除去のために行なうものであり、他方中間焼鈍である
場合は該熱処理は以後に続く加工を容易にするためのも
のであり、それぞれの加熱温度を２００〜６５０℃、加
熱時間を５秒〜２４時間と限定したのは、これら範囲外
では所期の目的を達せられないからである。なお最終焼
鈍の場合は再結晶温度以下、即ち２００〜５６０℃で５
秒〜２４時間の処理が望ましく、中間焼鈍の場合は再結
晶温度以上即ち４００〜６５０℃で１０秒〜２４時間の
処理が望ましい。さらに上記熱処理を非酸化性雰囲気中
で行なう理由は材料の表面及び内部酸化を抑制するため
でおる。Shun limited the cold processing applied to 5% to 90% to 5%.
This is because if it is less than 90%, the flatness and surface correlation of the material will be poor and the strength will be low, and if it exceeds 90%, the material structure will become non-uniform. Furthermore, if the subsequent heat treatment is a final annealing after finishing processing, the heat treatment is performed for refining the material and removing internal strain, whereas if it is an intermediate annealing, the heat treatment is performed for the subsequent processing. The reason why the heating temperature was limited to 200 to 650° C. and the heating time was limited to 5 seconds to 24 hours was because the intended purpose could not be achieved outside these ranges. In addition, in the case of final annealing, the temperature is below the recrystallization temperature, that is, 200 to 560°C.
The treatment time is preferably from seconds to 24 hours, and in the case of intermediate annealing, the treatment is preferably from 10 seconds to 24 hours at a temperature higher than the recrystallization temperature, that is, from 400 to 650°C. Furthermore, the reason for performing the above heat treatment in a non-oxidizing atmosphere is to suppress surface and internal oxidation of the material.
また上記表面清浄とそれに続く冷間加工及び熱処理を適
宜繰り返して行なう事により平滑で表面欠陥のない表面
性の優れた高強度かつ伸びの良好な材料を得ることがで
きる。Further, by appropriately repeating the above-mentioned surface cleaning and subsequent cold working and heat treatment, it is possible to obtain a material that is smooth, has no surface defects, has excellent surface properties, and has high strength and good elongation.
なお最終的に歪取りと形状矯正のためテンションレベラ
ー又はテンションアニール等を行なうことにより所望の
特性に調整することができる。Finally, desired characteristics can be adjusted by performing a tension leveler or tension annealing to remove distortion and correct the shape.
（実施例〕 次に本発明の実施例について説明する。(Example〕 Next, examples of the present invention will be described.
第１表に示す組成の合金をそれぞれ溶解し水平連続鋳造
により厚さ１０．の鋳塊を得、片面０．５ｓづつ研削し
て冷間圧延により厚さ１．５Ｍとした後、非酸化性雰囲
気中で５８０℃の温度で２時間保持し、０．０３℃／秒
の冷却速度で冷却した。その後、表面を清浄化し、０．
４２ｍｍの厚さまで冷間圧延を行なった後非酸化性雰囲
気中にて５４０℃で１時間保持して中間焼鈍を施し、０
．０３℃／秒の冷却速度で冷却し、再び表面清浄化を行
ない冷間圧延により厚さを０．２５ｉｉとした後、非酸
化性雰囲気中にて３００℃で２時間保持して仕上焼鈍を
施し、０．０５℃／秒の冷却速度で冷却した。このよう
な本発明による供試材についてそれぞれ引張強さ、伸び
１曲げ成型性、半田接合強度、メッキ密着性を調査し、
その結果を第１表に併記した。Each alloy having the composition shown in Table 1 was melted and horizontally continuously cast to a thickness of 10. After grinding 0.5 seconds on each side and cold rolling to a thickness of 1.5M, the ingot was kept at a temperature of 580°C for 2 hours in a non-oxidizing atmosphere, and rolled at a rate of 0.03°C/second. Cooled at the cooling rate. After that, the surface was cleaned and 0.
After cold rolling to a thickness of 42 mm, intermediate annealing was performed by holding at 540°C for 1 hour in a non-oxidizing atmosphere.
．． After cooling at a cooling rate of 0.3°C/sec, surface cleaning was performed again, and the thickness was reduced to 0.25ii by cold rolling, final annealing was performed by holding at 300°C for 2 hours in a non-oxidizing atmosphere. , at a cooling rate of 0.05°C/sec. The tensile strength, elongation 1 bending formability, solder joint strength, and plating adhesion were investigated for each of the test materials according to the present invention.
The results are also listed in Table 1.
なお曲げ成型性は先端半径（Ｒ）の異なる９０゜ダイス
の先端折り曲げ軸を供試材の圧延方向と平行に合わせて
供試材を折り曲げ、マイクロクラックの発生の有無を調
べて板厚（１）との比Ｒ／ｌで表わし、半田接合強度は
供試材の直径１２Ｍの部分に引張り用リード線を共晶半
田付けした後、１５０℃で６００時間保持してから引張
り試験を行ないその強度で表わし、さらにメッキ密着性
は供試材をホウフッ化物浴を用いて３ｎ−５％Ｐｂ合金
を７．５μｍの厚さにメッキした後１０５°Ｃｒ１００
０時間保持し、その後１８０°ニ折り曲げ、折り曲げ部
のメッキ層の剥離の有無を検鏡した。The bending formability was determined by bending the test material by aligning the end bending axis of 90° dies with different tip radii (R) parallel to the rolling direction of the test material, checking for the occurrence of microcracks, and determining the plate thickness (1 ), and the solder joint strength is determined by eutectic soldering of a tensile lead wire to a 12M diameter part of the specimen, holding it at 150°C for 600 hours, and then carrying out a tensile test. Furthermore, the plating adhesion was determined by plating the test material with 3n-5% Pb alloy to a thickness of 7.5 μm using a fluoride bath at 105°Cr100.
The sample was held for 0 hours, and then bent 180 degrees, and examined using a microscope to check for peeling of the plating layer at the bent portion.
次に第１表のＮα３の組成の合金を溶解し、水平連続鋳
造して厚さ１ｏｍｍの鋳塊を１ｑ、該鋳塊を片面ｏ、５
ｓづつ研削し、冷間圧延により厚さ１．５ｍとした後、
非酸化性雰囲気中にて第２表に示す条件でそれぞれ熱処
理を施し、その後表面を清浄化して冷間圧延にて厚さ０
．４２ｍとし非酸化性雰囲気中にて４６０℃で１時間保
持して中間焼鈍を施し、０．０３°Ｃ／秒の冷却速度で
冷却し再び表面を清浄化して冷間圧延にて厚さ０．２５
Ｍとし、非酸化性雰囲気中にて３００ ℃で２ｆｔ５間
保持して仕上焼鈍を施し、０．０５℃／秒の冷却速度で
冷却して供試材とし、それぞれ引張り強さ。Next, the alloy having the composition of Nα3 in Table 1 was melted and horizontally continuously cast to produce 1q of ingots with a thickness of 10 mm.
After grinding in s increments and cold rolling to a thickness of 1.5 m,
Heat treatment was performed in a non-oxidizing atmosphere under the conditions shown in Table 2, and the surface was then cleaned and cold rolled to a thickness of 0.
．． 42 m, and was held at 460°C for 1 hour in a non-oxidizing atmosphere to perform intermediate annealing, cooled at a cooling rate of 0.03°C/sec, cleaned the surface again, and cold rolled to a thickness of 0.02 m. 25
M, was held at 300°C for 2ft5 in a non-oxidizing atmosphere, was subjected to final annealing, and was cooled at a cooling rate of 0.05°C/sec to obtain a test material, and the tensile strength of each specimen was determined.
伸び１曲げ成型性、半田接合強度、メッキ密着性を調査
してその結果を第２表にイガ記した。The elongation, bending formability, solder joint strength, and plating adhesion were investigated, and the results are listed in Table 2.
次に第１表のＮｏ、 ３の組成の合金を溶解し、水平連
続鋳ｊΔして厚さ１０ｍｍの鋳塊を１ｑ、該鋳塊を片面
０．５ｓづつ研削し、冷間圧延により厚さ１．５ｍとし
た後、非酸化性雰囲気中にて４８０℃で５時間保持し、
０．０２℃／秒の冷却速度で冷却し表面を清浄化し、そ
の後第３表に示す条件で冷間圧延を施したものを中間焼
鈍をぜずに非酸化性雰囲気中にて３００ ℃で２０寺間
保持して仕上焼鈍をし、０．０５℃／秒の冷却速度で冷
却して供試材とし、それぞれ引張り強さ、伸び１曲げ成
型性、半田接合強度及びメッキ密着性を調査してその結
果を第３表に併記した。Next, the alloys with the composition No. 3 in Table 1 were melted, horizontally continuous casting was carried out to obtain 1 q of ingots with a thickness of 10 mm, the ingots were ground for 0.5 s on each side, and the thickness was reduced by cold rolling. After setting it to 1.5 m, it was held at 480°C for 5 hours in a non-oxidizing atmosphere,
The surface was cleaned by cooling at a cooling rate of 0.02°C/sec, and then cold rolled under the conditions shown in Table 3, and then rolled at 300°C in a non-oxidizing atmosphere for 20 minutes without intermediate annealing. The specimens were subjected to final annealing while being held at the temple, and cooled at a cooling rate of 0.05°C/sec to prepare test materials.The tensile strength, elongation 1 bending formability, solder joint strength, and plating adhesion were investigated. The results are also listed in Table 3.
さらに第１表のＮｏ３及びＮα７の組成の合金を溶解し
、水平連続鋳造により厚さ１０間の鋳塊を１７、該ｖｉ
跪を片面０．５．づつ研削し、冷間圧延により厚さ１．
５＃とじた後非酸化性雰囲気中にて５２０℃で２時間保
持し、０．０３℃／秒の冷却速度で冷却し表面を清浄化
し、その後冷間圧延して厚さ０．４２ｍとし非酸化性雰
囲気中にて４６０℃で１時間保持して中間焼鈍を施し、
０．０３℃／秒の冷却速度で冷却し、しかる後再び表面
を清浄化し冷間圧延を行なって０．２５ｍｍの厚さとし
、第４表に示す条件にて仕上焼鈍を施して供試材とし、
それぞれ引張強さ、伸び２曲げ成型性、半田接合強度及
びメッキ密着性を調査してその結果を第４表に併記する
。Further, alloys having compositions No. 3 and Nα7 in Table 1 were melted, and ingots with a thickness of 10 to 17 were made by horizontal continuous casting.
Kneeling on one side 0.5. It is ground and cold rolled to a thickness of 1.
After binding 5#, it was held at 520℃ for 2 hours in a non-oxidizing atmosphere, cooled at a cooling rate of 0.03℃/sec to clean the surface, and then cold rolled to a thickness of 0.42m and non-stick. Intermediate annealing is performed by holding at 460°C for 1 hour in an oxidizing atmosphere,
It was cooled at a cooling rate of 0.03°C/sec, and then the surface was cleaned again and cold rolled to a thickness of 0.25 mm, and finished annealed under the conditions shown in Table 4 to be used as a test material. ,
The tensile strength, elongation, bending formability, solder joint strength, and plating adhesion were investigated, and the results are also listed in Table 4.
第１表〜第４表から明らかなように本発明法ににる合金
はいずれも引張り強さにおいては６０、８ＫＦＩ ｆ
／ ｔｒｙ以上、伸びについては１０．０％以上及び半
田接合強度については０．９Ｎｙｆ／ｓ以上有し、また
曲げ成型性においてはいずれも０．８以下、さらにメッ
キ層の剥離は皆無であり、良好な特性を有している。こ
れに対し本発明法と製造条件の異なる比較法による合金
は少なくとも１つ以上の特性について本発明法による合
金より劣っていることが判る。即ち、比較法Ｎα１５は
半田接合強度が小さく、曲げ成型性及びメッキ密着性が
劣っており、比較法Ｎｏ、 １７は曲げ成型性及びメッ
キ密着性が悪い。また比較法Ｎ０２３及びＮα２９はい
ずれも引張り強さが小さく、比較法Ｎα１６． ＮＯ，
２２及びＮ０２８はいずれも伸びが小さく、曲げ成型性
が劣っている。As is clear from Tables 1 to 4, all the alloys produced by the method of the present invention have a tensile strength of 60.8 KFI f.
/ try or more, elongation of 10.0% or more, solder joint strength of 0.9 Nyf/s or more, bending formability of 0.8 or less, and no peeling of the plating layer. It has good characteristics. On the other hand, it can be seen that the alloy produced by the comparative method, which has different manufacturing conditions from the method of the present invention, is inferior to the alloy produced by the method of the present invention in at least one property. That is, comparative method No. 15 has low solder joint strength and poor bending formability and plating adhesion, and comparative method No. 17 has poor bending formability and plating adhesion. In addition, comparative methods N023 and Nα29 both have low tensile strength, and comparative method Nα16. No,
Both No. 22 and No. 28 have low elongation and poor bending formability.
（発明の効果）
このように本発明によれば電子機器部品のリードフレー
ム材、ヒートシンク材、電子部品のリード材や構成部品
のばね材及び各種端子材に利用する合金の製造において
熱間加工工程を廃止することによりコストを低減でき、
高強度と優れた加工性、半田性、メッキ性が１ｑられる
等工業上顕著な効果を秦するものである。(Effects of the Invention) As described above, according to the present invention, the hot working process can be performed in the production of alloys used for lead frame materials of electronic device parts, heat sink materials, lead materials of electronic parts, spring materials of component parts, and various terminal materials. Costs can be reduced by abolishing
It has remarkable industrial effects such as high strength, excellent workability, solderability, and plating performance of 1q.
Claims (1)
％以下のＳｎとそれぞれ２．５ｗｔ％以下のＮｉ、Ｚｎ
、Ｍｎ、Ｃｏ、Ａｌとそれぞれ０．５ｗｔ％以下のＭｇ
、Ａｓ、Ｃａ、Ｖ、Ｙ、希土類元素、Ｉｎ、Ｐｂ、Ｓｂ
、Ｂｉ、Ｔｅ、Ａｇ、Ａｕ、Ｐ、Ｂ、Ｃｒ、Ｇａ、Ｚｒ
、Ｇｅの１種又は２種以上を合計で５．０ｗｔ％以下を
含み、残部Ｃｕと不可避的不純物から成る銅合金を連続
鋳造し、該鋳塊の表面を研削した後、２０〜９５％の加
工率で冷間加工を行ない、しかる後非酸化性雰囲気中に
て３００〜９００℃で５秒〜２４時間加熱して０．０１
〜５００℃／秒の冷却速度で冷却を行なう工程の後、表
面を溶解又は研削により清浄化し、５〜９０％の加工率
で冷間加工を行ない、しかる後非酸化性雰囲気中にて２
００〜６５０℃で５秒〜２４時間加熱する工程を１回以
上繰り返して行なうことを特徴とする高力銅基合金の製
造法。Contains 0.01 to 5.0 wt% of Ti, and further contains 2.2 wt%
% or less Sn and 2.5wt% or less Ni, Zn, respectively
, Mn, Co, Al and 0.5 wt% or less of Mg each
, As, Ca, V, Y, rare earth elements, In, Pb, Sb
, Bi, Te, Ag, Au, P, B, Cr, Ga, Zr
A copper alloy containing one or more types of Ge, 5.0 wt% or less in total, and the balance consisting of Cu and unavoidable impurities is continuously cast, and after grinding the surface of the ingot, 20 to 95% of Cold working is performed at a processing rate of 0.01, followed by heating at 300 to 900°C for 5 seconds to 24 hours in a non-oxidizing atmosphere.
After cooling at a cooling rate of ~500°C/sec, the surface is cleaned by melting or grinding, cold-worked at a processing rate of 5-90%, and then heated for 2 hours in a non-oxidizing atmosphere.
A method for producing a high-strength copper-based alloy, comprising repeating the step of heating at 00 to 650°C for 5 seconds to 24 hours one or more times.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62101406A JP2555070B2 (en) | 1987-04-24 | 1987-04-24 | Manufacturing method of high strength copper base alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62101406A JP2555070B2 (en) | 1987-04-24 | 1987-04-24 | Manufacturing method of high strength copper base alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63266054A true JPS63266054A (en) | 1988-11-02 |
| JP2555070B2 JP2555070B2 (en) | 1996-11-20 |
Family
ID=14299837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62101406A Expired - Fee Related JP2555070B2 (en) | 1987-04-24 | 1987-04-24 | Manufacturing method of high strength copper base alloy |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2555070B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014074193A (en) * | 2012-10-02 | 2014-04-24 | Jx Nippon Mining & Metals Corp | Titanium copper and its manufacturing method |
| JP2017020115A (en) * | 2016-08-29 | 2017-01-26 | Ｊｘ金属株式会社 | Titanium copper and manufacturing method therefor |
| CN112030033A (en) * | 2020-09-14 | 2020-12-04 | 江西省科学院应用物理研究所 | Rare earth copper alloy for high-strength high-conductivity contact line |
| JP2021050393A (en) * | 2019-09-25 | 2021-04-01 | Ｊｘ金属株式会社 | Titanium copper alloy sheet for vapor chamber and vapor chamber |
| JP2021050392A (en) * | 2019-09-25 | 2021-04-01 | Ｊｘ金属株式会社 | Titanium copper alloy sheet for vapor chamber and vapor chamber |
| CN115305423A (en) * | 2022-08-16 | 2022-11-08 | 江西省科学院应用物理研究所 | Preparation method of copper alloy strip |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61143566A (en) * | 1984-12-13 | 1986-07-01 | Nippon Mining Co Ltd | Manufacture of high strength and highly conductive copper base alloy |
-
1987
- 1987-04-24 JP JP62101406A patent/JP2555070B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61143566A (en) * | 1984-12-13 | 1986-07-01 | Nippon Mining Co Ltd | Manufacture of high strength and highly conductive copper base alloy |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014074193A (en) * | 2012-10-02 | 2014-04-24 | Jx Nippon Mining & Metals Corp | Titanium copper and its manufacturing method |
| JP2017020115A (en) * | 2016-08-29 | 2017-01-26 | Ｊｘ金属株式会社 | Titanium copper and manufacturing method therefor |
| JP2021050393A (en) * | 2019-09-25 | 2021-04-01 | Ｊｘ金属株式会社 | Titanium copper alloy sheet for vapor chamber and vapor chamber |
| JP2021050392A (en) * | 2019-09-25 | 2021-04-01 | Ｊｘ金属株式会社 | Titanium copper alloy sheet for vapor chamber and vapor chamber |
| CN112030033A (en) * | 2020-09-14 | 2020-12-04 | 江西省科学院应用物理研究所 | Rare earth copper alloy for high-strength high-conductivity contact line |
| CN115305423A (en) * | 2022-08-16 | 2022-11-08 | 江西省科学院应用物理研究所 | Preparation method of copper alloy strip |
| CN115305423B (en) * | 2022-08-16 | 2023-11-14 | 江西省科学院应用物理研究所 | Preparation method of copper alloy strip |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2555070B2 (en) | 1996-11-20 |
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